| HS Code | 483600 |
| Product Name | Ethyl Acetate Electronic/EL Grade |
| Chemical Formula | C4H8O2 |
| Cas Number | 141-78-6 |
| Molecular Weight | 88.11 g/mol |
| Purity | ≥99.9% |
| Assay | ≥99.9% (GC) |
| Water Content | ≤0.01% |
| Acidity | ≤0.001% (as CH3COOH) |
| Residue On Evaporation | ≤0.001% |
| Color Apha | ≤10 |
| Refractive Index At 20c | 1.3720 - 1.3740 |
| Density At 20c | 0.894 - 0.898 g/cm3 |
| Boiling Point | 77.1°C |
| Flash Point | -4°C |
As an accredited Ethyl Acetate Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in 4L clean-room certified glass bottles with PTFE seals, ensuring ultra-high purity for electronic/EL grade applications. |
| Container Loading (20′ FCL) | 20′ FCL loading of high-purity Ethyl Acetate Electronic/EL Grade in drums/isotanks, ensuring contamination-free, safe transport for electronics applications. |
| Shipping | Ship Ethyl Acetate Electronic/EL Grade as UN1173, Class 3, Packing Group II. Use grounded, approved drums or IBCs, clearly labeled with flammable hazard signage. Avoid oxidizers, sparks, and static discharge. Ensure compliant documentation for road, sea, or air freight, and store cool, ventilated, away from ignition sources during transit. |
| Storage | Store Ethyl Acetate (Electronic/EL Grade) in tightly sealed, approved containers under a dry, inert atmosphere. Keep in a cool, well-ventilated area away from heat, sparks, open flames, and strong oxidizers. Prevent moisture contamination and static accumulation. Follow strict handling protocols to preserve ultra-high purity for electronic applications. |
| Shelf Life | Shelf life typically 2 years from manufacture if stored sealed, cool, and dry in original container. |
In semiconductor photolithography, ethyl acetate EL grade is incorporated into edge bead remover and backside rinse formulations for 300 mm and 200 mm wafer processing because its Hansen solubility parameters place it between PGMEA and butyl acetate for acrylic and novolak photoresist solubility, while its vapor pressure of 10.1 kPa at 20°C supports fast solvent flash without excessive wafer cooling. The formulation addition ratio for EBR concentrates containing ethyl acetate typically falls at 20–50 wt%, with the balance being PGMEA, cyclopentanone, or butyl acetate; direct backside rinse may use 50–70 vol% ethyl acetate in PGMEA depending on the resist supplier compatibility matrix. The downstream production process is the coater/developer track dispense sequence: after the photoresist spin coat reaches target thickness, the top and bottom EBR nozzles deliver solvent at 0.8–2.5 mL/s while wafer rotation is held at 800–1500 rpm, producing an edge exclusion zone between 1.5 mm and 3.0 mm. Exhaust balance and solvent temperature control are critical because ethyl acetate cools the wafer excessively when dispensed below 18°C, causing condensation-induced defects in humid cleanroom air.
Compliance for this application is anchored to ASTM D4614-11 for the base solvent fraction, SEMI S2 for coater track interlocks and exhaust safety, and ISO 14644-1:2015 Class 3–4 wafer handling. EL-grade certificates of analysis must report residual metals below 10 ppb for sodium, potassium, iron, and calcium, moisture below 500 ppm, and nonvolatile residue below 10 ppm, because alkali and transition metals enter post-CMP electrical test signatures as leakage current and flatband voltage drift. Where acetyl chloride or acetic acid levels exceed 2 ppm, pH-sensitive chemically amplified resists show scumming at the edge transition; the solvent is therefore filtered through 0.1 μm PTFE point-of-use filters and blanketed with dry nitrogen to prevent moisture ingress and peroxide accumulation. The use boundary is defined by BARC compatibility: ethyl acetate can swell solvent-sensitive bottom anti-reflective coatings and produce edge lift, so the addition ratio is reduced to 10–15 wt% when the film stack includes a solvent-sensitive BARC. Published data for this specific configuration is limited, and compatibility must be verified with resist/BARC vendor test vehicles rather than extrapolated from single-solvent solubility trials. The terminal product is the resist-patterned silicon wafer with a clean edge exclusion zone ready for etch, implant, or metrology steps.
