| HS Code | 683656 |
| Product | Silver Conductive Adhesive |
| Appearance | Silver paste |
| Volume Resistivity | 0.00001 ohm·cm |
| Thermal Conductivity | 1.5 W/m·K |
| Viscosity | 25000 cP |
| Curing Temperature | 150 °C |
| Curing Time | 30 minutes |
| Adhesion Strength | 5 MPa |
| Shear Strength | 8 MPa |
| Operating Temperature Range | -55 °C to 200 °C |
| Shelf Life | 6 months at 25 °C |
| Silver Content | 75 wt% |
| Specific Gravity | 3.2 |
As an accredited Silver Conductive Adhesive factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Silver Conductive Adhesive is packaged in a 5g syringe, sealed in a foil pouch, with application tips. |
| Container Loading (20′ FCL) | Silver Conductive Adhesive loaded in 20′ FCL: packed in sealed drums/cartons, palletized, secured, with proper labeling and ventilation. |
| Shipping | Ship Silver Conductive Adhesive as hazardous material, depending on formulation—often UN 1993 Flammable Liquid, N.O.S. (contains solvent) or UN 3082 Environmentally Hazardous Substance. Use UN-approved leak-proof packaging with absorbent material. Include SDS, proper labeling, and emergency response information. Ground transport recommended; air freight requires special authorization. |
| Storage | Store Silver Conductive Adhesive in its original, tightly sealed container in a cool, dry area between 15–25°C (59–77°F). Keep away from direct sunlight, heat sources, and open flames. Avoid exposure to moisture and humidity. Ensure adequate ventilation in storage areas and check the manufacturer’s expiration date before use. |
| Shelf Life | Typical shelf life is 6–12 months when stored unopened in a cool, dry place at room temperature. |
In discrete semiconductor assembly, silver conductive adhesive is deposited onto copper alloy or silver-plated lead frames by a positive-displacement auger pump fitted with a 25–30 gauge needle, with dispensing cycle times below 120 ms per unit to match high-speed indexing tables. The cured bond line for small-signal packages is held between 15 µm and 40 µm; a dispensed mass of 0.15–0.50 mg per 1.0×1.0 mm die pad yields a coverage ratio of 0.15–0.50 mg/mm². Because the one-component paste is supplied fully formulated, no separate mixing ratio applies in standard die-attach dispensing; the relevant formulation addition level is the applied mass per pad, and for jet dispensing the paste may receive <1.0 wt% low-boiling diluent to reduce plateau viscosity by 20–30%. Regulatory compliance for the final semiconductor package depends on RoHS Directive 2011/65/EU Annex II material restrictions, REACH Regulation (EC) No 1907/2006 Article 33, and the moisture/reflow sensitivity classification of IPC/JEDEC J-STD-020F; die shear adhesion is evaluated according to MIL-STD-883 TM 5011, and lap shear on bare copper coupons follows ASTM D1002. Downstream process controls include stepped cure profiles from 70°C to 150–175°C over 60–120 minutes, with a final cooling ramp below 5°C/min to limit thermal stress at the die-adhesive interface; automated die attach systems set placement force between 0.5 N and 1.5 N, and vacuum-cured lots are used when radiographic void area exceeds 10%. Terminal product types in this sub-segment are discrete small-signal packages including SOT-23, SOD-323, SC-88, surface-mount power modules, and silver-filled LED lead-frame attach. Process incompatibilities include sulfur-bearing ambient atmospheres that accelerate silver sulfidation at exposed bond-line edges and amine-containing flux residue that can initiate premature crosslinking during storage or dispensing.
Heterojunction and shingled photovoltaic module assembly introduces a process ceiling of 180°C because hydrogenated amorphous silicon passivation layers on 210 mm half-cells begin to lose passivation quality at higher thermal exposure; silver conductive adhesive is therefore deposited as a solder replacement material for ribbon attach at a line width of 0.4 mm to 0.8 mm and a wet film thickness of 30 µm to 50 µm. The formulation addition ratio, measured as wet adhesive coverage, is maintained at 0.8–1.5 mg per linear millimeter of 0.5 mm wide interconnection; silver flake loading remains in the 75–85 wt% range to keep volume resistivity below 1×10⁻⁴ Ω·cm after cure. Panel-level compliance is assessed under IEC 61215-1:2021 and IEC 61730-1:2023 for module performance and safety, with material-level declarations requiring RoHS Directive 2011/65/EU Annex II and REACH Regulation (EC) No 1907/2006 data. Downstream production equipment includes closed-cell stencil print heads with 40–60 µm emulsion thickness, ribbon singulation and placement on the wet adhesive, and belt lamination cure at 150°C to 180°C for 15–60 seconds; void formation at the cell-to-ribbon interface is controlled below 2% by maintaining squeegee pressure between 4–7 N/cm and verifying wet thickness with a non-contact laser profiler every 30 minutes. Terminal product types are busbar-less shingled modules using 1/4-cut HJT cells, IBC cell strings, and low-temperature back-contact modules where solder reflow above 220°C is prohibited. Operational boundaries include frozen one-part material stored below −20°C before printing and 30–60 minutes ambient thawing before use; prolonged exposure above 25°C increases solvent evaporation and shifts rheology outside the stencil-cleaning window.
