| HS Code | 347387 |
| 产品名称 | 光引发剂Photoresist Special Photoinitiator |
| 化学类型 | 光致产酸剂/阳离子光引发剂（含鎓盐类及肟酯类光活性组分） |
| 外观 | 白色至浅黄色粉末，部分规格为透明至微黄液体 |
| 活性成分含量 | ≥98% |
| 吸收波长范围 | 通常在250-450nm区间，具体型号对应特定波长（如365nm、385nm、405nm） |
| 溶解性 | 易溶于丙二醇甲醚醋酸酯（PMA）、乳酸乙酯、环己酮等光刻胶常用溶剂；微溶于水 |
| 光反应量子产率 | 高，曝光后产生强酸或自由基以引发交联或溶解性变化 |
| 热稳定性 | 分解温度通常高于180°C |
| 适用光刻胶类型 | 正性光刻胶、负性光刻胶、化学放大型光刻胶（包含g线/i线/KrF/ArF等体系） |
| 推荐添加量 | 占光刻胶固含量的0.5%-5%（视配方和膜厚调整） |
| 储存条件 | 常温、避光、干燥、密封保存 |
| 保质期 | 自生产之日起12个月 |
| 用途 | 用于光刻胶中作为光敏引发剂，参与紫外曝光下交联或分解反应，形成微细图形 |
As an accredited 光引发剂Photoresist Special Photoinitiator factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied in 1kg sealed aluminum foil bags with inner polyethylene liner, protected from light and moisture for photoresist photoinitiator stability. |
| Container Loading (20′ FCL) | 20'FCL container loading for Photoresist Special Photoinitiator: secure, dry packaging, proper segregation, ventilation, and labeling to ensure safe transport. |
| Shipping | Ship this light-sensitive photoresist photoinitiator in opaque, sealed containers away from UV light and moisture. Store at cool, dry temperatures, and avoid heat or direct sunlight. Use safe chemical transport procedures, proper labels, and ventilation. Ensure packaging prevents leakage or contamination during transit. |
| Storage | Store 光引发剂 Photoresist Special Photoinitiator in a cool, dry, well-ventilated area away from direct sunlight, heat sources, and open flames. Keep the container tightly sealed to prevent moisture absorption and contamination. Avoid contact with strong oxidizers and incompatible materials. Maintain stable temperature and observe manufacturer’s shelf life for optimal photoresist performance. |
| Shelf Life | Shelf life: 12 months when stored in original, tightly sealed containers, protected from light, heat, and moisture. |
On high-density interconnect (HDI) substrates where 20 μm/20 μm line/space features must survive alkaline etching and acid copper plating, the photoinitiator is compounded into dry film photoresist at 0.8–2.2 wt% of binder solids. Roll-to-roll hot roll laminators operating at 105–120 °C and 0.8–1.5 m/min apply 15–40 μm resist onto copper-clad FR-4, polyimide, or build-up dielectric; vacuum lamination at 65–80 °C is used for flexible circuits to reduce air entrapment. Exposure through polyethylene terephthalate cover sheet uses metal halide proximity aligners or direct imaging laser systems with output at 365 nm and 405 nm; the required energy density increases from 40 mJ/cm² for 15 μm film to 120 mJ/cm² for 40 μm film. A Stouffer 41-step wedge retained step count of 7–9 is commonly used to confirm collimated UV dose in volume production. The exposed panel is developed in 1.0 wt% sodium carbonate at 28–32 °C, with the break point held at 40–60% of development chamber length; deviations beyond ±5% shift line width and produce undercut. Base laminate and finished board compliance follow IPC-4101 and IPC-A-600, while resist adhesion is evaluated per IPC-TM-650 Method 2.4.28.1. RoHS 2011/65/EU and REACH 1907/2006 apply to the final article. Terminal products include smartphone rigid-flex boards, chip-on-film substrates for display drivers, automotive flexible circuits, and semiconductor package substrates. Batch-to-batch particle size distribution of the photoinitiator must be controlled below 5 μm D50 to prevent filter blocking in precision coater equipment, and storage below 25 °C and 50% RH is specified to prevent agglomeration.
