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Cationic Photoinitiator TOK PAG-1000

    • Product Name: Cationic Photoinitiator TOK PAG-1000
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 651514
    Product Name TOK PAG-1000
    Product Type Cationic photoinitiator / photoacid generator
    Chemical Class Sulfonium salt (triarylsulfonium type)
    Physical Form White to off-white solid or powder
    Solubility Soluble in organic solvents such as acetone, ethyl acetate, methanol, and propylene glycol methyl ether acetate
    Activation Wavelength UV region, approximately 250 to 365 nm
    Active Species Generated Strong acid upon UV irradiation
    Polymerization Mechanism Cationic ring-opening polymerization of epoxy, oxetane, and vinyl ether functional groups
    Thermal Stability Stable under normal handling and dark storage conditions
    Typical Loading 0.5 to 5 wt% based on total curable formulation
    Post Uv Cure Behavior Cationic curing may continue after UV exposure due to generated acid species
    Application Areas UV-curable adhesives, inks, coatings, photoresists, solder masks, and 3D printing resins
    Storage Requirement Keep in a sealed container in a cool, dry, dark area to prevent accidental photoactivation

    As an accredited Cationic Photoinitiator TOK PAG-1000 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Cationic Photoinitiator TOK PAG-1000 is supplied in sealed, light-resistant containers. Each package contains 500 grams of high-purity liquid.
    Container Loading (20′ FCL) Cationic Photoinitiator TOK PAG-1000 is packed in sealed drums on pallets, loaded in a 20-foot full container load.
    Shipping Ship Cationic Photoinitiator TOK PAG-1000 in light-resistant, airtight containers to prevent moisture absorption and premature activation. Avoid high temperatures and ultraviolet exposure. Ensure proper labeling as a reactive chemical. Use grounded, ventilated transport, separating from oxidizers and foodstuffs. Follow regional hazardous goods regulations for safe handling.
    Storage Store Cationic Photoinitiator TOK PAG-1000 in a tightly sealed, light-resistant container in a cool, dry, well-ventilated area away from direct sunlight and heat sources. Keep at recommended temperature, protect from moisture and humidity, and avoid contact with oxidizers or incompatible materials. Ensure container is properly labeled and closed after use.
    Shelf Life Shelf life is typically 12 months from manufacture date when stored airtight, below 25°C, protected from light and moisture.
    Application of Cationic Photoinitiator TOK PAG-1000

    A coil-fed metal decorating line running aluminium closures at 110 m/min through a microwave-powered mercury arc oven represents the highest-volume use where TOK PAG-1000 is titrated against titanium dioxide loading. In a white-pigmented cationic epoxide base coat formulated for crown corks and lug caps, the photoinitiator is added at 0.8–1.4 wt% of total wet coating. The relevant food-contact framework is FDA 21 CFR 175.300, with the finished closure validated under EU Regulation 1935/2004 Article 3 for organoleptic neutrality and inertness. Application uses a roller coater with gravure metering to deposit 5–8 µm dry film; through-cure is completed by dark-cure over 24–48 h at ambient warehouse temperature, which is monitored because post-cure below 15 °C slows acid diffusion and reduces methyl ethyl ketone double-rub resistance measured by ASTM D5402-19. Unlike radical UV coatings, cationic cure continues after the substrate leaves the lamp, allowing peak UVA irradiance of 800–1,200 mW/cm² per lamp head but demanding that no nucleophilic additives such as amine-based adhesion promoters enter the formula, because they quench the propagating oxiranium ion. The terminal parts are two-piece steel crown corks and continuous-thread metal caps for carbonated beverages, not sidewall body stock, because the oxygen-barrier requirements of drawn-and-ironed can bodies are not matched by this film thickness. Production lines often reject rolls when the coating pan return temperature exceeds 35 °C because the viscosity rise in a high-titanium-dioxide formula reduces gravure wetting and creates skinned material on the pan wall.

