| HS Code | 702019 |
| Dielectric Strength | 15 kV/mm |
| Volume Resistivity | 1×10^15 Ω·cm |
| Surface Resistivity | 1×10^14 Ω/sq |
| Dielectric Constant 1 Mhz | 3.2 |
| Dissipation Factor 1 Mhz | 0.01 |
| Thermal Conductivity | 0.8 W/m·K |
| Glass Transition Temperature Tg | 120°C |
| Coefficient Of Thermal Expansion | 40 ppm/°C |
| Operating Temperature Range | -40°C to 150°C |
| Mix Ratio Resin To Hardener | 1:1 by weight |
| Viscosity At 25 C | 3000 mPa·s |
| Cure Time At 25 C | 24 hours |
| Hardness Shore D | 70 |
| Water Absorption 24h | 0.2% |
| Flammability Rating | UL94 V-0 |
As an accredited Insulating Potting Adhesive Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Insulating Potting Adhesive Electronic/EL Grade, 1 kg container: sealed, moisture-resistant packaging for safe storage and precise dispensing. |
| Container Loading (20′ FCL) | 20′ FCL loading of Insulating Potting Adhesive (Electronic/EL Grade) on pallets, using secure drums/cartons, with proper segregation and bracing for safe transport. |
| Shipping | This insulating potting adhesive (electronic/EL grade) ships in sealed, labeled containers via ground service, kept upright and protected from heat/moisture. It is typically non-dangerous for standard transport but requires careful handling. Upon receipt, use appropriate PPE and ensure adequate ventilation. Avoid air freight unless carrier approval is confirmed. |
| Storage | Store in a cool, dry, well-ventilated area between 5–35°C. Keep the original container tightly sealed when not in use to prevent moisture absorption and contamination. Avoid direct sunlight, heat sources, and open flames. Ensure adequate ventilation and keep away from incompatible materials. Follow manufacturer’s shelf-life recommendations. |
| Shelf Life | Shelf life is typically 12 months from manufacture date when stored unopened in the original container below 25°C in a dry area. |
For 800 V class on-board chargers and automotive DC-DC converters, the potting adhesive is specified as a two-part electronic/EL grade metered at 100:30 by weight resin-to-hardener. Mixed viscosity at 25°C is held between 1,400 mPa·s and 1,900 mPa·s, permitting vacuum-assisted penetration into a 1.2 mm gap above MOSFET packages without entrapping air. Ratio control on production-scale 2K gear-pump dispensers is maintained within ±1.5% by weight; excursions beyond 3% are observed as hardener-rich surface layers with reduced crosslink density. The resin is degassed in the supply tank at 2–5 mbar for 10 min and dispensed through a 6 mm static mixer at 0.3–0.6 mL/s. After cavity filling, the module is pre-cured at 80°C for 60 min and post-cured at 120°C for 120 min. Dielectric strength measured per ASTM D149-20 on a 3.0 mm plaque is 17 kV/mm. Volume resistivity per ASTM D257-14 remains above 1×1014 Ω·cm after 1,000 h at 85°C/85% RH. Comparative tracking index is 600 V per IEC 60112. Thermal shock testing to IEC 60068-2-14:2009 Test Na at −40°C to 125°C for 500 cycles produces no cracking when the bondline is controlled below 3.0 mm. The finished power module is an aluminium-cased converter potted to IP67 with a 2.5 mm encapsulation layer over the gate-drive transformer and bus-bar terminals.
In high-voltage flyback transformers and pencil-type ignition coils, air pockets larger than 50 µm become partial discharge initiation points when local electric field stress exceeds 3 kV/mm. The electronic/EL grade is processed at 100:28 by weight and adjusted with a reactive aliphatic glycidyl ether to reduce mixed viscosity to 800–1,200 mPa·s at 25°C. The lower viscosity is required for void-free penetration into secondary winding layers with turn-to-turn gaps below 0.3 mm. Vacuum potting is performed in a chamber at 5 mbar absolute, with the bobbin preheated to 60°C to reduce dissolved moisture. The resin is held under vacuum until visible bubble release ceases, then vented to atmospheric pressure before gelation so that residual microbubbles collapse. Gelation at 100°C requires 18–24 min; post-cure at 150°C for 2 h raises the glass transition temperature to 148°C. Partial discharge inception voltage is measured per IEC 60270 on a potted coil with a 1.2 mm encapsulation layer. The acceptance criterion is set at 2.0 kV rms extinction voltage after 240 h at 105°C. The cured coil meets the 35 kV impulsive withstand requirement for ignition coil secondary insulation and is classified Class F under IEC 60085:2007. End component: a switch-mode power supply transformer or automotive ignition coil encapsulated without corona-promoting voids.