Stencil printing on a 125 µm heat-stabilized PET web requires a silver conductive adhesive with a plateau shear viscosity below 30,000 cP at 25°C and a post-print open time exceeding 45 minutes to avoid screen clogging before component placement. The adhesive addition ratio for 0402 passive attach pads is 0.10–0.20 mm³ per pad, obtained with a 100 µm stainless steel stencil and aperture area ratio above 0.66; formulations with silver filler loading of 70–80 wt% are specified because lower loadings raise sheet resistance above 50 mΩ/sq/mil. Conformity for wearable flexible hybrid electronics references ISO 10993-5:2009 for in vitro cytotoxicity and ISO 10993-10:2010 for skin sensitization when the circuit contacts intact skin, while RoHS Directive 2011/65/EU Annex II and REACH Regulation (EC) No 1907/2006 govern restricted-substance declarations; solder-free assembly is covered by IPC-A-610 Class 3 workmanship for flexible substrates and IPC/JPCA-4204 for printed electronics reliability. Downstream production lines combine a four-post stencil printer with vacuum table, a chip shooter placing 15,000 components per hour, and a convection tunnel oven curing at 80°C to 120°C for 10–30 minutes because PET distortion occurs above 120°C. Terminal products include epidermal biosignal monitors, RFID inlays on thermoplastic substrates, and printed heat-seal connectors for e-textile circuits. Overcure conditions above 130°C or exposure to amine-based z-axis tapes produce edge cracking at the adhesive-PET interface, and steady-state relative humidity above 60% during storage increases bulk resistivity by 20–40% due to moisture uptake in the cured epoxy matrix.
In high-vibration engine compartment environments, silver conductive adhesive substituted for SAC305 solder at lead-frame-to-PCB ground pads eliminates the 260°C reflow excursion and reduces intermetallic fatigue at the copper interface. The two-component adhesive is mixed at a Part A:Part B weight ratio of 10:1 and dispensed at a bond-line thickness of 75 µm to 150 µm; silver filler loading is maintained between 75 wt% and 80 wt%, and cured lap shear on zinc-nickel-plated steel is evaluated per ASTM D1002-10(2019) with a minimum acceptance value of 7 MPa. Conformity for automotive sensor modules is managed under IATF 16949:2016 process control, AEC-Q100 Rev H qualification for active components, IPC-A-610 Class 3 assembly criteria, and RoHS Directive 2011/65/EU Annex II; customer-specific PV test plans commonly add thermal shock cycling from −40°C to 150°C for 1,000 cycles with electrical resistance drift below 10%. Downstream manufacturing lines use vacuum-assisted syringe dispensing through 0.25 mm needles followed by component placement with 0.2–0.5 N force and one-step cure at 150°C for 30 minutes; inline X-ray inspection rejects units where void area exceeds 10% of the bond area or where adhesive bleedout extends beyond 0.3 mm onto adjacent pads. Terminal product types include ABS wheel-speed sensors, engine control module grounding straps, electronic brake actuator connectors, and airbag igniter current-carrying bonds. The material is incompatible with silicone-controlled release films that migrate into uncured epoxy and with ambient sulfur-crosslinked rubber gaskets that initiate silver sulfide creep at exposed pad edges under 85°C/85% RH aging.