Flat-panel display fabs producing TFT-LCD and oxide TFT backplanes use ethyl acetate EL grade as the organic rinse component in semi-aqueous cleaning sequences applied to Gen 8.5 and Gen 10.5 glass substrates before indium tin oxide sputtering and photoresist lamination. The formulation addition ratio is maintained at 3–15 wt% in the semi-aqueous detergent bath and 20–40 wt% in the solvent rinse, with the remainder being deionized water, isopropanol, or surfactant blends. The downstream cleaning line operates with ultrasonic or megasonic agitation followed by air knife drying; ethyl acetate vapor pressure of 10.1 kPa at 20°C supports rapid drying but requires closed-loop solvent recovery and LEV extraction to remain below lower flammability limits. Compliance is controlled through supplier certificates of analysis aligned to ASTM D4614-11 and metal ion specifications below 10 ppb, cleanroom handling per ISO 14644-1:2015 Class 4/5, EU RoHS 2011/65/EU for restricted substances in display-manufacturing process chemicals, and REACH 1907/2006 registration. The terminal product of this cleaning step is a glass substrate with organic residue levels sufficiently low to prevent ITO adhesion loss or photoresist dewetting, with acceptance typically verified by water contact angle and XPS carbon 1s scans rather than visual inspection alone.
For SMT stencil and misprinted PCB cleaning, ethyl acetate EL grade is used as a co-solvent in solvent-surfactant blends applied to SAC305 tin-silver-copper solder paste and rosin/no-clean flux residues. The addition ratio typically falls at 10–25 wt% in automated spray-in-air cleaning baths; manual wipe operations may use up to 50 wt% ethyl acetate only inside explosion-proof enclosures due to the flash point of −4°C. The production process consists of closed-cover spray or ultrasonic immersion at 30–45°C under nitrogen inerting, followed by DI water rinse and vacuum drying; this solvent dissolves uncured solder paste vehicles and rosin acids rapidly but does not saponify thermally cured no-clean residues, so formulations combine it with glycol ethers or ester-alcohol co-solvents and wetting agents. Cleaning equipment must meet ATEX 2014/34/EU for flammable solvent atmospheres, and cleaned assemblies are tested to IPC J-STD-001H and IPC TM-650 2.3.25 for ionic contamination. The terminal product is a cleaned SMT stencil or reworked printed circuit board assembly with ionic contamination below the class-specific control limit required for electronic reliability.
Etched aluminum foil for low-impedance aluminum electrolytic capacitors is degreased with ethyl acetate EL grade prior to anodic formation, because the solvent removes rolling oils and organic residues without leaving alkaline soap films that shift formation voltage. The addition ratio in the degreasing bath is typically 80–100 wt% ethyl acetate, with 0–20 wt% isopropanol added to slow evaporation and improve wettability on etched tunnel surfaces. The foil is conveyed through the bath at ambient to 45°C with dwell times of 8–20 s, followed by air knife drying and rewinding under controlled tension; the boiling point of 77.1°C allows rapid drying, while solvent recovery by activated carbon or condensation prevents losses and keeps workplace exposure below occupational limits. Compliance uses ASTM D4614-11 base solvent specifications, IEC 60384-1:2016 for capacitor-grade foil consistency, RoHS 2011/65/EU, and REACH 1907/2006. The terminal product is a clean etched aluminum cathode or anode foil ready for formation at rated voltages.
TFT array photolithography employs ethyl acetate EL grade in photoresist thinner systems at 5–25 wt% to shift the drying curve and reduce edge buildup during slit coating or spin coating on glass substrates. The replacement is not drop-in: ethyl acetate has a boiling point of 77.1°C, vapor pressure of 10.1 kPa at 20°C, and flash point of −4°C, compared with PGMEA boiling point of 146°C and flash point of 42°C. At substitution levels above 25 wt%, the rapid solvent flash can produce striations and film thickness non-uniformity above 3% across the substrate; below 5 wt%, the effect on drying profile is typically within process noise. The photoresist thinning process after dilution includes 0.2 μm PTFE filtration, slit nozzle coating at 10–50 mm/s, vacuum-assisted drying, and prebake at 90–110°C. Compliance is maintained through ASTM D4614-11 for base solvent quality, ISO 14644-1:2015 Class 4 air cleanliness in coat rooms, and SEMI S2 for equipment safety interlocks due to solvent flammability. The terminal product is a uniformly coated TFT array substrate with photoresist film thickness controlled to the vendor process specification.
