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Dipropylene Glycol Monobutyl Ether

Isobutyl Alcohol

General-Purpose Epoxy Resin for FR-4 Laminates & Encapsulation

Phenolic Resin for PCB Laminates & Electrical Insulation

Flexible Polyurethane Resin for Potting & Conformal Coating

High-Temperature Silicone Resin (200°C+) for Semiconductor Encapsulation

Low-Dielectric Modified PPO/PPE Resin (Df<0.002) for AI Server CCL

Modified PPO/PPE Resin for High-Frequency CCL Applications

Benzocyclobutene (BCB) Ultra-Low Dielectric Resin for Semiconductor Packaging

Photosensitive BCB Resin for Wafer-Level Packaging Applications

Dry-Etch BCB Resin for Semiconductor Passivation & Interlayer Dielectric

Standard BCB Resin (Df 0.0008-0.0020) for High-Frequency CCL

Ultra-Low Loss BCB Resin (Df 0.0003-0.0008) for AI Server CCL

Extreme-Low Loss BCB Resin (Df<0.0003) for Rubin OAM / 1.6T Switch

BCB Monomer / Precursor for Polymer Synthesis

BCB Composite / Blend for High-Frequency Laminate Formulations

Acenaphthylene-Based Ultra-Low Loss Ex Resin for M8-M9 CCL

Polybutadiene (PB) Resin for High-Frequency Low-Loss CCL

SBS/SEBS Resin for Flexible High-Frequency PCB Substrates

ODV Modified Hydrocarbon Resin (Df 0.0005-0.0010) for M9 CCL

46554 Records

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