| HS Code | 846449 |
| Product Name | Wet Electronic Isopropanol (G3-G5) |
| Chemical Name | Isopropyl alcohol (2-propanol) |
| Cas Number | 67-63-0 |
| Molecular Formula | C3H8O |
| Molecular Weight | 60.10 g/mol |
| Appearance | Colorless clear liquid |
| Odor | Mild alcoholic odor |
| Grade Range | G3-G5 |
| Purity Assay | Electronic grade, typically ≥99.9% |
| Density | 0.785 g/cm³ at 20 °C |
| Boiling Point | 82.6 °C |
| Melting Point | -89.5 °C |
| Flash Point | 12 °C closed cup |
| Viscosity | 2.4 mPa·s at 20 °C |
| Solubility | Miscible with water and many organic solvents |
| Water Content | Controlled low water content for electronic grade |
| Particle Impurities | Controlled to G3-G5 electronic-grade limits |
| Metal Ion Impurities | Controlled to G3-G5 electronic-grade limits |
As an accredited Wet Electronic Isopropanol (G3-G5) factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Wet Electronic Isopropanol (G3-G5) packaged in 4 L high-purity HDPE bottles, sealed with tamper-evident caps for safe handling and storage. |
| Container Loading (20′ FCL) | Loading Wet Electronic Isopropanol (G3-G5) into a 20-foot FCL container under controlled, compliant handling for shipment. |
| Shipping | Ship Wet Electronic Isopropanol (G3-G5) as UN1219, Isopropanol (Isopropyl alcohol), Class 3 flammable liquid, Packing Group II. Use approved flammable-liquid packaging, proper labels/markings, and follow DOT/IATA/IMDG rules. Keep containers closed, away from ignition sources, in a cool, ventilated area. This material is flammable and must be handled by trained personnel. |
| Storage | Store Wet Electronic Isopropanol (G3–G5) as a flammable liquid in a cool, dry, well-ventilated, fire-resistant area away from heat, sparks, open flames, and strong oxidizers. Keep containers tightly closed, grounded and bonded during transfer, and protected from moisture, sunlight, and contamination to maintain electronic-grade purity. Use secondary containment and comply with local flammable-liquid storage regulations. |
| Shelf Life | Wet Electronic Isopropanol (G3-G5) shelf life is 24 months from manufacture when stored sealed in original container under recommended conditions. |
Wet electronic isopropanol conforming to SEMI C18 high-purity solvent specifications is introduced after semi-aqueous post-etch residue removal on 300 mm silicon wafers. The solvent’s function in this sequence is not bulk dissolution but surface-tension modification during Marangoni drying. Tool-vendor technical bulletins for batch vapor dryers report IPA flow settings of 0.5 L/min to 2.0 L/min against filtered nitrogen flow rates of 30 L/min to 80 L/min, corresponding to a vapor-phase concentration of 1.0 vol% to 4.0 vol%. Liquid-phase rinse mixtures are more variable: some immersion tools specify 5 vol% to 15 vol% G4-grade IPA in deionized water, while single-wafer spin processors rely on vapor exposure rather than bulk blending. The production sequence includes a heated post-etch residue removal step using ammonium-hydroxide–hydrogen peroxide–water mixtures, a cascading deionized water rinse, and a final IPA vapor exposure with gradual wafer withdrawal speed below 2.0 mm/s to maintain meniscus stability. Equipment-specific failure modes observed on single-wafer spray processors include condensate dripping from the exhaust collar when IPA flow exceeds 2.5 L/min, causing non-volatile residue transfer onto the wafer edge, and batch-to-batch variation in drying marks when vaporizer temperature drifts below 120 °C. Published data for the exact relationship between vaporizer temperature drift and drying mark density on 300 mm single-wafer tools is limited, so current fab qualification relies on patterned wafer defect inspection rather than bulk solvent assay alone. Cleanroom compliance is governed by ISO 14644-1 Class 3 particle limits, while solvent quality for cation-sensitive front-end layers requires G4 or G5 grades with metal impurities controlled below the limits set in SEMI C18. The terminal finished product is a cleaned 300 mm silicon wafer with exposed low-k dielectric or gate oxide surfaces, ready for subsequent chemical vapor deposition or atomic layer deposition.
