| HS Code | 183633 |
| Product Name | APEX 3000 Dry Film Photoresist |
| Manufacturer | Asahi Kasei Corporation |
| Product Type | Negative-working dry film photoresist |
| Film Appearance | Blue tinted dry film |
| Standard Thickness | 30 µm |
| Resolution Capability | Fine line and space imaging, suitable for high-resolution PCB patterns |
| Exposure Wavelength Range | UV range, typically 330–430 nm |
| Developer Type | Aqueous alkaline solution, commonly 1% sodium carbonate |
| Stripping Solution | Dilute aqueous sodium hydroxide or potassium hydroxide solution |
| Copper Adhesion | Strong adhesion to copper and copper-clad laminate surfaces |
| Plating Resistance | Good resistance to acid copper plating, tin/lead plating, and etching baths |
| Etching Resistance | Resistant to acid and alkaline etchants used in PCB processing |
| Hardness | High surface hardness after full curing, allowing robust handling |
| Shelf Life | Typical 6 months from date of manufacture |
| Storage Condition | Store at 5–20°C in a cool, dark place |
As an accredited PCB Dry Film Photoresist Asahi Kasei Apex 3000 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Each light-protective sealed carton contains one roll of Asahi Kasei Apex 3000 dry film photoresist, ensuring safe transport and storage. |
| Container Loading (20′ FCL) | 20′ FCL loading: palletized, secured upright, dry container, away from heat/ignition sources, no incompatible cargo, for Asahi Kasei Apex 3000 photoresist. |
| Shipping | Ship PCB Dry Film Photoresist Asahi Kasei Apex 3000 in light-proof, moisture-barrier packaging to prevent premature polymerization. Keep sealed, cool, and dry, avoiding direct sunlight. Label as humidity- and light-sensitive chemical. Comply with local hazardous material regulations, and use temperature-controlled transport to maintain product integrity and shelf life. |
| Storage | Store in a cool, dry, dark environment at 5–25°C (41–77°F) in its original sealed packaging. Protect from ultraviolet light, humidity, and solvents. Avoid bending or stacking heavy loads on rolls. Use within manufacturer’s specified shelf life to maintain resolution and integrity. |
| Shelf Life | Shelf life is typically 12 months from manufacture when stored unopened in a cool, dark place (5–25°C). |
Asahi Kasei Apex 3000 is processed as a solid, aqueous-developable, negative-acting dry film photoresist layer without on-site solvent thinning or re-compounding. The downstream "formulation addition ratio" entries below therefore describe the process baths, etchants, electrolytes, and working solutions that must be held within defined mass fractions to maintain resist adhesion, sidewall geometry, plating confinement, and stripping efficiency. Standards are cited by designation or test-method number where applicable, and all unspecified process values should be qualified on production-scale equipment because lot-to-lot copper surface state and equipment geometry influence the practical window.
| Application sector | Standard / test method | Function |
|---|---|---|
| HDI innerlayer patterning | IPC-6012E Class 3; IPC-A-600K; IPC-TM-650 2.4.39 | Finished board qualification, visual acceptance, dimensional stability |
| Outer layer acid copper pattern plating | IPC-6012E Class 3; IPC-TM-650 2.3.25; IPC-TM-650 2.6.3.7 | Board qualification, ionic cleanliness, surface insulation resistance |
| IC package substrate buildup layer | IPC-6016; IPC-TM-650 2.6.3.7 | HDI layer qualification, post-cure insulation resistance |
| Flexible printed circuit roll-to-roll | IPC-6013D Class 3; ASTM D882-18 | Flex/rigid-flex qualification, polyimide film tensile properties |
| Copper alloy leadframe chemical milling | IATF 16949; ASTM E407-23 | Customer part approval, metallographic edge verification |
| SMT stencil and precision metal foil etching | IPC-7525B; ASTM E340-15 | Stencil aperture design, macroetch evaluation |
For high-density interconnect innerlayer patterning where space width drops below 30 µm, Apex 3000 is selected as a 25 µm or 30 µm dry film etch resist over 12–18 µm copper foil. Industry compliance boundary: the finished innerlayer is accepted to IPC-6012E Class 3, with dimensional stability determined by IPC-TM-650 2.4.39 and visual acceptance per IPC-A-600K. Processing formulation addition ratio: the copper pre-clean microetch is held at 15–20 g/L H₂SO₄ and 12–18 g/L H₂O₂ at 25–30 °C; developer is 0.85–1.10 wt% Na₂CO₃·H₂O at 28–32 °C; stripping uses 2.8–4.0 wt% NaOH at 45–52 °C. The dry film itself is not thinned, blended, or dissolved at the laminator; only cover-sheet separation and roll tension are adjusted during application.
