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Saint-Gobain CHR SG25-05(R) Primary Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR SG25-05(R) Primary Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 698576
    Product Name Saint-Gobain CHR SG25-05(R) Primary Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape
    Manufacturer Saint-Gobain
    Brand CHR
    Model SG25-05(R)
    Tape Type Pressure-sensitive tape
    Backing Material PTFE-coated glass cloth
    Adhesive Type Silicone
    Total Thickness 0.005 in (0.127 mm)
    Backing Thickness 0.0035 in (0.089 mm)
    Adhesive Thickness 0.0015 in (0.038 mm)
    Color White
    Temperature Range -100°F to 500°F (-73°C to 260°C)
    Dielectric Strength 7000 V
    Tensile Strength 100 lb/in
    Elongation 5%
    Adhesion To Steel 30 oz/in
    Width 1 in (25.4 mm)
    Length 36 yd (32.9 m)
    Core Diameter 3 in (76.2 mm)

    As an accredited Saint-Gobain CHR SG25-05(R) Primary Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Packaged as a single roll in a protective sleeve or carton, labeled with product identification; quantity: one roll per package.
    Container Loading (20′ FCL) 20′ FCL container loaded with palletized Saint-Gobain CHR SG25-05(R) glass-PTFE silicone adhesive pressure-sensitive tape, secured for dry ambient transport.
    Shipping Saint-Gobain CHR SG25-05(R) tape ships as a nonhazardous, non-DG article. Pack in sturdy cartons, keep dry, and protect from excessive heat, sunlight, and ignition sources. No UN number, hazard class, or special transport label is required; follow standard carrier rules and the manufacturer’s SDS.
    Storage Store Saint-Gobain CHR SG25-05(R) tape in its original packaging in a clean, dry, well-ventilated area at controlled room temperature, ideally 15–30°C. Keep away from direct sunlight, heat, moisture, sparks, and ignition sources. Avoid contact with solvents, oils, and strong oxidizers. Do not crush or stack heavy items. Rotate stock and use oldest first. Observe shelf-life and manufacturer instructions.
    Shelf Life Shelf life: 12 months from date of manufacture when stored in original packaging at 21°C (70°F) and 50% relative humidity.
    Application of Saint-Gobain CHR SG25-05(R) Primary Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape

    Where silicone PSA removes cleanly from carbon/epoxy tool flanges after a 177 °C cure

    In composite bagging operations, CHR SG25-05(R) Primary Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape is applied as a low-residue mask over sealed tool flanges, vacuum port lands, and thermocouple lead paths where flash resin would otherwise bond to tooling under autoclave compaction. The backing combines a woven glass cloth of 0.13 mm nominal thickness with a primary PTFE release face and a silicone pressure-sensitive adhesive, giving the interlayer release performance required during 177 °C carbon/epoxy cycles. Compliance documentation typically references ASTM E595-15 for outgassing; aerospace processors verify total mass loss below 1.0% and collected volatile condensable material below 0.1%, while European processors must confirm REACH registration and the absence of SVHC candidates in the adhesive system. The effective usage proportion is not a liquid formulation addition ratio; as a roll-good, the relevant process proportion is edge margin and splice overlap: 10–15 mm edge margin from the vacuum seal area, 20–30 mm minimum splice overlap for continuous masking, and an application rate of approximately 1.0–1.5 linear metres of tape per 1 m² of tool surface when using 50 mm width. The downstream process begins with solvent-wiped tooling at 23 ± 2 °C and 30–50% RH, followed by manual or automated tape laydown with 0.5–1.0 N/cm application pressure using a roller conforming to the flange radius. Cure is generally run in a nitrogen-purged autoclave with a 1.5–3 °C/min ramp rate, holding at 177 °C for 120–180 min under 0.6 MPa external pressure. The terminal finished products include CFRP wing fairings, nacelle acoustic panel inserts, and tooling compensation laminates where silicone contamination must be prevented before subsequent adhesive bonding. Operational boundaries include not applying this tape to surfaces that will later receive paint or primer without plasma cleaning, because silicone transfer can interfere with wetting and intercoat adhesion.

    What limits adhesive residue transfer on reciprocating packaging seal jaws?

