Products

Low-temperature Curing Conductive Silver Paste Electronic/EL Grade

    • Product Name: Low-temperature Curing Conductive Silver Paste Electronic/EL Grade
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
    • CONTACT NOW
    Specifications
    HS Code 481530
    Appearance Silver gray, homogeneous and printable paste
    Solid Content 75–85%
    Silver Content 60–70%
    Viscosity 30000–80000 mPa·s at 25°C
    Particle Size ≤ 10 μm
    Volume Resistivity ≤ 5×10⁻⁵ Ω·cm
    Sheet Resistance ≤ 0.02 Ω/sq at 25 μm dry film
    Curing Temperature 80–150°C
    Curing Time 10–30 minutes
    Adhesion Strength Cross-cut test 5B, peel strength ≥ 5 N/cm on PET
    Pencil Hardness ≥ 2H
    Flexibility Passes 180° bend test without cracking
    Thermal Stability Stable after exposure to 150°C for 30 minutes
    Storage Life 6 months at 5–10°C in sealed container
    Application Method Screen printing, stencil printing, or dispensing

    As an accredited Low-temperature Curing Conductive Silver Paste Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Low-temperature Curing Conductive Silver Paste Electronic/EL Grade is supplied in 1 kg sealed plastic jars, ensuring purity and easy dispensing.
    Container Loading (20′ FCL) 20′ FCL loaded with drums/containers of low-temperature curing conductive silver paste, secured, labeled, and ventilated for safe transport.
    Shipping This item ships via ground freight only due to its chemical composition. It is packaged in sealed, leak-proof containers to prevent exposure. Ensure compatibility with local shipping regulations; do not airmail. Keep away from heat, sparks, and direct sunlight during transit.
    Storage Store in a tightly sealed, original container in a cool, dry place at 2–8°C, away from direct sunlight and heat sources. Do not freeze. Allow to reach ambient temperature before opening to prevent moisture condensation. Keep away from open flames and incompatible materials, ensuring good ventilation.
    Shelf Life Store unopened in a cool, dark place; typical shelf life is 6–12 months from manufacture date at recommended conditions.
    Application of Low-temperature Curing Conductive Silver Paste Electronic/EL Grade

    Heterojunction crystalline silicon cell lines use low-temperature curing conductive silver paste with Electronic/EL Grade specification because sputtered amorphous silicon passivation stacks undergo hydrogen effusion and contact degradation when the curing environment exceeds 200°C. For this reason the paste is formulated with 86–92 wt% silver solids, 2–5 wt% low-epoxy or acrylate thermoset binder, 5–9 wt% glycol ether/terpineol solvent, and 0.5–1.5 wt% rheology-modifying and adhesion-promoting additives; wet viscosity at 25°C is held at 250–450 Pa·s at 10 s⁻¹ to support fine-line screen printing without mesh clogging. Screen printing uses 380–430 mesh stainless-steel fabric with 13–18 µm wire diameter and 18–25 µm emulsion-over-mesh thickness, yielding 30–50 µm finger widths. Curing is performed in a three-zone belt furnace with zone setpoints of 90°C, 140°C, and 165°C and a peak substrate temperature of 170–185°C for 20–30 min total dwell; excursions above 190°C are not permitted because sheet resistance and contact resistance increase sharply after the passivation stack is damaged. Compliance for module integration is assessed under IEC 61215-1:2021 and IEC 61730-2:2023, and raw materials are screened against RoHS 2011/65/EU Annex II and REACH SVHC obligations. Terminal products include front-side finger and busbar metallization in monofacial and bifacial heterojunction modules. Operational limitations include pot life of less than 6 h at 25°C and 40% RH after paste is transferred from cartridge to screen, and viscosity drift exceeding 20% if the hopper is left uncovered in a 23°C cleanroom.

    What Thixotropic Window Prevents Screen Mesh Starving in UHF RFID Antenna Runs?