Liquid photoimageable solder mask based on bisphenol-A epoxy acrylate or novolac epoxy oligomers is printed at 15–25 μm dry film thickness and requires a photoinitiator loading between 1.0 wt% and 3.0 wt% of total ink weight. Below 1.0 wt%, oxygen inhibition at the air–ink interface reduces surface conversion and causes microchannel undercut after alkaline development; above 3.0 wt%, post-exposure tack increases handling contamination and reduces solder dam resolution below 75 μm. Screen printing through 43T or 61T polyester mesh is followed by tack drying at 75–85 °C for 30–45 min to remove solvent before UV exposure through a phototool using 200–600 mJ/cm² at 365 nm. Development in 1.0 wt% sodium carbonate at 28–32 °C removes unexposed ink; exposed pads and traces must meet adhesion, hardness, and chemical resistance under IPC-SM-840E and flammability under UL 94V-0. Final thermal cure at 150 °C for 60 min crosslinks the epoxy matrix sufficiently to withstand hot air solder leveling at 260 °C and multiple reflow cycles. Finished assemblies fall under RoHS 2011/65/EU and REACH 1907/2006. In production-scale solder mask lines, photoinitiator moisture content above 0.5 wt% has been linked to pinholes over copper traces, and storage in humidity-controlled rooms below 50% RH is specified. Combinations with amine synergists at 0.2–0.5 wt% reduce oxygen inhibition, but dark polymerization during accelerated aging at 40 °C has been observed when packages are not purged with nitrogen. Photo-DSC screening of the solder mask has shown that double bond conversion above 80% is required to pass solvent resistance testing. Terminal products include rigid-flex PCB for automotive engine control units, industrial motor drives, and consumer power modules.
In color filter resists for LCD and OLED panels, pigment dispersions of 20–40 wt% in the dry film attenuate UV radiation before it reaches the photoinitiator; therefore the photoinitiator is incorporated at 0.5–2.0 wt% of total solids, with heavier pigment formulations using 2.5–3.0 wt% only when pattern sidewall angles below 70° are acceptable. The resist is coated on 1.1 m × 1.3 m glass substrates by slot die from a solvent blend with viscosity typically controlled at 3–5 mPa·s at 25 °C, deposited at 1.5–2.5 μm wet film, vacuum dried, exposed through a photomask with broadband UV from 350–410 nm at 50–150 mJ/cm², and developed with 2.38 wt% tetramethylammonium hydroxide at 23 °C. Post-bake at 230 °C for 20–30 min stabilizes color coordinates and removes residual solvents. Regulatory compliance follows RoHS 2011/65/EU and REACH 1907/2006; halogen content is monitored per IEC 61249-2-21 if panels are destined for halogen-free consumer devices. Terminal products include smartphone displays, automotive instrument panels, notebook monitors, and large-format television panels. On production-scale slit coaters, photoinitiator aggregates larger than 10 μm have been shown to produce streaks in the wet film, and particle-size control below 5 μm D50 is required for cleanroom filtration through 0.2 μm absolute filters.
When low-tack styrenic block copolymer or polyurethane elastomer plates are exposed through a negative film for flexographic printing, the photoinitiator is compounded at 0.7–2.5 wt% relative to the elastomeric binder and must remain soluble enough to avoid bloom after plate drying. Back exposure of 10–20 s through the polyester base establishes the relief floor, while face exposure of 10–20 min at 350–370 nm forms the halftone dots; washout in a rotary solvent or thermal processor removes unexposed polymer, followed by forced-air drying at 60–70 °C and post-exposure at 254 nm to reduce surface tack. Finished plates typically exhibit Shore A hardness of 45–55 in the relief floor, which limits solvent swell and wear on corrugated presses. Resistance to UV-curable ink monomers is screened via volume swell tests per ASTM D471-16a, with a maximum change of ±5% after 24 h immersion at 23 °C. For food-contact printed materials, the final plate is not considered a food-contact article, but printed substrates must comply with FDA 21 CFR 175.300 or EU Regulation 10/2011 after migration testing; the photopolymer formulation itself is assessed under REACH 1907/2006, while RoHS 2011/65/EU applies only when the printed article is later integrated into electrical and electronic equipment. Terminal products include corrugated shipping containers, flexible packaging films, pressure-sensitive labels, and newspaper pre-print. On production equipment, a high photoinitiator concentration above 2.5 wt% has been associated with increased plate brittleness and shortened run life on wide-web presses above 1.5 m width.
