|
HS Code |
224615 |
| Thermal Conductivity | High |
| Electrical Conductivity | Low |
| Operating Temperature Range | -50°C to 200°C |
| Color | Gray |
| Density | 2.5 g/cm³ |
| Flame Retardance | UL 94 V-0 |
| Material Type | Silicone-based |
| Thickness | 1 mm |
| Hardness | Shore 00-50 |
| Compression Set | <10% |
| Dielectric Strength | ≥10 kV/mm |
| Water Absorption | <0.5% |
| Surface Resistivity | ≥10^13 Ω/sq |
As an accredited Heat Conduction Material factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | The packaging contains 500g of Heat Conduction Material, sealed in a silver, resealable foil pouch with clear labeling and safety instructions. |
| Shipping | The chemical "Heat Conduction Material" should be shipped in secure, sealed containers designed to prevent leakage or contamination. It must be clearly labeled according to regulatory standards, and handled with appropriate personal protective equipment. Store the shipment away from moisture and extreme temperatures, ensuring compliance with all relevant safety and transport regulations. |
| Storage | The storage for Heat Conduction Material should be cool, dry, and well-ventilated, away from direct sunlight and sources of ignition. Containers must be tightly sealed, clearly labeled, and made of compatible, non-reactive materials. Store at ambient temperature and avoid contact with moisture or incompatible substances. Follow all relevant safety guidelines, including the use of secondary containment to prevent spills. |
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Thermal Conductivity: Heat Conduction Material with high thermal conductivity (≥5 W/m·K) is used in CPU thermal interface applications, where it enhances heat dissipation efficiency and maintains stable processor performance. Purity: Heat Conduction Material with 99.9% purity is used in LED module assemblies, where it minimizes electrical resistance and ensures reliable long-term thermal transfer. Particle Size: Heat Conduction Material with micro-sized particles (<10 µm) is used in power electronics, where it provides uniform surface coverage and reduces thermal resistance at interfaces. Stability Temperature: Heat Conduction Material with stability temperature up to 200°C is used in automotive battery packs, where it prevents thermal runaway and extends battery lifespan. Viscosity Grade: Heat Conduction Material with medium viscosity (10,000–20,000 cP) is used in assembling communication devices, where it enables easy application and consistent gap filling for optimal heat flow. Melting Point: Heat Conduction Material with a low melting point (60°C) is used in phase change heat sinks, where it offers rapid phase transition and effective temperature regulation. Electrical Insulation: Heat Conduction Material with high electrical insulation (>10^14 Ω·cm) is used in inverter modules, where it prevents electrical leakage and protects circuit integrity. Thermal Expansion: Heat Conduction Material with low coefficient of thermal expansion (<10 ppm/°C) is used in semiconductor packaging, where it reduces mechanical stress and improves device reliability. Hydrophobicity: Heat Conduction Material with superior hydrophobic properties (contact angle >110°) is used in outdoor photovoltaic systems, where it enhances moisture resistance and maintains thermal performance in humid environments. Aging Resistance: Heat Conduction Material with excellent aging resistance (no degradation after 1,000 hours at 150°C) is used in industrial motor drives, where it ensures consistent thermal operation and reduces maintenance intervals. |
Competitive Heat Conduction Material prices that fit your budget—flexible terms and customized quotes for every order.
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Every day in our production workshops, we watch equipment push the limits: compact chips on circuit boards pumping out watts of heat, batteries in power systems stacking layer upon layer, LED lights glowing well above ambient, signal amplifiers working non-stop. The growing demand for power density brings a single question to the fore—where will the heat go? That’s where our new Heat Conduction Material, Model HCM-920, enters real-world problem solving.
This isn’t a product built in isolation. Years on the factory floor and constant feedback from engineers led us to choose the right fillers, ideal polymer resins, and a balance of flexibility with toughness. Our research team borrows ideas from application failures—overheated modules in telecom, battery packs suffering critical shutdowns, and circuit boards delaminating from trapped heat. Every batch draws from hands-on field data, and every new roll faces stress, stretch, and thermal cycling tests beyond lab averages.
We use a silicone polymer base infused with a specialty ceramic blend, fine-tuned for consistent heat flow from component to heat sink or chassis. HCM-920 delivers a thermal conductivity tested at 4.5 W/m·K, holding its shape between -45°C and 200°C. More than just a number, this range reflects how the material performs from rigorously cold storage facilities to server banks in hot climates.
For engineers worried about assembly, HCM-920 comes in sheet form, with thicknesses starting from 0.3 mm up to 3.0 mm. We cut each roll to exact width and provide pre-patterned shapes on order, so the material goes straight from box to module without headaches. The silicone remains pliable for fit across uneven surfaces, closing air gaps and avoiding the common pitfall of dry spots or inconsistent coverage that leads to hotspots.