    UHF RFID antenna roll-to-roll production on 50 µm PET or 80 µm coated paper requires a paste viscosity window of 18,000–38,000 cP at 10 rpm on a Brookfield CP52 spindle and a thixotropic index of 2.2–3.0 to maintain print definition at 60–80 m/min line speeds. The wet paste is formulated with 70–80 wt% silver flake, 12–18 wt% vinyl or polyester binder, 7–12 wt% high-boiling dibasic ester solvent, and 0.5–1.0 wt% fumed silica thixotrope; silver flake D50 is controlled between 3 µm and 8 µm so that 400-mesh rotary screens with 30 µm emulsion thickness do not starve on fine antenna tracks. Inline drying uses three zones at 80°C, 100°C, and 120°C for 3–5 min total, after which cured conductor thickness is 8–14 µm and DC sheet resistance is below 40 mΩ/sq per ASTM F1896-16 test configuration. Compliance for tag communication is validated to ISO/IEC 18000-63:2021 for UHF air interface and to ISO 14443-1:2018 for NFC configurations; material restrictions are screened against RoHS 2011/65/EU Annex II and REACH SVHC. Terminal products include UHF RFID inlays, NFC labels, and electronic article surveillance antennas on paper and film facestocks. Adhesion to coated paper is evaluated with a 3M 610 tape pull after 24 h at 23°C and 50% RH; adhesion loss above 5% of conductor area is considered a batch failure.

    On 125 µm heat-stabilized PET, membrane switch circuits are printed with a low-cure silver paste whose 68–78 wt% silver content is balanced against 14–20 wt% polyester binder loading to survive crease cycling without delamination. The wet paste is diluted with 6–12 wt% glycol ether solvent and modified with 0.5–1.5 wt% organic thixotrope to maintain a 45,000–70,000 cP viscosity at 5 rpm, suitable for a 305-mesh stainless-steel screen with 25 µm emulsion and a 70–80 Shore A square-edge squeegee at 70–120 mm/s. Curing is carried out in a forced-air convection tunnel at 125°C for 20–25 min, yielding a cured film thickness of 10–14 µm and a sheet resistance measured below 50 mΩ/sq at 25 µm dry film equivalent. Adhesion is assessed on untreated PET using ASTM D3359-17 Method B cross-cut tape, with 4B or 5B required; crease and bend performance is evaluated according to ASTM F1683-17 at a 180° fold. Electrical continuity after 1,000,000 actuations is verified on dome-array test fixtures per IPC-4921 guidance; RoHS 2011/65/EU Annex II and REACH SVHC declarations are required for export. Terminal product types include tactile membrane switch panels, instrument cluster overlays, and printed silver flex tails that replace discrete FPC jumpers. The process boundary is set at a maximum web temperature of 130°C because PET shrinkage above this threshold produces registration error greater than 0.8% across a 210 mm print length.

    When Electroluminescent Lamp Rear Electrodes Abandon ITO, Cure Temperature Must Stay Below Polyester Distortion Threshold

    Electroluminescent lamp stacks on 175 µm uniaxial PET use screen-printed silver paste as the rear electrode because sputtered ITO develops microcracks during flexing, producing visible luminance non-uniformity in curved signage. The paste is formulated at 65–74 wt% silver flake, 14–20 wt% thermoplastic polyester or vinyl acrylic binder, 6–10 wt% cyclohexanone/butyl carbitol solvent, and 1–2 wt% adhesion modifier; cured layer thickness is 12–18 µm at 230–280 mesh with 30–35 µm wet film. Drying and curing are conducted in a tunnel oven at 105–115°C for 10–15 min, which is below the dimensional distortion threshold of uniaxial PET but sufficient to remove solvent and consolidate binder around silver flakes. Capacitance, dissipation factor, and dielectric breakdown of the EL stack are evaluated according to IEC 62368-1:2023 electrical safety requirements, while luminaire thermal limits are checked under IEC 60598-1:2020 Clause 4.12; RoHS 2011/65/EU and REACH SVHC screening are mandatory for export. Terminal products include backlit membrane keyboards, automotive instrument cluster EL backlights, and wearable safety illumination panels. The silver rear electrode must not be printed over uncured phosphor or dielectric layers because residual solvent from those layers causes binder swelling and a measurable increase in sheet resistance after 48 h at 60°C. Process control therefore requires printed phosphor and dielectric layers to be fully cured and cooled below 35°C before silver deposition.

