| HS Code | 819374 |
| Chemical Formula | C2H6O2 |
| Molecular Weight | 62.07 g/mol |
| Purity | ≥99.9% |
| Assay | ≥99.9% |
| Appearance | Clear, colorless liquid |
| Water Content | ≤0.1% |
| Specific Gravity | 1.113 - 1.115 at 20°C |
| Boiling Point | 197.6°C |
| Flash Point | 111°C (closed cup) |
| Refractive Index | 1.431 - 1.432 at 20°C |
| Viscosity | 16.9 cP at 20°C |
| Electrical Conductivity | ≤0.5 µS/cm |
As an accredited Ethylene Glycol Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Ethylene Glycol Electronic/EL Grade, 200 kg drum. Sealed, nitrogen-blanked container preserves ultrapurity for semiconductor and electronics manufacturing. |
| Container Loading (20′ FCL) | 20′ FCL loading of Electronic/EL Grade Ethylene Glycol in clean, sealed drums or isotank, protected from moisture and contamination. |
| Shipping | Ship Ethylene Glycol Electronic/EL Grade in clean, dry, epoxy-lined or stainless-steel containers or HDPE drums. Keep sealed to prevent moisture absorption and contamination. Avoid extreme temperatures to prevent freezing. No hazardous goods classification under standard transport regulations, but use proper labeling and protect from impact. |
| Storage | Store Ethylene Glycol Electronic/EL Grade in tightly sealed, factory-original containers to prevent moisture uptake and contamination. Keep in a cool, dry, well-ventilated area, away from direct sunlight and incompatible substances like strong oxidizers. Use corrosion-resistant materials such as stainless steel for storage tanks. Maintain temperature stability to preserve purity. Clearly label containers and follow strict handling protocols. |
| Shelf Life | Ethylene Glycol Electronic/EL Grade shelf life is typically two years when unopened, stored in sealed containers away from moisture and heat. |
A working electrolyte formulation for low-ESR aluminium electrolytic capacitors is prepared with ethylene glycol as the primary solvent after incoming lots are screened against water, chloride, sulfate, iron, sodium, and UV absorbance limits. The solvent loading is fixed at 40–75 wt% depending on target conductivity, sparking voltage, and low-temperature impedance; the solute package consists of ammonium adipate, ammonium sebacate, or ammonium azelate at 10–25 wt%, deionized water at 1–10 wt%, a nitro aromatic depolarizer at 0.1–2 wt%, and a phosphate ester corrosion inhibitor at 0.05–0.5 wt%. Chloride excursions above 0.5 mg/kg in the as-received glycol are a recognized production-scale cause of pitting on etched aluminium foil, which appears during high-ripple endurance testing as localized leakage current drift. Compliance is governed by IEC 60384-4:2016 for fixed aluminium electrolytic capacitors and JIS C 5101-4:2020 for endurance and ripple current classification; automotive-grade parts are further qualified under AEC-Q200 Rev D. During production, the electrolyte batch is charged into a jacketed vacuum vessel, held at 70–90 °C under −0.08 MPa to strip residual water, and passed through a 0.45 µm PTFE filter before vacuum impregnation of wound capacitor elements at 50–70 °C. Aging is carried out at the rated voltage for 60–120 min at 105 °C or 125 °C until leakage current falls below the defined upper limit. Terminal products include radial and snap-in capacitors for server power supplies, LED drivers, EV onboard chargers, and inverter DC-link circuits.
| Parameter | Release Limit | Test Method |
|---|---|---|
| Purity, GC area% | ≥99.8% | ASTM E2409-20a |
| Water content | ≤0.05 wt% | ASTM E203-21 |
| Chloride | ≤0.5 mg/kg | ISO 10304-1:2007 |
| Sulfate | ≤0.5 mg/kg | ISO 10304-1:2007 |
| Iron | ≤0.1 mg/kg | ISO 17294-2:2016 |
| Sodium | ≤0.1 mg/kg | ISO 17294-2:2016 |
| UV absorbance at 220 nm, 1 cm path | ≤0.05 AU | ASTM E169-16 |
In single-phase liquid cooling loops for data center servers and high-power converters, thermal degradation is controlled less by ethylene glycol’s boiling point than by the accumulation of glycolate and oxalate oxidation products at hot spots above 80 °C in the presence of dissolved oxygen and copper alloy surfaces. The fluid is formulated with electronic/EL grade ethylene glycol at 25–50 vol% in deionized water, an inhibitor package at 1–3 vol% containing benzotriazole or tolyltriazole at 0.1–0.5 wt%, and a borate/phosphate buffer adjusted to pH 8.0–9.5; electrical conductivity is maintained below 10 µS/cm to avoid leakage current across power semiconductor substrates. Copper-catalyzed oxidative degradation is suppressed by dissolved oxygen control below 1 mg/L, because glycolate formation accelerates when hot spots exceed 80 °C and the buffer capacity is depleted. Corrosion behavior is validated using ASTM D1384-18 for glassware coupon exposure and ASTM D3306-20 for glycol-base fluid classification, while system safety is assessed under IEC 62368-1:2023. Production blending is performed in closed stainless steel vessels under nitrogen purge, with inline conductivity and pH monitoring, 0.1 µm filtration, and vacuum degassing to dissolved oxygen levels below 1 mg/L. Filling into cold plates and coolant distribution units is followed by pressure testing at 1.5× the rated working pressure and helium leak verification. Terminal product types include rack-mounted server coolant, EV fast charger cold-plate fluid, and liquid-cooled power module coolant for silicon carbide inverters.