    Molten low-density polyethylene will adhere to unprotected cartridge-heated sealing bars at production temperature; a single-ply wrap of SG25-05(R) provides a release face that maintains uniform heat transfer while preventing film build-up on horizontal form-fill-seal jaw assemblies. The compliance baseline for food-contact packaging lines is not determined by the tape alone but by end-user validation under FDA 21 CFR 177.1550 for the PTFE release face and FDA 21 CFR 175.300 for the silicone adhesive, provided migration does not exceed 10 mg/dm² under the intended temperature-time condition; EU users additionally apply Regulation (EC) No 1935/2004 and EU 10/2011 migration testing as relevant. The deposition/application proportion for this roll-good is expressed as wrap geometry: a single ply across the seal-jaw width with 5–10 mm overhang on the entrance and exit edges, 2–5 mm side overhang to prevent adhesive contact with the film path, and overlap at butt joints of 5 mm at the ends. The downstream packaging process operates with cartridge-heated jaw temperatures from 120 °C to 220 °C, sealing pressure 0.2–0.5 MPa, and dwell time 0.5–2.0 s depending on polyethylene film gauge and screw speed. Because the silicone adhesive is thermoplastic in character under elevated temperature, the tape must be burnished against the jaw surface with 0.5–1.0 N/cm pressure during application and then heat-cycled at 150 °C for 15–20 min to remove air pockets before production begins. The terminal finished products include flat-bottom PE bags, laminated snack pouches, and medical IV overwrap pouches where seal integrity is measured by tensile delamination per ASTM F88/F88M-21 and where release face contamination must be excluded. The operative limitation is that silicone adhesive shear strength decreases above 200 °C; reciprocating jaws should therefore be evaluated at maximum sealing speed and cycle rate to confirm no edge creep before full production release.

    Application segmentPrimary standard/methodCritical acceptance valueOperational boundary
    Composite cure maskingASTM E595-15TML < 1.0%, CVCM < 0.1%Do not apply to bonding surfaces without plasma cleaning
    Packaging seal jaw releaseFDA 21 CFR 177.1550, 175.300Migration < 10 mg/dm²Silicone adhesive shear decreases above 200 °C
    Electrical harness overwrapIEC 60454-1:2017, ASTM D1000-17Manufacturer batch certificate for breakdown voltageAvoid mineral oil at sustained temperatures above 120 °C
    Textile fusing pressASTM D2724-19Bond strength per customer specificationReplace after 2–4 h if edge lift exceeds 1 mm
    Converting roller releaseASTM D543-20Surface energy < 20 mN/m on PTFE faceLimit MEK/toluene exposure to 15 min per cleaning cycle
    Powder coating maskingASTM D3330/D3330MResidue-free removal after cooling below 60 °CNot for surfaces requiring post-cure painting

    Wire harness processing lines in appliance and motor manufacturing employ PTFE-glass cloth silicone adhesive tape as a spiral-wrap insulation because the backing resists cut-through from copper lead wires while providing a non-stick release face that does not delaminate at varnish bake temperatures. The relevant pressure-sensitive adhesive tape specification is ASTM D1000-17, supplemented by IEC 60454-1:2017 for electrical pressure-sensitive adhesive tapes; a production audit will record breakdown voltage values from the manufacturer’s batch certificate, with industrial audits commonly observing values in the 2.0–3.0 kV band for 0.13 mm glass-PTFE tapes, although published data for this specific SG25-05 configuration under IEC 60454-1:2017 is limited. The application ratio in this segment is a spiral overlap: a 50% lap for motor lead protection or a 25% lap for less severe harness bundling, applied at 4–8 N/cm uniform winding tension using a taping head with a fixed traverse pitch of half the tape width. The downstream process consists of cutting and stripping lead wires at 20–25 °C, taping the lead bundle after connector crimping, then routing the harness through a varnish-dip or trickle-impregnation oven at 120–160 °C for 30–90 min. The tape must remain adherent during this bake while not blocking the varnish from penetrating the winding, which is why the PTFE release face is oriented outward and the silicone adhesive inward. Terminal finished products include shaded-pole motor lead harnesses, commercial oven internal wiring, and appliance heater pigtails where RoHS Directive 2011/65/EU compliance and low halogen content are specified by the OEM. Operational boundaries include avoiding applications where the tape edge is exposed to petroleum-based oils, because oil absorption can compromise the silicone adhesive at sustained temperatures above 120 °C.

