| HS Code | 903566 |
| Backing Material | Glass-PTFE |
| Adhesive Type | Silicone |
| Tape Type | Pressure Sensitive |
| Anti Static | Yes |
| Total Thickness | 6.5 mil (0.165 mm) |
| Backing Thickness | 3.0 mil (0.076 mm) |
| Adhesive Thickness | 3.5 mil (0.089 mm) |
| Color | White |
| Temperature Range | -100°F to 500°F (-73°C to 260°C) |
| Tensile Strength | 100 lb/in (17.5 N/cm) |
| Elongation | 5% |
| Adhesion To Steel | 35 oz/in (3.8 N/cm) |
| Dielectric Strength | 7000 V |
| Surface Resistivity | 10^6 to 10^9 ohms |
| Length | 36 yd (33 m) |
| Width | 1/2 in, 3/4 in, 1 in, etc. |
| Core Diameter | 3 in |
| Chemical Resistance | Good |
| Moisture Resistance | Good |
| Abrasion Resistance | Good |
As an accredited Saint-Gobain CHR SG56-03(R) Anti-Static Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied as one roll per carton, sealed in a protective plastic sleeve with clear product labeling and handling instructions. |
| Container Loading (20′ FCL) | 20′ FCL loading: palletized Saint-Gobain CHR SG56-03(R) anti-static glass-PTFE silicone adhesive tape rolls, secured and moisture-protected for transport. |
| Shipping | Saint-Gobain CHR SG56-03(R) tape ships as a non-hazardous, non-regulated article in original sealed packaging. No UN number, hazard class, or packing group applies. Store below 30°C, away from moisture, direct sunlight, and ignition sources. Handle carefully to avoid damage or contamination. Follow current SDS, carrier, and local transport requirements. |
| Storage | Store in a cool, dry, well-ventilated area away from direct sunlight, heat, ignition sources, and moisture. Keep the tape in its original sealed packaging, maintaining moderate temperature and humidity (e.g., 15–30°C, 40–60% RH). Do not freeze. Avoid contact with incompatible chemicals, dust, and sharp objects. Rotate stock following first-in, first-out principles to preserve adhesive and anti-static properties. |
| Shelf Life | Shelf life is 12 months from date of manufacture when stored in original packaging at 21°C (70°F) and 50% relative humidity. |
In rotary heat-seal packaging lines running coextruded LLDPE/LDPE films, the release surface of CHR SG56-03(R), an anti-static PTFE-coated glass fabric pressure-sensitive tape, contacts the hot seal jaw at impulse temperatures of 180–220 °C and sealing pressures of 0.4–0.7 MPa. The glass-reinforced PTFE backing prevents adhesive squeeze-out, while the static-dissipative phase maintains surface resistivity between 109 and 1012 Ω/sq when sampled and conditioned per ASTM D257. Charge decay testing per IEC 61340-2-1 gives a decay time below 2 s when measured from 1000 V to 100 V at 12 % relative humidity, a condition that frequently causes film tracking failures on unmodified PTFE release tapes. Seal jaw temperature mapping per ASTM F2029-16 shows that backing thickness variation of ±0.013 mm across the jaw face shifts the apparent seal temperature by 3–5 °C, which is critical for narrow-window sealant resins such as metallocene LLDPE. Silicone adhesive migration into the seal area becomes a process risk above 220 °C at dwell times above 1.5 s; low molecular weight siloxane species can transfer to the film sealant layer and reduce seal strength, but published data for this specific tape configuration is limited. Seal strength is measured per ASTM F88/F88M, and production lots must be qualified on the specific film structure rather than on a generic sealant standard. On intermittent L-bar sealers cycling below 20 cycles/min, the anti-static backing reduces film sticking to the release surface after scrap trim removal, but the cut tape edge must be lapped outside the seal footprint to avoid edge impressions transferring through thin films.