Flux residue removal from copper pillar and micro-bump arrays after lead-free reflow uses G4-grade wet electronic isopropanol as a carrier solvent in spray-in-air or single-wafer brush cleaning. The cleaning agent is not applied neat; documented process conditions specify 15 vol% to 30 vol% IPA in deionized water with 0.1 wt% to 0.5 wt% nonionic wetting agent, maintained at 45 °C to 60 °C. Higher IPA fractions above 40 vol% are avoided because they reduce dielectric surface energy to a point where re-deposited tin-oxide fines adhere more strongly to the passivation sidewall. The downstream process route in wafer-level packaging includes copper pillar electroplating, lead-free reflow at 245 °C to 260 °C, and conveyorized spray cleaning with high-pressure fan nozzles at 0.6 MPa to 1.2 MPa. After spray cleaning, a deionized water rinse is followed by a low-IPA vapor dry. Process conflicts arise at bump pitches below 40 µm, where capillary retention of flux residues between adjacent copper pillars requires increased mechanical shear but also raises the risk of undercut at the solder-resist interface. Published data for the exact lower flux dissolution limit under high-density copper pillar arrays with pitch below 30 µm is limited, and process qualification commonly proceeds coupon-level rather than full-wafer. Acceptance testing follows IPC J-STD-001H cleanliness criteria, with ionic residue verified by IPC TM-650 2.3.25 ROSE testing and surface insulation resistance monitored by IPC TM-650 2.6.3.7. The terminal finished product is a wafer-level chip-scale package with copper pillar interconnects and reflowed solder caps, prior to die singulation.
In flat-panel display lithography, G3-grade wet electronic isopropanol is metered directly into photoresist edge bead removal and backside rinse nozzles on coater/developer tracks. The addition ratio in edge bead remover solutions typically ranges from 20 vol% to 40 vol% IPA in propylene glycol monomethyl ether acetate, with the balance adjusted to photoresist viscosity: a lower IPA fraction near 20 vol% is used for thick organic planarization resists, while a higher fraction near 40 vol% is applied to thin high-resolution top-coat resists. The downstream process operates at 800 rpm to 1,500 rpm spin speed during edge bead removal, with backside rinse nozzles delivering 30 mL/min to 60 mL/min of IPA solution to the reverse side of glass substrates. On production lines for Gen 8.5 and Gen 10.5 glass, a recurring bottleneck is edge residue re-deposition when the exhaust balance drifts, causing the IPA concentration to fall below 15 vol% at the coating edge; this is corrected by mass-flow calibration of the EBR pump and replacement of polypropylene tubing with fluoropolymer lines to reduce solvent evaporation. Compliance for flat-panel fabs is evaluated under ISO 14644-1 Class 5 cleanroom conditions, and the solvent must meet SEMI C18 heavy-metal and particle specifications to avoid pixel-level defects. The terminal finished product is a developed TFT backplane or OLED substrate with defined photoresist patterns ready for dry etch or lift-off.
The final rinse after aqueous cleaning of photomask blanks and pellicle frames is G5-grade wet electronic isopropanol. The typical process uses a 50 vol% to 100 vol% IPA ratio in deionized water, depending on the pellicle membrane material; the upper range is reserved for static-dissipative polymer frames because water retention in frame pores produces outgassing defects under 193 nm exposure. The production sequence includes immersion in dilute ammonium hydroxide–hydrogen peroxide cleaning solution, deionized water overflow rinse, and final spin drying with heated G5 IPA at 30 °C to 40 °C. In mask shops, defect inspection is performed after cleaning with laser scattering tools calibrated to detect particles down to 20 nm; any IPA batch with particles above 0.5 particles/mL at 0.2 µm size threshold is rejected because it causes printable reticle defects. Published data for sub-20 nm particle contributions from pellicle frame adhesives in final IPA rinse is limited; fabs therefore qualify each adhesive batch by soak extraction. Process control points include point-of-use filtration through 0.05 µm PTFE membrane filters and conductivity monitoring of the final rinse line. Applicable standards include ISO 14644-1 Class 2 for mask handling areas and SEMI C18 for G5 solvent purity. The terminal finished product is a patterned photomask or pellicle assembly qualified for 248 nm or 193 nm lithographic exposure.
