| HS Code | 944915 |
| Product Name | Neon (Ne) Electronic/EL Grade |
| Chemical Formula | Ne |
| Molecular Weight | 20.1797 g/mol |
| Cas Number | 7440-01-9 |
| Purity | ≥99.999% (5N) |
| Physical State | Gas |
| Appearance | Colorless, odorless gas |
| Melting Point | -248.59 °C at 1 atm |
| Boiling Point | -246.05 °C at 1 atm |
| Gas Density | 0.9002 kg/m³ at 0 °C and 1 atm |
| Specific Gravity Vs Air | 0.696 |
| Critical Temperature | -228.75 °C |
| Critical Pressure | 2.76 MPa |
| Solubility In Water | Slightly soluble |
| Ionization Energy | 2080.7 kJ/mol |
| Electron Configuration | 1s² 2s² 2p⁶ |
As an accredited Neon (Ne) Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Neon (Ne) Electronic/EL Grade: packaged in high-pressure cylinders, 8.5 m³ (approximately 1.5 kg) per fill, with certified purity. |
| Container Loading (20′ FCL) | 20' FCL loaded with secure Neon (Electronic/EL Grade) gas cylinders, upright, hazard-labeled, ventilation ensured, non-flammable, inert atmosphere. |
| Shipping | Ship Neon (Ne) Electronic/EL Grade as a nonflammable compressed gas, UN 1065, in DOT-approved high-pressure cylinders. Keep cylinders upright, secured, and well-ventilated. Use Class 2.2 nonflammable gas labels, avoid heat/sunlight, and ensure valve caps are secured for safe transport. |
| Storage | Store Neon (Electronic/EL Grade) as a compressed gas in a securely upright, well-ventilated cylinder, away from heat, ignition sources, and direct sunlight. Maintain temperature below 52°C, protect valves with caps, and use approved regulators. Ensure proper labeling and segregation from incompatible materials in a dry, cool area. |
| Shelf Life | Neon (Electronic/EL Grade) is inert and stable; shelf life is indefinite when stored in sealed cylinder under proper conditions. |
Neon Electronic/EL Grade supplied for laser buffer, plasma discharge, and gas-fill service is specified at 99.9995 mol% minimum neon with impurity certification for oxygen, nitrogen, carbon monoxide, carbon dioxide, total hydrocarbons, krypton, and xenon. Representative lot specifications include water ≤ 0.5 ppmv by cavity ring-down spectroscopy, oxygen ≤ 0.5 ppmv by gas chromatography with pulsed discharge helium ionization detection, nitrogen ≤ 1.0 ppmv, total hydrocarbons ≤ 0.2 ppmv as methane, and krypton/xenon ≤ 1.0 ppmv each. This impurity profile has direct discharge-physics consequences: in 193 nm and 248 nm excimer laser chambers, water and oxygen convert into ultraviolet-absorbing species and contribute to optic contamination; in helium–neon lasers, nitrogen and water quench metastable helium states. Cylinders for this grade are vacuum-baked and passivated stainless steel or passivated aluminum alloy packages, with point-of-use connection standards determined by regional cylinder valve outlet designations.
When a 193 nm ArF immersion scanner operates in high-volume semiconductor fabrication, the neon balance gas does not merely dilute the halogen; it controls electron energy distribution, discharge impedance, and ultraviolet transmission in the laser cavity. A typical ArF lithography laser gas fill supplied to the laser gas cabinet is 0.05–0.15 mol% fluorine, 3–5 mol% argon, and 93–97 mol% neon at a total fill pressure of 250–400 kPa. The downstream production process begins at the point-of-use gas cabinet, where high-pressure regulator panels, mass flow controllers, automated halogen injection loops, and purifiers that reduce water to below 0.01 ppmv condition the gas before chamber injection. The 193 nm beam is then delivered through an optical train to expose photoresist on 300 mm wafers at numerical apertures up to 1.35 with immersion water. Compliance for the gas feed path follows SEMI C3 neon specifications, ISO 14644-1:2015 for the fill environment, and the laser OEM gas specification for halogen-to-neon ratio tolerances. Terminal product types include sub-10 nm FinFET logic, DRAM memory, and 3D NAND memory. An operational boundary observed in production is that water and oxygen in neon above 1 ppmv can accelerate 193 nm window and optic contamination; gas cabinet purifiers are therefore sized for water removal below 0.01 ppmv before injection.
| Application | Neon balance | Co-feed gases | Total pressure |
|---|---|---|---|
| ArF immersion lithography | 93–97 mol% | Ar 3–5 mol%, F₂ 0.05–0.15 mol% | 250–400 kPa |
| KrF LTPS annealing | 94–97 mol% | Kr 0.8–1.5 mol%, F₂ 0.05–0.15 mol% | 250–400 kPa |
| He–Ne metrology laser | 6–17 mol% | He 83–94 mol% | 200–800 Pa |
| PDP Penning fill | 90–95 mol% | Xe 5–10 mol% | 400–600 hPa |
Values in the table are representative ranges; final fill recipes are controlled by chamber design, electrode spacing, discharge volume, and laser or panel manufacturer specifications.