Printed circuit board fabricators apply the tape as a solder wave barrier and conformal coating mask where gold-plated edge fingers must remain free of flux, solder dross, and acrylic or silicone overcoats. The glass-reinforced PTFE backing withstands transient solder pot contact at 260–270 °C for 3–5 s when the tape edge is pressed with a roller to obtain a wetting footprint at least 1.5 mm beyond the mask boundary. Static charge on polyimide flex circuits during peel-back is addressed by the anti-static backing, and removal must be integrated into the facility ANSI/ESD S20.20 electrostatic protected area procedure with grounded tooling and controlled peeling. A practical incompatibility arises when no-clean flux residues contain dicarboxylic acids; these species can undercut the silicone adhesive edge at 40–60 °C and lift masking within 4 h, so the tape is not recommended for palletized boards awaiting washing longer than one shift. Peel adhesion values obtained per ASTM D3330/D3330M are lot-dependent and require verification on the specific soldermask; ceramic-filled soldermask reduces the surface energy below 38 mN/m and can lower initial tack sufficiently to permit solder dross ingress.
On multi-layer blown film winders and slitter rewind shafts, static accumulation from polyethylene terephthalate or nylon film at speeds above 300 m/min generates surface voltages approaching 25 kV on uncoated steel rollers. Wrapping the contact idler with the anti-static PTFE glass tape lowers the measured charge decay time below 0.5 s when tested per IEC 61340-2-1, provided the cut edges are lapped downstream of the web path to avoid exposed adhesive accumulating dust. The glass cloth reinforcement resists web abrasion at contact angles up to 30°; at higher wrap angles the edge weave of the backing may emboss fine particulate into corona-treated PET surfaces. Silicone adhesive transfer is not observed on film at roll surface temperatures below 80 °C, but corona refresh in-line at 1.5 kW can oxidize exposed adhesive edges and shift unwind tension by several percent after 300 h of operation. Published data for this specific configuration is limited to production trials rather than standardized qualification documents.
Autoclave and oven-cure operations for glass/phenolic and carbon/epoxy prepregs use the tape as a release boundary on aluminum caul plates, edge dams, and thermocouple ports. Cure cycles for 150 °C-cure epoxies typically ramp at 1–3 °C/min to 177 °C and hold under 0.60–0.70 MPa autoclave pressure. The anti-static backing reduces particle attraction during layup, which is critical when foreign object debris contamination above 250 μm is rejected by ultrasonic inspection per ASTM E2580. The process conflict occurs when a high-flow, low-viscosity resin system reaches 120 °C; at that point, the silicone adhesive tack can drop and allow the tape to float along the tool edge, producing void evidence in the cured laminate. The use of aluminum foil edge dams pressed over the tape at 0.1 MPa prevents lift but increases the risk of adhesive residue on the caul plate after demolding. Solvent wiping with isopropanol or methyl ethyl ketone may remove visible residue, but Fourier-transform infrared spectroscopy of the tool surface per ASTM E1252 is recommended before reusing tooling for Class A painted or bonded components. Aerospace vacuum-bag users must also evaluate outgassing per ASTM E595 because silicone adhesives can generate total mass loss above 1.0 % and must not be placed in a breathing path without acceptance testing.
When thermoforming plug assist covers on PET and polypropylene tray machines cycle at 18–25 strokes/min, a low-friction surface with static dissipation is required because sheet temperature at the plug contact ranges from 90 °C to 120 °C. The tape is applied to syntactic foam or aluminum plug faces in strips, but seam gaps greater than 0.5 mm create a localized rough band that can mark the sheet and raise clear PET reject rates by 2–5 %. The anti-static layer prevents trim dust from clinging to the formed tray lip before filling; verification is performed with a charged plate monitor or fieldmeter positioned 50 mm from the trimmed edge after the trim press. The silicone adhesive allows repositioning during installation but must be allowed to dwell for 24 h at 23 °C before thermoforming starts; otherwise shear forces at the plug edge can slide the tape and expose the adhesive line.
In chemical processing ancillary equipment, the tape functions not as a primary sealant but as an anti-static anti-friction sleeve on rotating valve stems, slide gate edges, and flange face protectors exposed to solvent vapors. When used on stainless steel gate edges in dilute-phase pneumatic conveying, the glass-PTFE backing limits powder adhesion, and the dissipative character supports compliance with IEC 60079-32-2 for electrostatic hazards in flammable atmospheres if the installation is bonded to earth at a resistance below 1.0 × 106 Ω. The silicone adhesive is degraded by continuous contact with ketones, chlorinated solvents, and strong mineral acids, so only intermittent vapor exposure should be assumed. Surface resistivity after immersion in methyl ethyl ketone for 1 h increases by more than one order of magnitude, which negates the anti-static function until the solvent evaporates and the surface is wiped dry. No direct qualification protocol under ISO 23936 for oilfield elastomers applies to this tape configuration because the backing is a reinforced polymer film, not a sealing elastomer.
