| HS Code | 264106 |
| Viscosity | 500-2000 cP at 25°C |
| Pot Life | 20-40 minutes |
| Cure Time | 24 hours at 25°C or 2 hours at 60°C |
| Hardness | Shore A 60-80 |
| Elongation At Break | 300-500% |
| Tensile Strength | 10-20 MPa |
| Dielectric Strength | 15-20 kV/mm |
| Water Absorption | 0.2-0.5% by weight |
| Operating Temperature | -40°C to +120°C |
| Glass Transition Temperature | -20°C to +10°C |
| Thermal Conductivity | 0.2-0.3 W/m·K |
As an accredited Flexible Polyurethane Resin for Potting & Conformal Coating factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged as a two-component kit, 1 gallon total, with resin and hardener for potting and conformal coating applications. |
| Container Loading (20′ FCL) | Load 20′ FCL with flexible polyurethane resin in sealed drums on pallets, securely lashed, hazard-labelled, ventilated, and segregated from incompatible materials. |
| Shipping | This chemical is shipped in sealed, moisture-resistant containers to prevent premature curing. It is typically classified as a non-dangerous good, but must be kept away from extreme temperatures and ignition sources. Use proper labeling, secure packaging, and ensure adequate ventilation during transport and storage. |
| Storage | Store in tightly sealed original containers in a cool, dry, well-ventilated area away from direct sunlight, heat, ignition sources, and incompatible materials. Protect from moisture and humidity, as the resin is moisture-sensitive. Maintain temperatures between 15–25°C (59–77°F). Avoid freezing. Use within manufacturer’s stated shelf life, and keep containers closed when not in use. |
| Shelf Life | Store unopened in original containers below 25°C, away from moisture and sunlight. Shelf life: 12 months from manufacture date. |
Production potting of automotive absolute-pressure sensors and throttle-position sensors uses a two-component flexible polyurethane cast at mix ratios between 100:25 and 100:45 by weight, with mixed viscosity held at 1,200–2,500 mPa·s at 25 °C. Meter-mix-dispense stations equipped with progressive cavity pumps and 24-element static mixers maintain ratio accuracy within ±1 wt% because deviation beyond ±2 wt% shifts gel time by more than 8 min and creates soft spots beneath the solder-side standoffs. The cured encapsulant exhibits Shore A hardness of 40–60, tensile elongation of 150%–300%, and tensile strength of 2–6 MPa when tested to ISO 527-2:2012. Low modulus below 30 MPa at −40 °C prevents CTE-mismatch shear from lifting 0402 ceramic capacitors during 1,000 thermal shocks from −40 °C to 125 °C per IEC 60068-2-14 test Na. Pre-drying of PCB assemblies at 60 °C for 2 h is mandatory when ambient relative humidity exceeds 60% because residual moisture reacts with aromatic isocyanate and causes CO₂ bubble formation visible as turbidity in the encapsulant. Vacuum potting at 5–20 mbar for 3–5 min after dispensing reduces void content below 0.5% by volume in housings 8–12 mm deep. Terminal products in this segment include engine control unit power stages, transmission speed sensors, and exhaust gas differential-pressure sensors encapsulated in PBT-glass housings. Adhesion to PBT-GF30 is improved with a moisture-curing polyurethane primer applied at 5–10 μm dry film thickness; without primer, lap-shear values to PBT fall below 1 MPa after 500 h at 85 °C/85% RH under IEC 60068-2-78. Published data for the specific effect of engine oil aerosol on flexible polyurethane embrittlement is limited; sealed ECU housings are therefore qualification-tested with oil aerosol present but not continuous immersion.