Low-temperature polysilicon thin-film transistor backplanes for OLED displays are produced by scanning a 248 nm KrF excimer laser beam across amorphous silicon-on-glass substrates, inducing rapid melting and recrystallization into polycrystalline silicon. The laser chamber fill for this process uses neon as the majority thermalizing buffer gas with krypton and fluorine: typical compositions are 0.8–1.5 mol% krypton, 0.05–0.15 mol% fluorine, and 94–97 mol% neon at a total pressure in the 250–400 kPa range. Neon purity directly affects pulse-to-pulse energy stability because oxygen and water shift discharge impedance and consume halogen during extended scanner operation. Production-scale ELA tools operate with line-beam optics, stage scanning, and automated laser gas management; the downstream process is integrated into the TFT array fabrication sequence before pixel electrode and encapsulation steps. Terminal products include active-matrix OLED displays for smartphones, wearable devices, and automotive instrument clusters. Compliance is governed by IEC 60825-1:2014 for laser product safety, ISO 14644-1:2015 for cleanroom gas handling, and the laser OEM gas specification for halogen-to-neon ratio drift limits. Published data for exact pulse energy drift as a function of a specific neon impurity level is limited; production qualification is therefore performed by gas analysis of the laser head at scheduled intervals and by monitoring pulse energy standard deviation during die exposure.
He–Ne laser tube filling is performed under high-vacuum bake-out of the glass or ceramic tube and cathode assembly because neon and helium fill gases are sensitive to outgassing from the sealed envelope. The fill ratio is set between 5:1 and 15:1 helium-to-neon, equivalent to neon content of roughly 6–17 mol%, at total pressures from 200 Pa to 800 Pa. Electronic/EL Grade neon is introduced through a heated glass manifold after electrode conditioning; the tube is sealed and aged under discharge to stabilize cathode surface potential. Industrial compliance for finished laser devices includes IEC 60825-1:2014 for laser product classification and ISO 11146-1:2021 for beam characterization. Terminal products include interferometric displacement sensors, laser scanning confocal microscopes, barcode readers, and alignment lasers for machine tools. The operational boundary is moisture and nitrogen: neon containing water above 1 ppmv can produce oxide and nitride cathode films that increase ignition voltage and reduce tube life.
Plasma display panel cells rely on neon as the majority Penning gas and xenon as the ultraviolet emitter. The fill gas composition is typically 90–95 mol% neon and 5–10 mol% xenon, with internal panel pressure held between 400 hPa and 600 hPa. During PDP assembly, front and back glass plates with address electrodes, dielectric layers, barrier ribs, phosphor layers, and an MgO protective layer are aligned, sealed, evacuated, and backfilled through a tubulation port. After filling, panels undergo aging discharges to stabilize the MgO surface and establish uniform firing voltage. Compliance for materials and finished devices includes RoHS Directive 2011/65/EU for restricted substances and applicable IEC display safety standards. Terminal product types are large-format public information displays, broadcast monitors, and professional video walls. The market boundary is that new PDP capacity has contracted, but the installed base still requires Neon Electronic/EL Grade in Ne–Xe fill gas with lot traceability for service and panel recharging.
Gas-filled neon indicator lamps and voltage reference tubes use low-pressure neon discharges in which a small argon addition lowers breakdown voltage and stabilizes the normal glow. Typical reference-tube fills are 99.0–99.9 mol% neon and 0.1–1.0 mol% argon at an absolute pressure of 133 Pa to 1333 Pa. Production includes glass envelope cleaning, electrode assembly, vacuum bake-out at 300 °C to 400 °C, backfill with Electronic/EL Grade neon, and sealed aging under discharge to stabilize cathode surface condition. Component compliance for materials is typically evaluated under RoHS Directive 2011/65/EU; where indicator tubes are installed in hazardous-area control panels, IEC 60079-0:2017 may apply. Terminal products include AC mains indicator lamps, power-supply voltage references, and industrial control panel status indicators.