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Saint-Gobain CHR SG56-03(R) Anti-Static Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape is constructed from a woven fiberglass reinforcement encapsulated in polytetrafluoroethylene and supplied with a silicone pressure-sensitive adhesive on one face. The CHR SG56-series designation places the material in a class of glass-reinforced fluoropolymer tapes; the 03 suffix corresponds to a nominal 0.003 in backing gauge, and the R suffix indicates an anti-static modification of the unmetallized glass-PTFE carrier. Exact thickness, adhesion, release, and surface-resistivity values for this specific anti-static variant should be taken from the current Saint-Gobain technical data sheet; independent published data for the R configuration is limited.
Incoming inspection of this product family commonly uses ASTM D3652/D3652M for total caliper, ASTM D3330/D3330M for 180° peel adhesion to stainless steel, ASTM D3759/D3759M for backing tensile strength and elongation, and ASTM D149 for short-time dielectric breakdown when the tape is used as an electrical wrap. Anti-static performance is typically characterized by ASTM D257 surface-resistivity measurements or by charge-decay testing under IEC 61340-2-3. Static-dissipative web materials are usually specified between 10^6 Ω/sq and 10^11 Ω/sq; untreated PTFE surfaces commonly exceed 10^14 Ω/sq. The glass-PTFE composite does not exhibit true conductivity, and the anti-static treatment provides controlled charge decay rather than ground-path shunting.
Thickness nomenclature in pressure-sensitive tapes is not a single-value specification. A 0.003 in backing class may be supplied as a total tape caliper of approximately 0.006 in to 0.009 in once silicone adhesive and liner are included. The woven glass core limits elongation and squeeze-out during heated nip contact, while the PTFE encapsulation contributes low-friction release, chemical resistance, and a continuous-use temperature window that is generally cited for glass-PTFE/silicone composites from -73°C to 260°C. Below -40°C the silicone adhesive remains flexible but peel to stainless steel can decline because of increasing viscoelastic modulus; above 260°C the adhesive system may oxidize and lose peel before the backing itself degrades.
Skived PTFE film with a silicone adhesive offers a smooth profile and excellent chemical resistance but has high elongation and cold-flow tendency under sustained web tension. The fiberglass reinforcement in SG56-03(R)-class tape reduces elongation and stabilizes slit edges, which is beneficial in heated sealing-bar service where dimensional creep can produce wrinkles and hot spots. The trade-off is surface texture: under high nip pressure on heated platen sealers, the woven pattern may transfer a shallow impression to soft polyethylene or polypropylene films. This is a process limitation rather than an adhesive failure, and it must be evaluated on the actual sealing line at maximum jaw pressure.
Compared with glass-cloth acrylic pressure-sensitive tapes, the silicone-adhesive version is selected when process temperature exceeds 150°C, because acrylic pressure-sensitive adhesives can soften, edge-lift, and leave residue after repeated thermal excursion. Acrylic systems generally produce higher room-temperature peel and lower substrate sensitivity but have a service ceiling well below that of silicone systems. Compared with anti-static polyimide/silicone tapes, the PTFE/glass product provides lower coefficient of friction and better release against hot-melt adhesives, but polyimide may be preferred where higher cut-through resistance, thinner dielectric construction, or smoother backing is required. The selection boundary is therefore defined by thermal load, mechanical stress, contamination sensitivity, and surface-profile tolerance.
