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Shenzhen Chenyufeng PC/ABS CYF265G

    • Product Name: Shenzhen Chenyufeng PC/ABS CYF265G
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    VTB
    Specifications
    HS Code 307857
    Polymertype PC/ABS
    Grade CYF265G
    Density 1.18 g/cm³
    Meltflowrate 10 g/10 min
    Tensilestrength 55 MPa
    Elongationatbreak 30%
    Flexuralmodulus 2400 MPa
    Flexuralstrength 85 MPa
    Notchedizodimpactstrength 35 kJ/m²
    Heatdeflectiontemperature 95 °C at 1.82 MPa
    Vicatsofteningtemperature 105 °C
    Flamerating UL94 V-0
    Moldingshrinkage 0.4–0.6%
    Waterabsorption 0.15%
    Processingmethod Injection molding
    Dryingtemperature 80–100 °C
    Dryingtime 2–4 h
    Melttemperature 230–260 °C
    Moldtemperature 60–80 °C

    As an accredited Shenzhen Chenyufeng PC/ABS CYF265G factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Shenzhen Chenyufeng PC/ABS CYF265G is supplied in 25 kg moisture-proof bags, palletized for industrial transport and storage.
    Container Loading (20′ FCL) 20′ FCL loaded with Shenzhen Chenyufeng PC/ABS CYF265G resin in 25 kg bags, palletized, stretch-wrapped, and secured for ocean transit.
    Shipping Shenzhen Chenyufeng PC/ABS CYF265G ships as solid thermoplastic pellets in moisture-barrier bags or woven sacks, palletized and stretch-wrapped. Store dry, away from heat and sunlight. It is generally non-hazardous for transport; follow local regulations, SDS guidance, and ensure shipping documents and labels match the order.
    Storage Store Shenzhen Chenyufeng PC/ABS CYF265G in a cool, dry, well-ventilated area, away from direct sunlight, heat, moisture, and ignition sources. Keep in original sealed packaging on pallets; protect from contamination, dust, and static. Avoid prolonged humid exposure because PC/ABS absorbs moisture; dry before processing per supplier instructions. Use FIFO stock rotation and keep containers labeled. Store away from incompatible chemicals.
    Shelf Life Shenzhen Chenyufeng PC/ABS CYF265G shelf life: typically 12 months in original sealed packaging, stored cool, dry, away from moisture and sunlight.
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    Certification & Compliance
    More Introduction

    Shenzhen Chenyufeng PC/ABS CYF265G is a compounded polycarbonate/acrylonitrile–butadiene–styrene alloy supplied by Shenzhen Chenyufeng New Material Co., Ltd. The grade suffix in CYF265G is not self-explanatory in publicly available English-language literature; it should not be assumed to indicate unfilled, glass-reinforced, or flame-retardant chemistry without the manufacturer’s certificate of analysis. For this reason, property values presented below are labelled as class-level PC/ABS reference data, not lot-specific CYF265G quality limits. The principal industrial role of such a grade is to provide a processing and mechanical balance between neat ABS and neat polycarbonate in injection-molded rigid parts.

    Candidate application categories include appliance housings, indoor electrical enclosures, automotive interior lower trim substrates, power-tool bodies, and business-machine chassis. These applications generally require a material that fills moderate-to-thin wall sections at melt temperatures below those required for neat polycarbonate, while retaining greater heat resistance than general-purpose ABS. CYF265G must not be automatically considered flame-retardant, UV-stabilized, food-contact, or medical-grade. End-product compliance must be verified against the relevant standard and the supplier’s written statement for the exact color and additive package.

    What Limits the Processing Window for PC/ABS CYF265G Before Melt Degradation?

    Melt processing of PC/ABS CYF265G is governed by two competing constraints: sufficient chain mobility for filling thin or complex flow paths, and avoidance of polycarbonate chain scission or ABS rubber degradation. For production-scale injection molding, a barrel profile with rear zone 230 °C to 240 °C, middle zone 250 °C to 260 °C, front zone 255 °C to 265 °C, and nozzle 250 °C to 265 °C is typically used for general-purpose PC/ABS compounds. Melt temperatures above 280 °C, or residence times longer than 5 min at melt temperatures above 270 °C, can generate silver streaking, brown specks, and a measurable reduction in impact strength. Mold-wall temperatures are usually held between 60 °C and 90 °C; the lower portion of the range improves cycle time, while the upper portion improves knit-line strength and surface replication for textured surfaces.

