| HS Code | 910606 |
| Product Name | Cyclohexane Electronic/EL Grade |
| Chemical Formula | C6H12 |
| Cas Number | 110-82-7 |
| Molecular Weight | 84.16 g/mol |
| Appearance | Clear colorless liquid |
| Purity | >= 99.9% |
| Water Content | < 10 ppm |
| Boiling Point | 80.7 °C |
| Melting Point | 6.5 °C |
| Flash Point | -20 °C (closed cup) |
| Density | 0.779 g/cm3 at 20 °C |
| Refractive Index | 1.4266 at 20 °C |
| Solubility In Water | Immiscible |
As an accredited Cyclohexane Electronic/EL Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Cyclohexane Electronic/EL Grade is packaged in 1 L glass bottles under nitrogen purge, ensuring ultra-high purity and contamination-free delivery. |
| Container Loading (20′ FCL) | 20′ FCL loading of Cyclohexane Electronic/EL Grade: secure steel drums/pails, upright, with proper dunnage and ventilation per hazardous goods protocols. |
| Shipping | Cyclohexane Electronic/EL Grade is a high-purity, highly flammable liquid shipped as UN1145, Class 3, Packing Group II. It must be transported in sealed, corrosion-resistant containers or ISO tanks to prevent contamination. Proper hazard labeling, grounding, and segregation from ignition sources are mandatory throughout transport. |
| Storage | Store Cyclohexane Electronic/EL Grade in tightly sealed, approved containers in a cool, dry, well-ventilated area away from heat, sparks, open flames, and direct sunlight. Keep away from oxidizers. Use grounded containers for transfers. Maintain minimal inventory and inspect regularly for damage or leaks to ensure purity and safety. |
| Shelf Life | Shelf life is typically 24 months if stored tightly sealed in a cool, dry, ventilated area away from ignition sources. |
Cyclohexane EL grade is charged neat at 100 vol% into fully enclosed ultrasonic-vapor degrease tools used for fine metal mask and open metal mask recovery after OLED deposition campaigns. The incoming material is lot-released against moisture ≤50 ppm by ASTM E203-16, boiling-range purity ≥99.9% by ASTM D5399-09, total sulfur ≤1 ppm by ASTM D5453-19, non-volatile residue ≤5 ppm by ASTM D1353-13, and critical metal impurities ≤10 ppb each by in-house ICP-MS. The cleaning line sits inside an ISO 14644-1:2015 Class 5 cleanroom, and the finished display module is verified under RoHS Directive 2011/65/EU. On a 25 L ultrasonic sump, the initial charge is 22 L, with replenishment of 0.8 L per 8 h to compensate for evaporation and mask carryout. Process sequencing includes a 35±2°C 40 kHz immersion soak for 240 s, vapor condensation at 80–82°C, and vacuum drying at <1 Pa for 300 s. Inspection uses 200× dark-field microscopy for aperture edge integrity and a condensation particle counter with a 0.3 μm detection threshold. Because the solvent has a closed-cup flash point of -18°C, the cleaning system is rated for Class I Division 2 flammable vapor service. Production experience shows that water ingress from inadequate nitrogen blanketing causes spot defects on the mask during subsequent organic material re-deposition, so the solvent sump is blanketed with dry nitrogen at 0.05 MPa. Terminal product types include rigid OLED panels, flexible AMOLED modules, foldable display stack assemblies, and automotive OLED display subassemblies.
In front-end semiconductor maintenance operations, hydrocarbon solvent cleaning of quartz chamber liners, SiC-coated graphite susceptors, aluminum showerhead plates, ceramic lift pins, and vacuum transfer robot arms is performed after water-based alkaline pre-cleaning to remove vacuum grease, hydrocarbon oil residues, and condensed organometallic by-products. The cyclohexane EL grade is used neat because a water-containing solvent would leave silicate or oxide residues inside recessed fastener bores. For polar residue removal from shielded aluminum surfaces, a 90:10 vol/vol cyclohexane-to-anhydrous ethanol rinse is applied only after compatibility verification. Lot acceptance follows ASTM D5399-09 for boiling-range purity, ASTM E203-16 for moisture ≤50 ppm, ASTM D1353-13 for non-volatile residue ≤5 ppm, and ASTM D5453-19 for sulfur ≤1 ppm. The cleaning equipment is a dual-basket automated parts washer with 40 kHz ultrasonics, a vapor rinsing zone held at 80–82°C, and a vacuum bake-out chamber at 100°C and <1 kPa for 120 min. Particle re-deposition is controlled by maintaining a solvent filtration loop rated at 0.2 μm absolute, and by discarding the sump when the particle count exceeds 5,000 particles/mL larger than 0.5 μm. The standard operating boundary is that copper-containing surfaces with exposed oxide should not be immersed without electrochemical compatibility testing, because trace chloride ≤1 ppm can induce pitting after drying. Finished component types include SiC-coated graphite susceptors, aluminum chamber liners, electrostatic chuck replacement parts, gas distribution showerheads, mass flow controller internal subassemblies, and wafer transfer robot arm segments.