RF power stage assembly demands a conductive adhesive bond that simultaneously presents volume resistivity below 1×10⁻³ Ω·cm and thermal conductivity above 2.0 W/mK to limit channel temperature rise in GaN-on-SiC power transistors. The adhesive addition ratio for die attach is 0.05–0.15 µL per mm² of die area, spread to a uniform bond-line of 20 µm to 50 µm under a die placement force of 1.0–2.5 N; formulations carrying 80–90 wt% silver flake with a thixotropic index of 4.0–6.0 are preferred for jet dispensing without tailing. Qualification protocols cite JEDEC JESD22-A104 for temperature cycling, MIL-STD-883 TM 5011 for die shear, and RoHS Directive 2011/65/EU Annex II with REACH Regulation (EC) No 1907/2006 for restricted-substance compliance; thermal interface performance is measured by laser flash per ASTM E1461. Downstream process equipment includes auger and piezoelectric jet dispensers, closed-loop tool heating to 70–90°C for viscosity stability, and vacuum bake ovens ramping at 3–5°C/min to 175°C for 60 minutes to reduce void density. Terminal products are GaN power amplifier modules for 32T32R massive MIMO base stations, LDMOS transmitter output stages, and millimeter-wave front-end blocks where a low-cure adhesive eliminates the 260°C solder reflow that damages pre-mounted plastic filters. Bond-line voids above 5% measured by X-ray require batch quarantine because localized thermal runaway at 10 W/mm² power density shifts insertion loss by more than 0.1 dB.
Disposable ECG electrode manufacture screen-prints a silver conductive adhesive onto Ag/AgCl-coated carbon film at a wet film thickness of 50 µm to 100 µm, then laminates the silver-plated metal eyelet over the printed pad to establish a low-polarization current path. The adhesive addition level is controlled by coating weight after drying at 120–250 g/m²; silver filler loading falls between 50 wt% and 70 wt% because higher metal content degrades flexural stability of the die-cut electrode substrate. Biocompatibility conformance for skin-contact devices follows ISO 10993-1:2018, ISO 10993-5:2009 for cytotoxicity, and ISO 10993-10:2010 for irritation and skin sensitization; electrode performance is evaluated per ANSI/AAMI EC12:2000(R)2015 for defibrillation recovery and DC offset voltage. Downstream processing includes rotary screen printing at 20–35 m/min, forced-air drying at 80–100°C for 5–15 minutes, high-speed die cutting, snap assembly, and wet-gel application; inline four-terminal resistance testing rejects electrodes with dry-film sheet resistance above 1 Ω/sq/25 µm. Terminal product types are disposable resting ECG/EKG electrodes, ambulatory Holter monitor electrodes, and transcutaneous electrical nerve stimulation pads. Operational incompatibilities include ethylene oxide sterilization of assembled electrodes because residual moisture accelerates silver chloride layer dissolution, and prolonged storage above 40°C increases direct-current offset voltage beyond the AAMI EC12 limit.
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SCA-8001 is a single-component, silver-flake-filled epoxy conductive adhesive supplied as a thixotropic paste for low-temperature electronic interconnect, die-attach, and shielding applications. The formulation contains 82 wt% silver flake with a D90 particle size of 12 µm dispersed in a bisphenol-F epoxy matrix. As-supplied viscosity at 25 °C and 5 s⁻¹ is 18,000 mPa·s measured by rotational rheometry in accordance with ISO 3219-1:2021. After cure at 150 °C for 30 min, the bulk volume resistivity is 2 × 10-4 Ω·cm per ASTM D257-14. The single-component format eliminates mixing variability associated with two-part silver epoxies, but it imposes frozen storage and thaw-cycle handling constraints. The cured adhesive contains no intentionally added lead, cadmium, mercury, or hexavalent chromium and is formulated to comply with the substance restrictions specified in EU RoHS Directive 2011/65/EU Annex II.
| Property | Test method | Measurement condition | Typical value |
|---|---|---|---|
| Silver content | ISO 11358-1:2022 | 25–600 °C, N2 | 82 wt% |
| Viscosity | ISO 3219-1:2021 | 25 °C, 5 s⁻¹ | 18,000 mPa·s |
| Thixotropic index | ISO 3219-1:2021 | Ratio at 1 s⁻¹/10 s⁻¹ | 4.2 |
| Volume resistivity | ASTM D257-14 | Cured 150 °C / 30 min | 2 × 10-4 Ω·cm |
| Lap shear, anodized Al 6061 | ASTM D1002-10(2019) | Bond line 75 µm | 10.3 MPa |
| Thermal conductivity | ASTM D5470-17 | 60 µm bond line | 3.2 W/m·K |
| Glass transition temperature | ISO 11357-2:2020 | DSC, 10 K/min | 112 °C |
| Outgassing, total mass loss | ASTM E595-15 | 125 °C / 24 h | 0.35% |
| Ionic contamination | MIL-STD-883 Method 5011.5 | Aqueous extraction | <10 ppm each Na⁺, K⁺, Cl⁻ |
The frozen paste must be held at -40 °C to -20 °C in sealed syringes or jars; supplier shelf life at -40 °C is 6 months. Before use, the container is thawed at 25 °C for 4 h with the closure intact. Opening a cold container in uncontrolled humidity deposits condensation on the paste surface; this moisture is transported into the bond line during dispense and appears as voiding after cure. Pot life after thaw is 8 h at 25 °C and 24 h at 10 °C. The viscosity at the end of pot life rises to approximately 32,000 mPa·s, and the shear-thinning recovery time lengthens beyond 20 s, producing tailing on 0.4 mm pitch pads. The paste exhibits a yield stress near 220 Pa at 25 °C; below this stress, it does not slump on 0.25 mm pads. Automated dispensing lines operating with an auger valve, 22-gauge tapered needle, 45 psi back pressure, and 0.8 mm/s needle speed maintain deposit-weight variation below ±4% on 300 mm substrates when paste temperature is controlled at 25 ± 1 °C. When ambient relative humidity exceeds 60%, substrates are pre-dried at 80 °C for 2 h and held under dry nitrogen until dispense, a handling threshold consistent with the moisture-control logic of IPC-J-STD-033B.1.