    Fusing press platen release at 140 °C interlining activation

    In garment interlining lamination, a continuous fusing machine presses cut parts between a heated PTFE-glass belt and a platen to bond fibrous interlining with hot-melt resin. SG25-05(R), when adhered to the platen surface or used as an edge repair strip, must withstand cyclic pressure at 130–150 °C without transferring silicone to shell fabrics. The tape’s use in apparel fusing is evaluated against brand restricted substance lists aligned with OEKO-TEX Standard 100 Annex 6 limits for residues, alongside EU REACH Regulation (EC) No 1907/2006 Annex XVII restrictions, while machinery operators document the application within Directive 2006/42/EC machine safety documentation. The process proportion here is not a batch addition ratio but a lamination surface area ratio: the tape should cover only the platen edge zones and seam crossing strips, typically 5–10% of the total platen area, replaced after 2–4 h of continuous operation when edge lifting exceeds 1 mm. The downstream fusing process operates at 0.2–0.4 MPa nip pressure, 130–150 °C platen temperature, and 0.8–1.5 m/min belt speed, with the glass-PTFE release face preventing adhesion of polyamide or polyester hot-melt resin. Finished product categories include shirt collars, suit lapels, and waistband interlinings where bond strength is tested according to ASTM D2724-19 or a customer-specific peel method. The limitation to record is that repeated steam and press cycles in garment aftercare can hydrolyze the silicone surface; therefore the tape’s presence as a process aid is not intended for end-garment seasoning.

    Gravure and flexographic coating lines require idler rollers and laminating nip rollers that will not accumulate solventborne ink or waterborne adhesive build-up during continuous converting. SG25-05(R) is wrapped over these roller faces to create a low-surface-energy release plane that reduces picking, misting, and edge deposit formation on film webs. The compliance basis is chemical resistance under ASTM D543-20 and surface release quantified by contact angle or surface energy below 20 mN/m on the PTFE face, though published data for this specific SG25-05 configuration under prolonged solvent immersion is limited. The usage ratio in this converting environment is a roll coverage ratio: 75–100% of the roller face is wrapped in a single layer, with 10–15 mm butt overlap at the seam and edge terminations sealed with a 5 mm edge fold onto the roller end, consuming roughly 1.25 m² of tape per 1 m² of roller surface due to overlap and trim loss. The downstream process operates at line speeds from 50–300 m/min, web tension 0.5–4 N/mm of web width, and drying temperatures 60–120 °C, depending on whether solventborne or waterborne ink is printed. The tape must be installed on clean, dry rollers with a surface roughness of Ra ≤ 0.4 µm, and it must be conditioned to machine room temperature for 4 h before wrapping to prevent wrinkle formation. Terminal finished products include flexible packaging laminates, release liners, and printed pressure-sensitive label facestocks where roller release defects produce visible coating voids. The operational boundary is that methyl ethyl ketone and toluene exposure can swell the silicone adhesive at the seam; therefore continuous exposure to strong aromatic solvents should be limited to 15 min per cleaning cycle and followed by air drying at 60 °C.

    If a powder-coating mask must survive 205 °C cure without edge lifting

    In powder coating of architectural aluminum extrusions, selected regions such as threaded bosses, grounding points, and machined mating surfaces are masked with a high-temperature release tape that must survive the cure oven cycle without leaving adhesive residue on the metal surface. The primary compliance checkpoint for this segment is ASTM D3330/D3330M adhesion testing combined with ISO 2409:2013 cross-cut residue assessment after bake, while the metal finisher must also verify that the tape does not contain prohibited substances under the automotive OEM’s IMDS or the EU ELV directive 2000/53/EC if the parts are designated for vehicle assembly. The process proportion is an area masking ratio: masked area does not exceed 5% of the total coated surface per rack, tape strips are applied with 1–2 mm clearance from the powder-coating edge to preserve electrostatic wrap, and strips are replaced after 2–3 oven cycles. The downstream powder-coating process includes hanging parts on grounded racks at 0.5–1.0 m/min conveyor speed, applying powder at 60–100 kV electrostatic voltage, and curing at 190–205 °C for 10–20 min. The glass-PTFE backing remains dimensionally stable during this cycle, while the silicone adhesive is selected for clean removability after the part cools below 60 °C. The finished parts include architectural window extrusions, aluminum enclosures, and automotive wiper arms with grounding pads that must be free of silicone contamination before subsequent bolt-down assembly. The limitation is that this tape is not designed for use on surfaces requiring post-cure painting; even after removal, silicone transfer may remain and must be removed with a solvent wipe such as isopropyl alcohol before adhesive bonding.