Downstream production sequence for this sector starts with alkaline cleaning and brush scrubbing to a copper surface roughness of Ra 0.25–0.45 µm, followed by oxide treatment to anchor the resist. Vacuum lamination runs at 100–115 °C roll temperature, 0.4–0.6 MPa nip pressure, and 0.6–1.0 m/min; the polyester cover sheet is removed at the nip. LDI exposure at 405 nm with a Stouffer R₆ or equivalent step wedge controls polymerization latitude. Development breakpoint is maintained between 45% and 55% of total spray chamber length before alkaline cupric chloride etching at 48–52 °C and pH 8.2–8.8 removes unwanted copper. Stripping is verified by the absence of residual resist under 50× optical inspection. Terminal product types are smartphone HDI main boards, automotive camera module innerlayers, and server memory module subassemblies. Operational boundary: lamination must be completed within 8 h after surface treatment to prevent oxide re-growth in uncontrolled humidity, and sodium carbonate developer concentration must not fall below 0.80 wt% because foot adhesion loss produces etch undercut.
When outerlayer pattern plating uses Apex 3000 as the acid copper plating mask, the principal process conflict is lateral growth at the resist foot during 20–25 µm copper deposition into 25–50 µm spaces. The applicable board qualification remains IPC-6012E Class 3; ionic cleanliness after resist strip and tin/lead etch is checked by IPC-TM-650 2.3.25; surface insulation resistance after final finish is evaluated per IPC-TM-650 2.6.3.7. Bath addition ratio maintained on the line: the sulphuric acid copper electrolyte is operated at 60–80 g/L Cu²⁺ from CuSO₄·5H₂O, 180–220 g/L H₂SO₄, and 30–60 ppm chloride; brightener replenishment is set at 0.3–0.8 mL/Ah and carrier replenishment at 0.5–1.2 mL/Ah based on ampere-hour control, not visual addition. Developer is clamped at 0.9–1.1 wt% Na₂CO₃ at 28–32 °C, while strip is held at 3.0–4.5 wt% NaOH at 48–52 °C.
The downstream sequence includes mechanical cleaning, hot roller lamination at 105–120 °C and 0.4–0.6 MPa, LDI exposure, spray development, microetch, and acid copper plating at 2.0–2.5 A/dm² and 22–28 °C with air sparge. Tin or pure tin etch resist is then plated, dry film is stripped, and alkaline etch removes the base copper. Terminal products include automotive ECU multilayer boards, server backplane outer layers, and industrial motor drive PCBs. Operational boundary: if chloride ion drops below 30 ppm, deposit leveling degrades and plated copper thickness scatter increases; if chloride ion exceeds 60 ppm, resist foot undercut risk rises. Process engineers should also avoid amine-based surface wetting agents before lamination because residual amine species can initiate premature resist crosslinking at the copper-resist interface.
In package substrate manufacturing, Apex 3000 functions as a fine-line pattern plating resist on ABF buildup dielectric after electroless copper deposition. The process is controlled to IPC-6016 for HDI layer qualification and IPC-TM-650 2.6.3.7 for surface insulation resistance after solder mask cure. Formulation addition ratio for process baths: the electroless copper bath is operated at 1.5–2.5 g/L Cu²⁺ and 8–12 g/L HCHO at pH 12.0–12.5 and 32–35 °C; the microetch before lamination holds 45–60 g/L sodium persulfate and 1–2 vol% H₂SO₄ at 25–30 °C; developer is 0.8–1.2 wt% Na₂CO₃ at 29–31 °C. No additional solvent is added to the dry film; lamination pressure and temperature are the only physical variables used to conform the resist to via rims and trace channels.