The cure reaction is an epoxy crosslinking reaction; differential scanning calorimetry at 10 K/min per ISO 11357-1:2016 gives an onset of 118 °C and an exothermic peak at 155 °C. Isothermal cure at 150 °C for 30 min reaches 92% conversion, while 175 °C for 15 min reaches 95% conversion. A low-temperature schedule at 120 °C for 60 min is available for heat-sensitive substrates but reduces lap shear by approximately 20% relative to the 150 °C schedule. A two-step profile of 100 °C for 20 min followed by 150 °C for 30 min reduces void area in 5 mm × 5 mm die bond lines from approximately 5% to below 1%. Outgassing after full cure is 0.35% total mass loss and 0.08% collected volatile condensable material per ASTM E595-15. A vacuum release step at 1 kPa absolute pressure during the first 5 min of the cure ramp further suppresses voiding under large-area die.
A reflowed SAC305 solder joint forms a metallurgical bond through tin-copper intermetallic formation at the pad surface, whereas SCA-8001 creates electrical continuity through discrete silver flake contacts held in compression by the cured polymer network. The bulk resistivity of 2 × 10-4 Ω·cm is approximately one order of magnitude higher than the 1.5 × 10-5 Ω·cm typical of SAC305, and the adhesive is not specified for continuous current densities above 1 A/mm² because contact-resistance drift under high current load has not been qualified. The primary advantage is thermal budget: SCA-8001 cures below 180 °C, while SAC305 reflow requires a peak temperature near 235–250 °C. The adhesive also accommodates moderate CTE mismatch through polymer compliance rather than through metallic ductility, which reduces the risk of brittle fracture on low-modulus substrates.
Relative to two-component silver flake epoxies, SCA-8001 eliminates mixing-induced variability and permits air-free packaging; however, the one-component format requires frozen storage and a controlled thaw cycle. Relative to pressureless sintered silver pastes, SCA-8001 requires no 250 °C drying profile and no pressure-assisted densification, but its bulk resistivity remains approximately 5 times higher than a well-sintered silver network. In comparison with carbon-filled systems, the silver flake network reduces resistivity by several orders of magnitude and improves thermal transport, but the material cost is higher and cured-joint rework is more aggressive.
| Property | SCA-8001 | SAC305 solder | Carbon-filled epoxy |
|---|---|---|---|
| Bulk volume resistivity | 2 × 10-4 Ω·cm | 1.5 × 10-5 Ω·cm | 1 × 10¹ Ω·cm to 1 × 10² Ω·cm |
| Processing temperature | 150 °C / 30 min | 235–250 °C reflow | 120 °C / 30 min |
| Thermal conductivity | 3.2 W/m·K | 58 W/m·K | 0.8 W/m·K |
| Lap shear, aluminum | 10.3 MPa | 35 MPa | 4 MPa |
| Rework route | Heat above 120 °C plus mechanical peel | Flux-assisted hot gas rework | Solvent swell and mechanical peel |
Lap-shear response is surface-finish dependent. On anodized Al 6061, the average lap shear is 10.3 MPa; on electroless nickel immersion gold, the value is 8.5 MPa; on mechanically abraded copper, the value is 7.2 MPa, all tested per ASTM D1002-10(2019) with a 75 µm bond-line thickness. Failure modes are mixed cohesive and interfacial, with cohesive failure becoming dominant on anodized aluminum as the cured adhesive modulus exceeds 2.8 GPa. The product does not require a primer on ENIG or anodized aluminum, but bare copper surfaces benefit from a benzotriazole-type anti-tarnish passivation before dispense to prevent interfacial corrosion under humid bias. The lower lap shear on bare copper is associated with surface oxide growth after abrading; the oxide layer weakens adhesive-to-pad contact and must be controlled by passivation or immediate processing.
