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Toray Industries ABS 100 MPM

    • Product Name: Toray Industries ABS 100 MPM
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 936433
    Melt Flow Rate G 10min 15-25 at 220°C/10 kg
    Mold Shrinkage Percent 0.5-0.8
    Ul94 Flame Rating HB

    As an accredited Toray Industries ABS 100 MPM factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Toray Industries ABS 100 MPM is supplied in 25 kg moisture-resistant paper bags, palletized in 1,000 kg lots for industrial handling.
    Container Loading (20′ FCL) Toray Industries ABS 100 MPM loaded in a 20′ FCL container, palletized in 25 kg bags, shrink-wrapped and secured for export shipping.
    Shipping Toray Industries ABS 100 MPM is a thermoplastic ABS resin supplied in moisture-barrier bags or octabins. It is not classified as dangerous goods and ships as general cargo. Keep dry, away from direct sunlight and heat, and avoid package damage during transport.
    Storage Store Toray Industries ABS 100 MPM in a cool, dry, well-ventilated warehouse away from direct sunlight, heat, moisture, and ignition sources. Keep original containers closed and labeled; prevent dust generation and static buildup. Segregate from oxidizing agents and incompatible chemicals. Maintain stable temperature, avoid freezing or excessive heat, and follow the manufacturer’s SDS and local regulations.
    Shelf Life Toray Industries ABS 100 MPM typically has a two-year shelf life when stored dry at room temperature in original sealed packaging.
    Application of Toray Industries ABS 100 MPM

    Toray Industries ABS 100 MPM is processed as a general-purpose acrylonitrile-butadiene-styrene injection moulding grade with high-flow rheology suited to thin-wall, multi-cavity tooling. Pre-drying in a desiccant dryer with a dew point below -30 °C at 80 °C to 85 °C for 3 h to 4 h reduces residual moisture to less than 0.05 wt%, preventing splay, silver streaking, and hydrolysis-induced surface defects. Melt temperature measured at the nozzle is maintained from 220 °C to 250 °C. Mould temperature from 40 °C to 70 °C controls surface gloss, crystallisation-free skin formation, and post-mould shrinkage. Screw geometry with an L/D ratio of 20:1 to 24:1 and compression ratio of 2.0:1 to 2.5:1 is used for homogeneous melt plastication. Drying verification follows ISO 15512 or equivalent Karl Fischer coulometric titration. The processing window below is a production reference, not a substitute for lot-specific certificate data.

    ParameterUnitSetpointReference condition
    Drying temperature°C80–85Desiccant dryer, dew point ≤ -30 °C
    Drying timeh3–4Moisture target < 0.05 wt%
    Nozzle melt temperature°C220–250ISO 294 injection moulding practice
    Mould temperature°C40–70Gloss and dimensional control
    Screw back pressureMPa0.5–1.0Hydraulic or servo-electric injection unit
    Hold pressure% of peak60–80Cavity pressure transfer
    Screw L/D ratio—20:1–24:1Single-flighted general-purpose ABS screw
    Compression ratio—2.0:1–2.5:1Feed zone to metering zone

    In thin-wall automotive interior trim production, ABS 100 MPM is injected into centre console side panels, steering column upper and lower covers, knee bolster garnishes, and switch bezels using hydraulic or servo-electric machines with clamp force from 80 t to 300 t depending on projected area. Wall sections of 1.2 mm to 2.0 mm are filled at injection speeds of 30 mm/s to 80 mm/s. The material flow length-to-thickness ratio supports unfilled rib-to-wall ratios of 0.5:1 to 0.7:1, reducing sink marks opposite rib intersections. Mould temperature at 50 °C to 60 °C raises surface gloss to a 20° glossmeter reading of 80 GU to 90 GU when measured under ISO 2813. For interior parts, energy-absorbing geometry and rib design must comply with ECE R21 or FMVSS 201 depending on the vehicle market. Finished components are tested for dimensional stability after 24 h at 80 °C and 50% RH. Post-shrinkage should remain under 0.5% when measured according to ISO 294-4. Flame performance of the natural grade is typically rated HB under UL 94 at 1.5 mm. Interior vertical surfaces requiring higher flame performance may need flame-retardant masterbatches, but these reduce flow length and must be qualified on the production tool. Moulded-in colour stress whitening is evaluated by visual inspection after impact testing according to ISO 6603-2 using a 5 kg striker at 2 m/s.

    How Does Etch Uniformity Affect Decorative Chromium Plating on ABS 100 MPM?

