| HS Code | 984074 |
| Product Name | Cationic Photoinitiator |
| Chemical Class | Onium salts (e.g., triarylsulfonium and diaryliodonium salts) |
| Cas Number | Varies by specific compound (e.g., 74227-35-3 for mixed triarylsulfonium hexafluoroantimonate) |
| Absorption Wavelength Range Nm | 200–400 |
| Polymerization Mechanism | Cationic ring-opening polymerization |
| Typical Epoxide Solubility | Soluble in epoxy monomers and polar solvents such as propylene carbonate and gamma-butyrolactone |
| Cure Depth Characteristic | Cures via dark reaction after irradiation, allowing through-cure of thick sections |
| Storage Stability | Stable at room temperature when protected from light and moisture |
| Application Forms | Liquid or solid, used at concentrations of 0.5–5 wt% in UV-curable formulations |
As an accredited Cationic Photoinitiator factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Cationic Photoinitiator is supplied in a sealed 25 kg fiber drum with inner liner, protected from light and moisture. |
| Container Loading (20′ FCL) | 20′ FCL loading of cationic photoinitiator: drums securely packed, labeled, ventilated, and compliant with hazardous material regulations. |
| Shipping | Ship cationic photoinitiators in light-resistant, moisture-proof, tightly sealed containers. Avoid exposure to UV light, humidity, and elevated temperatures during transit. If classified as hazardous, comply with IATA/IMDG/ADR regulations, use appropriate labeling, and segregate from oxidizers and ignition sources. Ensure secure packaging to prevent leakage. |
| Storage | Store cationic photoinitiators in a cool, dry, well-ventilated area away from direct sunlight, heat, and moisture. Keep containers tightly sealed to prevent exposure to humidity or contaminants. Avoid contact with strong oxidizers or bases. Use appropriate PPE when handling, and ensure compliance with manufacturer’s safety data sheet guidelines. |
| Shelf Life | Shelf life is typically 12 months when stored tightly sealed in a cool, dry place, protected from light and moisture. |
A cycloaliphatic epoxide system containing 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate at 55–75 wt%, oxetane diluent at 5–15 wt%, polyester polyol at 10–25 wt%, triarylsulfonium hexafluorophosphate at 1.2–2.0 wt%, and a slip aid at 0.3–1.0 wt% is roll-coated onto rigid metal food-contact end stock at a dry film weight of 8–12 g/m². On a 24-station metal decorating press running at 120–180 m/min, the sheet passes through a mercury arc UV tunnel delivering 600–900 mJ/cm² UVA and 1,200–2,500 mW/cm² peak irradiance. The processing window is narrower than free-radical coatings because adsorbed moisture acts as a chain-transfer agent and suppresses propagation; substrate infrared pre-conditioning is therefore set at 45–55 °C for 3–5 s before the UV zone. Finished can ends, steel lug caps, and twist-off closures are post-cured for 24 h at 25 °C or 30 min at 80 °C to complete dark cure. Mechanical acceptance criteria on production sheet include ≥50 methyl ethyl ketone double rubs per ASTM D5402-19, pencil hardness ≥2H per ASTM D3363-20, and crosshatch adhesion ≤1 per ASTM D3359-17. Food-contact compliance is tested against FDA 21 CFR 175.300 and EU 10/2011; overall migration must remain below 10 mg/dm², and specific migration of sulfonium-derived photolysis species is batch-validated by LC-MS/MS in fatty and aqueous simulants.
| Compliance Boundary | Standard / Test Method | Measured Parameter |
|---|---|---|
| United States metal food contact | FDA 21 CFR 175.300 | Resinous and polymeric coating compliance |
| European food contact articles | EU 10/2011 Annex I, II, III | Overall migration and specific migration of sulfonium-derived species |
| Mechanical adhesion | ASTM D3359-17 | Crosshatch tape pull classification |
| Solvent resistance | ASTM D5402-19 | Methyl ethyl ketone double rubs |
| Coating hardness | ASTM D3363-20 | Pencil hardness |
On high-density printed circuit assembly lines, a cationically cured cycloaliphatic epoxide conformal coating is applied by selective robotic spray at wet thickness 50–150 μm. A representative formulation contains cycloaliphatic epoxide at 40–60 wt%, oxetane diluent at 10–20 wt%, polyester polyol at 5–15 wt%, epoxysilane adhesion promoter at 0.5–2.0 wt%, and triarylsulfonium hexafluorophosphate at 1.5–3.5 wt%. After 365 nm UV exposure at 600–1,200 mJ/cm², propagation continues in dark areas for 24–72 h at 25 °C and 50 % RH; this dark-cure mechanism reduces tack-free time in component shadow zones that free-radical UV coatings cannot reach. To accelerate production, a 30–60 min thermal cycle at 80 °C increases epoxy conversion and stabilizes insulation resistance. The main process conflict is humidity: if the spray booth exceeds 60 % RH, atmospheric water competes with polyol chain transfer and surface tack may persist beyond 72 h. For boards containing high-impedance differential pairs, hexafluoroantimonate-type photoinitiators are not selected because the antimony-containing anion remains mobile under 85 °C/85 % RH testing; hexafluorophosphate or tetrakis(pentafluorophenyl)borate grades are substituted. Conformance is evaluated under IPC-CC-830B and surface insulation resistance test method IPC-TM-650 2.6.3.7, with typical acceptance at ≥100 MΩ after 168 h at 85 °C/85 % RH and 50 V DC. Terminal products include automotive engine control units, sensor modules, and power conversion boards. Published data for specific solder-mask interactions is limited; compatibility on tin-silver-copper pads must be confirmed per batch.