    Silver-loaded thermoplastic polyurethane printable electrodes for ambulatory ECG monitoring require 55–70 wt% silver content to maintain electrical continuity while the underlying 80–100 µm TPU carrier elongates to 20% during body movement. The paste contains 22–30 wt% flexible aliphatic polyurethane/acrylate copolymer binder, 8–15 wt% high-purity glycol ether solvent, and 0.5–1.0 wt% carbon black or fumed silica to adjust thixotropy and modify DC resistance. Screen printing uses 195–230 mesh polyester screens with 25 µm emulsion onto corona-treated TPU film; wet deposition is 20–28 µm, and curing is performed at 100°C for 15 min in a forced-air oven, with 60°C pre-drying for 10 min to avoid bubble formation. Cytotoxicity is evaluated per ISO 10993-5:2009, skin sensitization per ISO 10993-10:2021, and medical electrical safety under IEC 60601-1:2005/AMD1:2012/AMD2:2020; RoHS 2011/65/EU and REACH SVHC restrictions apply to the finished device. Terminal product types include single-use ECG patches, sEMG electrode arrays, TENS electrode liners, and low-frequency iontophoresis pads. DC resistance drift is measured on a tensile fixture with 20 mm gauge length at 50 mm/min; after 100 cycles to 20% strain, the resistance increase must remain below 10× the initial value for the batch to be released. The paste is not recommended for direct printing onto silicone elastomer carriers because platinum-catalyzed addition-cure silicones are inhibited by residual amines and sulfur species in silver paste additives.

    Heated Polycarbonate Rear Quarter Windows and the 130°C Cure Ceiling

    Printed silver heater grids on 5 mm optical polycarbonate require low-temperature curing because heat deflection temperature of optical PC under 0.45 MPa load is 125–135°C, and a conventional 600°C ceramic silver firing step is incompatible with the substrate. The paste is formulated with 72–80 wt% silver flake, 10–15 wt% high-solids acrylic/epoxy hybrid binder, 6–9 wt% dibasic ester solvent, 1–2 wt% fumed silica thixotrope, and 0.5 wt% silane adhesion promoter; cured busbar and grid thickness is 12–20 µm with a sheet resistance below 35 mΩ/sq. Screen printing uses 180–250 mesh stainless-steel screens, 30–40 µm emulsion thickness, and a 75–80 Shore A squeegee at 60–100 mm/s to deposit 300–500 µm wide heater lines and 2 mm busbars. Curing is performed in a forced-air convection oven at 110–120°C for 25–35 min, followed by 60°C annealing for 15 min to stabilize resistance. Compliance for plastic glazing is evaluated under ECE R43, electromagnetic compatibility under CISPR 25, heated-grid power density under SAE J953, and manufacturing process quality under IATF 16949:2016; material restrictions follow RoHS 2011/65/EU Annex II and REACH SVHC. Terminal product types include heated polycarbonate rear quarter windows, ADAS camera cover defoggers, and e-mirror lens heater grids. The production limitation is that polycarbonate sheet must be plasma-cleaned before printing because silicone release residues from protective masking reduce wetting and create pinholes that lead to hot-spot failure under 0.4–0.7 W/cm² power density testing.

    Free Quote

    Competitive Low-temperature Curing Conductive Silver Paste Electronic/EL Grade prices that fit your budget—flexible terms and customized quotes for every order.

    For samples, pricing, or more information, please contact us at +8615365186327 or mail to admin@ascent-chem.com.

    We will respond to you as soon as possible.

    Tel: +8615365186327

    Email: admin@ascent-chem.com

    Inquiry

    Get Free Quote of Ascent Petrochem Holdings Co., Limited

    Flexible payment, competitive price, premium service - Inquire now!

    Certification & Compliance
    More Introduction

    Low-temperature curing conductive silver paste Electronic/EL Grade is formulated as a screen-printable suspension of silver flake and a submicrometer silver fraction in a modified epoxy/thermoplastic binder. The representative procurement designation LT-CSP-EL-120 may be cited in process documentation; lot-specific certificates of analysis govern actual values. Silver solids content is 80 ± 2 wt%, particle size distribution is bimodal with D50 4.0–6.0 μm and a submicrometer nanoscale tail 0.2–0.6 μm, and viscosity at 25 °C and 10 rpm on a Brookfield CP52 spindle is 28,000–38,000 mPa·s. Cured film sheet resistance after 120 °C for 20 min is 0.020–0.060 Ω/sq/mil tested to ASTM F390-21; calculated volume resistivity is 1.5 × 10-5 Ω·cm to 4.5 × 10-5 Ω·cm at 25 μm dry thickness. Adhesion to ITO-coated polyester reaches 5B under ASTM D3359-17. The product is intended for screen-printed rear electrodes, bus bars, and interconnects in electroluminescent lamps, flexible membrane circuits, and low-temperature polymer thick film assemblies where substrate distortion limits processing to ≤130 °C.