For released microelectromechanical systems structures, the final rinse after sacrificial oxide etching is switched to G4-grade wet electronic isopropanol to reduce capillary force and stiction. In this application the solvent is used undiluted, corresponding to a 100 vol% addition ratio, because any water fraction above 1 vol% increases meniscus pressure during drying and causes cantilever collapse. The production process follows sacrificial layer etching in hydrofluoric acid vapor or buffered oxide etch, a deionized water rinse, then an immersion or vapor exposure to IPA at 25 °C to 40 °C, followed by controlled evaporation at 30 °C to 40 °C under reduced pressure or heated nitrogen. Process conflicts appear when the IPA bath is not changed frequently; absorbed water accumulates to 0.5 vol% to 1.0 vol% after repeated wafer transfers, and stiction-related yield loss rises. Equipment-specific controls include in-line Karl Fischer titration of the rinse bath and point-of-use 0.05 µm filtration to prevent particle deposition on released beams. Applicable contamination standards are SEMI C18 for solvent purity and ISO 14644-1 Class 5 or stricter for front-end MEMS cavities. The terminal finished product is a released MEMS die or sensor wafer, such as inertial measurement unit structures, prior to hermetic packaging.
High-purity electronic-grade isopropanol is used as a final cleaning solvent for germanium, silicon, and chalcogenide optical windows before ion-assisted electron-beam coating. The solvent is applied in a two-step ratio: 70 vol% IPA in deionized water for manual or brush cleaning of water-soluble polishing residues, followed by 100 vol% G5 IPA in vapor degreasing to remove adsorbed moisture and low-molecular-weight organics. The downstream production route includes precision lapping, ultrasonic cleaning in an aqueous surfactant bath, IPA rinse, and vacuum oven bake at 60 °C to 80 °C prior to deposition of anti-reflective films. Surface cleanliness is verified by contact-angle measurement and lamp-based particle inspection; a contact angle below 10° after final drying indicates residual hydrocarbon contamination. Optical coating chambers require substrate residual surface contamination below 0.1 µg/cm² for adhesion of magnesium fluoride or multilayer dielectric stacks; published data for this specific contamination threshold in chalcogenide materials is limited and is typically established by in-fab witness platelet tests. Applicable standards include ISO 10110-7 for surface imperfection tolerances, ISO 14997 for total scattering measurement, and SEMI C18 for high-purity solvent grade. The terminal finished product is a coated infrared optical element or laser window qualified for low-stress vacuum or aerospace optical assemblies.
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Wet Electronic Isopropanol (G3–G5) is a family of liquid 2-propanol grades identified as G3, G4, and G5. The base constituent is 2-propanol, CAS 67-63-0, supplied with higher control over trace metals, anions, water, and particles than technical or laboratory grades. The grade designation does not alter the solvent identity; it sets a contamination budget matched to front-end cleaning and drying steps of increasing defect sensitivity. Bulk assay is controlled at not less than 99.8% by gas chromatography with flame ionization detection, and the residual fraction is predominantly water and non-volatile residue. The G5 grade carries the most restrictive particle and cation budget, while G3 is used where the defect tolerance is closer to conventional electronic-grade solvent limits. The material is applied in immersion rinsing, vapor-assisted drying, edge-bead removal, and solvent delivery, where its water miscibility and surface-tension behavior reduce pattern-collapse loss and water-mark formation. Compliance is evaluated against SEMI C21 as the base electronic-grade isopropanol specification, supplemented by supplier lot certificates for subgrade-specific metal and particle limits.
Packaging configurations include 4 L fluoropolymer bottles, 20 L stainless steel canisters, and 200 L drum systems; larger containers are delivered under dry nitrogen pressure. The material is filtered during dispensing through point-of-use membranes rated at 0.05 µm or tighter. Automated chemical distribution systems use low-pulsation bellows or diaphragm pumps to avoid particle generation and flow instability. In high-volume fabs, the dispense line is continuously recirculated with a small bleed to maintain particle count and to prevent stagnant zones that accumulate valve-wear debris and polymer extractables.