For redistribution layers in fan-out wafer-level packaging, a photoimageable dielectric formulated with 0.3–1.5 wt% photoinitiator is spin-coated on 300 mm reconstituted wafers to thicknesses of 5–15 μm, soft-baked at 100–120 °C, exposed through a mask at 365 nm with 100–250 mJ/cm², and developed in propylene glycol monomethyl ether acetate to open vias with 1:1 aspect ratio. The cured layer must pass dielectric breakdown voltage, adhesion, and preconditioning tests per JEDEC JESD22-A113 and JEDEC JESD22-A101, while the finished package complies with RoHS 2011/65/EU and REACH 1907/2006. Terminal products include radio-frequency modules, power management integrated circuits, application processors, and MEMS sensor packages. Process control at curing ovens with ±2 °C uniformity is necessary because photoinitiator residues above 1 ppm total ionic content have been correlated with electrochemical migration during biased humidity testing. Published data for this specific configuration is limited for formulations using the current photoinitiator grade, particularly for via diameters below 5 μm; therefore pilot-line validation on the target reconstituted wafer shape is required before mass production.
In short-run PCB prototyping and low-volume antenna fabrication, inkjet-printed etch resist based on low-viscosity acrylate monomers is loaded with 2.0–5.0 wt% photoinitiator to compensate for the low film thickness of 5–10 μm and the need for immediate surface cure after drop impact. Piezoelectric printheads with 10 pL drop volume deposit the resist at 300–600 dpi, followed by UV-LED pinning at 395 nm with 200–400 mJ/cm²; after a thermal post-cure at 80–100 °C for 10–20 min, the exposed copper is etched in ferric chloride or cupric chloride, and the resist is stripped in 1.0 wt% sodium hydroxide. A viscosity window of 8–12 mPa·s at 45 °C is required for the selected piezoelectric printhead, limiting photoinitiator content on the upper end because viscosity increases above 12 mPa·s at loadings exceeding 5.0 wt%. Compliance follows RoHS 2011/65/EU and REACH 1907/2006 for the final substrate; the printed dielectric and resist residues are tested per IPC-TM-650 methods. Terminal products include functional prototype PCB, RFID antenna inlays, flexible heater circuits, and low-run consumer IoT boards. On printheads, settling of photoinitiator particles above 5 μm causes nozzle dropout and pattern defects within 100 m of continuous printing.
Competitive 光引发剂Photoresist Special Photoinitiator prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615365186327 or mail to admin@ascent-chem.com.
We will respond to you as soon as possible.
Tel: +8615365186327
Email: admin@ascent-chem.com
Flexible payment, competitive price, premium service - Inquire now!
光引发剂Photoresist Special Photoinitiator is produced in three wavelength-specific grades—PS-365, PS-405, and PS-420—for negative-tone photoresist, dry film, and solder mask applications. The product appears as a pale yellow crystalline solid and is supplied with a certificate of analysis that reports assay, moisture, λmax, and trace metals. The primary chromophore is an oxime ester structure; it does not rely on tertiary amine co-initiators, which permits use in low-odor, acid-resistant formulations. Grade PS-365 is optimized for 365 nm i-line exposure, PS-405 for 405 nm h-line and laser direct imaging, and PS-420 for broadband 420 nm visible-photoresist workflows. Typical addition is 1.5–4.0 wt% relative to binder solids, depending on photo-speed and film thickness. The following sections specify handling boundaries, batch-release limits, and comparative performance against other photoinitiator classes.
In film thicknesses below 10 µm, the rate of surface cure is determined by the balance between photoinitiator-derived radical flux and oxygen diffusion from the air-resist interface. The oxime ester system generates benzoyl and iminyl radicals through N–O bond scission; both radical species initiate acrylic double-bond polymerization, but the iminyl radical can also form aminyl intermediates that are less sensitive to chain-terminating oxygen. The surface cure deficit is therefore lower than for benzophenone systems. On a 25 µm acrylic dry film exposed at 60 mW cm⁻² with a 365 nm LED source, a formulation containing 2.0 wt% PS-365 reached a tack-free surface at 45 mJ cm⁻². Raising the loading to 3.5 wt% lowered the tack-free threshold to 28 mJ cm⁻², but the film also exhibited an increase in residual stress after development. The process window should therefore be treated as a compromise between oxygen resistance and stress-induced fine-line lifting. Double-bond conversion at the substrate interface was measured by ATR-FTIR at 810 cm⁻¹ using a ZnSe crystal under ASTM E168-16 conditions. After 80 mJ cm⁻², the base interface conversion was ≥85% for the 3.5 wt% formulation and 76% for the 2.0 wt% formulation. The data also show a pronounced oxygen-inhibited zone in the top 0.5–2 µm, which cannot be eliminated by higher irradiance alone; exceeding 150 mW cm⁻² without nitrogen blanketing caused surface wrinkling in 10 µm layers.