Wet-process polyolefin separator manufacturing demands a pore extraction solvent that combines low water content, low sulfur, and minimal non-volatile residue because residual solvent is trapped in the polymer matrix. The polymer feed is a mixture of ultra-high-molecular-weight polyethylene with Mw in the range of 1×10⁶–5×10⁶ g/mol compounded with liquid paraffin at 25–35 wt% polymer in a twin-screw extruder with L/D 48 and barrel temperatures of 180–220°C. The extruded gel sheet is cast at 1–2 mm thickness onto a chill roll, then extracted in a counter-current solvent line using cyclohexane EL grade fed at a solvent-to-film ratio of 10:1–15:1 by mass and maintained at 45–60°C. Residual paraffin after extraction is controlled to ≤0.3 wt% by online gravimetric analysis, and residual cyclohexane is reduced to ≤0.1 wt% in a multi-zone dryer before biaxial stretching and heat-setting at 120°C. Production experience shows that residual oil above 0.5 wt% causes surface haze after heat-setting and is traced to insufficient extraction temperature or solvent-to-film ratio below 10:1. The extraction solvent specification references ASTM D5399-09 for purity, ASTM E203-16 for moisture ≤50 ppm, ASTM D5453-19 for sulfur ≤1 ppm, and ASTM D1353-13 for non-volatile residue ≤5 ppm. The manufacturing site is certified to IATF 16949:2016 and ISO 9001:2015. End products include monolayer UHMWPE separators, three-layer PP/PE/PP shutdown separators, and ceramic-coated separator films for lithium-ion cells used in electric vehicle traction batteries and energy storage systems.
| Parameter | Industrial-grade cyclohexane | EL/Electronic-grade cyclohexane | Test standard |
|---|---|---|---|
| Water content | ≤200 ppm | ≤50 ppm | ASTM E203-16 |
| Non-volatile residue | ≤20 ppm | ≤5 ppm | ASTM D1353-13 |
| Total sulfur | ≤10 ppm | ≤1 ppm | ASTM D5453-19 |
| Boiling-range purity | ≥99.0% | ≥99.9% | ASTM D5399-09 |
Solder paste stencil misprint recovery lines in high-mix SMT assembly use a low-conductivity hydrocarbon-alcohol blend based on cyclohexane EL grade to remove Type 3 and Type 4 solder paste residues without swamping capillary action in 0.08–0.15 mm stencil apertures. The cleaning fluid is blended at 80:20 vol/vol cyclohexane to anhydrous isopropanol, sprayed at 0.25 MPa, and held at 25±2°C in a closed under-stencil cleaning module with a 0.45 μm absolute filtration loop. Compliance is maintained to IPC J-STD-001H for soldered electronic assemblies, with periodic resistivity-of-solvent-extract testing against a site-specific ionic cleanliness limit of <1.56 μg NaCl eq/cm². Misprinted printed circuit boards are passed through a two-zone conveyorized cleaner: the first zone dispenses the cyclohexane-isopropanol blend at 20 L/h through 0.30 MPa spray bars, and the second zone applies dry air knives at 25°C until surface moisture is below a dew-point reading of -40°C. End products include laser-cut stainless steel SMT stencils, reworkable printed circuit assemblies, squeegee blades, and stencil storage trays.
