| HS Code | 356477 |
| Chemical Composition | Fluorinated solvents (e.g., HFE, HFO, PFC) |
| Boiling Point Range | 40–60°C depending on grade |
| Flash Point | None (non-flammable for most grades) |
| Density | 1.4–1.6 g/cm³ |
| Evaporation Rate | Fast relative to water |
| Ozone Depletion Potential | 0 |
| Global Warming Potential | Varies by product, typically low to moderate |
| Surface Tension | Low, approximately 12–16 mN/m |
| Water Solubility | Negligible / immiscible |
| Ph | Neutral (approximately 7 in aqueous extract) |
As an accredited Fluorine Cleaning Agent Series factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Each fluorine cleaning agent is packaged in a 250mL HDPE bottle with a child-resistant cap and safety label. |
| Container Loading (20′ FCL) | 20′ FCL container loading for Fluorine Cleaning Agent Series ensures safe, secure transport with proper packaging and ventilation. |
| Shipping | Fluorine Cleaning Agent Series ships as hazardous chemical goods, requiring UN-approved packaging, clear hazard labeling, and full documentation per IATA, IMDG, and ADR regulations. Transport must avoid moisture and high temperatures, with proper segregation from incompatible materials. Ensure SDS availability and certified handling for safe, compliant delivery. |
| Storage | Store Fluorine Cleaning Agent Series in a cool, dry, well-ventilated area away from direct sunlight, heat, and ignition sources. Keep containers tightly sealed to prevent moisture contamination and vapor release. Maintain temperatures between 5–35°C. Separate from strong oxidizers, acids, and alkalis. Use explosion-proof equipment and proper grounding, with spill containment and secondary bunding available. |
| Shelf Life | Typically 12 months in sealed original containers, stored in a cool, dry, ventilated area away from heat and sunlight. |
In advanced semiconductor wafer handling, fluorinated cleaning agents are charged into multi-sump vapour degreasing systems to remove silicon-containing etch residue, fluoropolymer particles, and mixed metal-organic contamination from components that contact 300 mm wafers. Formulation ratio is set according to residue polarity. For silicon-containing etch debris and fluoropolymer particles, a blend of 70 wt% HFE-7100 and 30 wt% trans-1,2-dichloroethylene is circulated in the first sump; for mixed rosin-based die-attach residue, the feed is shifted to a 50 wt%/50 wt% HFE-7100/trans-DCE azeotrope. A final rinse sump is maintained at 100 wt% HFE-7100 to prevent carry-over of chlorinated species into the drying zone. Production-scale units use stainless steel 316L sumps with heating elements controlled to ±1.5 °C, ultrasonic arrays at 40 kHz and power density 18–25 W/L, and a vapour zone held 4–6 °C below boiling point. The thermal window is narrow: raising sump temperature beyond 62 °C increases solvency but causes polymer seals on non-metallic cassette rails to harden, while lowering below 55 °C extends residue breakthrough time from 180 s to over 300 s. Particulate cleanliness is verified per ISO 14644-13:2017 with surface particle counts aligned to IEST-STD-CC1246 level 50; ionic contamination is assayed by extracting wafers in ultrapure water at 18.2 MΩ·cm and analysing cations by ICP-MS, with sodium and potassium acceptance below 1×1012 atoms/cm². Components processed include electrostatic chucks, gas showerheads, quartz boats, transfer blades, edge rings, and 300 mm FOUP door assemblies.