| Construction class | Backing behavior | Continuous thermal window | Static behavior | Typical restriction |
|---|---|---|---|---|
| SG56-03(R) class: glass-PTFE/silicone | low elongation, textured release surface | -73°C to 260°C class range | anti-static, 10^6–10^11 Ω/sq class target | silicone migration, edge fraying |
| Skived PTFE film/silicone | smooth, high elongation, cold flow | -73°C to 260°C class range | untreated surface can exceed 10^14 Ω/sq | dimensional creep under tension |
| Glass cloth/acrylic | low elongation, fiber-reinforced | typically -40°C to 150°C | generally non-dissipative | high-temperature oxidation |
| Polyimide/silicone | thin, high cut-through resistance | -79°C to 260°C class range | supplied with or without static treatment | lower release, thinner caliper |
Production-scale failure modes observed with this class include transfer of silicone adhesive to heat-seal bars after excursions above 260°C, glass-fiber edge fraying at the slit boundary, and loss of anti-static function after aggressive solvent wipe. Silicone transfer is accelerated by high peel-off force during tape removal at elevated temperature; cooling the bar to 60°C before removal often reduces cohesive splitting and residual adhesive. Edge fraying creates particulate contamination and can be minimized by specifying ultrasonic slitting, but this is not available for all converted widths. Loss of anti-static behavior after solvent cleaning indicates that the treatment may reside in a soluble surface layer rather than in the bulk backing; if field wiping is required, a non-aggressive isopropanol wipe and re-test are recommended.
Heat-seal packaging and web-converting operations impose simultaneous requirements: the tape must discharge triboelectric charge without sacrificing release life at elevated temperature. Untreated PTFE is strongly triboelectric; during high-speed unwind at low relative humidity, surface potentials can exceed 5 kV and can attract airborne fibers or create nuisance shocks. Anti-static treatments reduce surface resistivity and provide charge decay, but they do not make the tape a conductor. Machine grounds, ionizing bars, or conductive rollers remain necessary where flammable solvent vapors or dust-exposure limits are present.
The performance window is bounded by both the silicone adhesive and the anti-static treatment. Silicone pressure-sensitive adhesives retain tack at low temperatures but are oxidation-sensitive at prolonged high temperature. In food-packaging sealing-bar trials, continuous exposure at 260°C can produce measurable peel loss within 8 h to 24 h, while short-cycle sealing at 180°C to 220°C with dwell times of 0.2 s to 1 s may be sustained for thousands of cycles. The glass-PTFE backing does not melt; PTFE crystalline transitions at 19°C and 30°C cause minor reversible dimensional changes. At 288°C the backing may release local decomposition products, and the tape should not be used as a permanent unsupported wrap above its continuous-use rating.
Because the anti-static treatment must survive the same thermal environment, not all anti-static grades are equivalent. Some migratory antistats can be extracted by solvent wiping or reduced by high-humidity exposure; a conductive filler approach may produce lower resistivity but can increase surface roughness. For this reason, charge-decay verification should be performed after high-temperature aging, not only as-received. Field acceptance testing on web handling equipment should follow IEC 61340-2-3 or an equivalent charge-decay method, with the tape aged at the maximum intended process temperature and then conditioned at 12% RH to challenge dissipative performance.
On horizontal form-fill-seal machines, the tape is applied to heated sealing jaws, side-seal bands, or vacuum platen surfaces as a replaceable release layer. The glass reinforcement prevents the tape from necking down under the reciprocating load of jaw motion, and the silicone adhesive minimizes residue when stripped after being baked at heat-seal setpoints. During installation, stainless-steel sealing bars are cleaned with isopropyl alcohol or a solvent compatible with ASTM D2651; anodized or chem-film-treated aluminum improves anchor strength compared with untreated aluminum. The tape is burnished under uniform pressure to eliminate entrapped air pockets that would otherwise act as thermal insulators and produce uneven seals.
In wire-harness and aerospace shops, the same glass-PTFE/silicone construction is used as a high-temperature dielectric wrap on cable bundles. The wrapped assembly must be tested as a system; ASTM D149 provides short-time dielectric breakdown, but process specifications such as AS22759, UL 510, or OEM harness standards may impose additional cut-through, flammability, and insulation-resistance requirements. Dielectric values obtained on flat tape coupons do not automatically transfer to wrapped cables because air gaps, overlap geometry, and wire insulation interaction affect the final insulation system.