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Neon (Ne) Electronic/EL Grade is a compressed-gas product supplied as a 99.9995 mol% minimum inert balance gas for excimer laser mixtures, plasma display fill, and thin-film metrology discharge applications. The designation “EL” refers to electroluminescent service, while the broader electronics-grade specification is used in semiconductor lithography and photomask metrology. The grade is distinguished from commercial neon not by total purity alone, but by the control of oxygen, water, carbon monoxide, carbon dioxide, hydrogen, nitrogen, argon, and total hydrocarbons at sub-1 ppmv ceilings. Supplier certificates of analysis for the electronic/EL grade typically list O2 ≤ 0.5 ppmv, H2O ≤ 0.5 ppmv, N2 ≤ 1.0 ppmv, total hydrocarbons as CH4 ≤ 0.1 ppmv, CO ≤ 0.5 ppmv, CO2 ≤ 0.5 ppmv, H2 ≤ 0.5 ppmv, and Ar ≤ 1.0 ppmv. Neon is recovered as a minor atmospheric component at 18.18 ppmv in dry air and is purified by cryogenic distillation followed by getter and adsorbent beds to reach electronic-grade limits. The product is nonflammable and chemically inert, with a CAS number of 7440-01-9 and transport classification of UN 1065, Class 2.2.
ArF immersion lithography systems expose photoresist at 193 nm, and KrF systems expose at 248 nm; in both cases the laser gas mixture is predominately neon. The gas acts as a transparent buffer that couples discharge energy to the rare gas and fluorine mixture without forming stable negative ions. Because neon has an ionization potential of 21.564 eV, it remains substantially non-ionized in the discharge channel while argon, krypton, and fluorine form the excimer states. Oxygen and water vapor are the most damaging impurities in this service: oxygen scavenges fluorine to form oxyfluorides, and water vapor hydrolyzes fluorine to HF, lowering the available fluorine partial pressure and shifting gas gain. Excimer laser gas controllers typically maintain a fluorine partial pressure in the range of 0.05–0.20 kPa in the balanced mixture, and an oxygen leakage of 1 ppmv can consume a measurable fraction of that active fluorine over a single gas fill. The resulting loss appears as a drop in narrowband output, increased discharge voltage, and more frequent gas replenishment. Production gas panels for 300 mm wafer fabs therefore use point-of-use purifiers, electropolished 0.25 µm Ra or finer stainless steel tubing, and VCR metal gasket fittings to prevent atmospheric incursion from exceeding the specified impurity ceiling. Published data for this specific configuration is limited, because laser gas lifetime is also controlled by laser chamber conditions, pulse repetition rate, and gas circulation flow.
In plasma display panel manufacturing, neon is mixed with xenon at a concentration between 4 mol% and 10 mol% to exploit the Penning ionization mechanism, in which metastable neon atoms transfer energy to xenon and lower the sustaining voltage. Neon is chosen for this role because its metastable energy is higher than the xenon ionization threshold, while its low atomic weight supports favorable electron mobility in the alternating-current discharge. Electronic/EL grade material is used in this application because oxygen and moisture entering the panel during backfill can oxidize the magnesium oxide cathode-protection layer and poison the phosphor layer. The panel fill station is typically configured with a vacuum manifold capable of base pressure below 1.3 Pa and a residual gas analyzer that monitors water at mass-to-charge ratio 18, oxygen at 32, and nitrogen at 28 before the panel is sealed. Electroluminescent lamp production places similar constraints on neon purity because residual water vapor can react with the sulfide phosphor and reduce luminance over operating time.
Release testing for electronic/EL grade neon is performed by gas chromatography with pulsed discharge helium ionization detection for permanent gas impurities, methane-converter flame ionization for carbon monoxide and carbon dioxide, and cavity ring-down spectroscopy for moisture. Calibration blends are prepared gravimetrically according to ISO 6142-1:2015, and the analytical laboratory operates under ISO/IEC 17025:2017 accreditation. Because neon is a high-ionization-potential gas, the PDHID method is preferred over thermal conductivity detection when resolving low-level nitrogen, hydrogen, and argon impurities. The cylinder package is qualified before fill by vacuum evacuation below 1.3 Pa, heated valve treatments, and purge cycling with a high-purity nitrogen or helium stream. Internal surfaces are inspected for oil film, rust bloom, and particle contamination. On high-volume laser gas lots, cylinders are dedicated to neon service to prevent cross-transfer from halogenated gas service; the cylinder connection is specified according to CGA V-1 as a CGA-580-compatible outlet for inert gases. After filling, cylinder homogenization is allowed for at least 24 hours before sampling to avoid headspace stratification.