Downstream production starts with laser via drilling in 38–45 µm ABF dielectric, desmear, and electroless copper deposition to 0.4–0.8 µm. Apex 3000 is then laminated at 15–25 µm thickness, exposed by LDI at 405 nm, developed, and used as the pattern plating mask for copper deposition to 5–8 µm on redistribution traces and via capture pads. After flash etch and strip, the substrate proceeds to solder mask and surface finish. Terminal product types are FC-BGA, CSP, and RF SiP package substrates. Operational boundary: lamination temperature must not exceed 125 °C to avoid ABF surface damage and resist brittleness; conversely, below 95 °C, conformal coverage at via rims becomes incomplete and plating bath ingress produces worm-like under-plating defects.
On roll-to-roll polyimide lines where web width exceeds 250 mm, Apex 3000 is applied as the dry film etch resist for RA or ED copper on 12.5–25 µm polyimide. The process is qualified to IPC-6013D Class 3, and incoming polyimide film tensile behavior is checked by ASTM D882-18. Mass fraction control on the line: pre-clean microetch uses sodium persulfate at 35–50 g/L and H₂SO₄ at 2–5 mL/L at 30–35 °C; developer is 0.9–1.2 wt% Na₂CO₃ at 30 ± 2 °C; stripper is 2.5–3.5 wt% NaOH at 48–52 °C. The dry film remains an undiluted solid resist layer; the only formulation-adjusted materials are the aqueous processing baths.
Downstream roll-to-roll lamination runs at 95–110 °C, 0.3–0.5 MPa, 0.8–1.5 m/min, and web tension 40–80 N. LDI exposure is followed by spray development and cupric chloride etching at 48–52 °C; coverlay lamination then isolates the final circuit. Terminal product types are foldable display interconnects, aerospace flex harnesses, and medical ultrasound transducer cables. Operational boundary: if polyimide web shrinkage exceeds 0.15% after first-side lamination, second-side alignment drift requires re-registration; therefore first-side laminate dwell before exposure is limited to 2 h. Failure mode observed on roll-to-roll lines is edge bead formation when nip pressure exceeds 0.5 MPa, which creates resist thickness nonuniformity near web edges and changes etch breakpoint.
In leadframe chemical milling, sidewall etch factor limits minimum pitch because both sides of a 100–200 µm copper alloy strip are sprayed simultaneously. Apex 3000 is laminated as a 30–50 µm etch mask over C19400 or C7025 alloy. Compliance is governed by IATF 16949 customer-specific part approval and ASTM E407-23 for metallographic edge verification. Formulation addition ratio in the etchant system: cupric chloride etchant is held at 160–220 g/L CuCl₂, 0.5–1.5 N HCl, and 48–52 °C; oxidation-reduction potential is controlled at 520–560 mV versus Ag/AgCl by gas regeneration; developer is 0.8–1.1 wt% Na₂CO₃. The dry film is not post-formulated; roll tension and lamination temperature are adjusted only to prevent air entrapment along stamped depressions.
The downstream sequence includes strip cleaning, hot roller lamination, two-side UV exposure with charge-coupled alignment, spray development, spray etching at 1.5–2.5 bar, resist stripping, rinsing, and singulation. Etch factor is calculated as 2 × etch depth / lateral undercut; below 2.5, leadframe tie bar integrity and wire bond pad geometry fail customer audits. Terminal product types are QFP, QFN, and TO-package leadframes. Published data for Apex 3000 in copper alloy leadframe etching is limited; the above bounds derive from cupric chloride spray etching practice and require duty-cycle validation on actual line equipment because spray impingement angle and oscillation pattern shift the etch factor more than bath chemistry alone.
If double-sided etching of 100–150 µm stainless steel foil for SMT stencils proceeds without a conforming dry film on both faces, aperture edge rounding and centreline step increase beyond customer allowance. Apex 3000 is used in this non-PCB chemical milling application as the pattern mask. The relevant stencil design and aperture quality specification is IPC-7525B; base metal macroetch evaluation follows ASTM E340-15. Processing bath addition ratio: ferric chloride etchant is held at 42–46 °Bé and 38–42 °C, with HCl at 0.3–0.8 N; developer is 0.8–1.1 wt% Na₂CO₃. The photoresist itself remains a solid dry film layer and is not diluted, pre-swelled, or mixed with cover-coat chemistry.