| Property | Test method | Typical production range | Process or field boundary observed |
|---|---|---|---|
| Mixed viscosity at 25 °C | ASTM D2196-20 | 1,200–2,500 mPa·s | Above 5,000 mPa·s causes incomplete leveling in 10 mm deep housings |
| Shore A hardness after 7 days | ISO 868:2003 | 40–60 | Below 30 fails wire-bond protection under swept-sine vibration |
| Tensile elongation at break | ISO 527-2:2012 | 150%–300% | Below 100% cracks around PBT standoffs after 500 cycles |
| Dielectric strength | ASTM D149-20 | 18–25 kV/mm | Below 15 kV/mm rejects after 85 °C/85% RH conditioning |
| Volume resistivity | ASTM D257-14 | 1×10^13–1×10^14 Ω·cm | Below 1×10^12 Ω·cm at 125 °C causes leakage drift on sense lines |
| Water absorption after 24 h | ISO 62:2008 | 0.2%–0.6% | Above 0.8% correlates with blisters at PBT-encapsulant interface |
In variable-frequency drive production, flexible polyurethane conformal coating is applied to control boards that operate in forced-air enclosures where condensation cycling follows motor overload and shutdown. Selective robotic spray equipment with needle valves and air-atomized nozzles deposits a wet film of 100–150 μm to achieve dry film thickness of 50–75 μm after solvent flash-off. The coating grade is typically a two-component aliphatic system with Part A viscosity of 400–800 mPa·s and Part B viscosity below 100 mPa·s at 25 °C; solvent-borne formulation reduces mixed viscosity to 100–250 mPa·s for fine-pitch connector avoidance. Cure is performed at 70 °C for 30 min in forced-convection ovens with exhaust rate of 6 air changes per minute, followed by 24 h ambient dwell before electrical testing. Qualification to IPC-CC-830B requires insulation resistance above 1×10^8 Ω after 168 h at 85 °C/85% RH and no blistering, cracking, or delamination. Dielectric withstand is tested at 1.5 kV AC for 60 s on 25 μm gap patterns. The coating’s low glass transition temperature below −20 °C permits movement over solder joints without transferring strain to 0201 chip resistors; strain-gauge measurements on FR-4 coupons show less than 0.1% surface strain at −40 °C. Rework requires local application of a proprietary glycol-ether remover because aggressive solvent immersion lifts the solder mask. Incompatibility arises when boards retain amine-based flux residues; amine compounds accelerate isocyanate consumption and can reduce mixed pot life from 8 h to 45 min in dip trays. The terminal board types include motor-drive control cards, regenerative braking interface boards, and power-factor-correction modules for 3-phase industrial inverters.
Outdoor LED driver potting requires a flexible polyurethane that maintains translucency after 2,000 h of 85 °C/85% RH aging while protecting aluminum electrolytic capacitor vents. The process issue is moisture sensitivity during dosing: at 28 °C and 75% RH, open-air pot life shortens from 35 min to 18 min because water reacts with the isocyanate component and accelerates viscosity build from 2,000 mPa·s to 50,000 mPa·s. Meter-mix machines with vacuum degassing of each component and nitrogen-blanketed day tanks maintain mixed moisture below 0.02%. Mix ratio of 100:40 by weight is common; ratio drift of ±1.5% produces Shore A variation from Shore A 35 to Shore A 55, which alters damping of surface-mount electrolytic capacitors under 10–500 Hz sinusoidal vibration per IEC 60068-2-6. Potting depth of 5–15 mm produces exothermic temperature below 60 °C; depths above 20 mm exceed 80 °C internal temperature and may distort the polycarbonate housing. Gel time at 25 °C of 28–35 min is selected to allow vacuum-assisted leveling but prevent resin creep into the wiring compartment. Cured resin must display dielectric strength above 18 kV/mm per ASTM D149-20 and volume resistivity above 1×10^13 Ω·cm per ASTM D257-14. Outdoor exposure to UV requires an outer housing that blocks short-wavelength radiation because aromatic flexible polyurethane will yellow; aliphatic grades reduce yellowing but increase raw material cost by 15%–25%. Terminal products are 100–400 W LED road luminaire drivers, horticultural lighting ballasts, and high-bay fixture power supplies with 4 kV surge immunity per IEC 61000-4-5.
