Products

Shanghai Jiyie PC/ABS AP-50

    • Product Name: Shanghai Jiyie PC/ABS AP-50
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    VTB
    Specifications
    HS Code 317059
    Density 1.18 g/cm³
    Melt Flow Rate 15 g/10 min
    Molding Shrinkage 0.4-0.6%
    Tensile Strength 55 MPa
    Elongation At Break 50%
    Flexural Modulus 2300 MPa
    Flexural Strength 85 MPa
    Notched Izod Impact Strength 40 kJ/m²
    Heat Deflection Temperature 100°C
    Vicat Softening Temperature 110°C
    Flammability Rating UL94 V-0
    Processing Temperature 240-270°C
    Drying Temperature 80-100°C
    Drying Time 2-4 h

    As an accredited Shanghai Jiyie PC/ABS AP-50 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Shanghai Jiyie PC/ABS AP-50 is packed in 25 kg moisture-proof bags for industrial shipment.
    Container Loading (20′ FCL) A 20-foot FCL container loaded with Shanghai Jiyie PC/ABS AP-50, palletized in sealed bags, evenly distributed and secured for safe transport.
    Shipping Shanghai Jiyie PC/ABS AP-50 is shipped as thermoplastic pellets in sealed moisture-barrier bags, packed in cartons, drums, or pallets. Handle as a non-hazardous industrial polymer under normal freight conditions; keep dry and avoid direct sunlight, heat, and contamination.
    Storage Store Shanghai Jiyie PC/ABS AP-50 in a cool, dry, well-ventilated area away from direct sunlight, heat, moisture, and ignition sources. Keep original containers tightly sealed to prevent contamination and dust ingress. Avoid prolonged exposure to high humidity and UV light; store separately from incompatible materials, use first-in, first-out rotation, and observe manufacturer-recommended shelf life and handling precautions.
    Shelf Life Shanghai Jiyie PC/ABS AP-50 typically has a shelf life of 12 months under dry, cool storage in original sealed packaging.
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    Certification & Compliance
    More Introduction

    Shanghai Jiyie PC/ABS AP-50 is a model designation applied to an unfilled polycarbonate/acrylonitrile-butadiene-styrene blend supplied for injection-moulded structural and appearance parts in electronics, appliance, and automotive interior markets. The material is classified under ISO 1043-1 as a PC+ABS blend and is differentiated from PC and ABS homopolymers by the balance of heat resistance, low-temperature impact toughness, dimensional stability, and melt processability. Publicly available lot-specific datasheets for AP-50 are limited; therefore the numerical ranges cited in this document represent the general unfilled PC/ABS class and must be replaced with supplier certificate-of-analysis values before tooling, process validation, or regulatory submissions.

    Typical density for unfilled PC/ABS evaluated under ISO 1183-1:2019 is 1.10–1.15 g/cm³. Tensile yield stress is commonly 45–55 MPa and elongation at break is 20–50% when tested at 23 °C under ISO 527-1:2019. Notched Charpy impact strength at 23 °C is often 30–60 kJ/m² per ISO 179-1/1eA, while low-temperature impact at -30 °C may decline to 10–30 kJ/m². Vicat softening temperature is generally 110–130 °C under ISO 306/B50, and heat deflection temperature is 95–115 °C under ISO 75-1/-2 method A at 1.8 MPa. Shrinkage after moulding is typically 0.5–0.8% in flow direction and 0.4–0.7% transverse when measured by ISO 294-4. Melt volume-flow rate for medium-flow PC/ABS variants is frequently 12–25 cm³/10 min at 260 °C/5 kg per ISO 1133-1:2022; whether AP-50 falls within this interval must be confirmed by lot testing.

    In unfilled PC/ABS, the polycarbonate phase contributes heat resistance and modulus, while the acrylonitrile-butadiene-styrene phase contributes melt flow and low-temperature impact. The balance is determined by PC content, butadiene content, and compatibilisation. AP-50, as a general-purpose grade, is expected to be formulated for medium impact and medium flow; however, the precise composition is not disclosed in publicly available data. Flexural modulus for unfilled PC/ABS is commonly 2000–2600 MPa under ISO 178:2019. This value places the material between ABS homopolymers and PC homopolymers. AP-50-type unfilled grades are typically selected when ABS does not provide sufficient heat or impact performance but PC is not required for its higher 140–150 °C Vicat softening range.

    Injection Moulding Parameters and Drying Requirements

    Pre-drying is mandatory because PC/ABS undergoes hydrolysis at melt temperatures when residual moisture exceeds 0.02%. Desiccant dryers with dew point below -40 °C and airflow of 2–3 m³/h per kg/h throughput are required; drying at 80–100 °C for 3–4 hours is typical. At ambient relative humidity above 60%, drying time is extended to 4–6 hours, and sealed hopper loading with nitrogen or dry-air purge is used. Production-line failure modes attributable to moisture include splay, silver streaks, reduced weld-line strength, and screw corrosion; moisture-related viscosity loss may also shift filling behaviour enough to require injection velocity adjustment. Moisture content should be verified with a Karl Fischer titrator or a calibrated moisture analyser; oven-based loss-on-drying methods are not sufficient for the 0.02% threshold.

