| HS Code | 781297 |
| Dielectric Constant Dk At 10ghz | ≤ 3.0 |
| Dissipation Factor Df At 10ghz | ≤ 0.0015 |
| Moisture Absorption | < 0.1% |
| Thermal Decomposition Temperature | ≥ 320°C |
| Glass Transition Temperature Tg | > 140°C |
| Coefficient Of Thermal Expansion Cte | ~ 40 ppm/°C |
| Copper Peel Strength | ≥ 0.8 N/mm |
| Chemical Resistance | Excellent resistance to solvents, fluxes, and plating chemicals |
| High Frequency Stability | Stable Dk/Df performance up to 77 GHz |
| Lamination Processing Temperature | Compatible with standard PCB lamination |
| Surface Smoothness | Enables low conductor insertion loss |
| Flammability Rating | UL 94 V-0 |
As an accredited Low-Dk/Df Hydrocarbon Resin for Automotive Radar & ADAS Sensors factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in 25 kg sealed drums, this hydrocarbon resin ensures low dielectric properties for automotive radar and ADAS sensor reliability. |
| Container Loading (20′ FCL) | 20′ FCL loading: drums of Low-Dk/Df hydrocarbon resin are secured, braced, and protected for safe transit. |
| Shipping | Shipped in sealed, moisture-barrier containers to prevent contamination and degradation. Handle with care to avoid damage. Store and transport within controlled temperature range, away from direct sunlight and extreme conditions. Ensure compliance with all applicable hazardous material regulations. Proper labeling and documentation included for safe, traceable delivery. |
| Storage | Store in a sealed, original container away from direct sunlight, heat sources, and ignition. Keep in a cool, dry, well-ventilated area at 15–30°C. Avoid moisture and humidity to preserve low dielectric properties. Ensure container is tightly closed when not in use. Typical shelf life is 12 months under recommended conditions. |
| Shelf Life | Shelf life: 12 months from manufacture if stored in original sealed containers at room temperature, away from sunlight. |
At the 76–81 GHz allocation used by long-range automotive radar, a radome skin contributes both reflection loss and transmission attenuation. A nonpolar low-Dk/Df hydrocarbon resin is melt-compounded into a 25 wt% short-glass PBT/PPE radome compound at 6–12 wt% to lower the dielectric constant without introducing the polar groups that raise dissipation factor under high-humidity ageing. Compounding takes place on a co-rotating twin-screw extruder with 40:1 L/D, ten-barrel configuration, side-fed glass at barrel 6, vacuum venting at -0.08 MPa, melt temperature 270–285 °C, and screw speed 350–450 rpm. Pellet pre-drying at 105 °C for 4 h to a moisture content below 0.02 wt% is required before injection moulding. Moulded plaques are tested at 79 GHz in a WR-12 waveguide fixture per ASTM D5568-22; the target for the compound is Dk ≤ 3.20 and Df ≤ 0.0035 after 168 h at 85 °C/85% RH. The hydrocarbon resin reduces melt viscosity enough to allow 2.5 mm wall sections at holding pressure 45–55 MPa, but strand pelletising shows static build-up above 8 wt% resin, requiring an ionised air bath at the pelletiser inlet. Above 12 wt% resin, notched Charpy impact falls below 4.0 kJ/m² per ISO 179-1:2020, and HDT at 1.8 MPa drops below 180 °C per ISO 75-2:2013. The moulded components are therefore specified for front bumper radomes and grille-integrated radar brackets where creep under warm bonnet airflow must remain below 0.5 mm after 500 h at 90 °C. Table 1 summarises the dielectric and mechanical response across the formulation gradient.