When a fused silica optic is transferred from the polishing cell to a coating line, cyclohexane EL grade is used neat as the final solvent rinse before ion-beam sputtering or electron-beam PVD because any film-forming non-volatile residue changes the adhesion of the first oxide layer. The cleaning sequence starts with a 40 kHz ultrasonic immersion bath at 30°C for 180 s, followed by a vapor degrease stage at 80–82°C with a withdrawal speed below 10 mm/s to prevent meniscus film breakup. Solvent is charged at 18 L in a 20 L vapor degreaser sump and is replenished at 0.3 L per 100 optics. The solvent specification requires purity ≥99.9% by ASTM D5399-09, water ≤50 ppm by ASTM E203-16, non-volatile residue ≤5 ppm by ASTM D1353-13, and sulfur ≤1 ppm by ASTM D5453-19. The cleaned optic is vacuum-baked at 120°C for 60 min and transferred into the deposition chamber under ISO 14644-1:2015 Class 5 conditions. Surface inspection is performed to ISO 10110-7:2017 for surface imperfections, with a rejection threshold of 0.05 μm scratch width and 0.5 μm dig diameter. Terminal products include AR-coated sapphire windows, high-reflectivity laser mirrors, polarizing beamsplitters, and collimating lens assemblies for fiber optic transceivers.
After NiP plating and diamond-turning, aluminum hard-disk substrates carry a mixed residue of hydrocarbon cutting oils, lapping media, and particulate debris that must be removed before sputtering magnetic layers. Cyclohexane EL grade is used as a final hydrophobic rinse after aqueous detergent removal of polishing slurry, at 100 vol%, in a robotic multi-stage cleaner. The cyclohexane sump is held at 45±2°C with 40 kHz ultrasonics, followed by a vapor condensation zone at 80–82°C and a hot-air spin dry at 120°C. Flow through the rinse tank is maintained at 2 L/min per substrate cassette, and the solvent is replaced when non-volatile residue exceeds 5 ppm by ASTM D1353-13. Incoming lot purity is verified by ASTM D5399-09 at ≥99.9%, ASTM E203-16 at ≤50 ppm water, and ASTM D5453-19 at ≤1 ppm sulfur. The operation is performed in an ISO 14644-1:2015 Class 5 clean zone, and final substrate particle count is controlled to <0.1 particles/cm² larger than 0.5 μm. Published production-line data for this specific cyclohexane configuration in HDD final rinsing is limited; the main field-observed failure mode is carryover of sub-0.2 μm particles from saturated sump filters, which is managed by 0.2 μm absolute filter replacement per 500 substrates. Terminal products include aluminum and glass magnetic recording media for enterprise nearline HDDs, actuator arm assemblies, and spindle motor bearing components.
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Cyclohexane Electronic/EL Grade is a saturated cyclic hydrocarbon solvent supplied for high-purity cleaning, nonpolar carrier-solvent, and surface-preparation applications in semiconductor, display, and precision parts processing. The material carries CAS Registry Number 110-82-7, molecular formula C6H12, and molecular mass 84.16 g/mol. It is a clear, low-viscosity liquid with a boiling point of 80.7 °C, melting point of 6.5 °C, density of 0.778 g/cm³ at 20 °C, viscosity of 0.98 mPa·s at 20 °C, surface tension of approximately 25 mN/m at 20 °C, dielectric constant of approximately 2.02, and closed-cup flash point of -18 °C. Packaging typically includes borosilicate glass bottles, fluoropolymer-lined 20 L pails, and 200 L stainless steel drums. The Electronic/EL designation identifies a grade manufactured and packaged under cleanroom protocols with release criteria for gas chromatographic assay, coulometric Karl Fischer water, nonvolatile residue, trace metals, and submicrometre particle count; it does not denote a specific additive package or an electrolyte-grade solvent. The product is supplied under the grade designation Electronic/EL; no separate model number is assigned.
At point of use, Cyclohexane Electronic/EL Grade is filtered through 0.05 µm to 0.1 µm PTFE membrane cartridges inside inert-gas-pressurized dispense systems. The low viscosity permits penetration into narrow clearance spaces in machined parts and shadow masks, but it also produces rapid drainage from vertical substrates. Condensed moisture is minimized by the low water specification, which is below the approximate water solubility of 55 mg/L at 25 °C; free water would otherwise accumulate at the solvent-water interface in storage vessels and create localized corrosion or haze defects when dispensed onto hydrophilic surfaces. The solvent is not a direct substitute for electronic-grade cyclohexanone in photoresist thinning because cyclohexane lacks the ketone polarity required to dissolve many novolak resin systems.