Liquid oxygen service components present simultaneous risks of ignition from hydrocarbon residues and particle-induced scouring under cryogenic flow. Cleaning and verification follow ASTM G93, SAE ARP1176, and CGA G-4.1; autogenous ignition behaviour of cleaned surfaces is tested per ASTM G72. In the first displacement sump, a two-phase PFPE/HFE system containing 25 wt% perfluoropolyether oil and 75 wt% HFE-7100 is used to remove hydrocarbon oils and particulate; the PFPE fraction is selected at kinematic viscosity 12 cSt at 40 °C. The final rinse is conducted with neat HFE-7100 to reduce the total organic residue below 500 mg/m², followed by a 1 wt% PFPE residual film for rotating components where boundary lubrication is required after cleaning. Process equipment consists of passivated 316L stainless steel tanks equipped with 0.2 μm absolute PTFE membrane filters, transverse ultrasonic transducers at 25 kHz, sonication power 25–35 W/L, and dry nitrogen blanketing at dew point −70 °C. Components are transferred through liquid rinse, vapour rinse, and vacuum oven at 60 °C for 4 h. The system is not used on titanium alloys containing stress-corrosion-prone oxide layers unless the final rinse is followed by dry nitrogen exclusion and particle verification; published data for this specific condition is limited. Cleaned items include LOX ball valves, pressure regulators, cryogenic pump impellers, heat-exchanger cores, pressure transmitters, and ground support coupling halves.
Medical device lipid and machining-coolant residues are removed in fluorinated solvent vapour degreasers validated to ISO 10993-18:2020 chemical characterisation and ISO 10993-5:2009 cytotoxicity; elemental impurity release is framed by ICH Q3D. Feed ratio for mineral-oil and silicone oil mixtures is 65 wt% HFE-7200 and 35 wt% trans-DCE; for polar machining emulsions the ratio shifts to 80 wt% HFE-7200 and 20 wt% isopropanol. The trans-DCE blend must not be used on polycarbonate substrates because stress cracking occurs at vapour temperatures above 45 °C; the IPA blend is restricted to metallic or fully amorphous PEEK parts. Components are loaded into low-outgassing polypropylene carriers; the degreaser is located in an ISO Class 7 cleanroom with a return-air particle count not exceeding 352,000 particles/m³ at 0.5 μm. Condensation rate on cooling coils is adjusted to keep solvent loss below 2 wt%/day. Drying at 80 °C and <1 mbar continues until the pressure-rise test gives <2×10−3 mbar·L/s. Avoid amine-based detergents in the pre-clean stage because residual morpholine derivatives react with trans-DCE under heat and elevate chloride contamination above 5 ppm. Terminal products include PEEK fracture-plate housings, titanium bone screws, stainless-steel guidewires, nitinol stent delivery shafts, and laparoscopic electrode assemblies.
| Process step | Fluid composition | Control parameter | Acceptance criterion |
|---|---|---|---|
| Immersion wash | 65 wt% HFE-7200 / 35 wt% trans-DCE | 50–55 °C, 120 s | Visual removal of machining oil |
| Ultrasonic rinse | 100 wt% HFE-7200 | 40 kHz, 10 W/L, 60 s | Particle count ≤25 particles/cm² at 0.5 μm |
| Vapour rinse | 100 wt% HFE-7200 | 60 s vapour zone | No non-volatile residue by ISO 10993-18:2020 extraction |
| Vacuum drying | Not applicable | 80 °C, <1 mbar | Pressure rise <2×10−3 mbar·L/s |
Under low-standoff micro-BGA packages and QFN thermal pads, no-clean flux residues escape aqueous defluxing because trapped volumes remain below the capillary radius of aqueous surfactants. Fluorinated cleaning agents with low surface tension are therefore applied in inline spray-under-immersion equipment. Residue acceptance follows IPC J-STD-001G Section 8.3.3; quantitative ionic cleanliness is measured by IPC TM-650 method 2.3.25, with the pass threshold set at 1.56 μg NaCl eq/cm² for high-frequency boards. Compatibility with coatings is evaluated per IPC-CH-65B. Feed formulation is ternary: 40 wt% HFE-7100, 40 wt% HFE-7200, and 20 wt% trans-DCE for mixed halide-free no-clean flux; for activated rosin fluxes the trans-DCE fraction is raised to 35 wt% at the expense of HFE-7200. The final rinse is 100 wt% HFE-7100 to prevent chloride carry-over. In a three-sump inline unit, first sump at 50 °C dissolves bulk flux, second sump applies ultrasonic agitation at 40 kHz and 20 W/L, and third sump provides final solvent rinsing with resistivity maintained above 10 MΩ·cm. Conveyor speed is constrained by the glass transition of low-temperature FR-4 substrates; line speed is 0.4–0.6 m/min. Drying is done by forced nitrogen at 70 °C for 90 s. For assemblies with edge-bonded bare die, ultrasonic energy above 25 W/L induces wire-bond fatigue at the neck; therefore the second sump is tuned to 15 W/L for those lots. Terminal products include high-density interconnect boards for avionics, RF power amplifier modules, medical monitoring electronics, and ceramic chip-carrier substrates.