    Decoratively plated ABS components such as automotive grille surrounds, door handles, and sanitary faucet trims require uniform micro-roughening of the butadiene phase before metallisation. Mouldings produced from ABS 100 MPM are etched in a chromium trioxide–sulphuric acid bath at 60 °C to 70 °C for 8 min to 12 min. The chromic acid concentration is maintained between 380 g/L and 420 g/L, and sulphuric acid between 180 g/L and 220 g/L. Over-etching produces a spongy surface with peel strength below 0.5 N/mm according to ASTM B533. Under-etching leaves hydrophobic domains that reject palladium-tin colloid. After etching, the parts pass through a stannous chloride/palladium chloride activation at 25 °C to 35 °C, followed by acceleration in dilute sulphuric or fluoroboric acid. Electroless nickel is deposited to 0.2 µm to 0.5 µm before electrolytic copper, semi-bright nickel, bright nickel, and microporous chromium. Moulded-in stress must be controlled before plating. Annealing at 70 °C for 2 h to 4 h may be used to relax orientation. Warpage after annealing should be measured according to ISO 17564. Plating adhesion must be tested after thermal cycling: 30 min at -40 °C and 30 min at 85 °C for 24 cycles, followed by cross-cut tape pull per ISO 2409. Published peel-strength data for this specific ABS 100 MPM grade in electroplating configurations is limited; adhesion validation therefore requires first-article approval using the final plating line and production etch rack density.

    When vacuum cleaner motor shrouds, food processor upper housings, and kettle body claddings are moulded, ABS 100 MPM must balance Vicat softening temperature and practical toughness at wall thicknesses from 2.0 mm to 2.8 mm. The Vicat softening temperature VST/B50 of this general-purpose ABS family is commonly specified under ISO 306 method B50 with a 50 N load and 50 °C/h heating rate. Converters should verify the lot certificate because VST/B50 values in the range 92 °C to 98 °C are typical for this unfilled grade family. Injection is performed with melt temperatures of 225 °C to 240 °C and mould temperatures of 40 °C to 50 °C to minimise jetting on tall vertical surfaces. Screw back pressure is kept at 0.5 MPa to 1.0 MPa. Hold pressure is set at 60% to 80% of peak injection pressure. Parts are degated using hot-tip or tunnel gates with gate diameter not less than 60% of wall thickness. Compliance for household appliances is assessed under IEC 60335-1 clause 30.2 for resistance to heat and fire. Unmodified ABS 100 MPM may require elevated flame-retardant performance for unattended appliances above 0.5 A connected load. Drop impact of assembled housings is conducted under IEC 60068-2-31. A production-scale failure mode seen with this material family is blush around hot runners when mould temperature exceeds 60 °C, which lowers gloss and creates colour mismatch in high-gloss top covers. Gate blush is controlled by increasing hot-tip temperature by 5 °C to 10 °C and reducing injection velocity during gate entry.

    When Office Automation Housings Require Creep Resistance and Low Warpage

    Office printer side frames, scanner bases, and document feeder trays are subjected to continuous static load from shaft bearings and paper stacks. ABS 100 MPM is used for these components when long-term deflection under load is controlled by rib geometry and unfilled flexural modulus. The flexural modulus of the grade is specified under ISO 178 at 23 °C with a test speed of 2 mm/min. Typical unfilled ABS values centre around 2000 MPa to 2400 MPa. Creep behaviour must be validated on the actual moulded part under 23 °C and 50% RH for 1000 h according to ISO 899-2. Using a static stress of 10 MPa, maximum strain is recorded and compared with design limits. Moulded-in stress is minimised by using melt temperatures of 235 °C to 245 °C and mould temperatures of 45 °C to 55 °C. Low warpage is obtained by moving from a single centre gate to a fan gate or sequential valve-gate system on larger parts with length-to-thickness ratios above 200:1. Flatness of a scanner platen support is inspected with a coordinate measuring machine after conditioning to ISO 291 atmosphere. Deviations of more than 0.4 mm over a 400 mm span typically require cooling fixture correction. Regulatory compliance for office equipment includes IEC 62368-1 for audio/video and information technology equipment. The unmodified grade is usually classified HB under UL 94. Internal live parts may require a minimum comparative tracking index determined by IEC 60112. For printers with fusers, local ambient temperature around the housing must remain below the heat deflection temperature under 1.8 MPa, commonly reported as HDT/A in the range of 85 °C to 95 °C per ISO 75-2.