Constant-current LED drivers for wet-location luminaires are potted into aluminium extrusions with wall thicknesses from 1.5 mm to 3.0 mm. For a 277 VAC driver, the potting layer between PCB and housing must withstand a 2,500 VAC dielectric withstand test for 60 s without breakdown. The selected electronic/EL grade uses a 4:1 by weight mix ratio and cures to a Shore A hardness of 65, limiting stress transfer to ceramic capacitors during repeated thermal expansion. Mixed viscosity at 25°C is 2,200–3,200 mPa·s; this viscosity allows the material to remain in the extrusion without a separate dam. The potting process uses a two-component gear pump with dynamic mixing at 300 rpm and a shot size of 85 g for a 240 mm × 45 mm driver cavity. Vibration at 40 Hz for 3 min releases entrapped air before the gel time of 45 min at 25°C. Cure is performed at 70°C for 3 h. The cured driver passes UL 8750 insulation requirements and UL 94 V-0 at 3.0 mm. Final component: a 150 W dimmable LED driver rated IP65 for −40°C to 60°C ambient operation.
When a battery management system slave module is mounted directly on a lithium-ion cell stack, the potting adhesive must tolerate continuous exposure to electrolyte vapours containing dimethyl carbonate and ethylene carbonate without softening. The electronic/EL grade is mixed at 100:30 by weight and applied as a 2.0 mm dam-and-fill layer over the cell-sense ICs and surface-mount fuses. Mixed viscosity is 1,600–2,400 mPa·s; gel time at 25°C is 70 min, giving sufficient working time for a 12-cavity fixture. The formulation contains 15 wt% alumina filler to reduce the coefficient of linear thermal expansion to 38 ppm/K below Tg. Cure schedule is 85°C for 90 min followed by 130°C for 60 min. After 1,000 h at 85°C/85% RH with 50 VDC bias, surface insulation resistance remains above 1×109 Ω when tested per IPC-TM-650 2.6.3.7. Thermal shock resistance is verified under IEC 60068-2-14:2009 Test Na with −40°C to 105°C for 1,000 cycles; no exposure of copper traces at the board edge is permitted. Amine-based accelerators are not added to this system because they reduce gel time below the fixture working window. End product: a 12-cell BMS module potted into a flame-retardant polycarbonate housing that passes UL 94 V-0 at 1.5 mm.
In variable-frequency drives, insulated-gate bipolar transistor power stages generate local heat fluxes above 15 W/cm² at the die attach interface. A rigid electronic/EL grade with a 100:30 by weight mix ratio and 50 wt% spherical alumina loading is used to encapsulate the bus-bar terminals and gate-drive circuitry. The filler loading raises mixed viscosity to 4,000–6,500 mPa·s; the material is therefore dispensed through a heated 12 mm progressive-cavity pump at 40°C. The cavity is preheated to 55°C to reduce thermal shock during filling. Cure is initiated at 90°C for 45 min and completed at 140°C for 90 min. The resulting potted module has a dielectric strength of 16 kV/mm on a 3.0 mm specimen per ASTM D149-20 and a comparative tracking index of 600 V per IEC 60112. The insulated bus-bar region withstands a 4.0 kVAC one-minute routine test per IEC 61800-5-1:2007 before the drive is cleared for shipping. Thermal cycling per IEC 60068-2-14:2009 Test Na at −40°C to 125°C for 300 cycles shows no delamination at the copper-alumina filler interface when the filled resin is cured with a linear shrink of 0.8% or less. End product: a 7.5 kW industrial motor drive with a potted inverter stage rated for 480 VAC input.