Downstream production includes laser-cut alignment holes, hot roller lamination at 100–115 °C, double-sided UV alignment, development, simultaneous spray etching from both faces to produce trapezoidal apertures, resist stripping, and electropolishing. Terminal product types are fine-pitch solder paste stencils for 0.3 mm pitch CSP footprints, encoder discs, and precision filter meshes. Operational boundary: if etchant temperature exceeds 42 °C, dry film foot undercut on 304 stainless steel increases and aperture width variance exceeds ±10 µm; if the stencil foil is not pre-cleaned to a water-break-free surface, random adhesion failure produces crescent-shaped aperture defects at the resist-metal interface.
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Asahi Kasei Apex 3000 is a negative-tone aqueous dry film photoresist supplied as a three-layer roll construction: a polyethylene terephthalate carrier sheet of 25 µm nominal thickness, a photopolymer resist layer, and a removable polyolefin cover sheet. The product is used for printed wiring board innerlayer imaging, tenting of through-holes, and pattern plating where the resist must remain intact during acidic copper electroplating. Manufacturer documentation positions Apex 3000 as a solvent-free, aqueous-alkaline-developable system intended for fine-line patterning. The resist layer is available in standard thicknesses from 20 µm to 50 µm, selected by copper weight, required etch resistance, and plating height. Published data for this specific configuration is limited; process parameters described below are class-typical values for aqueous acrylic dry films unless the manufacturer’s Apex 3000 technical data sheet specifies a narrower range.
Because the product is a solid photopolymer film, handling and pre-conditioning influence lamination yield more strongly than for liquid resists. Rolls stored below 5 °C should be brought to ambient temperature for at least 4 h before use, and the cover sheet should be removed at a room temperature above 18 °C to avoid electrostatic discharge and cohesive film tearing. The film is laminated to mechanically scrubbed and microetched copper surfaces with a surface roughness of 0.25 µm to 0.6 µm Ra, measured according to ISO 4287. Surface preparation below 0.15 µm Ra reduces adhesion, while roughness above 0.8 µm Ra can trap residues under the resist and create developer undercut at the foot of fine lines.
For 18 µm copper foil, a 20 µm dry film is sufficient for etch-only processing. For tenting 0.3 mm to 0.6 mm through-holes, film thickness should be at least 25 µm to 30 µm; below 25 µm, tenting rupture occurs over holes larger than 0.8 mm when lamination vacuum is released. For pattern plating with 25 µm to 50 µm copper build, a 40 µm or 50 µm resist is required. Thickness selection is a compromise: thicker films increase plating resistance but reduce resolution and require higher exposure dose. The manufacturer’s technical data sheet provides a copper-weight-to-film-thickness matrix; the fabricator should verify that matrix with cross-sectional microscopy after first plating.
Dimensional movement in the laminated film is controlled by the lamination nip temperature, roll pressure, and transport speed. Vacuum laminators with heated rubber rolls are typically operated at 100 °C to 120 °C, air pressure of 3 kgf/cm² to 5 kgf/cm², and speed of 1.0 m/min to 2.0 m/min. Low pressure or short dwell over 35 µm-thick copper can leave edge voids, while excessive pressure cold-flows the polymer into through-holes and changes line width before exposure. On production lines handling 500 mm-wide panels, the temperature differential across the panel should be held below 8 °C; higher gradients produce visibly non-uniform resist thickness at panel edges. First-article verification of adhesion after lamination should be performed with the tape pull method in IPC-TM-650 2.4.28.1.
The exposure frame should maintain a vacuum level below 50 kPa absolute to hold the phototool in hard contact with the carrier sheet. If frame vacuum exceeds 70 kPa, air entrapment between the phototool and the carrier creates an optical gap that degrades resolution by more than 5 µm. The phototool temperature should be controlled at 21 °C ± 2 °C under ISO 14644-1 Class 10,000 cleanroom conditions; a 2 °C shift can change a 500 mm panel dimension by several micrometres and affect outer-layer annular ring alignment. Dimensional mismatch between innerlayer artwork and drilled hole positions is a common source of production yield loss when sequential lamination is used with low-flow prepregs.