    Consumer Power Strip and Electrical Enclosure Moulding

    For power strip shells, adapter housings, and consumer electrical boxes, dimensional accuracy and consistent wall thickness are required for snap-fit assembly of internal live parts. The melt volume-flow rate MVR of ABS 100 MPM is measured under ISO 1133-1:2022 at 220 °C with a 10 kg load. High-flow ABS grades in this product family typically sit above 15 cm³/10 min, which supports filling of 1.5 mm to 2.5 mm walls in multi-cavity tools. Injection pressure at transfer should avoid overpacking. Peak specific pressure is kept between 70 MPa and 100 MPa. The grade is dried to less than 0.05 wt% moisture before moulding. Electrical enclosure creepage and clearance are determined by IEC 60664-1, not by resin selection alone. Dimensional stability after moulding and after 24 h at 70 °C is measured. The comparative tracking index for unfilled ABS of this type is generally below 600 V under IEC 60112. This restricts direct use in high-creepage live parts. Flame classification is typically HB under UL 94 at 1.5 mm or 3.0 mm. For power strip enclosures requiring V-0 at 1.5 mm, a flame-retardant modification or product-specific approval is required. Mould release should not contain silicone because it can migrate to the surface and create adhesion failure if internal labels are applied. Line operators typically run mould temperatures at 45 °C to 55 °C to keep post-mould shrinkage between 0.4% and 0.7% along flow direction per ISO 294-4.

    SectorRequirementStandard / testCondition or limitation
    Automotive interior trimFlammability and impactUL 94, ISO 6603-2HB at 1.5 mm; striker 5 kg at 2 m/s
    Decorative electroplatingPeel strength and thermal cycle adhesionASTM B533, ISO 2409Thermal cycling between -40 °C and 85 °C
    Household appliancesHeat and fire resistanceIEC 60335-1 clause 30.2End-product evaluation; unmodified ABS may be limited
    Office automationCreep and flatnessISO 899-2, ISO 2911000 h at 10 MPa; flatness ≤ 0.4 mm/400 mm
    Electrical enclosuresTracking index and flame classIEC 60112, UL 94CTI below 600 V; V-0 requires modification
    Moulded dimensionsShrinkage verificationISO 294-4Shrinkage 0.4%–0.7% in flow direction

    Surface Replication and Impact Retention in Personal Care and Recreation Components

    Hair dryer housings, electric toothbrush handles, razor bodies, and rigid toy structures are converted from ABS 100 MPM because the grade reproduces textured cavity surfaces ranging from VDI 12 to VDI 27. Textures are replicated through high injection speed and melt temperature at 230 °C to 250 °C. Mould texturing is produced by chemical etching. Surface replication is measured by a stylus surface roughness tester using ISO 4287. Impact toughness in the moulded part is influenced by moisture content, injection rate, and stress concentration at snap features. Charpy notched impact strength of unfilled ABS is measured under ISO 179-1/1eA. Values for general-purpose grades are commonly reported between 10 kJ/m² and 20 kJ/m² at 23 °C. Sharp internal corners must have minimum radius 0.5 mm to 1.0 mm. Smaller radii reduce crack initiation resistance and lower practical toughness. Colourants used with this grade are generally supplied as ABS or SAN-based masterbatches at let-down ratios from 2% to 4%. PE-wax carriers should be avoided because they can create visible delamination on high-gloss surfaces. For personal care devices, surface contact compliance is evaluated under ISO 10993-5 for cytotoxicity only when the resin is part of a finished device that contacts skin. This grade is not routinely supplied with medical documentation. Parts are assembled using ultrasonic welding with amplitude of 20 µm to 40 µm and frequency of 20 kHz to 40 kHz. Weld joint design should maintain a shear interference of 0.2 mm to 0.4 mm. After ultrasonic welding, burst strength in a sealed housing is verified by internal air pressure at 0.2 bar to 0.5 bar with leak detection.