    Opaque Lithographic Ink for Low-Odour Polyolefin Closure Printing

    Sheetfed offset presses printing flame-treated polypropylene lids at 8,000–12,000 sheets/h employ TOK PAG-1000 in cationic epoxy-ester ink vehicles at 2.5–5.0 wt% of the vehicle solids, not of the total ink. The process window is set by interdeck UV intensity: a wet ink film must receive 450–650 mJ/cm² UVA from each mercury lamp before the next unit, otherwise splitting at transfer rolls lifts unreacted epoxide and contaminates the blanket. Compliance for printed food closures begins with EU Regulation 1935/2004; because the print lies on the outer surface of the lid, a functional barrier may be claimed only if the specific migration limit for the photoinitiator and its photoproducts is below applicable detection thresholds. Published data for this specific PAG-1000 migration is limited, so closures for high-fat dairy products are qualified per batch using EN 1186 contact simulation and gas chromatography–mass spectrometry. The terminal pieces are injection-moulded polypropylene dessert lids and thin-wall yogurt cups with offset white panels; odor and taint panels are run at 40 °C for 10 days per ISO 13302:2003. Storage stability of the press-ready ink is checked at 40 °C for 72 h to detect viscosity drift or acid-number shift before release to the print floor.

    Ceramic-Loaded SL Resins Force a Reconsideration of Dosage

    In stereolithography cells running a 355 nm solid-state laser at 120–200 mW output and 80–120 µm spot diameter, TOK PAG-1000 is dosed at 1.0–3.5 wt% of the cationically curable epoxide/oxetane fraction when the vat also contains 50–70 wt% surface-treated fused silica or alumina for dental model and ceramic casting resins. The laser scans at 8–12 m/s with a layer thickness of 50–100 µm, and the vat temperature is held at 28–32 °C because the high solid loading magnifies viscosity drift with temperature. Cationic cure in this process is not oxygen-inhibited, but resin moisture measured by Karl Fischer titration is maintained below 0.2 wt%; above that threshold, water acts as a chain-transfer agent and green-part flexural strength measured by ASTM D790-17 falls before post-cure. Post-build annealing at 60–70 °C for 2 h completes the dark-cure but also introduces the main process conflict: residual acid after build continues to propagate crosslinking, so raising the initiator above 3.5 wt% produces measurable dimensional drift of more than 0.25 mm over 72 h on a 60 mm dental arch. Biocompatibility qualification follows ISO 10993-5:2009 for cytotoxicity and ISO 10993-10:2021 for irritation when the printed part is used as a surgical guide; investment casting patterns require ash-content and burnout protocols under ASTM D2584-18. The terminal articles include orthodontic models, drill guides, burn-out patterns for dental cobalt-chromium copings, and master patterns for low-volume titanium investment casting.

    When a Liquid Encapsulant Is Required to Cure Under a Flip-Chip Shadow

    Jetting dispensers that tack a flip-chip before wire bonding and underfill use TOK PAG-1000 at 0.8–2.0 phr in low-viscosity epoxy encapsulants formulated with oxetane diluents. A 365 nm UV-LED spot source fixes the visible fillet in 5–8 s, while the portion under the die shadow cures by free acid diffusion over 2–4 h at 80–100 °C; this dual mechanism eliminates the need for thermal initiators that would shorten pot life on the dispensing valve. Qualification is conducted against IPC-TM-650 2.6.3.7 for surface insulation resistance under 85 °C/85% RH bias, and the cured encapsulant is screened for extractable halides because residual chloride or antimony can promote electrochemical migration on exposed copper redistribution layers. The terminal assemblies are camera modules, MEMS microphones, and fingerprint sensor packages where the adhesive is confined to non-optical bondlines and must not yellow above ΔE 3 after 500 h QUV weathering per ASTM G154-16. Avoid amine-based flexibilizers in the same formulation because they neutralize the photogenerated superacid and reduce conversion to less than 70% at the shadow boundary.