Battery management systems for electric vehicle modules use flexible polyurethane potting to isolate cell-voltage sensing tabs, busbar connectors, and SMD metal-oxide-semiconductor field-effect transistors from condensation and electrolyte aerosol. Vacuum dispensing at 5–10 mbar for 90–180 s is required because dissolved air and moisture retained in the dispensed stream form interfacial voids at the PCB surface. Void content measured by X-ray computed tomography above 2% by volume correlates with partial discharge onset below 800 V on 0.8 mm creepage gaps; void-free sections withstand 1,500 V AC for 60 s. The mixed system has viscosity of 800–1,500 mPa·s at 25 °C, allowing flow under flat-pack components with 0.3 mm standoff. The exothermic peak in a 12 mm thick cast must remain below 65 °C to avoid drifting the reference voltage of adjacent shunt resistors; this is controlled with a 45-min gel time formulation. Hardness after 7 days at 23 °C is Shore A 30–Shore A 45, which allows serviceability of the module by mechanical peeling without damaging the flexible printed circuit. Compliance is anchored to UL 746E for potting compounds, with a relative thermal index of 130 °C in the specific grade and flammability classification of UL 94 V-0 at 1.5 mm thickness. Volume resistivity after 1,000 h at 60 °C/90% RH remains above 5×10^12 Ω·cm. The terminal products are 12–24-cell BMS slave boards, contactor pre-charge modules, and on-board charger low-voltage control isolation blocks. Incompatibility with lithium-ion electrolyte vapor is evaluated by exposure to 1,000 ppm dimethyl carbonate vapor for 500 h; published data for this specific configuration is limited, so automobile OEMs generally require no visible degradation and less than 10% hardness change.
For photovoltaic string inverters installed in coastal arrays, salt mist ingress into IGBT gate-drive boards dictates the choice of a hydrolytically stable flexible polyurethane encapsulant rather than a hard epoxy. The potted power stage combines 1.2 kV IGBT half-bridge modules, gate-drive optocouplers, and current-sensing shunts in a single cast block. Production equipment uses two-component progressive cavity dispensing with disposable static mixers; mix ratio is 100:30 by volume, and ratio monitoring by differential pressure transducers flags any drift beyond ±1%. Viscosity at 25 °C is 1,800 mPa·s; heated dispensing at 35 °C lowers viscosity to 700 mPa·s and increases volumetric flow to 5 mL/s, but reduces pot life from 20 min to 9 min. Salt mist exposure per IEC 60068-2-52 test Kb for 6 cycles must not produce corrosion migration across 2.5 mm spacing; post-exposure insulation resistance must remain above 1×10^9 Ω at 125 V DC. Partial discharge measurements per IEC 60664-1 are performed at 1,000 V on 1.5 mm gaps; discharge inception below 750 V triggers reject because microvoids at the ceramic substrate interface extend to the conductor edge. Thermal cycling from −40 °C to 105 °C for 2,000 cycles per IEC 60068-2-14 is required by inverter manufacturers; flexible polyurethane with elongation above 120% survives without cracking on aluminum heat spreader interfaces. The terminal products are 50–150 kW central inverters, 5–25 kW string inverters, and DC optimizer modules with 1 kV system voltage. A limitation is continuous operation above 125 °C at the hot-spot under the IGBT, where hydrolytic reversion of ester linkages accelerates; direct thermocouple measurement under full load is required during qualification.
Flexible polyurethane conformal coating used in unpressurised avionics compartments must satisfy low-outgassing requirements because volatile species condense on optical surfaces and connector contacts. The coating is applied by conformal-coating robot using a dual-head air spray at 0.15–0.25 MPa atomisation pressure; dry film thickness is controlled at 25–50 μm per IPC-A-610 class 3 acceptance. Qualification includes ASTM E595-15 outgassing with total mass loss below 1.0% and collected volatile condensable material below 0.1%; some aliphatic flexible polyurethane grades pass, while aromatic catalyst-packaged grades exceed TML due to residual solvent and low-molecular-weight urethane species. Cure schedule of 24 h at 23 °C followed by 4 h at 65 °C reduces post-cure volatile content. Adhesion to rigid polyimide and cyanate-ester boards is tested by cross-hatch tape per ASTM D3359-17, requiring class 4B or better after 10 thermal shock cycles from −55 °C to 125 °C. Dielectric withstanding voltage is 500 V AC for 60 s on 0.5 mm spacings. The coating is not selected for continuous hot spots above 125 °C where epoxy or parylene is specified; flexible polyurethane remains within its operational boundary at −55 °C to 115 °C on low-power flight control boards. Rework of a coated board is performed with heat at 80 °C and isopropyl alcohol/butyl acetate swab; the softened film is removed without fibreglass damage when the hot-air pencil is set below 300 °C. Terminal products include air-data computer interfaces, cabin pressure sensor boards, and navigational antenna base modules. Published data for the specific condensation of outgassed species on adjacent laser optics is limited; system-level thermal vacuum testing is required.