A base charge of 85 wt% HFE-7500 and 15 wt% HFE-7200 is maintained to shift boiling point to 128 °C and reduce vapour density variation; for polishing-compound residues, 10 wt% of a low-water isopropanol top-up is injected only in the first sump to raise Kauri-butanol value from 10 to 28. Surface cleanliness before electron-beam PVD coating is controlled under ISO 10110-7:2017 for surface imperfections and MIL-PRF-13830B for scratch-dig limits; coating adhesion is functionally verified after deposition by ISO 9211-4:2022 tape test. ZnSe and germanium substrates are loaded in PTFE cassettes and processed in a multi-sump vapour degreaser with ultrasonic at 40 kHz and low power density 8–12 W/L. Cavitation pitting on zinc selenide surfaces is a critical process conflict: at power density above 15 W/L, pit diameter exceeds 10 μm and coated optics fail MIL-PRF-13830B scatter inspection. Substrates remain in liquid phase for 60 s, vapour-rinse for 45 s, and are withdrawn at 5 mm/s to prevent condensation bands. Inspection under 365 nm UV black light identifies hydrocarbon filming below 1 nm thickness. Hygroscopic BaF2 substrates require pre-baking at 150 °C for 2 h before vapour degreasing to prevent subsurface water vapour entrapment. Processed optics include ZnSe IR windows, germanium multispectral lenses, MgF2 excimer laser mirrors, fused silica telecommunication ferrules, and CaF2 lithography lenses.
Refrigerant circuit flushing after hermetic compressor burnout removes acid sludge, copper oxides, and partially carbonised polyolester oil from evaporator and condenser coils. The flush agent must not destabilise the replacement refrigerant; lower-viscosity fluorinated liquid is introduced as a full-volume liquid flush at 0.3–0.7 MPa differential pressure. Purity of recharged refrigerant is governed by AHRI Standard 700; system tightness and relief provisions follow EN 378-2:2016. Flush charge is a two-stage sequence: first pass of 90 wt% HFE-7100 and 10 wt% isopropanol to pull acidic sludge from capillary tubes and TXV orifices; second pass is neat HFE-7100 at 100 wt% to prevent polar solvent retention. The IPA-laden first pass is limited to 15 min contact time on brass distributor nozzles to avoid dezincification above 2 μm. A closed flushing rig delivers 15–20 L/min through the disconnected line set at 20–25 °C. Used flush is passed through a 0.2 μm filter and acid number is continuously monitored; flushing continues until acid number of the return stream is below 0.05 mg KOH/g. After draining, the circuit is evacuated to <500 μm Hg (<66.7 Pa) and triple-swept with dry nitrogen. The filter-drier is replaced before charging with AHRI 700-compliant refrigerant. Terminal products include rooftop packaged units, VRF line sets, transport refrigeration evaporators, heat pumps, and centrifugal chiller bundles.