Thermal conductivity is 3.2 W/m·K at a 60 µm bond line per ASTM D5470-17. Thermal impedance for that bond line is approximately 0.19 cm²·K/W. A comparable 60 µm SAC305 solder bond line has an impedance near 0.010 cm²·K/W because the solder thermal conductivity is approximately 58 W/m·K. The adhesive is therefore not a drop-in replacement for solder in power devices where junction-to-case thermal budgets are below 0.5 °C/W; however, in low-power assemblies where the die dissipates less than 1 W and the bond-line area exceeds 25 mm², the thermal penalty remains within typical package derating margins. Bond-line thickness is the controlling variable: increasing the bond line from 25 µm to 100 µm raises thermal impedance from approximately 0.08 cm²·K/W to 0.31 cm²·K/W. Dispense programs must therefore maintain a uniform bond line and avoid die tilt; optical measurement of bond-line thickness on production assemblies shows a typical range of ±8 µm across a 5 mm × 5 mm die.
Published insertion-loss data for this specific formulation at 10 GHz is limited; therefore no numerical qualification is provided for radio-frequency signal integrity. The low-frequency electrical path is governed by percolation rather than bulk metallic conduction, and the cured adhesive exhibits a positive temperature coefficient of resistance below 0.004 /K over -40 °C to 125 °C. Silver migration resistance under humid bias is tested in accordance with IPC-TM-650 2.6.14 on 0.25 mm spaced comb patterns; the product passes at 85 °C/85% RH with a 50 VDC bias for 1000 h when the cured adhesive is fully cured and free of ionic residues. The same test reveals that incomplete cure or residual flux contamination from prior assembly operations accelerates dendritic growth, so process control at the dispense and cure stages is electrically relevant.
On an automatic stencil printer with a 0.125 mm laser-cut stencil and 70 Shore A metal squeegee, SCA-8001 prints reliably at squeegee speeds from 50 mm/s to 150 mm/s and a snap-off distance of 0.5 mm. The thixotropic index of 4.2 permits aperture release for pad pitches down to 0.3 mm, but print quality deteriorates when the paste temperature exceeds 27 °C because the recovery time after shear increases to 18 s and the slump ratio exceeds 10%. On a production line producing 3000 boards/day, the practical stencil life is 8 h; after this period, residual paste on the stencil underside accumulates silver flakes and generates bridging defects. Dry-wipe cycles every 5 boards and a solvent-wipe cycle every 50 boards maintain deposit-volume CpK above 1.33 for 0.5 mm × 0.25 mm apertures. Aperture fill factor remains above 0.95 after 30 prints when the paste temperature is held at 25 ± 1 °C and the print head is fitted with a closed-loop squeegee pressure control.
Uncured paste is removed with acetone or methyl ethyl ketone; the substrate is then rinsed with isopropanol and dried at 60 °C for 30 min. Fully cured adhesive requires heating above its glass transition to 120 °C followed by gentle mechanical wedge separation. Aggressive acid strippers are incompatible because they attack the silver flake and leave conductive residues. Rework of a cured bond line under a large die is not recommended when the die area exceeds 10 mm × 10 mm; the required shear force often exceeds 15 kg and can damage the die edge. Reworked pads require careful solvent cleaning to remove residual silver particles before re-dispense, because loose conductive debris can create shorting paths between adjacent pads on 0.3 mm pitch designs.
The cured adhesive is stable in air from -55 °C to 150 °C continuous service; intermittent exposure to 200 °C for 24 h causes a resistance increase of less than 8%. Sulfur-bearing environments accelerate silver sulfide formation; sustained exposure to H₂S above 0.1 ppm or contact with sulfur-vulcanized rubber gaskets is contraindicated. Acetic-acid-cure silicone encapsulants are also incompatible because the liberated acid corrodes silver flake and raises joint resistance. The paste must be kept sealed with a desiccant when not in use, and once thawed it must not be refrozen. The product is not qualified for direct immersion in liquid water or for continuous electrochemical bias in the presence of chloride ions above 10 ppm. On copper substrates, the presence of chloride-containing flux residues before dispense is a known contributor to interfacial corrosion and should be removed with a saponified aqueous cleaner followed by thorough drying.