On the manufacturing line, HCM-920 doesn’t crumble or tear during placement. Workers handle thousands of sheets in batches, and our material faces the stress of electric screwdriver torque, rapid alignment, or fast mechanical pressing, with no dust generation. This reduces downstream cleanup and increases uptime—something that becomes obvious when you compare it to old-style mica washers or DIY thermal pastes that flake out.
Customers switching from thermal pad competitors or from generic thermal pastes often point to two chronic issues: poor thermal transfer and assembly mess. Competitor pads, especially natural rubber-based or cheap imported silicone, tend to leak silicone oil or lose body after thermal cycles. The lost mass can seep into electronic contacts, causing corrosion or dielectric breakdown over time. Our HCM-920 tackles this directly by staying cohesive—leaving no residue, even after months of real field deployment.
Another common alternative, thermal paste, sometimes gives high conductivity right after application. But the struggle comes during rework or warranty claims. Once that paste has dried or is exposed to vibration and ambient humidity swings, it can break down, pump out from under pressure points, and reduce contact area. Recovery becomes a chore, requiring scraping and solvent cleaning.
By contrast, HCM-920 keeps stable shape and contact even after multiple mounting and demounting cycles. Our experience in servicing telecom infrastructure taught us how crucial this is when replacing burned out chips or upgrading boards. Through these lessons, we’ve proven that a sheet-based approach—matched in thickness to each design—saves hours per week per technician and reduces risk of part damage from invasive cleanup.
You see the difference in horizontal furnace runs, solar inverter power stages, medical diagnostic units, and automated test benches. Instead of waiting for a telltale discoloration or reviewing RMA returns, you get to see the same thermal profile month after month. The real value isn’t just in degree numbers—it's in reduced complaints, fewer unplanned shutdowns, and faster root-cause analysis.
Every batch of HCM-920 is tested for dielectric strength, mechanical elasticity, and surface finish. We target a breakdown voltage of over 6 kV/mm, so it fits applications between live traces and grounded metal without arc risk. The careful mix of filler and silicone gives the material a low compression set, making sure your mounting pressure translates to direct component contact instead of squeezing the pad thin and losing cooling performance.
We measure our own products through the same lens as our clients—living through production bottlenecks, unscheduled maintenance, and tough warranty metrics. Our engineering customers have reported that using HCM-920, thermal resistance from chip case to heat spreader measured 30% lower compared to legacy pads of similar thickness. This translates to lower operating junction temperatures and increases the service life of critical parts.
Backed by in-house testing, we also confirmed that HCM-920 resists oil bleeding and has nearly zero siloxane outgassing, so sensitive optical or sensor environments remain clean. No oily residue clouds lenses, and no adhesion loss occurs on vertical or inverted installations—important for modern smart-light fixtures and camera-driven safety controls.
Most failures don’t show up at the start. Months or even years of load cycling, freeze/thaw events, or exposure to dust and moist air will reveal who made the right material decisions. In field reports from energy-storage OEMs using HCM-920, battery units now last through triple the number of deep charge-discharge cycles before any thermal event warning occurs.
Telecom base station modules used in high humidity coastal regions have also shown improved isolation with our product. In these cases, HCM-920 doesn’t sponge up airborne moisture or degrade in salty atmospheres. Electronic modules maintain stable internal resistance, with surface tests after continuous operation matching baseline factory values.
We’ve run accelerated aging on prototypes, exposing pads to ozone, UV, and typical urban pollutants, then checked mechanical flexibility and conductivity. HCM-920 stays pliable—never going brittle, which helps especially with thermal cycling in EV battery packs or renewable energy hardware exposed to daily hot/cold swings.
Line staff feedback drives much of our process improvement. Sheet material, especially with HCM-920’s surface texture, allows for gloved or bare-hand placement without sticking to skin or causing particulate dust. Technicians with latex allergies benefit from our low-siloxane base. In assembly lines with robotic pick-and-place, HCM-920 defies static buildup, reducing risk of accidental discharge that could harm sensitive MOSFET gates or integrated circuits.
Waste handling matters too—scraps curl up and gather easily, no loose powder escapes, and the product doesn’t generate nuisance odors at elevated temperatures. We align lengths and cuts with common tape-and-reel or tray-pack lines, so operators spend less time trimming or adjusting. This reflects years spent on the shop floor, not just lab tests.
Even during mass summer runs, with indoor temperatures rising and cooling fans working overtime, HCM-920 maintains tack and coverage where competitors would fail. Assembly line supervisors often comment on reduced tool cleaning and shorter setup times.
