| HS Code | 633329 |
| Product Name | Saint-Gobain CHR M824 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape |
| Manufacturer | Saint-Gobain |
| Backing Material | Polyester Film |
| Adhesive Type | Silicone |
| Tape Type | Pressure Sensitive Tape |
| Color | Blue |
| Total Thickness | 3.0 mil (0.076 mm) |
| Backing Thickness | 2.0 mil (0.051 mm) |
| Adhesive Thickness | 1.0 mil (0.025 mm) |
| Adhesion To Steel | 25 oz/in (27.3 N/100mm) |
| Tensile Strength | 25 lb/in (438 N/100mm) |
| Elongation At Break | 100% |
| Dielectric Strength | 5,500 V |
| Temperature Range | -100°F to 400°F (-73°C to 204°C) |
| Core Diameter | 3 in (76.2 mm) |
| Standard Length | 36 yd (32.9 m) |
| Shelf Life | 12 months |
As an accredited Saint-Gobain CHR M824 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Saint-Gobain CHR M824 tape is packaged as one roll per package, wound on a core, sealed in plastic, and labeled. |
| Container Loading (20′ FCL) | 20′ FCL loaded with palletized rolls of Saint-Gobain CHR M824 polyester film-backed silicone adhesive pressure-sensitive tape, braced for ocean transport. |
| Shipping | Saint-Gobain CHR M824 pressure-sensitive tape is generally shipped as a non-hazardous, non-regulated article. It requires no UN number, hazard class, packing group, or special transport placards under DOT, IATA, or IMDG. Ship in original sealed cartons at ambient temperature, protected from heat, moisture, and direct sunlight. |
| Storage | Store Saint-Gobain CHR M824 tape in a cool, dry, well-ventilated area away from direct sunlight, heat, sparks, flames, moisture, ozone, and incompatible chemicals. Keep in original sealed packaging, upright, and protected from physical damage. Recommended conditions: 15–25°C (59–77°F) and 40–60% RH. Rotate stock, use oldest first, and observe shelf life. |
| Shelf Life | Shelf life is typically 12 months from date of manufacture when stored in original packaging at 21°C and 50% relative humidity. |
Saint-Gobain CHR M824 polyester film backing with silicone pressure-sensitive adhesive functions in coil winding operations as interlayer insulation, slot liner anchoring, and lead fixing tape. The formulation addition ratio applicable to compounded raw materials does not apply to this pre-coated tape; the downstream analog is the taping coverage ratio. For interlayer insulation, the tape is applied by tape-traversing heads mounted on programmable spindle winders with a spiral overlap of 50%, meaning each wrap covers half of the preceding wrap and produces two backing thicknesses at any point along the winding axis. This overlap derives from creepage and clearance requirements rather than from adhesive formulation limits. The governing compliance documents in this segment are IEC 60454-3-12 for polyester film tapes with silicone adhesive and UL 510 for pressure-sensitive insulating tape; dielectric performance is verified by ASTM D149. The downstream production process proceeds from winding into vacuum-pressure impregnation with solventless epoxy or unsaturated polyester varnish, followed by cure at 150–180 °C for 2–6 h. The dominant field failure observed on motor winding equipment is not cohesive failure of the film but adhesive exudation and edge lift during varnish cure; if silicone adhesive migrates into the varnish, coil bond strength can decline and partial discharge behavior may shift. Because silicone adhesive can interfere with adhesion, users verify varnish compatibility on actual stator and transformer configurations before production release, especially with high-solids and fast-cure varnish systems. The terminal finished products in this segment include Class F electric motor stator coils, toroidal transformers, solenoid coils, and low-voltage reactor windings. The tape layer count is not increased beyond two backing thicknesses because additional thickness alters the winding window fill factor and thermal impedance under load.
Across powder coating operations, the polyester/silicone tape is specified as a detachable cure maskant for bearing journals, threaded bores, grounding pads, and machined mating surfaces that must remain free of thermoset powder. The formulation addition ratio is not applicable to a pre-coated masking tape; the downstream equivalent is the maskant coverage ratio. The tape is applied in a single layer with edge overlap of 2–3 mm, and butt joints are not accepted because they open during thermal expansion of the part. The relevant compliance framework for finished coated parts includes AAMA 2604 and AAMA 2605 for architectural coating performance; the tape backing’s dimensional behavior is evaluated by ASTM D1204, and peel adhesion is checked by ASTM D3330. In the downstream process, parts enter an electrostatic spray booth where the powder is charged and deposited, then pass through a convection or infrared cure oven. Typical powder coating cure conditions for polyester/TGIC and polyurethane powders range from 190 °C to 200 °C for 10–15 min. The dominant failure mode on full-scale lines is edge lift at concave radii and through-hole edges caused by differential thermal expansion between the polyethylene terephthalate backing and the metal substrate. Operators observe that demasking after parts have cooled below 60 °C reduces adhesive splitting and residual adhesive scrim. The terminal products are architectural aluminum extrusions, automotive brake brackets, cast pump housings, and metal furniture components. Tape removal must occur before final inspection and adhesion testing because silicone residue can affect subsequent adhesive bonding or wet paint overcoat.