    Where Does PAG-1000 Fit Between KrF Resist Latitude and Cleanroom Metal Limits?

    At the point where a positive-tone chemically amplified resist is exposed on a 300 mm wafer, TOK PAG-1000 is incorporated at 1.0–6.0 wt% of film-forming polymer solids to supply the photogenerated acid that cleaves acid-labile blocking groups in polyhydroxystyrene derivatives. The track process consists of spin coating to 180–250 nm residual thickness at 1,500–3,000 rpm, soft-bake at 110–130 °C, exposure through a 248 nm KrF scanner, post-exposure bake at 100–120 °C, and development in 2.38 wt% tetramethylammonium hydroxide. Cleanroom boundary conditions follow ISO 14644-1:2015 Class 3 or stricter at the coat/develop interface, and the resist must pass user trace-metal specifications that typically reject sodium, iron, and potassium above 50 ppb by ICP-MS. The limiting process defect is acid diffusion from over-dosing: loadings above 6.0 wt% enlarge the deprotection zone beyond the optical aerial image, and process latitude is monitored by top-down CD-SEM after develop because published data for this specific PAG-1000 configuration is limited. The terminal articles are logic and memory integrated circuits, specifically redistributed power-management die and embedded non-volatile memory where the resist serves as mask for ion implantation or reactive ion etch.

    On printed circuit board conformal coating lines, TOK PAG-1000 is dosed at 0.6–2.0 wt% into solvent-free epoxy-urethane blends applied with selective spray valves over BGA packages and fine-pitch connectors. The cure sequence is staged: a 365 nm LED array fixes the fillet in 8–12 s, then a 40–60 °C tunnel completes epoxide ring-opening in shadowed areas within 24–48 h. Compliance is assessed under IPC-CC-830C, with condensation resistance verified by IPC-TM-650 2.6.3.7; automotive ECU builders also require revision-controlled relative thermal index data under UL 746E. The terminal articles are traction-motor control boards, LED driver modules, and battery-management-system wiring assemblies. Production hoppers must exclude primary amines because free amine species from board flux residues neutralize the sulfonium-derived acid and produce tacky shadow zones under BGAs.

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    Certification & Compliance
    More Introduction

    TOK PAG-1000 is a cationic photoinitiator sold as a crystalline triarylsulfonium hexafluorophosphate. The active compound is identified on the commercial technical data sheet by CAS 68156-13-8, with a molecular weight of 516.50 g/mol. Typical technical literature describes the material as a white to pale yellow crystalline powder with an HPLC assay of ≥99.0% and a melting range of 101–104 °C. The product is soluble in propylene carbonate, acetone, and chloroform, and is practically insoluble in water. A 50% solution in propylene carbonate is a common intermediate for low-dust handling in UV-curable epoxide and vinyl ether formulations. The UV absorption envelope extends from approximately 220 nm to 370 nm, allowing direct excitation at the 365 nm mercury emission line. Upon irradiation, the sulfonium salt generates a Brønsted acid that initiates ring-opening polymerization of cycloaliphatic epoxides, oxetanes, and vinyl ethers. Unlike Norrish Type I free-radical photoinitiators used for acrylate systems, TOK PAG-1000 is not consumed by oxygen inhibition; the cationic propagation mechanism is instead terminated by water, alcohols, amines, and basic fillers.

    Formulation work with TOK PAG-1000 on production-scale lines has centered on cationic clearcoats, adhesives, and electronic encapsulants where the concentration window is narrow. At 0.5–2.0 wt% active photoinitiator in a cycloaliphatic epoxide resin, surface cure dose is governed by lamp irradiance and film thickness. On a medium-pressure mercury line operated at 120 W/cm, a 25 µm clear epoxide film can reach tack-free cure between 1500 mJ/cm² and 3000 mJ/cm²; the same film under a 395 nm UV-LED array may remain tacky unless a sensitizer such as 0.25–0.50 phr of 2-isopropylthioxanthone or an anthracene derivative is added. Published data for this specific film configuration is limited, but the absorption cutoff of triarylsulfonium hexafluorophosphate salts makes 365 nm excitation more reliable than 385 nm or 395 nm excitation without a sensitizer.

