| HS Code | 177300 |
| Product Name | Saint-Gobain CHR SGC6-04(R) CHEMLAM Copper Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape |
| Manufacturer | Saint-Gobain |
| Brand | CHR |
| Series | CHEMLAM |
| Model Number | SGC6-04(R) |
| Tape Type | Pressure Sensitive Tape |
| Backing Material | Copper Glass-PTFE |
| Adhesive Type | Silicone |
| Color | Copper |
| Total Thickness | 0.004 in (0.102 mm) |
| Operating Temperature Range | -100°F to 500°F (-73°C to 260°C) |
| Electrical Conductivity | Conductive |
| Tensile Strength | 50 lb/in |
| Elongation | 5% |
| Peel Adhesion | 25 oz/in |
| Chemical Resistance | Excellent |
| Flame Resistance | Self-extinguishing |
| Liner Type | Silicone release paper |
| Standard Width | 1 in |
| Standard Length | 36 yd |
| Ul Rating | UL 510 |
| Rohs Compliance | Yes |
As an accredited Saint-Gobain CHR SGC6-04(R) CHEMLAM Copper Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Saint-Gobain CHR SGC6-04(R) CHEMLAM tape: one roll per package, sealed in protective wrap, clearly labeled. Quantity: 1 roll. |
| Container Loading (20′ FCL) | Saint-Gobain CHR SGC6-04(R) CHEMLAM tape rolls, palletized and shrink-wrapped, loaded into a dry 20′ FCL container, secured for safe transport. |
| Shipping | Shipped in original rolls/cartons as a non-hazardous article. Protect from crushing, moisture, heat, and contamination; store at ambient temperature. Use clean gloves and avoid punctures, creases, or direct sunlight. Not generally regulated under DOT/IATA/IMDG; verify SDS and local rules. Maintain lot traceability. Ensure packaging remains sealed in transit. |
| Storage | Store in a cool, dry, well-ventilated area away from direct sunlight, heat, moisture, and incompatible chemicals. Keep in original sealed packaging, laid flat, clean, and dust-free. Maintain moderate room temperature; avoid freezing or excessive heat. Protect from oils, solvents, and sharp objects. Rotate stock, follow FIFO, and use within the manufacturer’s recommended shelf life. Inspect rolls for damage before use. |
| Shelf Life | Shelf life is 12 months from date of manufacture when stored unopened in original packaging at 70°F (21°C) and 50% relative humidity. |
Component overhaul in turbine MRO facilities applies a copper glass-PTFE pressure-sensitive tape to polished bearing journals, bolt flanges, and labyrinth seal lands before surface preparation. The tape is positioned so the PTFE-coated glass cloth face receives impingement from 60-mesh or 80-mesh aluminum oxide grit propelled at 0.34–0.45 MPa. This backing layer dissipates particle energy, while the silicone adhesive maintains anchorage on degreased nickel superalloy substrates. Removal after HVOF or plasma spray deposition of WC-CoCr or NiCrAlY coatings must not leave adhesive residue that could alter the 0.02 mm radial clearance of a seal land. Peel adhesion to AISI 4130 steel per ASTM D3330/D3330 is used as incoming lot control, but high-angle particle impact resistance is not directly predicted by 180° peel testing. The adhesive side typically withstands short thermal excursions of 260°C; the exact thermal limit for this lot configuration must be verified against the certificate of conformance. Operators commonly preheat components to 90–120°C before spraying, which increases adhesive wet-out but also lowers shear resistance at the tape edge. Published data for this specific configuration under HVOF particle flux is limited, and line qualification with a sacrificial test coupon is required before production masking.
In an unlabeled thermal spray bench setup, the tape is applied to a 17-4PH stainless steel landing gear slide after solvent degreasing with acetone and a lint-free wipe. The tape edges are burnished with a phenolic roller to prevent grit ingress. Masking failures typically occur not by backing puncture but by edge lift caused by adhesive softening when the component surface exceeds 120°C during prolonged preheat. A process window of ±5°C around the specified preheat temperature is enforced on the line. The copper layer within the backing contributes thermal mass and reduces hot-spot transfer through the tape, which helps preserve silicone adhesive cohesion. Direct flame impingement or sustained exposure above 288°C is outside the operational boundary and results in adhesive carbonization rather than clean peel. After spraying, the tape is removed only after the component cools below 60°C; hot removal can smear adhesive onto flame-sprayed coatings.