Supplier certificates of analysis for this grade typically contain the release parameters shown in Table 1. These criteria are representative of electronic-grade saturated hydrocarbon solvents and are not intended to supersede lot-specific documentation. The particle-count value is measured by light obscuration and is meaningful only when sampling is performed under cleanroom conditions; atmospheric contamination can dominate counts in open laboratory sampling. Gas chromatographic assay by capillary GC-FID with NIST-traceable reference materials quantifies cyclohexane and hydrocarbon impurities, but it does not detect water or nonvolatile residue, which are measured separately. The trace-metal profile is generated by inductively coupled plasma mass spectrometry after evaporation of the organic matrix; sodium, potassium, iron, and copper are typically reported individually because these elements are critical in semiconductor device fabrication.
| Parameter | Typical Release Criterion | Analytical Method |
|---|---|---|
| Purity by GC | ≥99.9% area | Capillary GC-FID, NIST-traceable reference materials |
| Water | ≤50 mg/kg | ASTM E1064 |
| Nonvolatile residue | ≤5 mg/kg | ASTM D1353 |
| Acidity as acetic acid | ≤0.001 meq/g | ASTM D1613 |
| Total trace metals | ≤100 ppb | ICP-MS after evaporation |
| Particle count ≥0.5 µm | ≤100 particles/mL | Light obscuration, ISO 21501-3 |
Actual release data frequently show water below 20 mg/kg and nonvolatile residue below 3 mg/kg in freshly packaged material. Because cyclohexane has a water solubility of approximately 55 mg/L at 25 °C, water above this limit can separate as a second phase; drying is therefore performed before packaging rather than by simple decantation. Molecular sieve drying with 3A sieves is used when tighter moisture requirements are specified, and sieve fines are removed by subsequent 0.1 µm filtration. The specification for particle count at 0.5 µm should not be extrapolated to smaller particles; users requiring sub-0.1 µm control should verify point-of-use filtration performance and on-site liquid particle counting.
The primary difference is not the cyclohexane molecule itself but the type of contamination that is controlled and the environment in which packaging occurs. Reagent and ACS grades are assayed for general laboratory suitability; HPLC grade is additionally controlled for UV absorbance and chromatographic consistency. Electronic/EL grade shifts the control emphasis to trace metals and particles, which are not part of standard laboratory-grade specifications, while UV transmittance may not be a release parameter. Table 2 compares representative supplier specifications. It should be read as illustrative rather than universal; actual limits differ among manufacturers and should be verified against the certificate of analysis for a given lot. Electronic/EL grade also differs from industrial cyclohexane in packaging cleanliness, moisture content, and the presence of unsaturated or higher-boiling hydrocarbon impurities.
| Parameter | Industrial Grade | ACS/Reagent Grade | HPLC Grade | Electronic/EL Grade |
|---|---|---|---|---|
| Assay by GC | ≥99.0% | ≥99.5% | ≥99.9% | ≥99.9% |
| Water | ≤200 mg/kg | ≤200 mg/kg | ≤100 mg/kg | ≤50 mg/kg |
| Nonvolatile residue | ≤20 mg/kg | ≤20 mg/kg | ≤5 mg/kg | ≤5 mg/kg |
| Total trace metals | Not specified | Not specified | Not specified | ≤100 ppb |
| Particles ≥0.5 µm | Not specified | Not specified | Not specified | ≤100 particles/mL |
Electronic-grade cyclohexane is also distinct from electronic-grade cyclohexanone. Cyclohexanone is a polar ketone with a boiling point of 155 °C and is used widely in photoresist formulations; cyclohexane has a boiling point of 80.7 °C and is a nonpolar hydrocarbon. The two solvents are not interchangeable in most photoresist thinning or stripping applications. Cyclohexane is more likely to be selected for nonpolar cleaning, for carrier-solvent duties with hydrocarbon-soluble materials, or for surface preparation where low water and low residue are the primary requirements. For applications in which UV absorbance is the dominant specification, HPLC grade may be selected instead, but it may require additional point-of-use filtration and metal testing before use in semiconductor wet processing.
On semiconductor part-cleaning lines, Cyclohexane Electronic/EL Grade is used as a nonpolar rinse following aqueous cleaning or as a carrier in hydrocarbon-based cleaning formulations. The cleaning bath is constructed from electropolished 316L stainless steel with PTFE or PFA wetted surfaces; fluoropolymer seal materials are specified because natural rubber and Buna-N swell on exposure to cyclohexane. Nitrogen blanketing and flame arrestors are applied because the closed-cup flash point is -18 °C and the flammable range in air is approximately 1.2% to 8.3% by volume. Recirculating baths typically filter through 0.1 µm to 0.2 µm membranes; however, the low surface tension of cyclohexane can reduce the retention efficiency of some depth media compared with water. The solvent removes hydrocarbon greases and silicone-based release agents but has limited solvency for polar flux residues, metal oxides, and inorganic particles; mixed contaminant loads are therefore cleaned with a two-stage sequence using a polar solvent or an aqueous detergent followed by cyclohexane as the final nonpolar rinse. Water separation in the bath is monitored by haze or interface inspection because free water can generate localized corrosion and leave drying marks.