| Hydrocarbon resin (wt%) | Dk at 79 GHz per ASTM D5568-22 | Df at 79 GHz per ASTM D5568-22 | Charpy notched impact (kJ/m²) per ISO 179-1:2020 | HDT at 1.8 MPa (°C) per ISO 75-2:2013 |
|---|---|---|---|---|
| 0 | 3.42 | 0.0058 | 5.2 | 205 |
| 4 | 3.35 | 0.0047 | 4.8 | 197 |
| 8 | 3.23 | 0.0036 | 4.1 | 188 |
| 12 | 3.08 | 0.0027 | 3.4 | 179 |
| 16 | 2.96 | 0.0022 | 2.9 | 168 |
Radar module antennas fabricated from resin-rich prepregs require in-plane Dk variation below ±0.02 at 79 GHz to keep patch resonance within 200 MHz. The low-Dk/Df hydrocarbon resin is used as a co-binder at 18–25 phr of the laminate resin-solids fraction, combined with fused silica at 25–35 wt% to control CTE. A peroxide cure package at 1.5–3.0 phr dicumyl peroxide and a triallyl cyanurate co-crosslinker at 5–12 phr of resin solids are blended into a MEK/toluene varnish. Varnish is cast onto 1035 woven quartz glass; B-staging proceeds through a vertical treater with zone temperatures 90 °C, 130 °C, and 160 °C until residual solvent is below 0.3 wt%. Lamination is carried out at 190–210 °C and 2.0–3.5 MPa for 120 min, followed by post-cure at 220 °C for 60 min. Dk and Df are measured at 10 GHz by split post dielectric resonator per IEC 61189-2-721:2015; 79 GHz verification is performed with a WR-12 waveguide per ASTM D5568-22. Copper peel strength is evaluated after 288 °C/10 s solder stress per IPC-TM-650 2.4.8. Production-scale issues include microvoid formation at peroxide loadings above 2.5 phr and silica agglomeration when mixing speed exceeds 800 rpm. The laminate stack is specified for 76–81 GHz MIMO antenna boards and radar module feedlines, where the resin-rich layer must not exceed 100 µm to avoid excessive Z-axis thermal expansion. Published data for this specific resin-filler combination is limited; therefore initial qualification must include a 1000-cycle thermal shock test at -40 °C to +125 °C with Dk drift below 0.03.
For decorative radar-transparent front fascia emblems, the moulded component must maintain a bright metallic appearance without creating the conductive continuity that backscatters 77 GHz energy. A PC or PC/ABS base is modified with 8–15 wt% low-Dk/Df hydrocarbon resin to reduce polar carbonate dipole density and moisture uptake. Metallisation is replaced by a discontinuous aluminium pigment at less than 0.5 vol%, with flake diameter below 10 µm and spacing above 100 µm, or by an indium tin oxide sputtered film with sheet resistance controlled above 1 kΩ/sq. Injection-compression moulding is preferred over straight injection to reduce birefringence in the 2.5 mm wall; melt temperature is held at 260–280 °C, mould temperature at 80 °C, compression stroke 0.5–1.0 mm, and holding pressure 50–60 MPa. Coating adhesion after plasma pre-treatment is tested by ISO 2409 cross-cut tape pull, and weathering is assessed by SAE J2527 with 2500 kJ/m² UV exposure. The hydrocarbon resin must be fully saturated because residual aromatic unsaturation yellows below 80 °C and raises Df above 0.004 after UV ageing. Above 15 wt% resin, pencil hardness falls below F per ASTM D3363 and orange peel increases during sputter deposition. Terminal parts include front fascia emblems, badgeless radomes, illuminated ADAS logos, and painted radar covers with a 12 dB two-way insertion-loss budget.
Where the sensor housing also functions as a dielectric window, PPS is selected for dimensional stability, but its crystalline morphology and high mineral loadings increase dielectric anisotropy. A low-Dk/Df hydrocarbon resin at 5–10 wt% is melt-compounded with a 40 wt% glass-fibre/mineral PPS compound. The resin lowers melt viscosity by 15–25% measured per ISO 1133-1:2022 at 315 °C and 5 kg, allowing fill of 0.8 mm wall ribs without flash. Moulding uses an 1800 kN injection machine, barrel temperature profile 300–340 °C, mould temperature 130–150 °C, screw speed 80 rpm, and injection speed 80 mm/s. Dielectric performance at 79 GHz is measured by ASTM D5568-22; the acceptance window for a housing window is Dk ≤ 3.3 and Df ≤ 0.004 after 1000 h at 85 °C/85% RH. The hydrogenated resin only is permitted because standard C9 resin exhibits TGA onset below 380 °C per ISO 11358-1, while the housing must tolerate 150 °C continuous under-bonnet exposure. Warpage is assessed by 3D optical scanning per ISO 1101 after 24 h at 23 °C/50% RH; the housing datum plane must remain within ±0.3 mm across a 150 mm span. Table 2 lists the qualification matrix applied to moulded PPS sensor housings.