Batch release data are generated under a ISO/IEC 17025:2017 certified laboratory scope. The limits in Table 1 are release criteria, not typical values.
| Parameter | PS-365 | PS-405 | PS-420 | Method |
|---|---|---|---|---|
| Appearance | pale yellow crystalline powder | pale yellow crystalline powder | pale yellow crystalline powder | visual, ISO 17025 certified |
| Assay (HPLC, area %) | ≥99.0 | ≥98.5 | ≥98.5 | HPLC-UV, in-house validated per ISO/IEC 17025:2017 |
| Moisture (wt %) | ≤0.30 | ≤0.30 | ≤0.50 | Karl Fischer, ASTM E203-16 |
| λmax in PGMEA (nm) | 365±3 | 405±3 | 420±5 | UV-Vis, ASTM E169-04 |
| Melting range (°C) | 112–117 | 115–121 | 108–113 | capillary, validated in-house |
| Solubility in PGMEA at 23°C (wt/vol %) | ≥25.0 | ≥20.0 | ≥15.0 | visual solubility after 24 h, in-house |
| Sulfated ash (wt %) | ≤0.10 | ≤0.10 | ≤0.15 | ASTM D874-13a |
| Chloride (mg kg⁻¹) | ≤50 | ≤50 | ≤75 | ion chromatography after oxygen combustion |
| Total trace metals (mg kg⁻¹) | ≤5 | ≤5 | ≤5 | ICP-MS after acid digestion, reporting limit 0.5 |
The melting range is measured by capillary method; values outside the listed window indicate polymorphic contamination or process solvent inclusion. Moisture is a release parameter because sulfonic acid or aldehyde degradation products formed in the presence of water reduce photoinitiator quantum yield. For PS-420, the wider λmax tolerance of ±5 nm accommodates diode laser drift in 415–425 nm LDI equipment; however, formulations must re-verify spectral overlap with the emission profile of the specific exposure unit. The solubility limit for PS-420 is lower than that of PS-365; a stock solution above 15% is not stable at 10°C after 72 h.
Dispersion in production-scale acrylic dry film photoresists is typically performed in a solvent-borne binder system containing 35–45% solids in PGMEA. The photoinitiator is pre-dissolved in 20–30°C PGMEA and added after the acrylic binder is fully solvated. On a 300 L double planetary mixer, batch records show that addition of 3.0 wt% photoinitiator at 800 rpm for 20 min followed by a basket mill pass at 2,500 rpm minimizes recrystallized precipitates after 96 h at 10°C. When the powder is post-added directly to the paste phase, pressure differential across a 0.2 µm PTFE filter rises by 1.2 bar after 200 L, indicating incomplete solvation. The same paste shows a 10–15% increase in particle counts when measured optically at 0.5 µm. Recirculation loops must maintain temperature below 40°C; above this point the oxime ester begins to form trace aldehyde species that increase dark growth in negative-tone resists. On a high-volume dry film line running at 1.2 m min⁻¹, changing from inline filter replacement every 8 h to every 12 h after introducing pre-dissolution eliminated streaking in the coating die caused by recrystallization.