Diaryliodonium perfluorobutanesulfonate is dissolved at 1 wt% to 4 wt% of polymer solids in 248 nm and 193 nm chemically amplified photoresists, where it functions as a photoacid generator in protected poly(hydroxystyrene) or polymethacrylate matrices. After spin coating and soft bake at 90–110 °C for 60 s, the resist film is exposed through a photomask; the photogenerated acid catalyses deprotection during a post-exposure bake at 110–130 °C for 60–90 s. The critical process parameter is acid diffusion length, because it must remain small enough to preserve line-edge roughness within node-specific budgets while remaining sufficient to deprotect exposed regions. When photoacid generator loading exceeds 4 wt%, residual anion concentration and photoacid outgassing can increase; loadings below 0.8 wt% reduce photospeed and demand higher exposure dose. Development is performed in 0.26 N tetramethylammonium hydroxide. The resist itself is not governed by a single public coating standard; equipment and facilities are operated under SEMI S2 and SEMI S8 occupational and equipment safety requirements, and cleanroom environmental control follows ISO 14644-1. Terminal products are advanced logic and memory devices. Ambient base contamination must remain below 1 ppb to prevent surface acid neutralisation and T-top profile formation. Published formulation-specific data on EUV outgassing of low-molecular-weight sulfonium fragments is limited; tool qualification is required.
When ceramic-loaded cationic resins are processed by digital light projection, the slurry temperature and light dose determine the working curve. A representative preparation contains cycloaliphatic epoxide at 35–50 wt%, oxetane diluent at 10–20 wt%, dispersant at 1–5 wt%, and triarylsulfonium hexafluorophosphate at 0.5–2.0 wt%, loaded with 30–50 vol% alumina or fused silica having particle size 0.2–1.0 μm. The suspension is processed on DLP equipment with 385 nm LED arrays at 20–80 mW/cm² measured at the vat surface; layer thickness is 25–100 μm, and exposure time ranges from 1 s to 8 s. Higher ceramic volume fraction shifts the critical energy dose upward and reduces the Jacobs slope parameter. Recoating fails when suspension viscosity exceeds 5 Pa·s at 30 s⁻¹ and 25 °C. A deliberate overcure of 20–50 μm beyond slice thickness improves interlayer adhesion, but uncontrolled dark cure after the build can consume low-molecular-weight species and alter feature dimensions in channels below 200 μm. After printing, parts are debound and sintered at 1,200–1,650 °C. Terminal products include investment casting cores, microreactor channels, and dental diagnostic casts. Compliance for additive manufacturing coordinate systems is referenced to ISO/ASTM 52921. Published data for specific ceramic-laden resin formulations at high solids is limited; each powder lot requires working curve calibration.
Precision bonding of glass aspheres into anodized aluminium mounts uses a cationically cured cycloaliphatic epoxide with 1.0–3.0 wt% triarylsulfonium hexafluorophosphate, 50–70 wt% diepoxide, 10–20 wt% oxetane diluent, 2–5 wt% epoxysilane, and 1–3 wt% adhesion promoter. The adhesive is dispensed through a 0.2–0.5 mm needle at bondline thickness 20–80 μm and cured under 365 nm mercury arc irradiation at 1,200–1,800 mJ/cm². Shadow regions inside lens barrels continue conversion by dark cure for 48 h at 25 °C or 1 h at 60 °C. Low linear shrinkage below 0.3 % reduces stress birefringence in bonded doublets. Environmental durability is tested per ISO 9022-2 at 85 °C/85 % RH for 250 h; published data for this specific configuration is limited. Terminal products include lens assemblies in laser marking heads, fibre-optic ferrules, and compact sensor optics.
In indirect food-contact inkjet applications, a cationically cured cycloaliphatic epoxide/vinyl ether ink is jetted onto corona-treated polyolefin label stock and shrink sleeves at 360 dpi and 20–40 pL drop volume. The ink contains pigment at 5–15 wt%, oxetane diluent at 10–20 wt%, vinyl ether monomer at 5–15 wt%, and triarylsulfonium hexafluorophosphate at 3–8 wt%. Substrate surface energy is adjusted to 38–42 mN/m before cure under 365 nm LED or mercury arc lamps at 800–1,600 mJ/cm². Because the printed face is not a functional barrier, sulfonium-derived decomposition products such as diphenyl sulfide and aryl ketone fragments are monitored under EU 10/2011 Annex III food simulants; overall migration must remain below 10 mg/dm², and specific migration limits apply where substance-specific SML values are established. Printhead open-time stability is limited by moisture sensitivity; idle conditions at 40 °C/80 % RH can increase ink viscosity and require sealed reservoirs with nitrogen purge. Published data for specific sulfonium-derived migration values in printed sleeves is limited; each ink grade is batch-validated by LC-MS/MS. Terminal products include lidding films, pressure-sensitive labels, and full-body shrink sleeves.
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| Parameter | Test condition / equipment | Cationic CPI-820 | Free-radical Type I |
|---|---|---|---|
| Surface cure in air | 800 mJ/cm², 120 W/cm medium-pressure mercury lamp, 50 µm clear film | Tack-free | Surface tack unless nitrogen inerting used |
| Post-irradiation conversion change | FTIR-ATR, oxirane 910 cm⁻¹, 1 h at 25 °C | +8% to +15% | +1% to +3% |
| Linear shrinkage | Gas pycnometer, 25 µm film | 1.2–2.5% | 7–10% |
| Dark cure after 600 mJ/cm² | 24 h, 25 °C, epoxy conversion | 70% to 88% | No significant increase |
| Moisture sensitivity | 60% RH, open application | High; requires pre-drying | Moderate |