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The Fluorine Cleaning Agent Series is formulated around segregated HFE and HFC chemistries—methoxy-nonafluorobutane, ethoxy-nonafluorobutane, and trans-1,2-dichloroethylene-containing azeotropes—rather than a single solvent. The series includes an HFE-7100-equivalent single-fluid grade, an HFE-7200-equivalent grade for higher-boiling immersion processes, and an HFC-43-10mee-equivalent grade with a lower boiling point. In vendor certificates of analysis, the HFE-7100-equivalent grade is specified at 99.5 wt% minimum purity, 100 ppm maximum water, and 1 ppm maximum non-volatile residue; the HFE-7200-equivalent grade carries the same purity and moisture limits but shifts the boiling point to 76 °C from 61 °C. The series is intended for precision vapour degreasing, cold immersion, and ultrasonic cleaning of metallic and fluoropolymer components. Physical property ranges are measured under ASTM D1078, ASTM D4052, ASTM D1331, and ASTM D1133; the single-fluid HFE grades typically exhibit densities of 1.43–1.52 g/cm³ at 25 °C, surface tensions near 13.6 mN/m, and Kauri-butanol values of 10. Flash point is absent under ASTM D56 up to the boiling point.
In two-sump vapour degreasers with 316L stainless steel construction and a freeboard ratio of at least 1.5:1, the HFE-7100-equivalent grade produces a vapour blanket at 61 °C. The lower boiling point relative to trichloroethylene at 87 °C reduces thermal exposure for temperature-sensitive substrates, but it also requires secondary condensing coils maintained at 10–15 °C below the solvent boiling point to prevent excessive open-top loss. Typical immersion cleaning cycles run 3–5 min in the boil sump followed by 2–3 min in the rinse sump and 1–2 min in the vapour zone; ultrasonic agitation at 40 kHz with transducer power density between 0.15 W/cm² and 0.35 W/cm² is used for blind holes and capillary gaps. Soils limited to light hydrocarbon oils, fluorinated greases, fingerprints, and ionic residues are removed; heavy waxes or chlorinated paraffins exceed the solvency of a 10 Kauri-butanol value and are not recommended. Compliance with vapour degreaser safe operating practice is covered by ASTM D4276 and applicable local air regulations.
The series is differentiated from trichloroethylene, n-propyl bromide, and isoparaffins by a combination of low surface tension, absence of a flash point, and comparatively low Kauri-butanol values. The values in Table 1 are drawn from vendor technical bulletins and standard test methods; they describe the HFE-7100-equivalent, HFE-7200-equivalent, and HFC-43-10mee-equivalent grades.
| Property | HFE-7100 grade | HFE-7200 grade | HFC-43-10mee grade | Trichloroethylene | n-Propyl bromide |
|---|---|---|---|---|---|
| Boiling point (°C, ASTM D1078) | 61 | 76 | 55 | 87 | 71 |
| Density at 25 °C (g/cm³, ASTM D4052) | 1.52 | 1.43 | 1.58 | 1.46 | 1.35 |
| Surface tension (mN/m, ASTM D1331) | 13.6 | 13.6 | 14.1 | 29.5 | 25.9 |
| Kauri-butanol value (ASTM D1133) | 10 | 10 | 9 | 129 | 125 |
| Closed-cup flash point (ASTM D56) | none | none | none | none | 22 °C |
At 10 or lower Kauri-butanol value, the fluorinated grades cannot dissolve high-molecular-weight oils, waxes, or rosin-based fluxes; this is a deliberate limitation. In exchange, wetted surfaces exhibit surface tensions below 15 mN/m, which permits penetration into 25 µm capillary gaps and under low-standoff components. Trichloroethylene at 129 Kauri-butanol value removes a broader soil range but requires stabilizer packages and is subject to stricter emission controls under US EPA 40 CFR Part 63 halogenated solvent cleaning MACT standards. Compared with aqueous detergents, the series leaves no drying-water residues and does not require heated drying tunnels, but it is not effective for inorganic particulate removal unless ultrasonic energy is applied.
