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Standard BCB Resin (Df 0.0008-0.0020) for High-Frequency CCL
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Ultra-Low Loss BCB Resin (Df 0.0003-0.0008) for AI Server CCL
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Extreme-Low Loss BCB Resin (Df<0.0003) for Rubin OAM / 1.6T Switch
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BCB Monomer / Precursor for Polymer Synthesis
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BCB Composite / Blend for High-Frequency Laminate Formulations
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Acenaphthylene-Based Ultra-Low Loss Ex Resin for M8-M9 CCL
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Polybutadiene (PB) Resin for High-Frequency Low-Loss CCL
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SBS/SEBS Resin for Flexible High-Frequency PCB Substrates
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ODV Modified Hydrocarbon Resin (Df 0.0005-0.0010) for M9 CCL
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M6-M8 Grade Hydrocarbon Resin for High-Speed Copper-Clad Laminates
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M9 Ultra-Low Loss Hydrocarbon Resin for AI Server High-Speed Boards
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Next-Gen M10 Ultra-Low Loss Hydrocarbon Resin for 6G/AI Applications
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Fluorinated M10 Hydrocarbon Resin for AI Server Ultra-High-Speed Boards
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PTFE Composite Hydrocarbon Resin for Millimeter-Wave Applications
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Ultra-Low Loss Hydrocarbon Resin for AI Server CCL & OAM Modules
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Hydrocarbon Resin for 5G/6G mmWave Communication Modules
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High-Purity Hydrocarbon Resin for ABF Semiconductor Packaging
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Low-Dk/Df Hydrocarbon Resin for Automotive Radar & ADAS Sensors
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High-Temperature Hydrocarbon Resin for Aerospace & Defense Applications
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M6-M8 Hydrocarbon Resin for High-Speed CCL - Sunmun Technology
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