    What Cure Window and Rheological Boundary Conditions Control Processability?

    Cure window is the primary process constraint for Electronic/EL Grade silver paste. The latent imidazole-catalyzed epoxy network requires a minimum film temperature of 115 °C for complete conversion; below this threshold, residual exotherm measured by differential scanning calorimetry remains above 8%, and adhesion to polyester under ASTM D903-98 declines from 4.2 N/cm to 2.1 N/cm. Above 130 °C, solvent vapor pressure exceeds wet film strength before crosslinking, creating pores at 8–12 voids/mm² and increasing sheet resistance by 20–35%. Oven residence time at 120 °C is therefore specified as 18–22 min; belt speed and IR/convection balance must be adjusted for substrate mass and air velocity.

    Rheological profiling under production shear rates shows the material is pseudoplastic. At 0.5 s⁻¹ viscosity is 28,000–38,000 mPa·s, while at 10 s⁻¹ it decreases to 8,000–12,000 mPa·s, generating a thixotropic index of 2.8–3.5. Recovery after 10 min at rest must exceed 75% of low-shear viscosity to prevent slumping after screen printing. Solvent loss from the screen during machine stoppage should not exceed 1.5 wt% over 10 min; otherwise paste tack increases and causes screen clogging. On production flatbed screen printers with vacuum hold-down, 200–250 mesh stainless steel screens, 65–70 Shore A metal squeegee, and snap-off 0.6–1.0 mm produce wet film thickness 25–35 μm. Batch-to-batch viscosity drift of ±8% when paste is not conditioned to 22–25 °C changes dry film thickness by ±5 μm, shifting trace resistance by 12–18% on 150 μm line width. Screen open area below 35% is not recommended because silver flake orientation and mesh clogging increase line edge roughness.

    Particle size and screen mesh interaction determine print resolution. The D100 should not exceed 20 μm; this formulation has D100 ≤15 μm, compatible with 200–325 mesh screens. For 150 μm line/space capability, 325 mesh stainless steel with emulsion thickness 10–12 μm is required. Lower mesh counts increase wet deposition but reduce resolution; 200 mesh screens with 74 μm apertures cannot reliably resolve below 250 μm trace pitch.

    On forced-air conveyor ovens, air velocity above 2 m/s has caused edge lifting on 75 μm polyester substrates and registration drift due to film flutter. Multi-zone ovens should maintain first zone below 80 °C to allow solvent evaporation before crosslinking; a first-zone setpoint above 100 °C can cause surface skin formation and solvent entrapment.

    The binder system is a low-temperature latent epoxy with a blocked imidazole catalyst and a thermoplastic flexibilizer. Differential scanning calorimetry shows a cure exotherm peak at 118 °C and onset at 95 °C. Post-cure glass transition temperature is 82 ± 3 °C. The polyester-compatible solvent blend has a boiling range of 190–245 °C; evaporation rate is adjusted to avoid condensation on the screen while preventing dry-in. Weight loss after cure is 7.5–9.5% as determined by thermogravimetric analysis at 120 °C for 20 min.

    Because the paste is often evaluated against conventional high-temperature silver paste and conductive carbon as a drop-in conductor, the comparative data in Table 1 isolates the critical process and electrical differences. The term “EL grade” does not imply transparency; replacements for sputtered indium tin oxide require a transparent conductive formulation, whereas this material is intended for opaque rear electrodes and bus bars.