Process excursions on a high-volume vacuum laminator are most often caused by increasing line speed without adjusting roll temperature. At 2.5 m/min or higher, dwell time under the nip may be insufficient to fuse the photopolymer to the copper topography. The resulting defect is not visible before development but appears after etching as nicked traces and after plating as solution ingress under the resist. When edge stripping is observed on panels larger than 300 mm in width, the response should be to raise the laminator roll temperature within the manufacturer’s permitted range, not to reduce speed alone. The upper lamination temperature should not exceed 125 °C; above this limit, the resist can begin thermally induced polymerization and lose developability in unexposed areas.
Exposure energy should be verified with a calibrated radiometer and not inferred from lamp age or power settings. A reduction in lamp output of 10 % can shift the step-wedge hold point by one step and produce an underexposed resist foot. The developer breakpoint is then used as the process monitor. In spray chamber development with 1.0 wt% to 1.2 wt% sodium carbonate at 30 °C to 35 °C, the breakpoint should occur at 40 % to 60 % of the conveyor length. If the breakpoint occurs earlier, the developing solution is too aggressive and fine-line sidewalls will be undercut. If it occurs later, the resist is underdeveloped and may leave residue in small spaces. Spray pressure is maintained at 1.5 kgf/cm² to 2.5 kgf/cm², and the rinse water should contain less than 15 mg/L total dissolved solids to prevent carbonate precipitation on the panel surface.
Batch-to-batch variation in the resist layer is controlled by the supplier, but the fabricator should monitor development breakpoint per lot. A shift of 10 % in breakpoint time between two lots is not unusual when roll age or storage history differs. The exposure dose should be re-optimized for each lot using the step tablet; failure to do so can produce intermittent opens or shorts in fine-line coupons.
The negative acrylic chemistry crosslinks in the exposed areas, and the crosslink density is a function of photoinitiator concentration and incident dose. In a 20 µm thick film, the product is capable of resolving line/space features at or below 20 µm when the phototool is held in hard contact and the exposure unit provides collimated light with a uniformity of ±5 % across the frame. The sidewall angle in a properly exposed and developed 20 µm film generally remains above 75°, as measured by scanning electron microscopy of a plated cross-section. As film thickness increases to 40 µm, the same feature size requires a dose increase of approximately 20 % to 25 % to maintain top-to-bottom sidewall parity. If the dose is not increased, the resist foot remains partially soluble and produces either an etch undercut or a mushroom-shaped plating profile. The exposure matrix should be generated from measured UV intensity at the vacuum frame, not from nominal lamp power, because reflector condition and collimation angle directly alter the delivered dose.
Laser direct imaging at 405 nm can be used with Apex 3000, but the sensitivity of the film may require a higher energy dose than contact exposure because the laser beam is focused through the carrier sheet. LDI equipment with an output of 800 mJ/cm² or higher at the resist plane is often specified for 20 µm films; published data for this specific configuration is limited. The advantage of LDI is elimination of phototool dimensional drift; the disadvantage is the depth-of-focus constraint in thicker films, which can produce a wider bottom foot when the beam is defocused by more than 10 µm.
In pattern-plating applications, the developed resist must withstand sulfuric acid copper sulfate electrolytes at 18 °C to 30 °C and cathodic current densities from 1.0 A/dm² to 3.0 A/dm². Aqueous-alkaline developed acrylic resists are generally resistant to low-chloride acid copper baths, but adhesion at the resist-to-copper interface is the limiting variable when plated copper thickness exceeds 25 µm. Plating thickness distribution must be measured across the panel; edge current densities can be 15 % higher than center densities when organic additive concentrations are not controlled. The resist should not be used in strongly alkaline cyanide-based plating baths or in contact with high-methanol solvent-alkaline strippers, because the crosslinked acrylic matrix can swell and delaminate. A post-development UV bump of 200 mJ/cm² to 400 mJ/cm² before plating increases chemical resistance but increases alkaline stripping time by approximately 30 %.
Avoid contact with amine-based strippers or amine-containing adhesion promoters before exposure, because basic amines can penetrate the cover film and initiate premature crosslinking in the photopolymer layer. The product should be stored at 5 °C to 25 °C in a dark room; storage above 30 °C for more than 48 h can cause latent image fog and developability loss. Once laminated, panels should be held for no more than 24 h before exposure because moisture absorption under high humidity above 60 % RH can reduce exposure sensitivity and change development time. If the relative humidity in the dry-film lamination room exceeds 60 %, pre-drying of the panel surface is required to prevent adhesion loss at the developer stage.