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    Certification & Compliance
    More Introduction

    Saint-Gobain CHR SG25-05(R) is a roll-form pressure-sensitive tape whose primary backing is a woven E-glass fabric impregnated and top-coated with polytetrafluoroethylene. The PTFE phase is applied from an aqueous dispersion, dried, and sintered above 370 °C to consolidate the fluoropolymer layer and remove wetting agents. The exposed PTFE face functions as a low-energy release surface with a dynamic coefficient of friction against polished steel typically in the range of 0.05–0.10 when measured using ASTM D1894. The opposite face carries a cured silicone pressure-sensitive adhesive. The numeric suffix “05” identifies a nominal backing thickness of 0.005 in (0.127 mm), and the (R) suffix denotes standard roll goods configuration. Because the adhesive is pressure-sensitive rather than heat-curable, bond initiation occurs under applied pressure and maximum peel strength develops after approximately 24 h at 20–25 °C. The tape is supplied with an interleaving release liner in widths from 0.25 in (6.35 mm) to 36 in (914 mm) and slit roll lengths commonly 18 yd or 36 yd.

    Saint-Gobain CHR technical literature for the SG-series glass-PTFE/silicone tape family lists a continuous use ceiling of 260 °C for the backing and a continuous adhesive shear ceiling of 200 °C for load-bearing bonds. Intermittent exposure to 260 °C is permissible in short heat-seal dwell cycles where the adhesive line does not carry peel or shear loads. The PTFE-glass backing remains functional at cryogenic temperatures approaching −73 °C, while the silicone adhesive is specified for service down to −40 °C under load. Published data for the exact adhesive coat weight of SG25-05(R) is limited; certification values for a given lot should be obtained from the manufacturer for specification-bound work. Storage at 10–30 °C and 40–60 % relative humidity is typical for silicone pressure-sensitive tapes; liner release can be affected by moisture uptake at relative humidity above 70 %.

    What physical test data and limiting conditions govern the use of SG25-05(R)?

    Representative values obtained from Saint-Gobain CHR technical documentation for PTFE-glass/silicone tape constructions are presented in the following table. They are indicative single-lot values, not guaranteed specification limits. Thickness is measured under controlled compression per ASTM D3652; 180° peel adhesion to stainless steel is measured after a 20-minute dwell per ASTM D3330. Tensile testing follows ASTM D3759 with a 2-in gauge length and 12 in/min crosshead speed. Dielectric breakdown voltage is recorded using short-time voltage rise per ASTM D149.

    PropertyRepresentative valueTest method
    Nominal backing thickness0.005 in (0.127 mm)ASTM D3652
    Typical total tape thickness0.006–0.007 in (0.15–0.18 mm)ASTM D3652
    Adhesion to stainless steel, 180° peel25–30 oz/in (2.7–3.3 N/cm)ASTM D3330
    Tensile strength, machine direction150 lbf/in (26.3 kN/m)ASTM D3759
    Elongation at break4–6 %ASTM D3759
    Dielectric breakdown voltage4,000 VASTM D149
    Backing service temperature−73 °C to 260 °CManufacturer data; IEC 60216 thermal endurance class used where applicable
    Adhesive service temperature under load−40 °C to 200 °CManufacturer data

    Because the PTFE-glass backing is anisotropic, machine-direction tensile strength exceeds cross-web strength by approximately 20–30 %. Slitting and die-cutting operations should orient the parent roll so that the machine direction corresponds to the highest tensile load in the finished part. The silicone adhesive has low static shear capacity; sustained shear loads above 10 psi (0.07 MPa) at 150 °C can produce creep. In lap-shear configurations exposed to thermal cycling, the use of a mechanical clamp or separate high-temperature metal strapping is required.

    In converting, the tape is slit on narrow-web machines equipped with shear knives; crush-cut wheels are avoided because they fracture glass filaments and produce conductive debris. Width tolerance is held to ±0.015 in (±0.38 mm) for spooled slit rolls, and core sizes of 3 in (76 mm) or 6 in (152 mm) are common for industrial dispensers. Unwind tension above 10 lbf/in (1.75 kN/m) can cause telescoping in narrow spools because the silicone adhesive releases more easily from the PTFE face at elevated storage temperatures. In automated die-cutting operations, kiss-cutting through the backing but not the liner requires a tapered blade depth and is validated with a 10× optical comparator to avoid cutting into the liner and contaminating the adhesive edge with silicone.