Electrostatic powder coating lines for A356-T6 aluminum road wheels use the same copper glass-PTFE silicone adhesive tape over machined lug seats and center bores. The tape enters the line after an alkaline cleaner stage at 50–60°C and pH 10–12, followed by a chromium-free conversion coating bath and RO water rinse. The PTFE-coated glass face rejects fused polyester or epoxy-polyester powder at cure temperatures of 180–200°C for 15–25 min. Because the backing face is non-polar, overspray does not knit into a continuous film over the tape, and the edge peel line remains distinct. Silicone adhesive residue after full oven cure is minimized when the tape is removed after the wheel cools to 40°C or below. However, prolonged residence above 220°C can initiate cohesive splitting of the silicone layer on zinc-phosphated aluminum surfaces. Preheat and bake profiles must be fixed before tape lot interchange; a change in phosphate grain structure can alter adhesion by up to a factor of two in peel testing per ASTM D3330/D3330.
L-bar sealers running 25–50 µm LLDPE or LDPE lay-flat film apply the tape to the upper and lower sealing jaws so the PTFE-coated glass face contacts the polymer web. The copper component of the backing redistributes heat across the jaw width, reducing cold spots at the outboard ends. Sealing jaw setpoints typically range from 145°C to 175°C, with dwell times of 0.4–1.2 s and jaw pressure between 0.15 MPa and 0.4 MPa. Under these conditions, the PTFE surface prevents film melt adherence and fold-back during jaw opening. Kinetic coefficient of friction of PTFE-coated glass fabric against polyethylene film is typically below 0.10 when measured per ASTM D1894 at 23°C, which reduces web drag and coil set. The silicone adhesive must tolerate repeated thermal cycling from ambient to near 180°C without edge creep. Operators replace the tape after 500–800 cycles on high-speed lines because release properties degrade through abrasion and contaminant building; the exact interval is line-specific and is established by tracking seal strength across the web per ASTM F88/F88M.
For indirect food packaging applications, the PTFE resin component is evaluated against FDA 21 CFR 177.1550, and the silicone adhesive component against FDA 21 CFR 175.105. The copper layer is not a direct food-contact surface and must be encapsulated or positioned away from direct product contact. Intermittent exposure to cleaning solutions with pH below 4 or above 12 at elevated temperature can reduce adhesive anchorage at the jaw edge. Mechanical abrasion from printed film surfaces containing titanium dioxide pigments shortens tape life more rapidly than unpigmented film. The silicone adhesive should not be combined with amine-based release agents or certain organotin heat stabilizer residues because these can plasticize the PSA and shift the clean-removal temperature downward by as much as 15°C in line trials.
In engine compartment harness routing, the tape is installed over silicone-sheathed cables and conduit brackets where radiant heat from exhaust manifolds or turbocharger housings reaches sustained levels of 120–180°C. The copper-bearing face is oriented toward the heat source in some layouts, while the PTFE-coated glass face is oriented outward for contamination protection in others. Orientation must be fixed in the assembly drawing because the two surfaces have different emissivity and release behavior. The silicone adhesive provides vibration damping on stainless steel tube clamps and reduces fretting against nylon cable ties. Continuous exposure above 200°C on aluminum heat shields can oxidize the outer copper surface and raise surface emissivity, altering the heat balance. The tape is not a primary electrical insulator when the copper face is exposed; dielectric isolation must be provided by the harness jacket. When conformity to electrical equipment directives is required, the homogeneous copper and glass-PTFE layers are assessed under RoHS 2011/65/EU annex II substance restrictions, and the article is screened against the current REACH SVHC list.