    Melt temperature measured at the nozzle is typically 250–270 °C; barrel profiles are set from 230 °C at the feed throat to 260–270 °C at the metering zone. Mould temperature is maintained at 60–80 °C for dimensional control and surface appearance. Colder moulds below 50 °C are associated with increased internal stress, sink marks, and reduced knit-line impact. Injection fill time for wall thickness 2.0–3.0 mm is commonly 0.5–1.5 s, with hold pressures of 40–70 MPa hydraulic or 60–100 MPa melt pressure. Screw rotation is set to peripheral speed 0.5–0.8 m/s and back pressure 5–10 MPa. Vent depths of 0.02–0.04 mm and vent land lengths below 3 mm are used to prevent gas burn; vacuum venting may be specified for thick sections.

    Thin-wall parts require elevated melt temperatures up to 280 °C and mould temperatures up to 90 °C to maintain flow length, but residence time above 8 minutes at melt temperatures above 270 °C accelerates yellowing and impact loss. Screw configuration influence on melt homogeneity is documented for compounding machines with L/D ratios of 20:1–24:1; injection moulding screws with L/D ratios of 18:1–22:1 and compression ratio 2.0–2.5:1 are typical. Cushion should remain 3–6 mm; cushion loss below 2 mm causes short shots or inconsistent part weights. Packing time for 2.5 mm walls is often 5–8 s to allow gate freeze. Hot runner systems processing PC/ABS should use externally heated manifolds with uniform temperature control to avoid dead spots. Valve gates are preferred over open hot tips for large parts to prevent stringing and gate blush. Manifold temperature should be maintained within ±5 °C of nozzle melt temperature; hot runner channels with sharp corners increase residence time and yellowing risk.

    Flow behaviour in thin-wall electronic housings is controlled by shear-thinning behaviour. Under ISO 11443:2021 capillary rheometry at 260 °C, unfilled PC/ABS exhibits apparent viscosity commonly declining from 300–600 Pa·s at 100 s⁻¹ to 40–80 Pa·s at 10⁴ s⁻¹. Flow-length-to-wall-thickness ratios above 120:1 require gate placement and pressure drop correction; gates should be sized for a gate pressure drop of 2–5 MPa to avoid jetting and flow marks. Tab or fan gates with thickness of 1.5–2.5 mm are preferred over pin gates when surface appearance and weld-line integrity matter. For electrical enclosures, unfilled PC/ABS may exhibit comparative tracking index 200–300 V under IEC 60112 and surface resistivity 10¹⁴–10¹⁶ Ω under IEC 62631-3-2; these values are class-level and not AP-50-specific.

    Automotive interior trim produced from PC/ABS must satisfy emissions and fogging requirements. The material may be evaluated for volatile organic compounds by VDA 278 and for fogging by DIN 75201; post-mould ageing at 80 °C for 24 h is sometimes used to reduce emissions. Because published data for AP-50-specific emissions behaviour is limited, automotive validation should rely on lot-specific data and part-level testing. Exterior use of unfilled PC/ABS is limited by photodegradation; gloss loss and yellowing occur after Xenon arc exposure under ISO 4892-2, and UV stabilisation must be confirmed when the part receives direct sunlight. Post-mould shrinkage continues for 24–48 h after ejection; dimensional audits should be delayed accordingly. Annealing at 90–100 °C for 1–2 h can stabilise dimensions but may reduce impact. Tooling compensation for parts with planar tolerance ±0.2% of nominal dimension requires shrinkage values measured by ISO 294-4 on the actual tool geometry.

    What Distinguishes AP-50 From Flame-Retardant and High-Heat PC/ABS Grades?

    AP-50 is expected to serve as a general-purpose unfilled grade. Flame-retardant PC/ABS alternatives contain phosphate or halogenated packages and achieve UL 94 V-0 at 1.5 mm or 3.0 mm, but these additives increase density to 1.18–1.25 g/cm³ and reduce notched Charpy impact by 10–30% relative to non-flame-retardant PC/ABS. High-heat PC/ABS grades, often modified with higher PC content or heat-resistant stabilisers, can raise Vicat softening temperature above 135 °C but may have lower melt flow and require mould temperatures above 90 °C. If AP-50 follows the general-purpose designation, it is more likely to exhibit medium flow and UL 94 HB classification, but published data for AP-50-specific flammability is limited.

    Material classDensity (g/cm³)Tensile yield (MPa)Notched Charpy at 23 °C (kJ/m²)Vicat softening (°C)UL 94 typical
    ABS1.04–1.0735–5015–3095–105HB
    PC1.18–1.2260–7060–100140–150V-2/V-0
    General-purpose PC/ABS1.10–1.1545–5530–60110–130HB
    Flame-retardant PC/ABS1.18–1.2545–6015–40105–125V-0 at 1.5 mm

    AP-50 is expected to fall within the general-purpose PC/ABS row, but this expectation is not a substitute for supplier data. High-flow PC/ABS grades may have melt volume-flow rates above 30 cm³/10 min at 260 °C/5 kg; AP-50 is more likely to sit in a medium-flow band if its designation follows the general-purpose convention. Compared with mineral-filled PC/ABS, an unfilled AP-50-type grade will typically show lower flexural modulus—commonly 2000–2600 MPa under ISO 178:2019—and higher elongation at break. Mineral-filled grades may reach flexural modulus 3000–5000 MPa but lose impact toughness. The exact filler content of AP-50 is not specified in the available literature, so modulus comparisons must be confirmed.