Trace-metal carryover is controlled at the purification stage and at the point of dispense. The critical elements are sodium, potassium, iron, calcium, magnesium, aluminum, zinc, and copper; their individual maxima are stated on the certificate of analysis because process sensitivity is element-specific and node-dependent. Inductively coupled plasma mass spectrometry is used after controlled evaporation of the isopropanol matrix; because the matrix is relatively volatile, detection limits below 0.01 µg/L are achievable in cleanroom laboratories. G3 material is aligned with bulk electronic solvent limits, whereas G4 and G5 impose successive reductions for the critical cation set. Published data for this specific configuration is limited outside supplier certificates; material qualification therefore requires comparing the lot certificate with the front-end defect budget and with the analytical reporting limit of the process metrology. In post-etch rinse loops, cation carryover is also influenced by the wetted path: stainless steel components with incomplete electropolish can release iron, and elastomer seals can release calcium or magnesium foulants that appear in the solvent after static contact.
Grade selection is governed by the receiving tool’s particle and metal specifications, not by general purity preference. G3 is specified for mature front-end cleaning and for back-end solvent applications where the wafer surface is not exposed after gate oxide formation. G4 is assigned to post-metal cleaning and advanced packaging flows with moderate defect sensitivity. G5 is reserved for critical pre-gate cleaning, high-aspect-ratio drying after wet etch, and any application where single-particle or trace-cation events become yield-limiting. This hierarchy reduces solvent cost by matching purity to the device layer, but it also requires supply-chain segregation: refitting a dispense line from G3 to G5 without adequate purge can contaminate the high-purity lot with residues left in the line.
Physical property data for wet electronic isopropanol are consistent with high-purity 2-propanol. At 20 °C, the density is 0.785 g/cm³, the surface tension is 21.7 mN/m, and the dynamic viscosity is 2.04 mPa·s. The vapor pressure at 20 °C is 4.4 kPa, and the closed-cup flash point is 12 °C. The lower flammable limit in air is approximately 2.0% by volume and the upper flammable limit is approximately 12.7% by volume. These values are standard reference data for 2-propanol and are used for pump sizing, meniscus modeling, and ventilation-rate calculations.
| Property | Value | Method or reference |
|---|---|---|
| Density at 20 °C | 0.785 g/cm³ | ASTM D4052 |
| Boiling point at 101.325 kPa | 82.5 °C | distillation |
| Flash point closed cup | 12 °C | ASTM D56 |
| Surface tension at 20 °C | 21.7 mN/m | ring method |
| Vapor pressure at 20 °C | 4.4 kPa | manometric |
| Viscosity at 20 °C | 2.04 mPa·s | ASTM D445 |
Marangoni drying relies on the surface-tension gradient between water and isopropanol at the moving meniscus. Ultrapure water at 20 °C has a surface tension of 72.8 mN/m. Dilution with isopropanol reduces surface tension to approximately 30 mN/m at a few volume percent, and the spatial gradient produces a shear stress directed from the low-surface-tension region to the high-surface-tension region. The gradient drains rinse water from high-aspect-ratio trenches without mechanical contact. Process performance depends on the uniformity of vapor delivery, wafer withdrawal speed, and the ratio of isopropanol vapor to water vapor in the tool. High withdrawal speed increases film thickness and may overwhelm the Marangoni force, leaving residual liquid. Excessive isopropanol condensation can create localized liquid pools that dry by evaporation and leave non-volatile residue. G4 and G5 grades are therefore characterized by low non-volatile-residue limits, and the solvent is selected not only for surface-tension reduction but also for its post-evaporation residue contribution. On production tools with recirculating rinse-water baths, isopropanol concentration in the bulk bath is controlled to maintain the flash point and megasonic response of downstream cleaning modules.