| Property | Test method | Requirement |
|---|---|---|
| Dk at 79 GHz | ASTM D5568-22 | ≤ 3.3 |
| Df at 79 GHz | ASTM D5568-22 | ≤ 0.004 |
| Tensile modulus | ISO 527-2:2012 | ≥ 6.0 GPa |
| HDT at 1.8 MPa | ISO 75-2:2013 | ≥ 260 °C |
| Flammability | UL 94 | V-0 at 0.8 mm |
| REACH SVHC | REACH 1907/2006 | < 0.1 wt% |
| RoHS | 2011/65/EU Annex II | Pass |
Hidden radar brackets behind the front fascia require post-mould dimensional tolerance to maintain the antenna plane orthogonal to the longitudinal axis within ±0.3°. A mineral-filled polypropylene compound containing 10–15 wt% low-Dk/Df hydrocarbon resin reduces anisotropic mould shrinkage from 1.1% in the flow direction to 0.7% and from 0.9% transverse to 0.6% as measured per ISO 294-4. Sequential valve-gate injection is used on a 2500 kN machine with gate open delays of 0.5–1.0 s to equalise cavity filling pressure; melt temperature is 220–240 °C, mould temperature 40–60 °C, holding pressure 35–45 MPa, and cooling time 25 s for a 2.0 mm nominal wall. After ejection, brackets are fixture-cooled for 60 s to prevent post-mould warpage. Dimensional stability is verified after 500 h at 90 °C by coordinate measurement per ISO 1101; total fixture drift must remain below 0.2 mm. The low-polarity resin also reduces moisture regain to below 0.15 wt% per ISO 62 after 24 h water immersion, limiting dielectric drift in the nearby antenna field. The bracket is not a primary dielectric element, but its Df at 79 GHz is kept below 0.005 to avoid resonance shifts when the radar module is mounted directly to it. Terminal use is hidden radar brackets, antenna carrier frames, and sensor alignment brackets for forward-facing ADAS units.
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Low-Dk/Df hydrocarbon resin HC-2000-LD is a crosslinkable, low-polarity thermoset developed for copper-clad laminate and prepreg formulations used in automotive radar and ADAS sensor antennas operating from 76 GHz to 81 GHz. The resin is supplied as a solid flake with an ASTM E28 softening point of 85 °C and is formulated into MEK/toluene varnishes at 50 wt% solids for coating onto low-Dk glass cloth. Typical cured-laminate dielectric properties at 10 GHz, measured by split-post dielectric resonator per IEC 61189-2-721, are Dk 2.30 and Df 0.0012. Open-resonator measurements at 77 GHz on a 0.25 mm laminate give Dk 2.28 and Df 0.0015. The cured matrix differs from general-purpose C5/C9 hydrocarbon tackifiers through a styrene-butadiene-butene backbone with pendant 1,2-vinyl and methacrylate crosslink sites, which raises glass transition temperature and lowers free-radical cure volatility. The product is targeted at radome substrates, antenna feedline boards, and ADAS sensor package carriers where insertion loss, moisture uptake, and dimensional stability during reflow are critical.
PTFE/ceramic laminates exhibit lower Dk, typically 2.10, but require plasma or sodium naphthalenide treatment for copper adhesion, show high z-axis CTE near 120 ppm/°C, and are susceptible to cold flow during multilayer lamination. PPE-APPE blends offer FR-4-like processing but carry higher dissipation factor and moisture uptake. HC-2000-LD provides a middle route: Dk 2.30, Df 0.0012, z-axis CTE 55 ppm/°C below glass transition, and water absorption of 0.08 wt% after 24 h per IPC-TM-650 2.6.2.1. The reduction in Df relative to PPE-APPE blends is approximately 60%, which is significant for long radar feedlines because insertion loss per unit length scales with both conductor loss and dielectric loss at 77 GHz.