Printed circuit board fabricators apply the tape to gold or palladium edge contacts before hot air solder leveling or wave soldering to prevent solder wetting on non-solderable surfaces. The downstream usage ratio is strictly a single layer, with tape overhanging the masked edge by 0.5–1 mm; multiple layers are not used because the added thermal mass changes the local solder thermal profile and can trap flux under the adhesive edge. In the production process, the printed circuit board is fluxed and preheated to 100–130 °C, then transported through a molten SAC305 wave at 250–260 °C for 2–5 s, followed by hot air knives for excess solder removal. The relevant compliance standards are IPC J-STD-001H for soldered electrical and electronic assembly and IPC A-610H for acceptability; ionic cleanliness is tested by IPC-TM-650 2.3.25. The main process rejection route on the production floor is not film tearing but flux migration beneath the adhesive edge during preheat, which can leave a solderable or contaminated margin after tape removal. If silicone adhesive transfers to the gold surface, downstream gold wire bonding and connector plating processes may exhibit dewetting; therefore boards are demasked only after cooling below 40 °C to reduce adhesive transfer at the interface. The formulation addition ratio for this tape does not apply because the silicone adhesive is already coated at the converter; the equivalent process parameter is the tape-to-board masked area ratio per panel as defined by the selective masking program. Terminal finished products include PCIe adapter cards, DIMM memory modules, industrial backplanes, and automotive ECU boards.
When a silicone-coated release liner is converted into narrow rolls on zero-speed turret winders, splicing performance is governed by the ability of the tape to grip a low-surface-energy substrate immediately after the knife cut. In this downstream process, the tape is used as a flying splice between the expiring web and the new core leader. The formulation addition ratio does not apply; the operational ratio is the splice pad width as a percentage of web width. A full-web splice uses a single layer with 10–20 mm overlap onto the expiring web and the new leader, while a limited-width splice may cover 50–75% of the web width where web tension permits. Compliance is process-driven under ISO 9001:2015, with tape properties evaluated by ASTM D3330 peel adhesion and ASTM D3759 tensile strength. The production bottleneck observed on turret winders running above 300 m/min is the millisecond-scale bond development required at the nip; the tape must be consolidated by a nip roller at 2–4 bar to displace boundary-layer air and wet the silicone release surface. Polyester backing is preferred over vinyl because its modulus prevents splice stretching under web tension, but the splice creates a thickness step that can mark rolls during winding. Converters therefore reject splices whose combined thickness step exceeds the roll profile tolerance for the finished slitting grade, and slit rolls are scanned by contact charge-coupled device or laser profilometers for step defects. The terminal products in this segment are release liners for pressure-sensitive labelstock, wound care dressings, silicone-coated kraft for graphic films, and process liners for transdermal patches.
| Application segment | Compliance standard | Test method | Process-control limitation |
|---|---|---|---|
| Electrical coil insulation | IEC 60454-3-12, UL 510 | ASTM D149 | Adhesive exudation during varnish cure |
| Powder coating cure masking | AAMA 2604/2605 | ASTM D1204 | Edge lift due to film shrinkage at cure oven residence |
| PCB maskant before hot air solder leveling | IPC J-STD-001H, IPC A-610H | IPC-TM-650 2.3.25 | Flux migration under tape edge |
| Release liner splicing | ISO 9001:2015 | ASTM D3330, ASTM D3759 | Splice step height and edge peel at turret winders |
| Conformal coating masking | IPC CC-830B, IPC A-610H | ASTM D3330 | Adhesive transfer to keep-out zones after cure |
In selective conformal coating operations, the tape masks connector pins, press-fit zones, and test points before application of acrylic, polyurethane, or silicone coating. The application ratio for this pre-coated pressure-sensitive adhesive film is a single layer; because the masking footprint is defined by printed circuit board design keep-out zones, the tape edge is placed within 0.5 mm of the keep-out boundary and overlap is not used. The relevant compliance framework includes IPC CC-830B for conformal coating qualification and IPC A-610H for electronic assembly acceptability; tape adhesion and removability are evaluated by ASTM D3330. In production, the coating is applied by selective spray equipment or needle dispense systems, then cured at 60–100 °C for 10–60 min depending on coating chemistry and board thermal mass. The primary process failure is adhesive transfer to the substrate after cure; if the tape is removed too late or at elevated temperature, silicone residue can remain in the keep-out zone and create connector mating or wire bonding anomalies. Because this adhesive chemistry contains silicone, surfaces that will later be adhesive-bonded or painted require plasma or corona treatment after tape removal; published data for this specific configuration is limited, so users must validate surface energy and adhesion on actual assemblies. The terminal products are automotive ECU modules, battery management electronics, industrial sensors, and avionics boards with selectively coated regions. The tape is not reused; it is removed after coating cure and before soldering or press-fit operations.