    What Limits Cationic Cure Depth When the Photoinitiator Is Used Below 2 wt%?

    At loadings below 2 wt%, through-cure becomes dose-limited because fewer photogenerated acid molecules are available to overcome termination by residual moisture and nucleophilic impurities. The Beer-Lambert relationship controls the light-intensity gradient within the film. In a clear 10 µm film with a photoinitiator loading of 0.5 wt%, absorbance at 365 nm may be low enough to allow nearly uniform acid generation through the film, but the total acid yield is low. At 2 wt%, surface absorbance can exceed 1.0 AU, increasing surface crosslinking while reducing photon flux at the substrate interface. Pigmented formulations containing TiO₂ or carbon black show a more severe limitation because scattering and absorption compete with the photoinitiator. In such systems, a longer-wavelength sensitizer and higher irradiance are normally required. Process engineers evaluate through-cure by attenuated total reflectance FTIR, following attenuation of the epoxide ring vibration at 910 cm⁻¹, and by solvent rub testing according to ASTM D5402-19. An acceptable residual epoxide level is usually specified below 5% of the initial peak area; above this threshold, hardness and chemical resistance decline disproportionately.

    Viscosity Control and Solubility Boundaries in Epoxide Formulations

    TOK PAG-1000 is supplied as a solid, and ambient-temperature solubility in cycloaliphatic epoxide resins is limited. The preferred dissolution method is to heat the epoxide carrier to 50–60 °C under high-shear mixing in a jacketed vessel, add the photoinitiator in portions, and then cool rapidly to 25 °C after complete dissolution. Prolonged exposure above 70 °C should be avoided because sulfonium salts can undergo thermally induced decomposition and release acid. For low-viscosity inks and coatings, a 50% propylene carbonate solution is often used; this stock solution is added at the letdown stage. Crystallization can occur if the dissolved solid concentration exceeds 5 wt% in a nonpolar epoxide diluent or if the formulation is stored at 4–8 °C. Viscosity drift is monitored with ISO 3219:2021 cone-plate viscometry at 25 °C and 100 s⁻¹. A drift of less than 10% over 72 h in a closed container is generally considered acceptable for cationic adhesives; larger drift indicates premature oligomerization or moisture ingress. When ambient relative humidity exceeds 60%, dry nitrogen blanketing of the mixing vessel is used to reduce water pickup.

    Production-scale dispensing of cationic epoxide adhesives containing TOK PAG-1000 requires control of dark cure. In a static mix dispense system, the mixed resin is held at 20–25 °C to limit viscosity increase. Raising the mixing head temperature to 40 °C can shorten the working life from several days to less than 8 h for highly reactive cycloaliphatic epoxy systems. This behavior is consistent with acid-catalyzed homopolymerization after incidental photolysis or thermal acid generation. Equipment should be shielded from sunlight and fluorescent lamps because low-level UV exposure can generate acid during storage and produce viscosity rise or localized gel particles. Needle blocks and dead volumes should be flushed at shift end to prevent cured deposits from accumulating.