In monocrystalline silicon wafering, a diamond wire saw coolant is formulated with ethylene glycol at 20–45 wt% of the concentrate, a polyethylene glycol secondary lubricant at 5–15 wt%, a carboxylate dispersant at 0.5–2 wt%, and a triazole corrosion inhibitor at 0.1–0.5 wt%; the concentrate is diluted 1:5 to 1:20 with deionized water at the sawing line. Wafer surface cleanliness is controlled against SEMI M1-0322 for polished monocrystalline silicon wafers, and the coolant is handled in an ISO 14644-1:2015 Class 6 cleanroom to limit particle deposition. The cutting process uses a diamond wire diameter of 60–80 µm, wire speed of 10–20 m/s, and coolant supply of 5–15 L/min per cutting head at 25–35 °C; ethylene glycol binds free water, reduces evaporation at the kerf, and prevents agglomeration of silicon swarf that otherwise raises wire breakage frequency on multi-wire saws. Spent coolant is passed through sedimentation tanks and a 10 µm filter press before recirculation. Finished products include 182 mm and 210 mm monocrystalline silicon wafers for PERC, TOPCon, and heterojunction photovoltaic cells, as well as polished wafer substrates for semiconductor device fabrication.
A ceria-based shallow trench isolation slurry formulated with ethylene glycol at 2–5 wt% shows reduced pad-edge accumulation when the polisher runs above 40 °C because the glycol lowers the evaporation rate of the aqueous carrier. The full slurry composition is abrasive at 1–10 wt%, oxidizer at 0.5–2 wt%, ethylene glycol at 1–8 wt%, and balance deionized water with pH adjusted to 4–10 depending on oxide, tungsten, or copper planarization. Slurry quality is tracked by particle size distribution under ISO 22412:2017 and zeta potential under ISO 13099-1:2012; wafer surface metal contamination is verified against SEMI M1-0322. The CMP process is run on a rotary polisher with platen speed 30–90 rpm, carrier downforce 1.5–5 psi, and slurry flow 100–300 mL/min with in situ diamond pad conditioning. At slurry temperatures above 40 °C, pad drying is the dominant contributor to within-wafer non-uniformity; ethylene glycol shifts the evaporation front outward and reduces scratch-generating crystallized residues. Terminal wafer types include planarized copper/low-k interconnect wafers, tungsten contact wafers, and oxide shallow trench isolation structures at the 28 nm node and above.
When ethylene glycol is substituted into an aqueous organic light-emitting diode ink vehicle, the principal evaluation parameters are drop speed, latency performance, and film thickness uniformity across a 1–10 pL droplet range. The ink vehicle is prepared with ethylene glycol at 5–20 wt%, a higher-boiling co-solvent at 20–60 wt%, the emissive or charge-transport material at 0.1–2 wt%, and a nonionic surfactant at 0.01–0.1 wt%. Because the emissive material is typically proprietary, published data for this specific configuration is limited; industrial qualification therefore relies on printhead compatibility trials rather than open literature. Regulatory compliance for finished display panels is assessed under RoHS Directive 2011/65/EU, REACH Regulation (EC) No 1907/2006 Annex XVII, and IEC 62368-1:2023. The inkjet process uses a piezoelectric printhead with 20–30 µm nozzle diameter, printhead temperature 25–35 °C, substrate temperature 30–50 °C, vacuum drying at 1–10 hPa, and thermal annealing at 100–200 °C. Finished product types include printed OLED display panels, QLED color filter arrays, and organic photodetector backplanes.