Vacuum environments impose a total mass loss budget on any potting adhesive used near optical surfaces or sealed enclosures in avionics sensor modules. The electronic/EL grade is processed at 100:32 by weight and cured at 120°C for 4 h to force completion of the resin-hardener reaction before space-level testing. The cured sample is tested per ASTM E595-15; acceptance requires total mass loss below 1.0% and collected volatile condensable material below 0.1%. A post-cure at 150°C for 2 h is used to reduce TML values below the acceptance threshold by driving off low-molecular-weight cyclic homologues. Outgassing acceptance is paired with solder joint protection: a 1.5 mm potting layer over a 48-pin quad-flat package must not impose more than 0.2% strain on the gull-wing leads after thermal vacuum cycling from −65°C to 150°C. The same grade passes UL 94 V-0 at 1.5 mm and provides a dielectric strength of 18 kV/mm per ASTM D149-20.
| Parameter | Test method | Acceptance limit |
|---|---|---|
| Total mass loss | ASTM E595-15 | <1.00% |
| Collected volatile condensable material | ASTM E595-15 | <0.10% |
| Surface insulation resistance after damp heat | IPC-TM-650 2.6.3.7 | >1×109 Ω |
End product: an air-data sensor assembly potted into an aluminium housing for a commercial aircraft retrofit programme.
Photovoltaic microinverters attached to the module frame experience daily temperature swings from −40°C to 85°C and high UV exposure on the enclosure. The electronic/EL grade is metered at 100:30 by weight, degassed in a 2K dispenser, and injected into the microinverter cavity at 0.4 mL/s. Mixed viscosity is 1,300–1,800 mPa·s at 25°C. The cavity is preheated to 50°C to lower viscosity and prevent moisture condensation before sealing. Cure schedule is 80°C for 60 min followed by 125°C for 90 min. Dielectric withstand of the potted assembly is verified at 3,000 VAC for 60 s per IEC 62109-1:2010 as a routine test. The potted unit is then subjected to IEC 60068-2-14:2009 Test Na with −40°C to 85°C for 200 cycles and damp heat at 85°C/85% RH for 1,000 h with a 1,000 VDC insulation resistance measurement after recovery. The cured compound has a comparative tracking index of 600 V per IEC 60112 and a temperature index of 130°C per UL 746B.
| Test | Standard | Condition | Pass criterion |
|---|---|---|---|
| Dielectric strength | ASTM D149-20 | 3.0 mm plaque | ≥15 kV/mm |
| Volume resistivity | ASTM D257-14 | 500 VDC | ≥1×1014 Ω·cm |
| Thermal shock | IEC 60068-2-14:2009 Test Na | −40°C to 85°C, 200 cycles | No crack or delamination |
| Damp heat with bias | IEC 62109-1:2010 | 85°C/85% RH, 1,000 h | Insulation resistance >1 MΩ |
End product: a 250 W single-phase microinverter qualified to UL 1741 for grid-interactive service.
After selective soldering and in-circuit test, household appliance control boards are potted only once programming-pad access is no longer required. The potting adhesive selected for washing-machine inverter boards is a 1:1 by volume electronic/EL grade with a gel time of 30 min at 25°C and a Shore A hardness of 80. The low mixed viscosity of 600–900 mPa·s allows gravity-assisted flow into a 0.8 mm gap between the PCB and a plastic carrier without pressure dispensing. The board is preheated to 40°C for 15 min to eliminate residual moisture before application. Cure is performed at 65°C for 2 h, which is compatible with the 105°C temperature rating of the electrolytic capacitors on the board. The cured compound passes glow-wire testing per IEC 60695-2-11:2021 at 750°C without flame and has a comparative tracking index of ≥600 V per IEC 60112. The finished control board meets reinforced insulation creepage-distance requirements under IEC 60335-1:2010, Clause 29. End product: a 1,200 rpm front-loading washing-machine motor control board potted for vibration damping and moisture resistance.
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Insulating Potting Adhesive Electronic/EL grade denotes a solvent-free polymeric encapsulant formulated for bonding and sealing electronic assemblies where dielectric strength, ionic purity, and resistance to thermal cycling are acceptance-critical. The grade designation is used by materials suppliers for formulations that meet elevated cleanliness and electrical insulation requirements beyond general-purpose potting compounds. Typical two-part epoxy systems are based on bisphenol-A or cycloaliphatic epoxy resins with anhydride or amine hardeners; filled silica, alumina, or treated calcium carbonate systems are common. One-part silicone or polyurethane variants are offered where low modulus is required, but the electronic/EL grade described here usually refers to filled epoxy systems specified for rigid or semi-rigid encapsulation of power supplies, LED drivers, sensors, and high-voltage connectors.