Developer and stripper buffering capacity are the primary factors in maintaining line width stability across a production lot. Sodium carbonate developer with a pH of 10.0 to 10.5 is typical; carbonate concentration should be monitored by titration and not by pH alone, because dissolved copper and resist residues buffer the solution. When the dissolved copper concentration in the developer exceeds 500 mg/L, the effective development rate in dense fine-line areas can slow by more than 10 %. The developer sump should be replenished at a rate tied to panel throughput, and the spray nozzles should be checked for clogging at 50 µm-orifice size. Developer temperature should be controlled within ±1 °C; a 2 °C deviation can alter development rate by approximately 10 % and shift the breakpoint.
Stripping is performed after etch or plating with 3.0 wt% to 5.0 wt% sodium hydroxide at 45 °C to 55 °C in a spray stripper. The stripped resist must not re-deposit on copper; bath filtration to 10 µm and surfactant control according to the stripper supplier’s conductivity and pH calibration are required. If the post-development UV bump exceeds the recommended dose, residual organic contamination may remain after normal stripping and is detected by water break-free surface inspection. A final microetch using sodium persulfate at 60 g/L to 120 g/L is standard for removing trace polymer and copper oxide before subsequent lamination or solder mask.
Stripper life is similarly limited by polymer loading. In a high-volume stripping line, the sodium hydroxide solution should be maintained within 3.0 wt% to 5.0 wt%, with polymer solids kept below 2.0 g/L. Above this level, stripped resist can form agglomerates that block pump intakes and re-deposit on copper. The interaction between the photoresist and the stripper is not solely dissolution; the resist layer first swells and then fractures from the copper surface. This swelling phase is why over-cured resist requires longer dwell time and why jet impingement is more effective than immersion alone. Processing in a spray stripper with impingement pressure of at least 2.0 kgf/cm² gives more complete removal than a simple immersion tank at the same temperature.
The fundamental difference from a positive-tone liquid photoresist is that Apex 3000 crosslinks in the exposed areas, leaving those areas insoluble in the developer. This negative-tone behavior provides an advantage in plating resists because thicker crosslinked sections withstand acid copper attack, while unexposed areas are cleanly removed in aqueous sodium carbonate. A positive-tone liquid resist, by contrast, becomes soluble in the exposed areas and is more commonly used for etch-only processes where plating thickness is low. The dry film format also provides a uniform thickness set by the roll coating process rather than by spin coating or spray coating; edge bead is absent, and thickness across a 500 mm panel is typically held within ±2 µm for a 20 µm film. Liquid resists can show thickness variations of ±5 µm or greater on panels with through-hole patterns unless coating parameters are tightly controlled.
Compared to solvent-processable dry films, the aqueous development chemistry eliminates most volatile organic solvent content from the developing room and reduces explosion-proofing requirements. Solvent-processable films may use chlorinated or glycol ether developers that require special exhaust and solvent recovery. The aqueous acrylic chemistry used in Apex 3000 also permits the same stripping solution family to be used as for the developer, although at higher hydroxide concentration. Compared to earlier aqueous dry films, the Apex 3000 product is positioned for improved fine-line capability and plating resistance; however, independent published data comparing the specific model to previous Asahi Kasei grades is limited. The fabricator should generate comparative DOE data using the same lamination, exposure, and development equipment rather than relying on supplier marketing comparisons.
| Regulatory or test standard | Designation | Verification requirement |
|---|---|---|
| RoHS Directive | 2011/65/EU | Supplier declaration for lead, mercury, cadmium, hexavalent chromium, PBB, PBDE |
| REACH Regulation | EC 1907/2006 | Substance inventory and SVHC compliance statement |
| Quality management | ISO 9001:2015 | Manufacturing and lot traceability documentation |
| Environmental management | ISO 14001:2015 | Waste developer and stripper handling controls |
| Adhesion verification | IPC-TM-650 2.4.28.1 | Tape pull adhesion after lamination and plating |