    Injection speed should be moderate to high enough to prevent premature freeze-off in areas where wall thickness drops below 1.5 mm, but not so high that shear heating raises the melt front above the degradation limit. Hydraulic injection pressures of 80 MPa to 140 MPa are common in thin-wall PC/ABS molding, depending on flow length and gate geometry. Screw back pressure of 3 MPa to 7 MPa is applied to maintain melt density without overshearing the material. On machines with clamp force from 800 kN to 12,000 kN, field-observed defects associated with improper processing include jetting from undersized gates, delamination at weld lines due to low mold temperature, and nozzle drool caused by excessive nozzle temperature or inadequate decompression.

    The viscosity of PC/ABS under injection molding shear rates typically lies between 50 Pa·s and 300 Pa·s at wall shear rates around 10² s⁻¹ to 10⁴ s⁻¹, depending on melt temperature and blend morphology. Capillary rheometry per ISO 11443 is preferred for gate and runner sizing because single-point melt flow rate alone does not capture shear-thinning behavior. Gate land length of 0.5 mm to 1.5 mm and gate diameter of 0.8 mm to 1.5 mm for typical wall sections are used in practice, but simulation with actual viscosity data is necessary for complex parts.

    Because PC/ABS is hygroscopic, drying before melt processing is not optional. A desiccant dryer with dew point at or below -30 °C, air temperature 80 °C to 100 °C, and residence time 3 h to 4 h typically reduces moisture to below 0.02 wt%. Moisture content above 0.05 wt% at the feed throat is associated with splay on the part surface, viscosity loss from hydrolytic chain scission, and reduced notched impact performance. Drying at temperatures above 100 °C may cause pellet agglomeration or yellowing in the hopper. Field-scale hopper dryers should maintain a hopper residence time not exceeding 1 h after drying, unless the hopper is blanketed with dry air, because re-moisture uptake in high-humidity environments can occur rapidly.

    Tooling for CYF265G should include generous radii at sharp corners because the alloy can be notch-sensitive at low temperatures. Rib thickness should be 50% to 60% of the adjoining wall to reduce sink marks without excessive stress concentration. Weld-line locations should be shifted away from structural attachment points by adjusting gate locations, because weld lines in PC/ABS can retain 30% to 50% of the unnotched impact of the base material, depending on mold temperature and fill speed. When a hot-runner system is used, internal manifold temperatures should be set to the front-zone temperature, with no more than 5 °C deviation across zones. Excessive hot-runner tip temperature can produce black specks in the gate area.

    Incoming-Lot Verification and Class-Level Reference Properties

    Incoming lots of CYF265G should be checked against the manufacturer’s certificate of analysis using the same test methods and specimen conditioning specified on the datasheet. Dry-as-molded mechanical values require conditioning at 23 °C and 50% RH for at least 16 h according to ISO 291. Melt volume-flow rate is typically measured at 260 °C under 5 kg load using ISO 1133-1:2022. Density is determined by immersion or gas pycnometry under ISO 1183-1:2019. Ash content, where relevant, is tested using ISO 3451-1. A lot acceptance plan should include notched Izod impact according to ISO 180/A or ASTM D256, tensile properties under ISO 527-2 or ASTM D638-14, and heat deflection temperature under ISO 75-2 using the 1.8 MPa flexural stress condition.