    When TOK PAG-1000 Replaces Hexafluoroantimonate or Iodonium Salts in UV-Cured Inks

    Compared with a triarylsulfonium hexafluoroantimonate salt, TOK PAG-1000 has a less acidic photogenerated anion, which improves hydrolytic stability but reduces cure speed in cycloaliphatic epoxide inks. In a thin-film ink applied at 10 g/m² and cured under a 120 W/cm mercury lamp, a PF₆-based system may require 20–30% additional UV dose to reach equivalent epoxide conversion relative to an SbF₆-based system. The actual offset is formulation-specific; monomer polarity, moisture content, and pigment loading shift the ratio. Where fast cure is critical, formulators may combine TOK PAG-1000 with an anthracene-type photosensitizer rather than selecting the antimonate salt. Compared with diaryliodonium hexafluorophosphate, TOK PAG-1000 provides absorption at longer wavelengths and higher thermal stability, but diaryliodonium salts may produce lower color in very thin clear films because their absorption cutoff is shorter.

    Comparative profile of cationic photoinitiator classes
    PropertyTOK PAG-1000Triarylsulfonium SbF₆Diaryliodonium PF₆
    Cation classTriarylsulfoniumTriarylsulfoniumDiaryliodonium
    AnionPF₆SbF₆PF₆
    Absorption maximum304 nm304 nm246 nm
    Useful UV window220–370 nm220–370 nm220–320 nm
    Relative cure speed in cycloaliphatic epoxide at 365 nmModerateFasterModerate to lower
    Hydrolytic stabilityHigherLower; antimony hydrolysis riskHigher
    Thermal stabilityHigherHigherLower; iodonium salts may degrade near 150 °C

    TOK PAG-1000 is typically handled as a skin and eye irritant under the supplier safety data sheet. Nitrile gloves, safety goggles, and local exhaust ventilation are required during weighing and dissolution. The powder should be stored in a tightly closed container at 15–25 °C and protected from light and moisture. Under REACH, the product may be subject to registration obligations at annual tonnages above 1 t. Under RoHS Directive 2011/65/EU, cationic photoinitiators are not among the restricted homogeneous materials, but the presence of fluorine and phosphorus in the anion requires review in waste and recycling streams. No statement can be made concerning FDA 21 CFR food-contact status without supplier food-contact documentation and specific end-use migration testing.

    The Product Is Supplied as a Crystalline Triarylsulfonium Hexafluorophosphate

    Because TOK PAG-1000 is a solid, batch-to-batch variability in particle size can affect dissolution time. Production records show that agglomerates formed during prolonged storage at 30 °C can require extended high-shear dispersion; passing the powder through a 500 µm sieve before charging reduces undissolved residue. The material should not be milled or micronized without inert gas because airborne dust may form explosive mixtures; the supplier’s safety data sheet should be consulted for dust explosion data. In a typical batch addition, the photoinitiator is charged after the resin and before the final letdown, so that high-shear mixing for 15–30 min at 50–60 °C is sufficient for full dissolution. Filtering the final formulation through a 5 µm absolute filter cartridge removes residual particles and prevents downstream screen clogging in inkjet or precision dispensing heads.

    In UV powder coating development using a co-rotating twin-screw extruder with L/D 40:1, early barrel zones are kept at 70–80 °C because the sulfonium salt can undergo thermal decomposition above 90 °C; melt residence times below 60 s are preferred. Production batches have shown yellowing and gel particles when the die temperature exceeds 90 °C. Published data for this specific configuration is limited, but the behavior is consistent with the thermal sensitivity of triarylsulfonium hexafluorophosphate salts.

    Through-cure of a cationic clearcoat is measured by scraping or cross-sectioning the cured film after UV exposure and examining the substrate-side layer. Under-cured cationic films exhibit soft, tacky substrate-side material and poor solvent resistance. FTIR microscopy maps epoxide conversion across the film depth; the epoxy ring absorbance at 910 cm⁻¹ should decrease by more than 90% for a fully cured clearcoat. Adhesion to aluminum and glass is commonly evaluated with ASTM D4541-17 pull-off adhesion or ISO 2409:2020 cross-cut adhesion. Cured films that show cohesive failure within the coating and no delamination are considered formulation-appropriate for the substrate. These tests provide objective release criteria for process commissioning when TOK PAG-1000 is used in UV-cured industrial coatings.

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