Wrapping bolted flange annuli with this tape functions as a removable external barrier against acid mist, caustic splash, and moisture ingress. The PTFE-coated glass cloth face resists short-term splashes of 37% hydrochloric acid, 50% sodium hydroxide, and 30% sulfuric acid at ambient temperature. The copper layer inside the backing adds puncture resistance when maintenance tools contact the flange, reducing the risk of a continuous tear through the PTFE glass. The silicone adhesive adheres to grit-blasted carbon steel and 316L stainless flange faces after a wipe with isopropanol. This is a splash guard, not a primary corrosion barrier or secondary containment system. Immersion in process fluids is outside the intended use because the silicone layer can plasticize or lose cohesive strength after extended contact with strong mineral acids at temperatures above 40°C. Chemical resistance screening is performed in accordance with ASTM D543 on representative stainless steel coupons, with 24 h exposure at 23°C followed by peel adhesion checks.
For flange isolation, the tape is applied in multiple passes with 50% overlap around the annulus after bolt torqueing is completed. This avoids locking process fluid inside the crevice before closure. The PTFE surface reduces particle accumulation and allows visual inspection of the tape edge for fluid intrusion. In sodium hypochlorite storage areas, copper contact with stagnation moisture can form salts at the tape edge; this must be monitored during preventive maintenance. Published data for this specific application configuration is limited, particularly for long-term UV exposure and coastal salt spray, so field evaluation with exposed coupons is required. The tape is replaced only on a clean, dry flange; solvent residue from methyl ethyl ketone can reduce silicone anchorage if not fully evaporated.
Composite repair stations position the tape on aluminum or steel tooling as a release interface adjacent to the vacuum bag edge, with the PTFE-coated glass face against the bag film and the silicone adhesive against the tool. The copper layer contributes to heat spreading under the heating blanket, reducing local thermal gradients that can distort a 177°C epoxy prepreg repair cure. A typical cure profile is 2 h at 177°C under 0.7–0.9 bar vacuum and 0.3 MPa positive autoclave pressure. Under these conditions the silicone adhesive remains anchored to the tool, while the PTFE face prevents the bag from bonding to the tape. The adhesive side must not be exposed to the uncured repair laminate because silicone contamination can inhibit composite interlaminar bonding. A secondary flash tape or vacuum bag sealant must cover all exposed adhesive edges.
The tape is not a substitute for a true mold release agent on the repair surface. It is used only outside the bondline, typically around the breather fabric and edge bleed region. Repeated autoclave cycles above 190°C can reduce clean peel from steel tool surfaces, particularly after tool surfaces are repeatedly abraded. Incoming material is inspected for total thickness per ASTM D3652/D3652M and backing tensile properties per ASTM D3759/D3759. Lot-to-lot variation in silicone adhesive crosslink density can shift removal force by more than 30% in peel tests, so repair process specifications require a fixed tape lot or a re-qualification peel coupon before production use. The copper layer is not intended for electrical continuity across the repair zone, and it should not be relied upon as a grounding path unless the copper face is exposed and specifically qualified for that function.