For water-washable solder flux applied through jetting heads on surface-mount printed circuit board lines, ethylene glycol is introduced at 1–5 wt% to suppress nozzle drying without shifting halide concentration. The flux formulation contains an organic acid activator at 2–5 wt%, isopropanol or denatured ethanol at 80–90 wt%, and a nonionic surfactant at 0.1–0.5 wt%; ethylene glycol’s water-retention capacity reduces paste transfer failures between board loading intervals. Flux qualification follows IPC J-STD-004C for classification and IPC-TM-650 methods 2.6.14 for surface insulation resistance and 2.3.25 for halide content. The assembly process deposits flux by selective jetting or spray, preheats the board to 100–120 °C, reflows with SAC305 solder at a peak temperature of 235–250 °C, and removes residues in an inline deionized water wash at 40–60 °C with air-knife drying. Terminal products include server motherboard assemblies, automotive electronic control units, and industrial power module PCBs where post-reflow ionic contamination must remain below the board assembler’s acceptance threshold.
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Ethylene Glycol Electronic/EL Grade is a high-purity monoethylene glycol refined for semiconductor process cooling, electronic chemical preparation, and precision thermal-management service. The product is usually designated by electronic-grade or EL-grade nomenclatures such as EG-EL, EL-99.8, or equivalent purity-suffixed lot codes. Representative certificates of analysis list MEG content by ASTM E202 at ≥99.8% by weight, water content by ASTM E203 at ≤0.10% by weight, and distillation range by ASTM D1078 within 193°C to 198°C at 101.3 kPa.
CAS 107-21-1 identifies the substance. At 20°C, density is approximately 1.115 g/cm³ and dynamic viscosity is approximately 21.3 mPa·s. These pure-component values affect pump sizing and heat-transfer coefficient calculations in low-temperature coolant loops but are not generally used as batch-release limits.
Ionic contaminants govern leakage current, electrochemical corrosion, and long-term fluid stability in high-purity cooling loops. Chloride and sulfate are particularly critical because they lower solution resistivity and participate in localized attack at metallic wetted surfaces. A 50 vol% aqueous dilution prepared with ASTM D1193 Type I water and measured at 25°C is commonly specified below 2.0 µS/cm by ASTM D1125 for electronic/EL product lots. That conductivity ceiling reflects a low ionic burden but does not imply that the glycol is an inhibitor; uninhibited glycol-water mixtures can still corrode some metals.
Metal contamination is controlled because iron and copper residues accelerate oxidative degradation of ethylene glycol to glycolic acid, formic acid, and oxalic acid at elevated temperatures. The resulting free acidity can lower pH and increase solvent reactivity in precision circuits. Electronic/EL specifications therefore limit iron to ≤0.1 mg/kg and sodium to ≤0.1 mg/kg by ICP-based methods. Free acidity is commonly capped at ≤20 mg/kg as acetic acid by ASTM D1613.
UV-absorbing contaminants include unsaturated carbonyl compounds, trace aromatics, and early oxidation products. The 220 nm transmission value is the most sensitive indicator of oxidative history. Electronic/EL product data typically list ≥75% at 220 nm, ≥90% at 250 nm, and ≥95% at 275 nm against a reference water blank. UV-visible spectrophotometry is used, but exact cuvette path length and blank preparation vary by supplier.
Production-scale filling operations for electronic/EL grade use 316L stainless steel or PTFE/PFA-lined piping, and storage vessels are blanketed with filtered nitrogen to restrict oxygen ingress and water uptake. Cleanroom filling is typically performed under ISO 14644-1 Class 5 or better. Drums and totes are flushed with filtered nitrogen before filling and sealed with fluoropolymer gaskets. These controls are necessary because contamination introduced during packaging will reach the final cooling loop unless point-of-use filtration is installed.
The following table consolidates representative release limits drawn from published electronic/EL grade technical data. Suppliers may tighten or expand these values by model and end-use.
| Parameter | Test method | Representative electronic/EL limit |
|---|---|---|
| MEG assay | ASTM E202 | ≥99.8% by weight |
| Water | ASTM E203 | ≤0.10% by weight |
| Color, Pt-Co | ASTM D1209 | ≤5 |
| Free acidity as acetic acid | ASTM D1613 | ≤20 mg/kg |
| Chloride | Ion chromatography | ≤0.5 mg/kg |
| Sulfate | Ion chromatography | ≤1.0 mg/kg |
| Iron | ICP-OES | ≤0.1 mg/kg |
| Sodium | ICP-MS | ≤0.1 mg/kg |
| UV transmittance at 220 nm | Spectrophotometry | ≥75% |
| UV transmittance at 250 nm | Spectrophotometry | ≥90% |
| UV transmittance at 275 nm | Spectrophotometry | ≥95% |
Lot-release testing for trace anions is usually performed by ion chromatography with a detection limit below 0.1 mg/kg for chloride and sulfate. Metallic impurities are commonly determined by ICP-OES or ICP-MS after dilution, with reporting limits at or below 0.05 mg/kg for sodium and potassium. A single universal particulate-release limit is not always stated on electronic/EL certificates because particle content depends on packaging, transfer equipment, and transport conditions. For that reason, point-of-use filters rated at 0.1 µm absolute are installed in many semiconductor chiller circuits.