When polymer compatibility is evaluated, low Kauri-butanol values do not eliminate stress cracking; ASTM D543-21 immersion screening is required for acrylic, polycarbonate, polyetherimide, and elastomer seals before production release. HFE-based fluids are generally compatible with stainless steels, aluminium, copper, and most fluoropolymers, but plastisol and some Buna-N seal formulations may exhibit excessive swell after 7-day exposure at the boiling point. In production-scale ultrasonic lines, elastomer seals in transducer housings and pump diaphragms have been identified as the primary failure mode; silicone and perfluoroelastomer replacements are used when mass uptake exceeds 5 wt% in compatibility coupons. Drying is complete because the low latent heat and low surface tension permit rapid drainage; however, water displacement from blind holes requires 30–60 s vapour dwell after liquid drainage to prevent entrained water droplets from causing corrosion.
The fluorinated grades in the series are supplied without acid-acceptor inhibitors, which differentiates them from n-propyl bromide and many chlorinated formulations. In vendor safety data, HFE-7100-equivalent and HFE-7200-equivalent are stable under neutral pH conditions below 200 °C; decomposition accelerates above 250 °C and can generate hydrogen fluoride in the presence of moisture. Therefore, immersion heaters must be limited to a surface heat flux below 2.0 W/cm², and hot surfaces in the sump must not exceed 180 °C. Acid number of the boiling sump is monitored by ASTM D974; when acid number exceeds 0.05 mg KOH/g, the charge is drained and replaced. This operational boundary differs from n-propyl bromide, which requires periodic inhibitor replenishment and can hydrolyse to acidic species if water content exceeds 100 ppm.
Regulatorily, the series is distinct from tetrachloroethylene and methylene chloride because the HFE components have no ozone-depletion potential under the Montreal Protocol and are listed in manufacturer documentation as having 100-year global warming potentials below 600 for HFE-7100 and below 60 for HFE-7200. The same documentation reports atmospheric lifetimes of 4.1 years for HFE-7100 and 0.77 years for HFE-7200; these are significantly shorter than the 5,500-year atmospheric lifetime of perfluorooctane but longer than many water-based detergents. However, the series is not exempt from emerging PFAS-related restrictions under EU REACH Annex XV and US EPA TSCA section 5 risk evaluations; waste disposal, air emission controls, and wastewater segregation must be reviewed for the specific CAS registry numbers before use.
Because HFE-7100 boils at 61 °C instead of 87 °C and has a vapour density approximately 8.6 times that of air, the existing heating and cooling balance of a trichloroethylene machine is not transferable. The primary failure mode in retrofit is excessive solvent loss at the open top; this is corrected by reducing primary coil temperature to 45–50 °C, increasing freeboard height to 1.5:1–2.0:1 of tank width, and lowering secondary coil coolant to −10 °C to 0 °C. Boiler power is typically reduced by 20–30% relative to trichloroethylene because the lower latent heat and lower boiling point require less energy input to maintain vapour. Condenser water flow rates are adjusted so that the vapour line remains 5–10 cm below the freeboard lip under full production load. These changes are consistent with ASTM D4276 and with OEM vapour degreaser retrofit guidance.
At the component-cleaning line, 68 kHz or 130 kHz ultrasonic transducers are selected for submicron particle removal when the series is used in single-sump immersion tanks. Power density is held between 0.10 W/cm² and 0.20 W/cm² to avoid cavitation damage to soft aluminium features; bath temperature is controlled at 20–25 °C for cold cleaning or at 55–60 °C for the HFE-7100-equivalent vapour line. Filtration of the immersion sump at 1–5 µm absolute, combined with 0.5 µm point-of-use membranes, maintains non-volatile residue below 1 ppm in high-reliability electronics. Post-clean ionic contamination is verified by IPC-TM-650 2.3.25 resistivity of solvent extract; production lots are released at ≤ 1.56 µg NaCl equivalent/cm². This final application scenario is limited to light soils and particles; published data for this specific configuration is limited when heavy fluoropolymer greases are the target contaminant.