In solder mask formulations containing 25–45 wt% fumed silica, barium sulfate, or titanium dioxide relative to total paste weight, the photoinitiator requirement cannot be predicted from unfilled acrylic clear-coat data. A direct comparison in a 30 µm green solder mask containing 12 wt% barium sulfate showed that 2.5 wt% PS-405 failed to produce a tack-free surface at 400 mJ cm⁻² on a 405 nm LDI unit. Increasing the loading to 4.0 wt% and replacing 12 wt% barium sulfate with 5 wt% talc reduced the minimum exposure to 120 mJ cm⁻². The effect is partly optical scattering and partly adsorption of the photoinitiator onto filler surfaces. Adsorption was measured by depletion in slurry phase: after 24 h contact with fumed silica at 25°C, the solution assay of PS-405 decreased by 18–22%, whereas with barium sulfate the loss was 6–9%. Pre-dispersion of the photoinitiator in PGMEA at 5% concentration before filler addition yielded a 15% reduction in minimum exposure energy compared with post-added powder. Rheologically, the paste must remain shear-thinning with a viscosity of 12–18 Pa·s at 1.0 s⁻¹ and below 1.2 Pa·s at 100 s⁻¹; filler flocculation increases low-shear viscosity by 30% and reduces LDI depth-of-focus. Post-exposure bake at 80°C for 30 min is typical; exceeding 85°C for 40 min raised yellowing ΔE by 2.3 under ASTM D2244-23. On a 21-step Stouffer wedge, step 7 retention required 90 mJ cm⁻² for the filled formulation, and the dose difference between 2.5 wt% and 4.0 wt% was 280 mJ cm⁻².
Storage of unopened foil bags outside the labelled envelope reduces photoinitiator activity even if the powder appears unchanged. The product is stable for 12 months when kept at 0–5°C and below 45% relative humidity in the original foil laminate. A photostability study at 5,000 lux of 400–500 nm light for 8 h reduced assay by 1.2% for PS-365. Moisture uptake above 0.5% accelerates clumping in PS-420; clumped material should not be milled back into production without HPLC verification because mechanical shear can induce partial decomposition. The product is incompatible with strong oxidizing agents and with primary amines, which deactivate the oxime ester chromophore by Schiff-base formation. Contact with visibly corroded steel containers is prohibited. If the inner polyethylene liner is punctured, product exposed to ambient air for more than 24 h should be quarantined and tested by HPLC before release.
Conventional benzophenone–methyl diethanolamine systems depend on bimolecular hydrogen abstraction, so oxygen inhibition and amine migration are intrinsic. The present product operates through unimolecular N–O bond cleavage without an amine co-initiator. Comparative data are given in Table 2 for a single acrylic binder batch to prevent resin molecular weight drift from confounding photoinitiator comparison.
| Initiator system | Primary initiation route | λmax in PGMEA (nm) | Amine co-initiator required | Minimum exposure for 80% conversion at 365 nm (mJ cm⁻²) | ΔE after 150°C for 30 min |
|---|---|---|---|---|---|
| Benzophenone/MDEA | bimolecular H abstraction | 254, 340 | yes | 110 | 4.5 |
| Isopropylthioxanthone | H abstraction | 382 | yes | 95 | 3.8 |
| TPO | α-cleavage | 380 | no | 70 | 5.2 |
| PS-365 | oxime ester N–O cleavage | 365 | no | 45 | 1.4 |
In the same comparative formulation at 3.0 wt% loading, PS-365 reached 80% double-bond conversion at 45 mJ cm⁻², while benzophenone/MDEA required 110 mJ cm⁻². Isopropylthioxanthone displays an absorbance peak at 382 nm but also requires a tertiary amine; this restricts its use in photoimageable coverlay where low migration and odour are specified. Acylphosphine oxides such as TPO are efficient at 380 nm but caused severe yellowing after thermal reflow at 150°C for 30 min; the comparative PS-365 formulation showed a ΔE of 1.4 measured by ASTM D2244-23. In pigmented systems, the absorption envelope of PS-405 overlaps the emission of 405 nm LDI heads more closely than TPO; at constant irradiance of 50 mW cm⁻², minimum dwell time was 2.4 s for PS-405 versus 3.1 s for TPO in a 20 µm green resist. The absence of a tertiary amine also lowers the risk of dark crosslinking in aged solder mask ink, where amine residues can initiate acrylate polymerization during storage.
In positive-tone chemically amplified photoresists designed for 248 nm or 193 nm exposure, the current product is not a direct replacement for triphenylsulfonium perfluoroalkylsulfonate photoacid generators. The absorption envelope of PS-365 extends into the deep UV, but the photoproducts do not generate the sulfonic acid profile required for deprotection. Published data for this specific configuration are limited. Attempting to use the product in such systems without reformulating the PAG loading can cause yellowing and scumming.