Package configurations for electronic/EL grade neon include single 10 L and 49 L water capacity cylinders with a nominal working pressure of 15 MPa at 21 °C. Multi-cylinder packs and semitrailer-mounted high-pressure modules are used where a fab or laser rebuild operation requires extended gas flow. The cylinder valve is a high-purity diaphragm or packless type with a metal-to-stainless-steel seat to minimize particle generation during opening and closing. A typical cylinder change-out must include a purge of the pigtail connection with dry nitrogen and a leak check using a helium leak detector capable of resolving 1 × 10−9 Pa·m3/s. The purge step removes atmospheric oxygen and moisture that would otherwise enter the gas stick during connection. Suppliers apply a tamper-evident seal on the valve outlet and issue a certificate of analysis that lists the lot number, cylinder serial number, and impurity concentrations measured by the methods specified.
| Impurity | Industrial 99.995 mol% | Electronic/EL 99.9995 mol% |
|---|---|---|
| Oxygen (O2) | 5.0 ppmv | 0.5 ppmv |
| Water (H2O) | 5.0 ppmv | 0.5 ppmv |
| Nitrogen (N2) | 10.0 ppmv | 1.0 ppmv |
| Total hydrocarbons as CH4 | 1.0 ppmv | 0.1 ppmv |
| Carbon monoxide | 1.0 ppmv | 0.5 ppmv |
| Carbon dioxide | 1.0 ppmv | 0.5 ppmv |
| Hydrogen | 1.0 ppmv | 0.5 ppmv |
| Argon | 5.0 ppmv | 1.0 ppmv |
Industrial-grade neon with a lower purity floor may be accepted for sign-tube and decorative light sources, but it is not interchangeable with electronic/EL grade in fluorine-containing excimer laser service. A 99.995 mol% industrial neon lot without comprehensive oxygen and water specification can carry oxygen above 5 ppmv and water above 5 ppmv; at those levels the fluorine consumption in an excimer laser is observable as an increase in gas top-up frequency and in window deposition. The electronic/EL grade specification differs from a generic 99.999 mol% research product because the reactive impurity profile, not merely total purity, is bounded. Qualification for a new neon source in a semiconductor fab is therefore performed with a fixed laser gas replenishment algorithm and a controlled exposure test; published data for this specific configuration is limited, and direct extrapolation from supplier purity claims is not recommended. End users typically compare certificate-of-analysis oxygen and water values across several lots and require a maximum delta between incoming lot and baseline lot to prevent gas panel drift. The use of a lower-grade neon may also shorten the duty cycle of the point-of-use purifier, because the purifier capacity for oxygen and water is finite and inversely related to inlet concentration.
Compared with helium and argon used in semiconductor gas panels, neon occupies a narrow application band because its high cost and low atmospheric concentration restrict it to strongly ionizing discharge or excimer buffer processes. Helium has a thermal conductivity of approximately 0.151 W/(m·K), while neon is about 0.049 W/(m·K) at 300 K; this makes neon less effective as a convective heat-transfer medium and more suited to low-discharge-voltage Penning mixtures. Argon is heavier and more readily ionized, but its metastable energy is lower and cannot efficiently transfer energy to xenon in display panels. The selection of electronic/EL grade neon over other noble gases is therefore not based on availability or cost but on discharge physics: the neon metastable energy lies above the xenon ionization threshold and the gas remains relatively transparent at 193 nm and 248 nm.
The supply chain for electronic/EL grade neon begins in air separation unit neon recovery, where crude neon is concentrated from the overhead of the air separation column and then purified through a hydrogen catalytic removal unit and cryogenic adsorption. The installed capacity for neon recovery is not a fixed multiple of oxygen production, and batch-to-batch variance in the argon-to-neon ratio depends on air humidity, feed pressure, and column operating conditions. This is a significant process difference from argon or helium supply, where bulk-scale storage buffers isolate the user from short-term production variation. Users with strict excimer laser qualifications often compare the argon content of the neon source because argon contamination above 1 ppmv can increase the discharge voltage slightly in some mixtures. Published data for this specific configuration is limited, and such effects should be validated on the target laser chamber rather than inferred from other gas systems.
At 101.325 kPa and 0 °C, neon gas density is 0.9002 kg/m³, with a specific gravity of approximately 0.696 relative to air. Neon is delivered as a compressed gas rather than a cryogenic liquid because its critical temperature is 44.4 K and its critical pressure is 2.65 MPa. These physical constants place neon in a different logistical category than nitrogen or argon, which are delivered to large fabs as cryogenic liquids. The product is odorless, colorless, and nonflammable, but it can displace air in low-lying gas cabinet exhaust ducts; gas cabinet design commonly follows the oxygen-deficiency hazard assessment requirements of CGA P-1 and local mechanical codes.
Electronic/EL grade neon must not be contaminated by connection to oil-lubricated vacuum pumps, elastomer-sealed regulators, or glass sign-tube manifolds. Hydrocarbon films left by these components can desorb during cylinder evacuation and appear as total hydrocarbon spikes on the next fill. Dedicated gas sticks are required for semiconductor use, with ceramic-seat flow restrictors and a point-of-use filter rated for particulate removal at 3 nm on high-purity gas lines. Because neon is chemically inert, it is compatible with common stainless steel, nickel, copper, and aluminum alloys used in gas panels, but not with downstream systems that rely on gas detection calibration for combustible gases. Certification data and process-specific qualification remain the controlling evidence when a lower-cost alternative is evaluated for the same gas panel.