Modern power electronics set higher demands every year. HCM-920 plays a silent, but crucial, role in upcoming automotive inverters, next-generation 5G base stations, and miniaturized consumer power banks. No matter the format—high-voltage DC/DC conversions, compact battery thermal management, or densely packed LED boards—our formulation holds up.
For R&D teams pushing into new voltage levels or seeking compact designs, HCM-920’s consistent dielectric properties and mechanical performance support reliable design sign-off. We’ve worked directly with customer project managers who report reduced prototype failures, less scrap during transition phases, and smoother compliance handoffs to regulatory labs.
Early-stage startups, who can’t afford reliability hiccups, frequently reach out for customization advice. We’ve returned sample cuts with modified thickness or extended temperature range within a week, drawing from our batch reserves and on-site slitting equipment. Whether it’s challenges in drone battery modules or wearable medtech, the solution isn’t just the product itself—it’s the rapid support and dialogue between our engineers and end users.
Pressure is mounting on all manufacturers to cut hazardous waste and design for recyclability. HCM-920 leaves out lead, bromine, and antimony compounds completely. RoHS compliance reflects our company’s approach—not just something to tick on a form, but an ethos developed with our clients, who need to prove their own environmental credentials.
Disposal at the end of product life matters as much as clean assembly. HCM-920’s low toxicity and stable decomposition profile mean it can be safely handled in electronics recycling processes. It doesn’t leach dangerous byproducts into soil or water. Large-scale electronics manufacturers in Europe have highlighted this property, helping them pass stringent local and global standards without supply chain headaches.
No product lasts without eyes and ears in the field. Every month, our application support team rings up production managers and service techs using HCM-920. We keep records of positive and negative feedback and invite regular visits to the line. Based on these conversations, we’ve introduced tighter thickness tolerances and special versions for high-vibration automotive assemblies.
Five years ago, an international client took us to task about perceived outgassing in their optics modules. We changed both the raw filler source and upgraded our kneading equipment to drive out trace volatiles better. That year, failure rates in the affected application shrank by nearly half.
We learn with every batch, and we welcome tough demands. Our process team meets daily to compare batch cards and production logs. Any recurring issue—like tiny pinholes or unexplained color changes—drives a root cause investigation right at the extrusion line.
Old-fashioned mica insulators cracked and struggled to fill surface imperfections, especially at higher mounting pressures, letting heat cycles loosen fasteners and cause cold weld joints. Paste-type alternatives, while seemingly cheap, run into batch-to-batch inconsistency and sometimes become conductive after exposure to dust or metal debris.
Graphite films, another modern alternative, offer good in-plane conductivity but fall short on out-of-plane heat transfer. Their mechanical fragility means careful, slow handling compared to the robust, forgiving sheets of HCM-920. This matters in real assembly, where throughput and tolerance for hurried adjustments decide project success.
Our material focuses on high vertical (through-thickness) conductivity, so heat travels directly from chip to mounting surface without bottlenecks. Even in the case of double-sided cooling for large format IGBTs or SiC MOSFETs, HCM-920 supports pressure from metal clips or bus bars without loss of structure.
The cost per module, once time and yield losses are factored in, generally favors HCM-920 for medium to high-volume runs. Fewer rejects, little rework requirement, and more consistent thermal data make the difference in final system reliability.
Materials like HCM-920 make new system designs possible. As more companies design for smaller, denser, faster, and more connected devices, thermal challenges won’t go away—they will intensify. Our work continues, in close dialogue with users, to improve conductivity, mechanical resilience, and environmental compatibility. We constantly review our upstream sourcing, manufacturing process, and end-of-life considerations.
Real innovation in the chemicals industry means moving beyond lab tests. Our team builds on decades of production experience and willingness to solve new problems as they arise. Engineers, production managers, and maintenance staff all play a part in our product’s evolution. With HCM-920, we share not just a material, but an ongoing partnership grounded in reliability, openness to change, and hard-won expertise.
Across sectors—automotive, telecommunications, consumer electronics, energy storage, and more—thermal management stands as a non-negotiable factor for system lifetime and safety. HCM-920 brings high conductivity together with mechanical strength, stable operation, and easy integration into real production workflows.
For over two decades, our teams have listened to customer pain points, optimized our process for quality, and adapted to changing regulatory and technological requirements. HCM-920 embodies our belief that well-engineered thermals make innovation possible and keep the world running cooler, longer, and safer.
We stand ready to support your most demanding applications, with knowledge built in the factory rather than the brochure. HCM-920 delivers—sheet after sheet, year after year, across the world’s toughest working environments.