| Parameter | Ethyl acetate EL | PGMEA |
|---|---|---|
| Boiling point | 77.1°C | 146°C |
| Vapor pressure at 20°C | 10.1 kPa | 0.42 kPa |
| Flash point (closed cup) | −4°C | 42°C |
| Surface tension at 20°C | 23.9 mN/m | 27.7 mN/m |
Fine metal masks for OLED evaporation carry organic residues from photolithographic patterning, cutting, and handling, and these residues degrade mask alignment and shadowing accuracy if they outgas in vacuum chambers. Ethyl acetate EL grade is used in mask cleaning formulations at 70–100 wt%, with 0–30 wt% isopropanol or n-propyl alcohol as co-solvent to control etch sensitivity of Invar or nickel-iron mask materials. The cleaning process employs closed ultrasonic immersion at 25–40°C, nitrogen inerting, and vacuum drying at 60–80°C, followed by residue verification through contact angle measurement and GC-headspace analysis. Because Invar surfaces are sensitive to chloride-induced pitting, the ethyl acetate must meet chloride specifications below 5 ppb and water content below 500 ppm; ASTM D4614-11 is the base standard, with SEMI S2 for tool interlocks and ISO 14644-1:2015 Class 4 for final inspection. The terminal product is a clean fine metal mask ready for alignment in OLED evaporation equipment, with the specific nonvolatile residue threshold defined by mask vendor control limits rather than a universal published value.
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Ethyl Acetate Electronic/EL Grade is a high-purity alkyl ester solvent supplied for semiconductor fabrication, flat-panel display edge cleaning, and printed circuit board flux removal where ionic contamination, moisture, and particulate burden must be controlled. The substance is identified by CAS 141-78-6, molecular formula C4H8O2, and molecular mass 88.11 g/mol. The designation EL is not a unified classification across manufacturers. Common supplier model codes include Ethyl Acetate EL Grade, Ethyl Acetate Electronic Grade, Ethyl Acetate MOS Grade, and Ethyl Acetate UP-S. Because model nomenclature is supplier-specific, incoming material should be qualified against the lot certificate of analysis rather than the trade name alone.
The product is distinguished by low water, low acidity, low nonvolatile residue, and per-element trace-metal reporting. At 20°C, density is 0.900–0.904 g/cm3, refractive index n20/D is 1.370–1.373, viscosity is 0.45 mPa·s, surface tension is 23.9 mN/m, boiling point is 77.1°C, flash point is -4°C closed cup, and vapor pressure is 73 mmHg. These values are used to set spin-dispense volumes, ventilation rates, and drying parameters in single-wafer and conveyorized cleaning tools.
| Parameter | Typical Electronic/EL Grade Range | Typical Test Method |
|---|---|---|
| Assay by GC-FID | ≥99.99% normalized area | supplier GC-FID |
| Water | ≤100 ppm (0.01%) | ASTM E203-16 |
| Acidity as acetic acid | ≤30 ppm (0.003%) | ASTM D1613-06(2018) |
| Nonvolatile residue | ≤10 ppm (0.001%) | ASTM D1353-13 |
| Density at 20°C | 0.900–0.904 g/cm3 | ASTM D4052-18 |
| Chloride | ≤5 ppm | ion chromatography |
| Sodium | ≤50 ppb | ICP-MS |
| Potassium | ≤50 ppb | ICP-MS |
| Iron | ≤50 ppb | ICP-MS |
| Total trace metals | ≤500 ppb | ICP-MS |
| Particle count ≥0.5 µm | ≤100 particles/mL | optical particle counter |
The low water limit is not purely analytical. Ethyl acetate undergoes acid-catalyzed hydrolysis to ethanol and acetic acid. When water exceeds 500 ppm, hydrolysis can increase free acetic acid, raise solution conductivity, and promote corrosion of copper traces in electronic assemblies. The product is therefore transferred under dry nitrogen or a desiccant breather in facilities where ambient relative humidity exceeds 60%. Acidity limits below 30 ppm as acetic acid are specified specifically to minimize this autocatalytic degradation and to protect metal interconnects.
In semiconductor wafer processing, Ethyl Acetate Electronic/EL Grade is dispensed through point-of-use filters with pore sizes of 0.05 µm in single-wafer spin tracks used for edge bead removal and backside cleaning. The solvent is applied to 200 mm and 300 mm wafer formats. Because flammability is high, the dispensing module is grounded and interlocked with flammable vapor detection. Process temperatures are generally kept between 20°C and 25°C to reduce vapor accumulation. Sodium and iron are the most common rejection cations in semiconductor-grade solvent audits. Per-lot ICP-MS reporting is required because trace metal deposition can alter gate oxide integrity and reduce interconnect reliability.