| Application zone | Test or reference | Scope and boundary |
|---|---|---|
| Thermal spray masking | ASTM D3330/D3330 | Peel adhesion on degreased steel; does not fully predict grit blast edge resistance |
| Powder coating bake masking | ASTM D4969 | PTFE-coated glass fabric backing mechanical properties |
| Heat sealing bar release | ASTM D1894 | Kinetic coefficient of friction against polyethylene film |
| Composite repair cure | ASTM D3652/D3652M | Thickness consistency and cure-cycle dimensional control |
| Chemical splash exposure | ASTM D543 | Reagent resistance screening; service is splash-only, not immersion |
| Food packaging indirect contact | FDA 21 CFR 177.1550 / 175.105 | Resin and adhesive component regulatory review |
| Electrical equipment supply | RoHS 2011/65/EU Annex II | Homogeneous material restriction screening within defined electrical scope |
| Boundary parameter | Typical qualification window | Failure mode outside window |
|---|---|---|
| Thermal spray preheat surface temperature | 90–120°C | Adhesive edge lift and overspray ingress |
| Powder coat oven cure dwell | 180–200°C for 15–25 min | Cohesive adhesive splitting on removal |
| L-bar sealing jaw setpoint | 145–175°C | PTFE surface contamination and film drag increase |
| Composite bagging cure | 177°C for 2 h at 0.3 MPa | Tool adhesion loss or adhesive residue transfer |
| Chemical splash temperature | ≤40°C ambient splash | Silicone plasticization and PTFE glass delamination |
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Saint-Gobain CHR SGC6-04(R) CHEMLAM copper glass-PTFE backing silicone adhesive pressure-sensitive tape is specified as a high-temperature mask, release, and protective tape in thermal processing and component protection operations. The carrier is a glass cloth-reinforced polytetrafluoroethylene composite identified by the copper designation; a formulated silicone pressure-sensitive adhesive is coated on one surface. The (R) suffix denotes a release-liner configuration, but liner type and release force must be confirmed from the Saint-Gobain technical data sheet. Product-specific thickness, mass, and adhesion values are published in the manufacturer certificate of analysis. Standard test methods for this product family include ASTM D3652 for thickness, ASTM D3759 for backing breaking strength and elongation, and ASTM D3330 Method A for peel adhesion to stainless steel.
The silicone adhesive is typically a solvent-based or solventless formulation with a continuous dry-heat rating of 260 °C and short-term tolerance to 316 °C. Published values for this specific configuration may be lower if the copper-modified backing influences thermal transfer. The glass-PTFE carrier remains dimensionally stable over the same range. At temperatures below -73 °C, peel strength decreases because silicone polymer chain mobility is reduced. These are product-family benchmarks and do not replace certified test results from the SGC6-04(R) datasheet. Pre-drying at relative humidity above 60% is recommended before high-temperature application because surface moisture delays adhesive wet-out and can produce steam blistering during rapid heat-up.
Silicone pressure-sensitive systems retain a higher proportion of initial peel strength after thermal aging at 260 °C in forced-air ovens. Acrylic PSAs generally harden above 149 °C and lose peel strength; silicone systems withstand repeated cycling from -60 °C to 260 °C with less embrittlement. Initial room-temperature peel adhesion of silicone tapes is typically 3.0 N/25 mm to 5.0 N/25 mm on stainless steel per ASTM D3330 Method A, whereas acrylic PSAs may exceed 6.0 N/25 mm; this lower initial tack is offset by thermal stability and low-surface-energy wetting. The silicone adhesive also wets silicone release liners and low-energy substrates more effectively than acrylic, but it is not suitable for applications where post-mask paint adhesion is required because low molecular weight silicone species can migrate onto nearby surfaces.
| Property | Test Method | Representative Range for CHEMLAM SGC Glass-PTFE Silicone Tape |
|---|---|---|
| Total tape thickness | ASTM D3652 | 0.15 mm to 0.25 mm |
| Backing thickness | ASTM D3652 | 0.10 mm to 0.18 mm |
| Peel adhesion to stainless steel | ASTM D3330 Method A | 3.0 N/25 mm to 5.0 N/25 mm |
| Breaking strength | ASTM D3759 | 350 N/25 mm to 700 N/25 mm |
| Elongation at break | ASTM D3759 | 5% to 10% |
| Continuous dry heat rating | Manufacturer thermal aging | 260 °C |
| Short-term excursion | Manufacturer thermal aging | 316 °C |
In thermal spray masking operations, the tape is applied to fixture surfaces that require protection from plasma plume overspray. The glass cloth reinforcement resists tearing during grit blasting and high-velocity particle impingement; the PTFE surface prevents most molten ceramic and metallic deposits from adhering, allowing the mask to be stripped after coating. A plasma spray gun operating with ceramic powder feed rates of 20 g/min to 120 g/min can generate surface temperatures that char the exposed tape edge. Published data for this specific configuration is limited, so the tape should be evaluated as a sacrificial mask on a fixturing trial. The silicone adhesive holds the tape to curved surfaces during thermal cycling, but the operator must verify that adhesive residue is removed before coating inspection because silicone contamination can reduce coating adhesion.