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Saint-Gobain CHR M824 is a pressure-sensitive tape constructed from a biaxially oriented polyethylene terephthalate carrier and a silicone pressure-sensitive adhesive. It is specified for high-temperature masking, splicing of silicone-coated release liners, protection during powder coating cure, and electrical isolation where clean removal from low-energy surfaces is controlling. The manufacturer’s technical bulletin lists a nominal total thickness of 0.051 mm (2.0 mil) per ASTM D3652, 180° peel adhesion to stainless steel of 33 N/100 mm (30 oz/in.) per ASTM D3330, and backing tensile strength of 438 N/100 mm (25 lbf/in.) with elongation at break of 120% per ASTM D3759. Dielectric breakdown is reported as 5.0 kV per ASTM D149. These nominal values define a moderately conformable film tape rather than a high-elongation vinyl or a thick rubber-based masking product.
The functional distinction comes from the silicone adhesive. A polyorganosiloxane pressure-sensitive adhesive maintains chain mobility at elevated temperature and has a low surface energy near 22–24 mN/m. This permits wet-out on silicone liners and release-coated tooling that acrylic or rubber adhesives cannot reliably bond. After exposure to bake cycles at 180°C, cohesive integrity is retained better than in acrylic systems, which can further crosslink, oxidize, or transfer residue. Adhesion is not the only criterion: silicone systems are selected when tape removal after cure must not generate siloxane transfer or visible residue on the workpiece, especially in subsequent liquid-coating operations.
The mechanical response of the carrier is relevant for dimensional control. Biaxially oriented PET has relatively high stiffness and low creep under room-temperature tension, so a 2.0 mil tape holds a straight edge during manual taping and die cutting. Elongation at break of 120% should not be interpreted as conformability: most of the extension occurs after yield and is not recoverable in process. Converting operations that require sharp bends or complex curved masks should evaluate minimum bend radius and springback before tooling is cut, because the tape will not behave like a rubber or polyurethane masking product.
Acrylic pressure-sensitive adhesives derive high initial peel strength from polar interactions with metals and glass, but they often harden or leave residues after thermal cycling. Rubber-based adhesives are built on unsaturated elastomer networks with limited oxidation resistance. Both classes can embrittle, split, or transfer adhesive fragments when exposed above their rated limits. A silicone adhesive on CHR M824 is formulated as a crosslinked polyorganosiloxane network. Its crosslink density and low surface energy reduce the tendency for adhesive shear failure during removal from stainless steel, glass, and silicone-coated papers, provided the tape is removed within the specified temperature window. The tape is therefore used for splicing silicone-coated release liners, masking cured silicone surfaces, and protecting platen or tooling surfaces where adhesive residue is a processing defect, not merely a cosmetic issue.
| Property | Manufacturer-published typical value | Test method |
|---|---|---|
| Total thickness | 0.051 mm (2.0 mil) | ASTM D3652 |
| Peel adhesion to stainless steel | 33 N/100 mm (30 oz/in.) | ASTM D3330 |
| Backing tensile strength | 438 N/100 mm (25 lbf/in.) | ASTM D3759 |
| Elongation at break | 120% | ASTM D3759 |
| Dielectric breakdown voltage | 5.0 kV | ASTM D149 |
| Continuous service temperature | −73°C to 180°C | Manufacturer thermal rating |
| Short-term thermal excursion | 200°C | Manufacturer process limit |
The table values are manufacturer-published typical values and should be verified against the current revision of the technical bulletin before inclusion in purchase specifications. ASTM procedures vary with specimen width, dwell time, and peel angle.
In production-scale powder coating facilities, edge lifting and under-masking are the most frequently observed failure modes. These failures are not solely adhesive deficiencies; they are often caused by residual oils on the workpiece, insufficient application pressure, or excessive film tension during manual taping. A common process sequence includes solvent degreasing, wiping with 70% isopropanol / 30% deionized water, application at 20–25°C, and a dwell time of 15–30 min before oven loading. Under these conditions, CHR M824 holds a straight edge on flat and moderately curved surfaces. On radii below approximately 1.5 mm, the polyester carrier may bridge and create an opening; the tape should be segmented or the design should specify a more conformable carrier. High-humidity application above 60% RH can reduce initial tack because condensation on the workpiece acts as a weak boundary layer.