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    Certification & Compliance
    More Introduction

    Toray Industries ABS 100 MPM is an injection-molding grade within the Toyolac ABS resin family specifically formulated for decorative electroplating and high-appearance molded components. The grade combines a controlled butadiene rubber phase with melt-flow properties suitable for thin-wall injection molding. Incoming material is characterized according to ISO 1183-1 for density, ISO 1133-1:2022 for melt volume-flow rate at 220°C/10 kg, ISO 527-1/2 for tensile properties, ISO 178 for flexural modulus, ISO 179-1/1eA for notched Charpy impact, and ISO 75-1/2 for deflection temperature under load. Typical density is 1.04–1.06 g/cm³. Melt volume-flow rate is controlled within 18–24 cm³/10 min. Tensile yield stress is specified in the range 42–48 MPa, flexural modulus in the range 2.2–2.5 GPa, and notched Charpy impact at 23°C in the range 18–26 kJ/m². Mold shrinkage is typically 0.4–0.6% when measured according to ISO 294-4.

    PropertyTest methodTypical range
    DensityISO 1183-11.04–1.06 g/cm³
    Melt volume-flow rateISO 1133-1:2022, 220°C/10 kg18–24 cm³/10 min
    Tensile yield stressISO 527-242–48 MPa
    Flexural modulusISO 1782.2–2.5 GPa
    Notched Charpy impact, 23°CISO 179-1/1eA18–26 kJ/m²
    Deflection temperature under load, 1.80 MPaISO 75-284–88°C
    Mold shrinkageISO 294-40.4–0.6%

    In electroplating operations, ABS 100 MPM is selected over general-purpose ABS grades because its rubber-phase distribution promotes uniform chromic acid micro-etching and consistent adhesion of electroless and electrolytic metal deposits. Compared with a general-purpose Toyolac 100 grade, the 100 MPM variant exhibits a wider etching processing window and lower reject incidence for skip plating and micro-blisters after thermal cycling. Compared with high-impact Toyolac 700 grades, it trades some low-temperature impact for improved surface uniformity and reduced molded-in stress. ABS 100 MPM is not a PC/ABS alloy; it does not contain polycarbonate and therefore does not require the elevated melt temperatures or aggressive venting associated with PC/ABS molding.

    What Limits Plate Adhesion When ABS 100 MPM Is Etched in Mixed Chromic Acid?

    Adhesion on electroplated ABS depends on mechanical interlocking generated by selective oxidation of butadiene domains at the molded surface. A mixed chromic acid/sulfuric acid solution, typically containing 350–420 g/L CrO3 and 300–400 g/L H2SO4, is held at 60–70°C for 5–15 min. The etch removes surface butadiene particles and leaves microcavities. Subsequent palladium-tin activation followed by electroless nickel or electroless copper deposition fills these microcavities. If etch time exceeds the upper bound, excessive dissolution of the butadiene phase creates caverns that weaken the base layer and induce cohesive failure below the plate. If etch time falls below the lower bound, palladium uptake is insufficient and skip plating occurs at sharp geometries. Production experience in high-volume plating lines indicates that ABS 100 MPM tolerates etch interruptions without plate peel when parts are molded with low residual stress at a mold wall temperature of 50–80°C. Adhesion is quantified by peel testing in accordance with ASTM B533; decorative plating lines frequently specify a minimum peel strength of 0.8 N/mm, although published adhesion values for this specific configuration are limited and must be verified on the actual part geometry.

    Pre-drying is mandatory above ambient relative humidity. ABS 100 MPM absorbs sufficient moisture to produce splay and hydrolysis-related surface defects if processed without desiccant drying. In production-scale molding cells, a desiccant-bed dryer with a dew point of −40°C or lower and an air flow of 0.05 m/s per kg/h is recommended. The granulate is dried at 80°C for 3–4 h, reducing moisture to below 0.05% by weight. Lower-temperature drying at 70°C for 6 h is acceptable for small hoppers. Shot-to-shot moisture variation above 0.08% produces visible gas splay on flat plaque surfaces and increases the incidence of post-etch microvoids. The melt temperature should be controlled between 230°C and 250°C at the nozzle. Barrel zones from feed to nozzle are typically set at 200–220°C, 210–230°C, 220–240°C, and 230–250°C. The mold wall temperature is held between 50°C and 80°C. Residence time at melt temperature should not exceed 5 min. Longer residence degrades the polybutadiene phase, causing yellowing and lowering the etch ratio.