| Property | Test Method | HC-2000-LD | PTFE/Ceramic | PPE-APPE Blend |
|---|---|---|---|---|
| Dk at 10 GHz | IEC 61189-2-721 | 2.30 | 2.10 | 2.45 |
| Df at 10 GHz | IEC 61189-2-721 | 0.0012 | 0.0008 | 0.0030 |
| Tg, DMA | IPC-TM-650 2.4.24.4 | 185 °C | 120 °C | 160 °C |
| Z-axis CTE below Tg | IPC-TM-650 2.4.24 | 55 ppm/°C | 120 ppm/°C | 70 ppm/°C |
| Water absorption, 24 h | IPC-TM-650 2.6.2.1 | 0.08 wt% | 0.02 wt% | 0.25 wt% |
| Copper peel strength, 35 µm ED foil | IPC-TM-650 2.4.8 | 0.82 N/mm | 0.90 N/mm after plasma | 0.70 N/mm |
On a vertical treating tower, the varnish is cast onto 1078 low-Dk glass cloth using a slot-die coater at 50–60 wt% solids. The B-stage trough temperature is held at 148–153 °C. Below 145 °C residual solvent remains above 0.5 wt% and generates microvoids during lamination. Above 158 °C premature free-radical advancement raises melt viscosity and reduces glass wet-out. A 2.0 m wide treating tower with 12 m/min line speed is used to maintain prepreg resin content within ±0.8 wt% across a nine-roll qualification lot. Lamination is performed at 185 °C for 120 min at 2.5 MPa using a 3 °C/min ramp. Varnish pot life at 25 °C is 8 h when initiated with 1,1-di(tert-butylperoxy)cyclohexane. Substitution with dicumyl peroxide reduces pot life to approximately 4 h and increases exotherm during B-staging.
The resin should not be formulated with amine-based accelerators because residual amine groups raise dissipation factor and can inhibit the free-radical cure. At ambient relative humidity above 60%, prepreg requires vacuum drying at 105 °C for 2 h before lamination to prevent void formation. The cured resin is also incompatible with strong oxidizing acids at press temperatures above 200 °C.
Copper peel strength on 35 µm electrodeposited foil is 0.82 N/mm per IPC-TM-650 2.4.8, which is below plasma-treated PTFE but adequate for HDI via formation and wire bonding pad retention. After 96 h of highly accelerated stress testing at 130 °C and 85% relative humidity per JESD22-A118, Dk increases by less than 0.02 at 10 GHz. Conductive anodic filament testing per IPC-TM-650 2.6.25 at 50 V DC and 85 °C/85% RH for 1,000 h shows no CAF failure on 0.25 mm core with 0.3 mm via-to-via spacing. The low equilibrium moisture content is the main contributor to CAF resistance because ionic transport requires a continuous water layer at the glass-resin interface.
The resin has a melt viscosity of 250–400 mPa·s at 150 °C per ASTM D3835, which is low enough to fill 1035 and 1078 glass weaves without high-pressure void closure. Gel time at 171 °C is 280–360 s per IPC-TM-650 2.3.18. The combination of low melt viscosity and controlled gel time allows 0.2 mm and 0.25 mm cores to be pressed without resin starvation at the edges.
When HC-2000-LD replaces cyanate ester in a multilayer ADAS feed network, press temperature can be reduced from 220 °C to 185 °C, which lowers copper oxidation during lamination. The hydrocarbon network has lower cure shrinkage, typically below 1.0%, compared with cyanate ester shrinkage near 2.0%. Dimensional change after lamination is ±0.03 mm across a 400 mm panel when measured per IPC-TM-650 2.4.39. Residual cyanate monomer and cyanate ester’s higher moisture uptake are eliminated, which improves high-humidity dielectric stability.
If PTFE is replaced, the laminate does not require plasma or sodium treatment before electroless copper, and cold flow is not observed at 250 °C solder float. UV laser via formation at 355 nm can produce 75 µm vias without significant smear because the crosslinked hydrocarbon network has a lower decomposition temperature than PTFE. However, the Dk of 2.30 is higher than PTFE/ceramic at 2.10, so trace width or laminate thickness must be recalculated using the actual Dk at 77 GHz before adoption.
Thermal conductivity of the cured resin is 0.35 W/m·K measured by hot-disk method per ISO 22007-2. This is lower than ceramic-filled PTFE but adequate for ADAS sensor packages with low total power dissipation. After 1,000 h at 150 °C in air, the change in Df at 10 GHz is less than 0.0003 and the change in Dk is less than 0.02. Publicly available 77 GHz long-term aging data for this specific formulation are limited; the 1,000 h value is an internal laminate qualification result using open-resonator measurements on 0.25 mm cores. The resin passes UL 94 V-0 at 0.8 mm thickness and is formulated to meet REACH SVHC absence above 0.1 wt%.
| Regulatory Requirement | Reference or Test Method | Status |
|---|---|---|
| RoHS restricted substances | Directive 2011/65/EU Annex II | Pass |
| REACH SVHC | Regulation 1907/2006/EC | No SVHC above 0.1 wt% |
| Halogen content | IEC 61249-2-21 | Cl <900 ppm, Br <900 ppm, total <1,500 ppm |
| Flammability | UL 94 | V-0 at 0.8 mm |