    ParameterElectronic/EL Grade low-temperature silver pasteHigh-temperature silver pasteConductive carbon paste
    Cure schedule120 °C, 20 min150–180 °C, 30–60 min80–120 °C, 15–30 min
    Sheet resistance0.020–0.060 Ω/sq/mil (ASTM F390-21)0.015–0.050 Ω/sq/mil15–30 Ω/sq/mil
    PET substrate compatibilityYes at 120 °C cureLimited; shrinkage 1.2–1.5% on 75 μm filmYes
    Adhesion to ITO/PET5B (ASTM D3359-17)5B after 150 °C cure4B
    Pot life at 25 °C8 h6–12 h12 h

    When Replacing High-Temperature Silver Paste or Conductive Carbon on Polyester Substrates

    Substitution of high-temperature silver paste is feasible only when the substrate is polyester or another heat-sensitive film and the circuit design accepts a moderate increase in sheet resistance. High-temperature silver pastes typically cure at 150–180 °C for 30–60 min, which exceeds the heat distortion temperature of unstabilized polyethylene terephthalate and causes shrinkage of 1.2–1.5% in 75 μm film. Electronic/EL Grade paste cures at 120 °C for 20 min, limiting polyester shrinkage to 0.2–0.4%. In contrast to conductive carbon paste, which exhibits sheet resistance of 15–30 Ω/sq/mil and is suitable only for field grading or static dissipation, the silver paste provides 0.020–0.060 Ω/sq/mil; this is a difference of approximately three orders of magnitude, as determined by ASTM F390-21.

    The paste is not a replacement for sintered die-attach silver or high-temperature cermet conductors. Sintered die-attach materials require 200–300 °C and, in some formulations, pressure-assisted densification to achieve bulk-like silver conductivity. The epoxy-bound Electronic/EL Grade material retains polymer matrix limitations, including glass transition temperature near 82 °C and a maximum continuous operating temperature of 85 °C. The cured film is not soldered directly; molten SAC305 at 230–250 °C causes binder degradation and adhesion loss. For solder interconnects, a plated copper or high-temperature silver pad must be used, with the low-temperature silver serving only as printed trace.

    In electroluminescent lamp fabrication, the paste is printed as the rear electrode and as bus bars along the lamp perimeter. A typical dry film thickness of 20–30 μm balances conductivity with flex crack resistance. Lamps laminated with ITO-coated polyester front electrodes and barium titanate dielectric layers have shown capacitance retention after 1,000 h at 60 °C/90% RH, but published data for this specific configuration is limited. The low-temperature cure avoids the characteristic orange-peel or ITO cracking observed with high-temperature silver pastes.

    The product differs from UV-curable silver conductors in cure mechanism and throughput boundary. UV-curable formulations crosslink within seconds under UV-LED or electrodeless lamps but require line-of-sight exposure; low-temperature thermal cure penetrates under opaque components and packages. However, UV-curable silver often achieves lower solvent content and faster throughput on roll-to-roll lines. For high-volume label printing, UV-curable systems may be preferable; for EL lamp rear electrodes and membrane circuit tails where thermal cure is acceptable, Electronic/EL Grade paste provides a wider process window and lower binder sensitivity to moisture. The 28,000–38,000 mPa·s viscosity is approximately four to five orders of magnitude higher than printable piezo inkjet silver inks, typically 8–15 mPa·s, so the material cannot be used in inkjet heads; it is limited to screen or stencil printing.

    Flexural endurance of cured traces on 75 μm polyester was tested using a 3 mm radius bend over 10,000 cycles; resistance increased by 15–25%, but published data for this specific configuration is limited. Cured film moisture absorption at 85 °C/85% RH for 500 h is 1.8–2.4%, contributing to sheet resistance drift of 8–12%. End-use flex testing is required for dynamic bending applications.

    Storage and handling boundaries are listed in Table 2. Paste should be stored at 4–8 °C; unopened container shelf life is 6 months. Before opening, containers must acclimate for 4 h at 22–25 °C. At relative humidity above 60%, substrate pre-drying at 60 °C for 15 min is required to prevent microvoids from trapped moisture. The paste should not be diluted with amine-containing solvents; amine species accelerate epoxy advancement and reduce screen-life below 2 h. Pot life after opening at 25 °C is 8 h.

    RequirementStandard/RegulationStatus/Value
    Sheet resistanceASTM F390-210.020–0.060 Ω/sq/mil
    Adhesion classificationASTM D3359-175B
    ViscosityISO 3219-1:2017, ASTM D2196-2028,000–38,000 mPa·s
    RoHS restricted substancesDirective 2011/65/EU Annex IIPass by batch testing
    REACH SVHC declarationRegulation (EC) No 1907/2006No SVHC above threshold
    Top