For procurement screening, typical acceptance limits include dielectric strength determined per ASTM D149-20 on 3.0 mm cast plaques from 15 kV/mm to 25 kV/mm, volume resistivity after conditioning per ASTM D257-14 exceeding 1.0 × 1014 Ω·cm at 23 °C and 50 % RH, and mixed viscosity at 25 °C between 500 mPa·s and 5,000 mPa·s for vacuum dispensing. Such figures are not universal; they are drawn from published technical data sheets for electronic-grade epoxy potting adhesives and depend on filler loading, hardener stoichiometry, and post-cure schedule.
Model codes are vendor-specific and commonly encode hardener speed, viscosity class, and flame-retardant rating. A data sheet may list a product as low-viscosity electronic/EL, UL 94 V-0 at 0.75 mm, mixed viscosity 1,200 mPa·s at 25 °C, pot life 45 min for 100 g mass. Published data for a single named product configuration is limited; procurement comparisons should rely on the manufacturer’s certificate of analysis and third-party test reports rather than generalized product family values.
The primary difference is control of ionic contaminants and outgassing constituents. General-purpose electrical potting adhesives may contain higher residual chloride, sodium, or ammonium species that reduce surface insulation resistance under humidity and bias. Electronic/EL grade formulations are typically specified to maintain surface insulation resistance above 1.0 × 109 Ω after 85 °C/85 % RH bias testing per IPC-TM-650 method 2.6.3.7 or similar. They also tend to be less plasticized, with lower exothermic temperature rise during cure and lower volumetric shrinkage.
| Property | Test method | General-purpose epoxy | Electronic/EL epoxy | Silicone | Polyurethane |
|---|---|---|---|---|---|
| Mixed viscosity at 25 °C | ASTM D2196 | 200–50,000 mPa·s | 500–5,000 mPa·s | 300–20,000 mPa·s | 500–10,000 mPa·s |
| Dielectric strength | ASTM D149-20 | 12–20 kV/mm | 15–25 kV/mm | 15–22 kV/mm | 12–20 kV/mm |
| Volume resistivity | ASTM D257-14 | 1012–1014 Ω·cm | >1014 Ω·cm | 1014–1015 Ω·cm | 1012–1014 Ω·cm |
| Hardness | ASTM D2240 | 80–90 Shore D | 75–90 Shore D | 20–60 Shore A | 40–95 Shore A |
| CTE below Tg | ASTM E831 | 40–80 ppm/°C | 25–60 ppm/°C | 150–300 ppm/°C | 100–200 ppm/°C |
In production-scale vacuum potting of LED drivers, the mixed electronic/EL grade adhesive is degassed at 0.1–10 kPa absolute pressure for 5–30 min before transfer to a piston or progressive-cavity dispenser. Vacuum potting chambers are held below 5 kPa during shot delivery to prevent void entrapment in transformer bobbins and toroidal coils; then the assembly returns to atmospheric pressure for leveling. Pot life at 25 °C is commonly 30–90 min for 100 g mixed mass, and pot life decreases nonlinearly with larger batch size because of exothermic self-heating. On two-component mixing equipment, outlet temperature is controlled to 20–25 °C to maintain viscosity stability.
Cure schedules are specified by hardener chemistry. An anhydride-cured electronic/EL epoxy may require 80 °C for 2 h plus 120 °C for 2 h, while an amine-cured system may cure at 60 °C for 4 h. Low-temperature cure below 50 °C is generally not recommended for full electrical property development because residual unreacted amine or anhydride can depress volume resistivity and increase moisture uptake.
Batch-to-batch variation in filled electronic/EL adhesives is most visible in mixed viscosity and filler settling. Production lines that use drum storage at 23 °C without recirculation have observed viscosity drift of 5–15 % after 6 months due to hardener sediment or moisture ingress through partially closed containers. This requires in-line viscosity checks per lot using a Brookfield viscometer at 25 °C before releasing to potting stations.