| Qualification point | Standard or method | Acceptance criterion | Exposure or test condition |
|---|---|---|---|
| Total mass loss | ASTM E595-15 | Below 1.0% | 125 °C, 24 h, 10⁻⁵ Pa |
| Collected volatile condensable material | ASTM E595-15 | Below 0.1% | 25 °C collector plate |
| Flammability | UL 94 | V-0 | 1.5 mm thickness |
| Cross-hatch adhesion | ASTM D3359-17 | Class 4B or better | After 10 thermal shock cycles |
| Insulation resistance | IPC-CC-830B | Above 1×10^8 Ω | 85 °C/85% RH, 168 h |
| Dielectric withstand | IPC-CC-830B | No breakdown at 500 V AC | 60 s on 0.5 mm spacings |
Industrial refrigeration compressor controllers and evaporative condenser panels are coated with flexible polyurethane because ammonia vapour and water condensation produce alkaline films that corrode silver migration paths. The coating is applied by dip coating; viscosity is 350 mPa·s at 25 °C and solids content is 38% by weight, producing a dry film of 30–60 μm in one dip. Solvent flash-off at 23 °C for 10 min is followed by cure at 60 °C for 30 min. Cross-hatch adhesion class 4B per ASTM D3359-17 must survive 500 h of ammonia vapour exposure at 25 ppm; unprotected tin-lead pads show dendritic growth within 96 h under the same condition. Insulation resistance between interconnects spaced 2 mm remains above 5×10^8 Ω at 85 °C/85% RH after 1,000 h. The cured film is reworkable with a hand-held hot-air tool at 250 °C and a butyl acetate swab. A limitation of this coating is its 0.2% water absorption after 24 h immersion per ISO 62:2008, which temporarily reduces surface insulation after defrost cycles; a 20 min bake at 60 °C restores insulation. The terminal products are electronic expansion valve controllers, glycol pump variable-speed drive boards, and walk-in freezer defrost logic cards.
Competitive Flexible Polyurethane Resin for Potting & Conformal Coating prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8618136850665 or mail to admin@ascent-chem.com.
We will respond to you as soon as possible.
Tel: +8618136850665
Email: admin@ascent-chem.com
Flexible payment, competitive price, premium service - Inquire now!
FP 2410-P and FP 2410-C are two-component, solventless flexible polyurethane systems designed for electronic potting, low-stress encapsulation, and selective conformal coating of printed circuit assemblies. The A-component is an isocyanate prepolymer based on 4,4′-diphenylmethane diisocyanate with an NCO content of 15.0–16.5%; the B-component is a mixed polyol formulated from castor-oil-derived ricinoleate polyol, polyoxypropylene diol, and a hindered amine chain extender. Mixing ratio by weight is 100:73 for FP 2410-P and 100:82 for FP 2410-C. Mixed density is 1.05 g/cm³ at 25 °C according to ASTM D792-20. Mixed viscosity at 25 °C is 1100–1500 mPa·s for FP 2410-P and 250–450 mPa·s for FP 2410-C, as determined by rotational viscometry under ISO 3219:2021. These materials are used where vibration damping, low cure shrinkage, and reworkable assembly interfaces are required, but open processing must be controlled for ambient moisture uptake because free isocyanate reacts with water to generate carbon dioxide and reduce cured-network integrity.
Before dispensing, the A- and B-components are conditioned to 25–30 °C for 12 h in sealed containers. Vacuum de-airing of the mixed material at 5–10 mbar for 3–5 min is recommended for potting sections thicker than 5 mm. Static mixers with 20–24 elements and a mixing pressure below 1.5 MPa produce homogeneous cure; higher mixing pressure has been observed on stainless steel progressive-cavity dispensers to raise the mixed-stream temperature by 4–6 °C, reducing pot life by approximately 15%. Pot life at 25 °C for a 250 g mass is 20–30 min to reach 200% of initial viscosity for FP 2410-P, while FP 2410-C has an open time of 18–22 min at 25 °C and 50% RH before surface tack develops.