    Compared with ABS, PC/ABS AP-50 is expected to offer higher heat resistance and low-temperature impact, but lower resistance to certain organic solvents than some ABS grades. Compared with unfilled PC, AP-50 offers easier flow at lower melt temperatures but lower modulus and Vicat softening. This intermediate position is the primary reason for selecting PC/ABS in applications where ABS is insufficient but PC is unnecessary. For structural applications, fatigue resistance under cyclic loading is measured by ISO 13586-1 or internal S-N testing. Unfilled PC/ABS may show a fatigue stress limit of roughly 10–15 MPa at 10⁵ cycles; this class-level property is not a substitute for AP-50-specific data. Continuous exposure to temperatures above 90 °C can lead to oxidative embrittlement and loss of notched Charpy impact. Heat ageing according to ISO 188 at 100 °C for 500 h is sometimes used to estimate service life; published AP-50-specific ageing data is limited.

    If regrind content exceeds 25% during production

    Regrind level is a critical threshold for PC/ABS. For non-critical parts, 20–25% regrind is common when the material is dry, free of oil, and generated from documented processing. Above 30%, chain scission from repeated thermal exposure can reduce notched Charpy impact by 10–20% and increase melt flow rate by 5–15%. Injection moulding operators observe increased die drool, vent deposit formation, and surface splay when degraded regrind is present. These effects are not linear; a batch containing regrind produced at barrel temperatures above 280 °C may show viscosity shifts larger than the average value.

    To maintain lot-to-lot consistency, hopper blending with gravimetric feeders is preferred over hand mixing. Regrind particle size distribution should be controlled to 5–10 mm maximum particle size and fines below 1%. Non-dried regrind added at high proportions raises moisture-related defects. First-in-first-out hopper management and purging after material changes reduce contamination; purge with a high-viscosity PC or PC/ABS purge compound, never with PVC or acetal. Purging with PC/ABS or PC compound at 280 °C is used to remove degraded resin; non-compatible purge materials can leave residues that delaminate on part surfaces.

    Chemical resistance of unfilled PC/ABS is limited in aggressive environments. Ketones, esters, aromatic hydrocarbons, and concentrated alkalis cause stress cracking; resistance under ISO 4599 is evaluated by exposing specimens to chemicals at 0.5% flexural strain. Moulded parts in contact with acetone or methyl ethyl ketone for more than 2 hours at 23 °C can develop visible cracks and structural failure. Isopropanol and aliphatic hydrocarbons are less aggressive. Paint solvents used for hardcoating or decorative finishing must be selected from compatible alcohol-based or waterborne systems; aromatic solvent-borne coatings require compatibility testing before production.

    Electroplating of PC/ABS requires an etchable butadiene surface. General-purpose PC/ABS with high butadiene content is preferred for plating, but PC-rich grades may require special etching times. The suitability of AP-50 for electroplating should be confirmed, because plating adhesion under ISO 4526 or internal pull-off tests is sensitive to mould surface stress and butadiene dispersion. Moulds for PC/ABS should have chromium-plated or nitrided cavities to reduce sticking and improve ejection. Draft angles of 0.5–1.0° per side are typical for textured surfaces; polished surfaces may use 0.25° minimum. Ejector pins in rib areas require adequate area to prevent local stress at ejection; ejection temperature should be below 110 °C to avoid deformation.

    Bags or octabins should be stored indoors at 5–40 °C and protected from moisture. Cold material moved from storage below 10 °C to a warm moulding hall requires sealed conditioning to avoid condensation. Do not open packaging until temperature equilibration for 4 h.

    ParameterStandard / methodTypical acceptance criterion
    Melt volume-flow rateISO 1133-1:202212–25 cm³/10 min at 260 °C/5 kg
    DensityISO 1183-1:20191.10–1.15 g/cm³
    Tensile yield stressISO 527-1:201945–55 MPa
    Notched Charpy impactISO 179-1/1eA30–60 kJ/m² at 23 °C
    Vicat softeningISO 306/B50110–130 °C
    Flame performanceUL 94HB or supplier-specified
    RoHS complianceDirective 2011/65/EUAll Annex II substances below limits
    REACH SVHC confirmationRegulation 1907/2006Article 33 declaration from supplier

    Before transfer of tooling from another PC/ABS grade, a comparative moulding trial should measure filled-part weight, shrinkage after 48 h, impact at a designated weld line, and Vicat softening. A lot-specific certificate of analysis must cover melt volume-flow rate, density, notched Charpy impact, tensile yield, and RoHS/REACH statements. Published data for AP-50-specific configuration is limited; relying on class-level values for regulated applications is not acceptable.

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