During thermal cycling from −40 °C to 125 °C, the electronic/EL grade’s coefficient of thermal expansion below glass transition and its tensile modulus determine whether bondline delamination or passivation cracking occurs. Low-stress electronic-grade epoxies are formulated with CTE values between 25 ppm/°C and 60 ppm/°C below Tg and Tg above 80 °C. Filler loading is not a free variable. Increasing fused silica or alumina content reduces CTE and increases thermal conductivity, but also raises mixed viscosity and modulus. A typical process conflict appears at filler loadings above 60 wt%: thermal conductivity approaches 0.8 W/m·K to 1.0 W/m·K, but mixed viscosity may exceed 10,000 mPa·s, and vacuum penetration into gaps below 0.2 mm becomes marginal. Published data for exact cliff-edge values for every product configuration is limited; manufacturers’ technical bulletins usually specify maximum filler levels for vacuum potting based on shot volume and capillary gap.
Power modules with IGBT or SiC devices require heat dissipation and partial discharge resistance. The electronic/EL grade is therefore selected with a compromise filler content, commonly 40–55 wt%, to retain flow into 0.5 mm clearance gaps while achieving CTE below 50 ppm/°C. Thermal shock acceptance is evaluated per IPC-TM-650 method 2.6.7 or JEDEC JESD22-A104, with 500 to 1,000 cycles from −40 °C to 125 °C used for automotive or industrial power supplies. Cracking in 3 mm sections and adhesion loss on FR-4, alumina, or copper leadframe surfaces are common failure modes when hardener stoichiometry deviates by more than ±5 %.
Compared with silicone potting, electronic/EL epoxy provides higher tensile and lap shear adhesion to PCB substrates, typically 5–15 MPa lap shear on aluminum or FR-4 per ASTM D1002-10, but has lower elongation, usually 1–5 % per ASTM D638-14, making it unsuitable for large CTE-mismatched assemblies that demand elastomeric movement. Silicone remains the preferred choice for flexible circuits and large-area ceramic substrates; electronic/EL epoxy is specified where structural rigidity, chemical resistance, and high-frequency dielectric stability are required.
Partial discharge onset voltage in high-voltage potting is sensitive to voids, delamination, and metallic or ionic contamination. Electronic/EL grade formulations designed for high-voltage use are filtered to remove particulates above 20 μm and are specified with measured partial discharge inception voltage per IEC 61287-1 or similar equipment-specific methods. In transformer and ignition coil potting, unfilled or low-filler electronic/EL epoxies are often preferred to reduce filler sedimentation and edge-enhancement at copper windings. The trade-off is higher CTE and lower thermal conductivity, which shifts thermal management requirements to the housing or heat sink.
Ionic contamination is controlled at the resin and hardener synthesis stage. Technical data sheets for electronic/EL grade typically report hydrolyzable chloride below 100 ppm and sodium or potassium below 10 ppm. When used with amine-cured systems, the presence of residual amine structures can raise dissipation factor at elevated temperature; therefore, anhydride-cured electronic/EL epoxies are often selected for high-frequency transformers and capacitors where dielectric loss per ASTM D150-18 must remain below 0.02 at 1 MHz. Polyurethane alternatives, though flexible, generally exhibit lower thermal stability and higher moisture permeability per ASTM D570-22, making them less suitable for continuous operation above 105 °C.
On twin-screw extrusion or static mixer dispensing systems, maintaining stoichiometric ratio within ±2 % is necessary for electronic/EL epoxy systems. Anhydride-cured formulations are less sensitive to mixing-ratio drift than amine-cured systems, but off-ratio hardener affects Tg, dielectric loss, and moisture resistance. In-line FT-NIR or refractive index monitoring has been used on production lines to verify hardener content before vacuum potting; typical acceptance limits are set from calibration curves with 95 % confidence. Static mixers shorter than 12 elements can produce striated resin regions that remain visible after cure and act as weak planes during thermal shock.