In immersion particle removal, wet electronic isopropanol is mixed with ultrapure water at low volume fractions to lower the contact angle on hydrophobic silicon and low-k films. The shift improves the ability of megasonic transducers operating at frequencies between 700 kHz and 1 MHz to dislodge particles from the substrate. The benefit is mechanical rather than chemical; no significant oxide dissolution or polymer attack is expected at ambient temperature. Batch-to-batch particle burden is a separate control variable: point-of-use filtration through 0.05 µm fluoropolymer membranes is standard because an elevated particle count in the solvent lot can add more defects than are removed from the wafer. In high-volume lines, recirculation skids monitor differential pressure across the particle filter, and a sustained increase is traced to the dispensed lot. For batch immersion tools with volumes above 50 L, passive evaporation shifts the isopropanol fraction and can change cleaning uniformity; closed-loop spiking based on density or refractive index is used to hold the solvent ratio within the tool’s operating band.
Water in isopropanol acts not only as a residue after evaporation but also as a reaction participant in moisture-sensitive uses. Low-water grades are specified for adhesion-promotion solvents and carrier solvents where organosilanes or isocyanates can hydrolyze before film formation. Exposure to ambient air with relative humidity above 60% raises the water content of open dispense reservoirs, especially in spin-coater canisters with intermittent draw. Point-of-use moisture monitoring or dry nitrogen blanketing is required when the product is used at the low-water limit. In direct solvent replacement, technical-grade isopropanol may contain water above 0.5%, while the electronic grades are dried below 0.2% or lower depending on subgrade. The residual water level is reported on the certificate by Karl Fischer titration with ASTM E203 as the reference method.
Compared with technical-grade isopropanol, wet electronic product adds particle, trace-metal, and packaging controls. Technical-grade material may have no sub-micrometer particle specification and may be packaged in containers that contribute extractables. Compared with ACS reagent-grade isopropanol, the electronic product is controlled for particle counts and for the individual cation set relevant to patterned-wafer defects. The solvent identity remains 2-propanol; the difference lies in filtration, drying, dispense-packaging, and analytical traceability. The G3–G5 range is therefore a supply-chain specification hierarchy rather than a chemical modification of the solvent molecule.
The following analytical controls are commonly referenced on certificates for wet electronic isopropanol. End-user acceptance should be based on the lot certificate and on the process node defect budget; method codes may vary by supplier.
| Control parameter | Typical reference method | Application relevance |
|---|---|---|
| Assay by gas chromatography | GC-FID | Solvent identity and non-volatile residue budgeting |
| Water content | ASTM E203 Karl Fischer | Moisture-sensitive process compatibility |
| Non-volatile residue | ASTM D1353 | Post-evaporation residue defectivity |
| Color, APHA | ASTM D1209 | Bulk organic contamination screen |
| Density | ASTM D4052 | Pump calibration and flow metering |
| Flash point | ASTM D56 | Flammability classification and storage |
| Particle count ≥0.20 µm | LPC | Defect density after drying and cleaning |
Wet-bench enclosures are ventilated to keep isopropanol vapor below the lower flammable limit of approximately 2.0% by volume. Because the vapor is denser than air, exhaust take-offs are placed near the solvent surface and at the rear of the process chamber. Storage follows NFPA 30; transfer lines are grounded because isopropanol has low conductivity and can accumulate static charge. Dispense vessels are constructed of high-density polyethylene, polytetrafluoroethylene, or electropolished stainless steel, with elastomer seals limited to fluoroelastomer or perfluoroelastomer grades to reduce extractable release and particle shedding. The product is not compatible with strong oxidizers; spill response uses non-combustible absorbents rated for polar solvents. In heated baths, the local exhaust velocity is set by the equipment supplier and should be checked after any change in tank temperature or lid position.
Peroxide accumulation is a slow storage concern when isopropanol is held for extended periods in partially full containers with oxygen-containing headspace. Storage in opaque containers under dry nitrogen reduces the peroxide formation rate; when peroxide testing is required, lot acceptance is verified by iodometric titration and stated as a maximum peroxide concentration on the certificate. Containers are kept closed when not in use to minimize moisture absorption and airborne particulate deposition. Under nitrogen blanketing and controlled filtration, open-container shelf life is limited by the tool’s particle-count requirement rather than by gross solvent degradation.