Cyclohexane Electronic/EL Grade is used only when the coated solid has sufficient nonpolar solubility. Many conjugated polymers used in organic light-emitting diodes and polymer solar cells require aromatic or halogenated solvents and are not soluble in cyclohexane; published data for those active-layer systems show limited applicability. For nonpolar small-molecule films and organic dielectric layers with alkyl solubilizing groups, cyclohexane provides rapid evaporation and low surface tension that can improve wetting on glass, indium tin oxide, or metal electrodes. In slot-die and spin-coating operations, the solution viscosity is typically adjusted to 2–10 mPa·s by controlling solids loading and molecular weight; the neat solvent viscosity is 0.98 mPa·s at 20 °C, which is lower than many aromatic coating solvents. The coating head, feed lines, and drying enclosure are rated for flammable vapour because the flash point is -18 °C and the boiling point is 80.7 °C. Because the melting point is 6.5 °C, storage in cold rooms can produce a solid phase; the material must be fully thawed and homogenized before use to avoid concentration gradients from residual thawed liquid. Vacuum drying of cast films is commonly performed at 40–60 °C; higher temperatures may accelerate film morphology changes without substantially improving solvent removal. Residual solvent is verified by thermal desorption or extractive gas chromatography rather than by weight loss alone.
The ≤5 mg/kg nonvolatile residue limit is relevant in applications where evaporation leaves a surface film that can change electrical performance. Storage and transfer systems maintain this limit with nitrogen blanketing, PTFE gaskets, and electropolished 316L stainless steel tubing. Atmospheric oxidation during prolonged storage can generate acidic and higher-boiling species; therefore, headspace oxygen is excluded and venting is routed through a dryer or flame arrestor. Contact with high-density polyethylene containers for longer than 6 months is not recommended because extracted oligomers can increase nonvolatile residue. Drying with 3A molecular sieves is used when moisture limits below the as-supplied specification are required; spent sieves contribute fines and are isolated by 0.1 µm PTFE filtration. The product should not be stored in containers with copper or copper-alloy wetted surfaces for extended periods where trace metal dissolution is a concern. Moisture excursions above 100 mg/kg are addressed by re-drying or segregation to non-critical cleaning; molecular sieve drying is preferred over simple nitrogen sparging.
Cyclohexane Electronic/EL Grade is incompatible with strong oxidizing agents, and its vapors can form explosive mixtures with air at concentrations between approximately 1.2% and 8.3% by volume. Process equipment must be bonded and grounded; nitrogen inerting is required if the solvent is heated above its flash point. The solvent should not be used as a direct substitute for oxygenated solvents in polar photoresist systems or in applications where high dielectric constant is required. It is also unsuitable for use with amine-based additives in formulations that are sensitive to water uptake, because residual moisture in the solvent can react with isocyanate or silane coupling agents. If the material is to be used in a closed-loop recovery system, distillation should include a water separator because the water solubility limit of 55 mg/L means that condensed free water can accumulate in the receiver and must be removed before return to the cleaning bath.
Each production lot is released only after gas chromatographic purity, coulometric Karl Fischer water, nonvolatile residue, acidity, trace-metal profiling, and particle counting have been completed. Batch-to-batch variance in trace-metal content is monitored because contamination can arise from raw feed, storage, packaging, and handling rather than from the intrinsic cyclohexane molecule. The certificate of analysis reports lot-specific values, and the user is responsible for confirming that reported limits are compatible with the wet-clean, coating, or surface-preparation process. For semiconductor users following SEMI standards, the supplier’s liquid particle counting method should be reviewed against the specific point-of-use configuration; published data for sub-0.1 µm particle performance in cyclohexane is limited, so point-of-use filtration and on-site particle monitoring are commonly used. The material should be sampled only in a cleanroom or ventilated enclosure to avoid atmospheric particle contamination and flammability exposure.