As an adhesive, electronic/EL grade can replace mechanical fasteners in small power supplies, bonding ferrite cores to aluminum heat sinks with lap shear values from 5 MPa to 15 MPa per ASTM D1002-10. However, adhesive thickness should be controlled between 0.1 mm and 0.5 mm; thicker bondlines increase thermal resistance and reduce mechanical strength. Bondline thickness control in production is achieved by pre-applied glass bead spacers or dispense path programming on XYZ robotic platforms with needle standoff verification.
Shelf life of unmixed electronic/EL epoxy in unopened containers is commonly 6–12 months at 23 °C. Frozen storage extends this to 12–24 months for some cycloaliphatic systems, but repeated thaw cycles can nucleate filler agglomeration. Pot life is mass-dependent: a 100 g mixed mass may remain dispensable for 60 min, while a 500 g mass may gel in 25–40 min due to exothermic acceleration. Production work instructions therefore specify maximum batch mass and cooling of mixing reservoirs to 15–20 °C for long pot-life operations.
In under-hood or enclosed power electronics, comparative tracking index per IEC 60112 and relative thermal index per UL 746B may be required. Electronic/EL epoxies with high filler loading can show CTI above 600 V, but this value depends on filler surface treatment and must be validated on the final molded section, not inferred from resin type alone.
Procurement specifications for electronic/EL potting adhesive often include the following conformity items:
| Requirement | Standard or method | Typical acceptance criterion |
|---|---|---|
| Flame retardance | UL 94 V-0 | V-0 at 0.75–3.0 mm thickness |
| Dielectric strength | ASTM D149-20 | ≥ 15 kV/mm |
| Volume resistivity | ASTM D257-14 | ≥ 1.0 × 1014 Ω·cm |
| Dielectric constant at 1 MHz | ASTM D150-18 | 2.5–5.0 |
| Dissipation factor at 1 MHz | ASTM D150-18 | ≤ 0.02 |
| Water absorption 24 h | ASTM D570-22 | ≤ 0.5 % |
| Outgassing | ASTM E595-15 | ≤ 0.10 % TML, ≤ 0.01 % CVCM for space-adjacent variants |
| Low-halogen compliance | IEC 61249-2-21 | Cl < 900 ppm, Br < 900 ppm, total < 1,500 ppm |
| Restricted substances | RoHS 2011/65/EU, REACH 1907/2006 | Declared compliant by supplier certificate |
Operational boundaries include moisture sensitivity and substrate compatibility. Filled electronic/EL epoxy systems should be stored unopened at 5–25 °C; storage below 5 °C can crystallize hardener components, while storage above 30 °C accelerates viscosity increase and reduces pot life. Before potting, substrates such as FR-4, polyimide, and oxidized copper should be dried at 85–110 °C for 2–4 h when ambient relative humidity exceeds 60 %, because adsorbed moisture at the bondline can become steam during exothermic cure and produce voiding. Avoid combination with amine-based surface activators or certain platinum-catalyzed silicone residues, as premature crosslinking or interfacial contamination can occur. Compliance with UL 746E requires that the specific cured compound be tested in the intended thickness and on the intended substrate; a generic “UL listed” statement does not transfer across different modules.
Production-line failure modes observed with electronic/EL potting adhesives include filler settling in supply reservoirs, entrapped air in sharp-edged winding corners, and abrasive wear of progressive-cavity pump stators at filler loadings above 40 wt%. In high-humidity assembly environments, amine blush on the adhesive surface can form within 30 min of open mixing; such surfaces should be evaluated by surface insulation resistance testing before conformal coating or final sealing. For potting depths greater than 25 mm, exothermic temperature rise can exceed 120 °C and cause stress cracking; sequential shot filling or low-exotherm hardener systems are then used.
For high-voltage automotive battery management modules, an electronic/EL grade with CTE below 40 ppm/°C, dielectric strength above 18 kV/mm, and low outgassing is dispensed under vacuum to fill 1.0–3.0 mm gaps between busbars and housing. The cured adhesive must retain adhesion after 1,000 h at 85 °C/85 % RH and 1,000 thermal cycles, with leakage current below 1 μA at rated working voltage. In contrast, general-purpose electrical epoxy at equal section thickness may show lower dielectric strength and higher extractable ion content, which can lead to electrochemical migration under bias. Published data for this specific configuration is limited; therefore, qualification coupons should be potted under the same vacuum profile, nozzle movement, and batch size used in mass production.