In composite autoclave cure, the tape is placed over bagging seams and tooling edges. Use in contact with epoxy prepreg requires an evaluation of silicone transfer; the adhesive is not approved for direct bondline contact where structural adhesive strength is measured per ASTM D5868. The backing withstands autoclave cycles at 177 °C and 0.69 MPa for repeated cure cycles. For induction coil wrapping, the glass-PTFE backing provides dimensional stability and thermal release, but if the copper component is conductive, the end user must verify whether the product is suitable for primary electrical insulation or solely for thermal release. On heat-sealing bars, the non-stick surface prevents molten polymer contamination and allows release from polyethylene and polypropylene films at sealing temperatures up to 204 °C. Unlike skived PTFE films, the glass cloth carrier reduces tensile elongation under tension. Unlike polyimide tapes, the PTFE surface leaves no carbonized residue after contact with molten polymer. Unlike aluminum foil tapes, the PTFE composite is not used as a radiative heat shield and does not reflect heat in the same manner.
Chemical milling tanks and hot acid etch lines use glass-PTFE carriers because of resistance to sulfuric, hydrochloric, and nitric acid at concentrations up to 20% at 25 °C; published data for the copper-modified backing is limited. The silicone adhesive is swollen by toluene, xylene, methyl ethyl ketone, and chlorinated solvents; continuous exposure reduces peel strength and causes edge lifting. Hot concentrated sodium hydroxide degrades the glass reinforcement, so the composite may lose mechanical strength even though the PTFE matrix remains intact. Do not use this tape in liquid oxygen service or in high-purity semiconductor environments where silicone outgassing is not permitted. When chemical resistance testing is performed, ASTM D543 is the applicable immersion protocol, but the user must specify the exact fluid, temperature, and duration.
Automated die-cutting of pressure-sensitive tapes requires controlled release force between the liner and the adhesive. The (R) configuration is specified where the liner stabilizes the soft silicone adhesive during rotary die-cutting and vacuum transfer. Liner release force is typically measured on the finished tape per FINAT FTM 3 or ASTM D3330; published release values for SGC6-04(R) may lie between 5 g/25 mm and 40 g/25 mm, but converter-specific values should be obtained from the manufacturer. Die-cutting at 15 °C to 25 °C is recommended; adhesive ooze and edge stringing increase above 30 °C because the silicone PSA becomes more flowable. The liner must be removed before high-temperature exposure because paper-based liners discolor and release coatings may degrade above 204 °C.
| Parameter | CHR SGC6-04(R) CHEMLAM Copper | Acrylic PTFE Glass Tape | Polyimide Tape | Aluminum Foil Tape |
|---|---|---|---|---|
| Continuous dry heat | 260 °C | 149 °C | 260 °C | 150 °C to 316 °C |
| Low-temperature peel retention | -73 °C | -40 °C | -269 °C | -30 °C |
| Conformability | Moderate with glass cloth carrier | Moderate | High | High |
| Adhesive class | Silicone | Acrylic | Silicone or acrylic | Acrylic |
| Non-stick surface | Yes, PTFE | Yes, PTFE | No | No |
| Silicone migration risk | Present | Absent | Present if silicone adhesive | Absent |
Compared with standard CHR glass-PTFE silicone tapes without the copper designation, SGC6-04(R) is specified where the copper-modified backing provides different thermal performance or visual identification; published data for the specific copper modification is limited. The product is not interchangeable with conductive copper foil tapes because the glass-PTFE matrix governs dielectric and release behavior. In automated converting, the release-liner configuration reduces adhesive delamination during high-speed cutting but increases total material thickness, which may affect die depth settings on rotary presses. The end user must confirm liner caliper and silicone adhesive coat weight from the lot certificate because batch-to-batch adhesive thickness variance can shift die-cut registration by 0.05 mm or more.