Reaction of the isocyanate prepolymer with the mixed polyol follows a second-order polyaddition profile, with gel time at 25 °C and 100 g mass of 35–45 min for FP 2410-P. At 60 °C, gel time decreases to 8–12 min. Practical handling life is defined by the time to reach 200% of initial viscosity, not gelation; in static-mixer dispensing, FP 2410-P can be processed until the mixed viscosity reaches 1400–1500 mPa·s, and FP 2410-C until 500–550 mPa·s. Humidity accelerates surface cure but consumes free isocyanate. Above 60% RH, bubbles and surface haze appear in castings unless substrates are pre-dried at 70 °C for 4 h or the resin is processed under a nitrogen blanket with dew point below -30 °C.
Section thickness controls peak exotherm and residual stress. In a 20 mm diameter potting cavity at 23 °C, peak exotherm is 32 °C; in a 50 mm diameter cavity, peak exotherm reaches 46 °C, producing transient thermal stress at the component-to-resin interface. For this reason, FP 2410-P is specified in lifts of 25–30 mm maximum when potting high-power inductors or toroidal transformers. Thinner sections cure slowly below 18 °C; the practical minimum cure temperature is 10 °C, below which chain extension becomes impractically slow and Shore A hardness remains below 45 after 24 h when measured by ASTM D2240-15.
Selection between flexible polyurethane, flexibilized epoxy, and addition-cure silicone is governed by adhesion, shrinkage, thermal-cycling recovery, and rework access. In assemblies with ceramic chip capacitors and glass diodes, rigid epoxy systems with Shore D hardness above 80 can produce solder-joint fractures after 1000 thermal cycles from -40 °C to 125 °C; FP 2410-P at Shore A 50–60 reduces transmitted stress while retaining lap shear on FR-4 laminate of 2.5–3.2 MPa according to ASTM D1002-10. Addition-cure silicone systems offer lower moisture uptake and higher continuous-use temperature, but adhesion to epoxy solder mask and PBT connectors is commonly below 1.0 MPa without an adhesion promoter, and cut-through resistance is lower. FP 2410-C provides lap shear on FR-4 of 2.0–2.8 MPa without a primer on epoxy solder mask.
Table 1 summarizes typical comparative data for the three material classes. Values are not guaranteed lot limits; they represent manufacturer technical-bulletin data and internal test reports for flexible electronic resins. Published data for this specific FP 2410 formulation is limited in open literature, so the values below should be interpreted as product-class benchmarks rather than independent verification data.
| Property | FP 2410-P / FP 2410-C | Flexibilized epoxy potting | Addition-cure silicone potting |
|---|---|---|---|
| Mixed viscosity at 25 °C | 1100–1500 / 250–450 mPa·s | 800–3000 mPa·s | 300–1000 mPa·s |
| Cured hardness | Shore A 50–60 / A 65–75 | Shore D 60–75 or Shore A 80–90 | Shore A 20–40 |
| Elongation at break, ASTM D638-14 Type IV | 150–220% / 100–150% | 5–15%, flexibilized grades 50–100% | 80–200% |
| Dielectric strength, ASTM D149-20 | 18–22 kV/mm | 16–20 kV/mm | 18–24 kV/mm |
| Water absorption, 24 h | 0.3–0.5% | 0.1–0.2% | <0.1% |
| Linear cure shrinkage | 0.2–0.4% | 0.5–1.2% | <0.1% |
| Coefficient of linear thermal expansion | 120–160 ppm/°C | 60–80 ppm/°C | 250–350 ppm/°C |
| Maximum continuous service temperature | 110–130 °C | 125–150 °C | 180–220 °C |
| Flammability rating | UL 94 V-0 at 2.0 mm | UL 94 V-0 at 3.0 mm | UL 94 V-0 at 3.0 mm |
Selective coating with FP 2410-C is recommended only when the assembly is not continuously immersed in process fluids and service temperature remains below 120 °C. For motor controllers and battery-management units, full potting is replaced by a 60–80 µm cured film applied over pre-cleaned assemblies using a four-axis selective coater fitted with a 0.25 mm needle and fluid pressure of 0.20–0.35 MPa. At 30 °C, the viscosity of FP 2410-C drops to 180–250 mPa·s, allowing consistent edge fillet formation around QFP leads without bridging. Curtain coating is not recommended because the open time at 25 °C and 50% RH is 18–22 min; after this interval, surface tack may trap airborne particulates and interfere with optical inspection.