For printed circuit board assembly, the material is used in spray-in-air oscillating or ultrasonic cleaning cells to remove rosin-based flux residues from populated boards. Ultrasonic cleaning of low-flash-point solvents requires explosion-proof equipment and should not be performed in open heated tanks. Published equipment-specific failure data for this configuration are limited. Incoming lots should be checked for water, acidity, and particulate count before production use because residue formation after drying is often traced to moisture above 500 ppm or nonvolatile residue above 10 ppm.
Standard packaging includes 200 L stainless steel drums and 20 L fluoropolymer-lined containers. The product is filtered through 0.1 µm or 0.05 µm membranes during filling, and containers are cleaned to remove particulate contamination. Long-term contact with aluminum, mild steel, natural rubber, and low-density polyethylene should be avoided because the ester can swell or extract plasticizers and the hydrolytic acid may corrode metal. Stainless steel, PTFE, and fluoropolymer-lined equipment are preferred. HDPE should be used only for short-term, validated transfer in moisture-controlled areas. The product is incompatible with strong oxidizers and strong acids; contact should be prevented.
Compared with acetone, ethyl acetate has a higher boiling point (77.1°C versus 56.2°C) and a higher flash point (-4°C versus -17°C). This reduces excessive evaporation and solvent consumption in manual wipe cleaning, though the liquid remains a Class I flammable solvent. Compared with PGMEA, ethyl acetate has higher vapor pressure and lower surface tension, which improves penetration into narrow gaps under low-standoff components on printed circuit assemblies. Its solvency for certain cross-linked novolak photoresist residues is lower than that of PGMEA. A replacement decision requires edge bead removal testing at the specific post-bake condition because published comparative data for this specific configuration are limited.
| Parameter | Electronic/EL Grade | ACS Reagent Grade | HPLC/UV Grade |
|---|---|---|---|
| Assay | ≥99.99% | ≥99.5% | ≥99.9% |
| Water | ≤100 ppm | ≤0.1% | ≤0.05% |
| Acidity as acetic acid | ≤30 ppm | ≤0.01% | ≤0.005% |
| Nonvolatile residue | ≤10 ppm | ≤20 ppm | ≤5 ppm |
| Trace metals by ICP-MS | per-element ≤50 ppb for Na, K, Fe | not specified | not specified |
| Particle filtration | 0.05–0.1 µm point-of-use | not specified | not specified |
Electronic/EL grade should not be confused with anhydrous or HPLC grade used in analytical chromatography. The key difference is not only water content but the combination of per-metal ICP-MS reporting, controlled particle burden, cleanroom filling, and point-of-use filtration. ACS reagent grade may have sufficient purity for general laboratory work but lacks the trace-metal and particle controls required for etched semiconductor surfaces. HPLC-grade ethyl acetate is often optimized for low UV absorbance, with UV cutoff near 256 nm, whereas electronic/EL grade may not carry an absorbance specification because its intended use is cleaning rather than spectrophotometric detection.
Flammability control is mandatory. The lower explosive limit is 2.0 vol% and the upper explosive limit is 11.5 vol%. Ventilation must maintain the 8-hour time-weighted average below 400 ppm under OSHA 29 CFR 1910.1000 Table Z-1 and ACGIH TLV-TWA 400 ppm. Storage should be in approved flammable-liquid cabinets with grounding and explosion-proof electrical equipment. At ambient temperatures above 30°C, vapor pressure increases; drum venting must be designed for flammable service.
In high-humidity cleaning rooms, rapid evaporation can lower substrate surface temperature below the dew point, causing moisture condensation and leaving a secondary aqueous residue after drying. Cleanroom relative humidity should therefore be controlled, typically at 45±5%, and forced-air drying should use filtered inert gas rather than uncontrolled compressed air. Point-of-use filtration is recommended because particle contamination above 100 particles/mL at 0.5 µm can leave visible spots after air-drying. Under European CLP classification, the substance carries H225 for highly flammable liquid and H319 for eye irritation. The product is not classified as carcinogenic, mutagenic, or reprotoxic. RoHS does not apply directly to process solvents, but electronic/EL grade is supplied with trace metal and halide documentation to support electronics manufacturing quality audits.