Chemical compatibility is a separate operational boundary. PET undergoes hydrolysis in hot alkaline aqueous solutions above 60°C, and the tape is not recommended for immersion in aggressive aromatic hydrocarbons, chlorinated solvents, or strong alkaline strippers. Silicone adhesives can be attacked by certain silicone fluids and solvent blends at elevated temperature. In facilities that operate both silicone-containing masking products and Class A liquid painting lines, the tape should be segregated from paint preparation areas because trace siloxane transfer can produce surface craters even at low levels. Compliance with REACH 1907/2006 and RoHS 2011/65/EU is commonly addressed in manufacturer documentation, but food-contact status under FDA 21 CFR 177.1550 should not be assumed without grade-specific certification.
In cleanroom and electronics assembly, silicone outgassing can be a specification constraint. Low-molecular-weight siloxane species can volatilize under vacuum or high-temperature bake and condense on optical surfaces or relay contacts. CHR M824 is not generally classified as a low-outgassing product for space applications; users requiring ASTM E595 total mass loss below 1.0% should request lot-specific data. Published data for this specific configuration under ASTM E595 is limited, and the tape should not be substituted into a qualified space-grade assembly without additional testing.
The thermal limit of CHR M824 is governed primarily by the polyethylene terephthalate carrier. Silicone pressure-sensitive adhesives can withstand short excursions to 260°C in air, but biaxially oriented PET begins to shrink and lose dimensional stability above 180–200°C. The manufacturer rates the tape for continuous service up to 180°C, with short-term exposure to 200°C depending on dwell time, air velocity, and load. A forced-air oven with non-uniform temperature distribution can create localized hot spots that exceed the PET limit and produce edge lift, adhesive oozing, or carrier embrittlement after repeated cycles. These are application-specific failure modes and should not be attributed solely to the silicone adhesive.
For sustained 260°C exposure, polyimide/silicone tape is the usual substitution. Polyimide retains dimensional stability and dielectric strength at higher temperatures, but it is generally more expensive and less conformable than PET. Compared with a polyester/acrylic tape, CHR M824 offers higher thermal capability and better adhesion to silicone surfaces; compared with polyimide/silicone, it offers lower cost and greater conformability at the expense of continuous thermal rating. The distinction is not based on one property but on the temperature, surface energy, and residue constraints of the specific production line.
| Tape class | Adhesive chemistry | Continuous thermal limit | Adhesion to silicone surfaces | Residue risk after bake | Relative cost position |
|---|---|---|---|---|---|
| Saint-Gobain CHR M824 | Silicone | 180°C PET-limited | High | Low | Intermediate |
| Polyester/acrylic | Acrylic | 130°C | Poor | Moderate | Lower |
| Polyimide/silicone | Silicone | 260°C | High | Low | Higher |
| Polyester/rubber | Rubber | 80–100°C | Poor | High | Lowest |
The comparative matrix is generalized for industrial masking and splicing tapes. Specific adhesion values and thermal ratings depend on the manufacturer, grade, and test method; the table should be used only as a selection guide, not as a purchase specification.
For coil wrapping, busbar insulation, and harness bundling, the relevant specification is dielectric breakdown voltage rather than peel adhesion alone. The reported breakdown value of 5.0 kV per ASTM D149 is electrode-configuration dependent and does not establish a continuous working voltage. In transformer and motor manufacturing, the tape is applied with multiple layers and staggered laps to prevent creepage paths. The 2.0 mil thickness provides limited mechanical protection against cut-through from sharp copper edges; a single layer should not be used where the film is stressed over a bare conductor edge. Typical practice uses 50% overlap or double-layer construction to reduce the probability of pinhole failure, particularly after varnish impregnation at 120–150°C.
Polyester film has high intrinsic dielectric strength, but final insulation performance depends on impregnating resin, winding tension, and conductor-edge quality. In vacuum-pressure impregnation, the tape must allow resin penetration through gaps or edge bleed paths. CHR M824 is a continuous film rather than a porous or creped product; complete resin saturation through the film is not possible. The tape should be specified as an outer wrap or with a taping pattern that leaves controlled gaps for resin flow. Published data for impregnation bleed-through performance in this specific configuration is limited; winding trials are recommended before production qualification.
High-humidity environments above 85% RH reduce surface resistivity and increase partial-discharge risk at insulation defects. Although PET film has low moisture absorption, contamination on the film or adhesive can create conductive paths. Storage should be maintained at 20–25°C and 50% RH in sealed polyethylene packaging. The tape should not be subjected to condensation cycling unless the assembly is evaluated for adhesive loss and electrical tracking under the specific operating conditions.