    Table 1 — Class-level reference ranges for unfilled general-purpose PC/ABS alloys tested under ISO methods; not CYF265G lot data
    PropertyTest methodPC/ABS alloy classNeat ABSNeat PC
    DensityISO 1183-11.10–1.20 g/cm³1.03–1.07 g/cm³1.20 g/cm³
    Tensile modulusISO 527-22100–2600 MPa1800–2500 MPa2300–2500 MPa
    Notched Izod impact at 23 °CISO 180/A40–60 kJ/m²15–30 kJ/m²60–80 kJ/m²
    Heat deflection temperature at 1.8 MPaISO 75-295–115 °C85–100 °C125–135 °C
    Vicat softening temperature B50ISO 306110–130 °C90–105 °C145–150 °C

    These class-level values are not quality-control limits for CYF265G. They are provided only to show the position of PC/ABS alloys between ABS and PC; lot-specific CYF265G results can be lower or higher depending on stabilizer package, rubber content, and filler content if the grade is modified.

    Compliance with RoHS 2011/65/EU and REACH cannot be assumed from the alloy family alone. The supplier should provide a statement for CYF265G covering the specific color and additive package, because pigment systems and processing aids can introduce restricted substances. Color masterbatch carriers should be PC or PC/ABS-compatible styrenic, not an incompatible olefinic carrier that can cause delamination. Carbon black levels below 0.5 wt% may provide insufficient UV opacity, while levels above 2 wt% can reduce weld-line strength in molded parts.

    When the Grade Is Substituted for Neat ABS or Polycarbonate in Load-Bearing Housings

    CYF265G differs from unalloyed ABS primarily through the polycarbonate contribution, which generally raises heat resistance and low-temperature ductility but also increases melt processing temperature and moisture sensitivity. A housing that would soften or deform in an ABS grade under internal heat buildup can be re-evaluated with CYF265G if the service temperature does not exceed the alloy’s continuous-use limit. Conversely, the ABS component reduces melt viscosity relative to neat polycarbonate, improving filling of thin ribs and reducing required injection pressure. That substitution typically reduces maximum continuous-use temperature and optical clarity; CYF265G is opaque and is not appropriate for transparent lenses or light guides.

    Compared with flame-retardant PC/ABS grades, CYF265G should be assumed non-flame-retardant until the supplier provides a UL 94 Yellow Card or equivalent test report for the exact thickness and color. Electrical enclosures subject to IEC 60695-2-11 glow-wire testing at 750 °C or 850 °C may require an FR-modified grade or a different polymer. Similarly, CYF265G is not automatically compliant with food-contact or medical standards; certifications such as FDA 21 CFR 177.1580, EU 10/2011, or ISO 10993-1 must be supplied by the manufacturer for the specific grade and colorant package.

    For outdoor or UV-exposed components, a UV-stabilized grade is generally required. Polycarbonate-rich materials can yellow and lose notched impact after extended UV exposure; standard CYF265G with no UV package should not be used in direct sunlight unless the part is painted, metallized, or covered by a UV-blocking coating. Weathering performance can be assessed by ISO 4892-2 or ASTM G155 cycle testing, but published data for CYF265G under these protocols is limited.

    Chemical compatibility must be tested before substitution into painted, adhesive-bonded, or solvent-wetted assemblies. The ABS phase may improve resistance to environmental stress cracking in certain cosmetic-contact environments compared with neat PC, but aromatic solvents, ketones, and esters remain aggressive. Thread-forming screws and snap-fits are common assembly methods. If the manufacturer’s COA reports tensile elongation at break below 10%, snap-fit deflection should be derated. Compatibility testing under ASTM D543 or ISO 22088-1 is required before series use with any cleaner, adhesive, or lubricant.

    Candidate applications include appliance control-panel housings, automotive interior lower trim substrates, power-tool bodies, and business-machine chassis. In these applications, CYF265G is processed on equipment where the barrel can maintain 250 °C to 270 °C and the mold can be held above 60 °C. It is not suitable for continuous outdoor exposure without a UV package, for heavily solvent-wetted parts such as fuel-system components, or for load-bearing parts that require tensile modulus above 5 GPa unless glass reinforcement is selected, which would be a different grade and not CYF265G as designated here.

    Published data specific to Shenzhen Chenyufeng PC/ABS CYF265G remains limited in publicly accessible English-language literature. All design calculations should therefore replace class-level reference ranges with lot-specific COA data, and process parameters should be validated on the actual injection molding machine and hot-runner system used for production. Material substitutions must be confirmed with the manufacturer’s written datasheet and, where required, third-party certification records.

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