When a cleanroom process loop contains microchannel cold plates with hydraulic diameters below 0.5 mm, particulate loading above the low ppm range can cause channel plugging and non-uniform heat transfer. Electronic/EL product is therefore handled as a contaminant-sensitive fluid rather than as a commodity glycol. Published data for particle counts in all packaged configurations is limited, so the point-of-use filter is treated as the final control layer.
In semiconductor tool cooling, an electronic/EL ethylene glycol blend is used in closed-loop chillers that maintain resistivity across narrow fluid gaps. Leakage current is influenced by ionic mobility, temperature, and electrode spacing. For a chiller with plate-and-frame heat exchangers and 0.5 mm hydraulic-diameter microchannels, the fluid-resistivity requirement typically drives selection of electronic/EL EG rather than industrial EG. Published data for leakage current in specific tool configurations is limited, but the low chloride and sulfate ceilings reduce the primary ionic contributors that sustain stray current in aqueous circuits.
At operating temperatures between 80°C and 90°C, unpreserved glycol-water fluids can generate acidic oxidation products when aerated. Oxygen exclusion and closed-loop blanketing are therefore operational boundaries. Stainless steel 316L and fluoropolymers are preferred wetted materials. Copper, brass, galvanized steel, and unpassivated carbon steel should be avoided unless a qualified inhibitor package is present. Electronic/EL ethylene glycol is not a dielectric fluid and is not intended for direct-contact service with energized circuitry; aqueous mixtures remain electrically conductive and can cause short-circuit failure.
The primary difference is not purity alone but the certification of trace ionic species and UV-active contaminants. Polyester-grade ethylene glycol also carries high assay and low aldehyde requirements because it protects polymerization catalysts, but it may not be packaged or certified for chloride, sulfate, sodium, and particulate burden relevant to semiconductor cooling. Automotive antifreeze concentrate contains corrosion-inhibitor packages such as silicates, phosphates, nitrites, or carboxylates. Those additives can form deposits in 0.5 mm microchannels and are unsuitable for cleanroom thermal management.
| Feature | Electronic/EL grade | Polyester grade | Automotive antifreeze concentrate |
|---|---|---|---|
| Corrosion-inhibitor package | Absent | Absent | Present |
| Chloride and sulfate certification | Specified at low mg/kg levels | Often limited or not certified | Not applicable due additive salts |
| UV transmittance | Specified at 220 nm, 250 nm, and 275 nm | Often specified but may be less stringent | Not specified |
| Packaging cleanliness | Cleanroom, nitrogen-blanketed, 0.1 µm filtered | Bulk rail/tanker | Bulk or drum, not electronic-clean |
| Primary end use | Semiconductor cooling, electronic chemicals | Polyester resin intermediate | Engine cooling |
Electronic/EL grade is supplied without an inhibitor package. That distinction is critical in electronic chemical synthesis and coolant formulation because the formulator can add a precise inhibitor system without interference from unknown industrial additives. This also means the product is not a ready-to-use coolant for mixed-metal loops; inhibition must be engineered for the specific metallurgy and operating temperature.
Because electronic/EL ethylene glycol is hygroscopic, open containers should not be left at relative humidity above 60% without dry-gas purging. Water absorption changes refractive index and can push the material outside its specified water limit. Transfer from drums should use diaphragm pumps with PTFE or stainless steel heads. Carbon steel fittings and brazed copper components are not recommended. Waste disposal must follow local hazardous-chemical regulations, and used coolant blends may contain process-derived contaminants that alter disposal classification.
A decline in UV transmittance at 220 nm indicates accumulation of unsaturation, carbonyl species, or oxidative by-products. In polyester-grade applications, such impurities can affect catalyst performance. In electronic/EL service, low UV transmission may signal aging in storage or exposure to air at elevated temperature. If a lot falls below the supplier-specified UV floor, it is generally not approved for high-purity semiconductor cooling without further analysis because the same oxidative pathway can increase acidity and reduce resistivity.
Stored electronic/EL EG should be kept under a dry inert-gas blanket and sampled for acidity and water before release. When a package has been opened and exposed to ambient air for extended periods, the retained sample should be rechecked by ASTM E203 and ASTM D1613 before use. Published data for the rate of UV-transmittance loss in partially filled drums is limited, but the sensitivity of the 220 nm measurement makes it an early warning indicator rather than a replacement for ionic-purity release testing.