    AssessmentDesignationApplicability
    ThicknessASTM D3652Manufacturer lot conformity
    Peel adhesionASTM D3330Adhesive performance
    Tensile propertiesASTM D3759Backing mechanical strength
    Dielectric breakdownASTM D149Electrical insulation qualification
    Flame ratingUL 510Verify product-specific recognition
    PTFE resinFDA 21 CFR 177.1550Applies to backing resin only; adhesive status separate
    Substance restrictionsREACH, RoHSCurrent compliance statement needed from manufacturer

    Heat-Sealing, Release, and Electrical Insulation in Production Equipment

    The tape is applied to heated L-bar sealers, side-seal jaws, and impulse seal wires by removing the interleaving liner, aligning one edge with the leading metal boundary, and burnishing the backing with a hand or pneumatic roller at 20–40 psi (0.14–0.28 MPa) roller pressure. No primer is required on clean aluminum or stainless steel; oil and oxidation debris are removed with 99 % isopropanol or methyl ethyl ketone and allowed to evaporate before tape placement. On continuous form-fill-seal and bag-making lines, the PTFE-glass face prevents polyethylene or polypropylene melt from anchoring to the sealing jaw. Seal-bar cleanup intervals in high-volume film converting commonly extend from shift-to-shift scraping to planned replacement when the outer PTFE surface is visibly abraded or when film tack transfer reappears. Jaw temperatures are set between 120 °C and 260 °C depending on film gauge and line speed; above 200 °C the silicone adhesive can continue crosslinking on the metal surface and may lose peel adhesion during extended production runs. For dwell times longer than 2 s above 220 °C, mechanical edge clamps are recommended.

    In transformer coil wrapping, motor slot insulation, and wire harness bundling, the glass-PTFE composite provides a dielectric barrier and surface slip during varnish bake cycles. Processing windows of 4–6 h at 180 °C are typically tolerated by the backing without loss of slip. Partial discharge inception voltage for the specific SG25-05(R) construction is not fully specified in published data; insulation coordination requires final encapsulated-geometry testing per IEC 60664. Glass particles generated by crush-cut slitting can become conductive debris in high-voltage windings; ultrasonic or shear slitting is preferred for electrical insulation grades.

    Release applications include mandrel wraps for filament winding and lay-up of uncured epoxy or polyester systems. The silicone adhesive holds the tape in place on curved aluminum or steel mandrels, but direct contact with mold-release chemistry must be checked because silicone plasticizers can migrate into low-viscosity resin systems during autoclave cure. Published data for the interaction between the adhesive and specific resin formulations is limited; a resin gel-time cure simulation is recommended before production release.

    Compared with skived PTFE tape, SG25-05(R) has higher tensile strength and lower elongation because the woven glass reinforcement suppresses the cold flow and dimensional relaxation observed in unfilled PTFE. Skived PTFE is preferable when a conformable, low-porosity barrier is required on curved sealing tools; it does not contain glass filaments that can fracture at trimmed edges. Compared with PTFE-glass tapes using acrylic pressure-sensitive adhesive, the silicone adhesive version sustains higher peel at 150 °C and wets silicone-coated surfaces more effectively, but it is not recommended for room-temperature structural shear applications and must be excluded from surfaces scheduled for painting or bonding. Compared with 1-mil polyimide film tape, SG25-05(R) is thicker and more puncture-resistant; polyimide is selected when the dielectric barrier must remain within a 0.002 in total thickness allowance and when a non-silicone adhesive is required.

    A further distinction is chemical resistance. The PTFE-glass backing resists acids, bases, and most solvents except molten alkali metals and strong fluorinating agents; the silicone adhesive is swollen or degraded by prolonged exposure to esters, ketones, and chlorinated solvents. In such environments, the tape can delaminate at the backing-adhesive interface before the PTFE surface shows visible attack.

    When Silicone Adhesive Must Be Rejected in Paint or Plasma Environments

    Silicone migration from the pressure-sensitive adhesive can create low-surface-energy defects in subsequent liquid-paint and powder-coat applications. Per ISO 8296 wetting-tension measurement, a contaminated substrate may exhibit a lower wetting tension than the 48 mN/m threshold required for many polyurethane and epoxy topcoats. Parts that will enter electrostatic painting, plasma-enhanced coating, or oxygen-sensitive vacuum chambers should not carry the tape unless the entire silicone-contaminated zone is subsequently cleaned with a validated siloxane-degrading solvent and cleared by X-ray photoelectron spectroscopy. This restriction does not apply to the PTFE-glass face, but the adhesive side is the source of contamination.

    The tape should not be used as a permanent cover in silicone-sensitive cleanrooms or optical bonding areas. In these cases, the appropriate substitute is typically a PTFE-film or polyimide tape with an acrylic adhesive. The silicone adhesive is also incompatible with prolonged immersion in methyl ethyl ketone, acetone, toluene, and chlorinated solvents; swelling at the adhesive line may cause edge lifting and residual transfer during mask removal.

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