Production lines with pneumatically actuated meter-mix dispensers have documented stringing when mixed viscosity exceeds 1600 mPa·s at 25 °C, producing stray material on connector leads. To prevent stringing, FP 2410-C is held at 30–35 °C before dispense, reducing viscosity to 180–250 mPa·s. High-humidity environments above 60% RH cause foaming in thick sections because water reacts with free isocyanate; resin containers must be purged with dry nitrogen to maintain moisture content below 0.05% by weight, determined by Karl Fischer titration according to ASTM D4672-18. On potting lines with static mixers of 20–24 elements, mixing pressure should not exceed 1.5 MPa; higher pressure creates shear heating and shortens pot life.
FP 2410-P and FP 2410-C are resistant to aliphatic hydrocarbons, mineral oil, dilute acids, and isopropanol wipe-down. They should not be specified for continuous contact with ketones, chlorinated solvents, or hot alkaline cleaning solutions at pH above 10 above 50 °C, because ester and urethane linkages hydrolyze under these conditions. Water immersion data at 25 °C show hardness retention of 85% after 1000 h, but immersion at 80 °C in deionized water reduces elongation at break from 180% to 60–80% within 500 h, as measured by ASTM D638-14 Type IV. For outdoor or high-UV applications, an opaque black or aliphatic polyurethane topcoat is required; QUV exposure per ASTM G154-23 cycle 2 for 500 h produces surface chalking and 10–15% loss of adhesion on uncoated copper.
Adhesion to bare copper is below 1.0 MPa unless an organosilane adhesion promoter or tin-plated surface is used. On 6061-T6 aluminum, lap shear values after a 24 h ambient cure are 1.8–2.4 MPa without primer; primerless peel strength after thermal cycling is below 1.0 N/mm. These limitations are relevant for conformal coating of power electronics with exposed copper bus bars, where a post-coat inspection for white watermark defects under 10× magnification is required per internal process control plan.
Electrical and compliance test data for production lots produced under ISO 9001:2015 Clause 7.5.3 document control are summarized in Table 2. The data are based on third-party reports for lots FP-2421-013 through FP-2421-019 and should not be interpreted as guaranteed values for every batch. Acceptance limits are maintained in the corresponding technical data sheet for each model.
| Requirement or test | Standard or method | Result for FP 2410 series |
|---|---|---|
| RoHS restricted substances | EU 2011/65/EU Annex II as amended by (EU) 2015/863 | Pass; Pb, Cd, Hg, Cr(VI), PBB, PBDE below quantitative limits |
| REACH SVHC content | EC 1907/2006 candidate list | No SVHC reported above 0.1% w/w |
| Flammability | UL 94 | V-0 at 2.0 mm after 7-day ambient post-cure |
| Conformal coating qualification | IPC-CC-830B / UL 746E | Pass; insulation resistance above 10⁸ Ω after moisture conditioning |
| Dielectric strength | ASTM D149-20 | 19–21 kV/mm at 2.0 mm |
| Volume resistivity | ASTM D257-19 | 1.2×10¹³ Ω·cm at 25 °C and 50% RH |
| Moisture and insulation resistance | IPC-TM-650 method 2.6.3.3 | Pass at 65 °C / 90% RH, 10 days |
| Low-temperature flexibility | ASTM D522-17 Method B, 1/8 in mandrel | No cracking at -40 °C |
The principal processing limit is exposure of uncured mixed material to ambient humidity above 65% RH, which causes micro-foam in sections thicker than 10 mm. In an 8 kW IGBT encapsulation line using FP 2410-P, a shift from open-pot manual casting to closed-loop meter-mix with nitrogen-blanketed day tanks reduced void content from 4.2% to 0.6% by volume, measured by X-ray inspection under IPC-A-610 Class 2 criteria. Similar benefits are not obtained if the resin is allowed to cool below 20 °C; viscosity rises above 2000 mPa·s, and static-mixer pressure increases to 2.0–2.4 MPa, exceeding the recommended 1.5 MPa limit.