On laminating or coating rollers, the tape functions as a release surface against hot-melt adhesives, solvent-based coatings, or thermoplastic films. Friction values for fluoropolymer/glass surfaces are commonly evaluated under ASTM D1894; dynamic coefficients against polyethylene can fall in the 0.05 to 0.2 range depending on surface finish and web temperature. The anti-static variant reduces static-driven film wrinkling and particle pickup. However, the tape is not a direct replacement for a conductive metal roll; it provides a dissipative barrier only in combination with a grounding path from the roll core.
| Property or requirement | Reference standard | Measured parameter |
|---|---|---|
| Tape caliper | ASTM D3652/D3652M | total thickness, mils or μm |
| Peel adhesion | ASTM D3330/D3330M | 180° peel to stainless steel |
| Backing tensile / elongation | ASTM D3759/D3759M | break strength and elongation at break |
| Surface resistivity / charge decay | ASTM D257, IEC 61340-2-3 | Ω/sq, decay time |
| Dielectric breakdown | ASTM D149 | short-time breakdown voltage |
| Surface preparation | ASTM D2651 | metal cleaning and adhesive anchorage |
| Thermal service | manufacturer continuous-use rating | peel retention after high-temperature dwell |
From a compliance standpoint, PTFE and glass cloth are not generally restricted under RoHS, but the specific anti-static additive and any fluoropolymer incineration residue require supply-chain documentation. Direct food-contact use is not automatically granted by the presence of PTFE; the specific SG56-03(R) formulation must be evaluated under 21 CFR 175.300 for adhesive components and 21 CFR 177.1550 for PTFE resin where applicable. Anti-static additives may have separate migration limits. For medical or pharmaceutical contact, the manufacturer should be required to provide a statement of extractables and lot-specific compliance.
Chemical compatibility of the glass-PTFE backing is governed by fluoropolymer chemistry. PTFE resists most acids, alkalis, and solvents, with the exception of molten alkali metals and elemental fluorine at elevated conditions. The silicone adhesive is more chemically limited; strong alkalis and chlorinated solvents can swell or degrade the pressure-sensitive adhesive, and ketone-rich cleaning solutions may extract low-molecular-weight siloxane species over repeated wipe cycles. For chemical-coating processes, the selected solvent should be tested in contact with the adhesive edge for 24 h to detect edge lift or visual clouding.
Operational boundaries include avoiding molten alkali metals, elemental fluorine, and strong oxidizing acids at elevated temperature. PTFE decomposition products are hazardous above 300°C, so local hot spots from cartridge heaters must not exceed the manufacturer rating. Silicone adhesive migration can interfere with downstream coating, painting, or medical-device bonding; if post-processing requires clean bonding surfaces, the tape should be used only as a temporary mask and removed well before the additional operation. The anti-static treatment is not a replacement for grounding in flammable vapor areas; conductive floor and machine grounding remain mandatory.
On actual sealing lines, the first visible failure is often adhesive squeeze-out at the tape edge rather than backing failure. The squeeze-out can transfer to the package, causing a glossy spot or unintended bonding. Reducing initial nip pressure and re-burnishing the tape may not recover the adhesive; the typical corrective action is to remove the tape, clean the bar, and install fresh material. If squeeze-out recurs at temperatures below 200°C, the bar temperature setpoint should be verified with a contact thermocouple, because embedded heater controllers may report barrel temperature but not actual jaw-face temperature.
The SG56-03(R) construction differs from carbon-filled anti-static PTFE tapes in that the anti-static mechanism does not necessarily produce black conductive backing; anti-static glass-PTFE is often beige or tan. If color is used as a visual proxy for static-dissipative performance, it is unreliable and should not replace surface-resistivity verification. In applications where static must be dissipated to a ground plane through the tape thickness rather than across the surface, a conductive-transfer adhesive or metal-foil backing should be specified. Surface-resistivity targets in the dissipative range are not a guarantee of charge decay at low humidity.
During production startup, the most informative field test is a dwell coupon on the actual sealing-bar or roller material at maximum cycle rate and temperature. After a predetermined number of cycles, ASTM D3330/D3330M peel measurements on the aged coupon indicate whether adhesive retention and anti-static performance remain inside control limits. Because the backing contains woven glass, slit edges may present exposed fiber ends; ultrasonic or crush-cut slitting is preferred over shear slitting for narrow rolls used in automated placement. The tape should be stored at 21°C and 50% RH in original packaging, away from direct sunlight and strong oxidizing agents; contact with plasticized films or low-molecular-weight oils should be avoided because these can soften the silicone adhesive and create residue transfer.