    When ABS 100 MPM Replaces General-Purpose ABS in High-Volume Electroplating Cells

    Converting an existing molding cell from a general-purpose Toyolac 100 grade to ABS 100 MPM requires adjustment of the injection speed profile rather than a simple material substitution. Because plating-grade ABS retains a slightly higher low-temperature viscosity to control frozen-layer orientation, injection speeds above 150 mm/s are often necessary for thin-wall sections below 2.0 mm to prevent flow hesitation at the end of fill. In a 350 t hydraulic clamp press with a 40 mm general-purpose screw and a check-ring non-return valve, the fill time for a 1.5 mm thick automotive wheel cover is typically held between 0.8 s and 1.5 s. Hold pressure is set to 60–80 MPa specific to the screw, with hold time of 4–8 s. Insufficient hold pressure produces sink marks that remain visible after electroplating. Excessive hold pressure creates high packing stress near the gate; after chromic acid etching, the gate area exhibits local blistering and peel loss when tested per ASTM B533. Plating rejects also correlate with moisture variation, cold slugs, and wear on the check ring. A worn check ring with more than 0.05 mm clearance allows uncontrolled shot-size variation and intermittent short shots in multi-cavity tools.

    Field data from production-scale injection molding indicate that the gate location is a primary defect driver in electroplated ABS. Gate-induced molecular orientation produces locally high residual stress that accelerates chromic acid attack and causes microcracking after electrolytic chromium deposition. Moveable split molds with side gates or tab gates are preferred over direct pin gates for flat decorative panels. When ribs or bosses are required, their wall thickness should not exceed 50% of the adjacent nominal wall to limit shrinkage differential. Ejector pin marks should be kept outside visible metalized surfaces because plating magnifies surface irregularities. In multi-cavity tools, cavity-to-cavity fill imbalance above 5% by weight produces different pack histories and inconsistent etch response across a single plating rack.

    Chemical Pre-Plate Etch and Electroless Metallization Sequence

    Prior to electroplating, molded substrates are typically degreased, pre-etched, etched, neutralized, catalyzed with palladium-tin colloid, accelerated, and then metallized in an electroless nickel or electroless copper bath. ABS 100 MPM must remain dimensionally stable during this sequence. The heat deflection temperature under a load of 1.80 MPa is specified around 84–88°C per ISO 75-2; however, electroplating line temperatures remain below 70°C so that molded-in stress relaxation does not distort part geometry. Printed part tolerances should account for a mold shrinkage of 0.4–0.6%. For parts plated on one side only, differential stress between the metal layer and the ABS substrate can induce warpage after chromium deposition. This is managed by balancing ejector pin marks, gate placement, and plating bath rack contact pressure.

    After electroless metallization, electrolytic copper, nickel, and chromium layers are applied in accordance with decorative electroplating practices described in ASTM B604. Thermal cycling of finished components is commonly conducted according to ASTM B553 to detect latent adhesion defects. Reject parts generally fail through blister formation at the nickel-chromium interface or through cohesive failure in the ABS surface layer. In such failures, the root cause is often excessive molded-in stress rather than inadequate resin etching. ABS 100 MPM is therefore evaluated not only by melt-flow and mechanical data but also by etch ratio, plate coverage, and part-level thermal-cycle performance. Published data for this specific configuration is limited for some plating line chemistries; adhesion performance must be validated on the intended tool geometry and rack density.

    Comparison parameterABS 100 MPMGeneral-purpose Toyolac 100High-impact Toyolac 700
    Primary processing roleElectroplating substrateGeneral injection moldingImpact-modified molding
    Melt volume-flow rate18–24 cm³/10 minHigher flow; exact value grade-specificLower flow; exact value grade-specific
    Notched Charpy impact at 23°C18–26 kJ/m²Medium impactHigher impact
    Etch uniformityControlled rubber distributionLess controlled; skip plating more commonRubber agglomeration may increase etch variability
    Melt temperature window230–250°CSimilarSimilar to slightly higher
    Dimensional stability in plating lineConsistent with ISO 75-2 HDT 84–88°CComparableComparable; verify part geometry

    ABS 100 MPM is not formulated for solvent bonding or structural adhesive joining where surface etching is absent. It should not be processed with amine-based mold-release additives because those additives migrate to the surface and interfere with palladium-tin activation. Regrind use is possible at levels up to 20% when the regrind is dry, free of dust, and derived from unfilled ABS 100 MPM. Higher regrind fractions increase the variability of the surface butadiene distribution and reduce plating adhesion consistency. When regrind is introduced, the melt volume-flow rate and moisture content should be checked against the same ISO 1133-1:2022 and ISO 15512 methods used for virgin material. Parts molded from wet regrind exhibit splay and localized skip plating that are not resolved by longer etch time. The operational boundary is therefore set by moisture content below 0.05%, melt residence time below 5 min, mold wall temperature of 50–80°C, and etch time within the validated process window for the specific plating line.

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