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Saint-Gobain CHR M815 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR M815 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 442501
    Product Name Saint-Gobain CHR M815 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape
    Backing Material Polyester film
    Adhesive Type Silicone
    Tape Type Pressure sensitive
    Total Thickness 2.0 mil (0.051 mm)
    Backing Thickness 1.0 mil (0.025 mm)
    Adhesive Thickness 1.0 mil (0.025 mm)
    Color Translucent
    Adhesion To Steel 25 oz/in (27 N/100 mm)
    Tensile Strength 25 lb/in (44 N/10 mm)
    Elongation At Break 100%
    Operating Temperature Range -100°F to 400°F (-73°C to 204°C)
    Dielectric Strength 5000 V
    Insulation Resistance 1 x 10^6 megohms

    As an accredited Saint-Gobain CHR M815 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Saint-Gobain CHR M815 tape is supplied one roll per box, individually wrapped, with multiple boxes per shipping carton.
    Container Loading (20′ FCL) 20′ FCL loading: Saint-Gobain CHR M815 polyester film silicone adhesive pressure-sensitive tape, palletized, strapped, moisture-protected, evenly distributed, secured for ocean transport.
    Shipping Saint-Gobain CHR M815 tape ships as non-hazardous, non-regulated goods under normal transport rules. Keep in original sealed packaging, dry, at ambient temperature, away from direct sunlight and moisture. Avoid crushing or punctures. Standard surface or air freight is suitable; confirm current SDS before shipping. No special labels usually required.
    Storage Store Saint-Gobain CHR M815 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape in its original sealed packaging in a cool, dry, well-ventilated area. Protect from direct sunlight, heat, moisture, dust, and ignition sources. Maintain 15–25°C and 40–60% relative humidity. Keep away from solvents, oils, oxidizers, and sharp objects. Rotate stock, using oldest first. Avoid prolonged exposure to excessive temperatures.
    Shelf Life Shelf life is 12 months from manufacture when stored in original packaging at 70°F (21°C) and 50% relative humidity.
    Application of Saint-Gobain CHR M815 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape

    In a thermoset powder coating line processing cast A356 aluminum electrical enclosures, Saint-Gobain CHR M815 is die-cut into annular masks for bearing bores, threaded bosses, and grounding pads before the parts enter a 7-stage aqueous cleaning and iron phosphate pretreatment line. Application is performed after the dry-off oven at a part surface temperature between 30 °C and 40 °C, using a pneumatically actuated fixture that presses each mask at 0.20 MPa to 0.35 MPa for 2 s to 4 s; this seating pressure collapses air channels without yielding the polyester film carrier. Tape lot acceptance includes thickness per ASTM D3652/D3652M and tensile strength and elongation at break per ASTM D3759/D3759M. The polyester film retains its tensile integrity during the 180 °C to 200 °C powder cure cycle, which is held for 15 min to 20 min at metal temperature depending on whether the powder is epoxy-polyester hybrid or polyester-TGIC chemistry. The silicone adhesive is selected because it does not soften enough to permit powder entrapment under the mask edge during electrostatic deposition, and because its post-cure peel from the phosphate substrate leaves no visible residue on production witness panels evaluated with a modified ASTM D3330/D3330M peel protocol. Removal is specified only after the shell temperature has dropped below 60 °C to preclude cohesive splitting of the silicone adhesive layer. The masking tape is not part of the final assembly; its compliance obligations are limited to RoHS Directive 2011/65/EU documentation for the polyester film and silicone adhesive, and the processor must verify that no silicone transfer remains on the phosphate surface before electrical bonding because silicone contamination can raise contact resistance at grounding interfaces. The terminal product is a coated enclosure with electrically conductive grounding pads and unfilled threaded mounts.

    What Boundaries Constrain Polyester-Film Masking During Autoclave Cure of Epoxy Prepregs?

    Within autoclave-cured epoxy prepreg manufacturing, the tape is applied as flash tape and tool flange edge protection where bagging films attach to steel or aluminum tooling; it is not positioned as a bag-side sealant or exposed to direct peel-ply bond surfaces. The silicone adhesive must be isolated from the abraded adherend, because transfer onto 180-grit abraded aluminum can reduce water-break-free surface quality and interfere with single-lap shear results measured per ASTM D1002. The polyester backing is dimensionally stable only within a defined thermal window; when the autoclave ramp exceeds 180 °C at 6 bar, biaxially oriented polyethylene terephthalate undergoes stress relaxation, and shrinkage measured in accordance with ASTM D1204 may exceed 2.0 %. The tape is therefore specified for 120 °C to 180 °C epoxy cure cycles rather than bismaleimide or polyimide cycles that exceed the carrier relaxation threshold. Tape is applied with 25 mm overlap on tool flanges, rolled with a hand roller at 0.15 MPa to 0.25 MPa, and removed only after the tooling cools below 50 °C. Surface contamination is monitored by water contact angle; acceptance criteria typically require a change of less than 5° from the pre-tape baseline. Published peel force data for this specific tool flange configuration is limited; production acceptance therefore relies on a 10-piece initial trial and subsequent lot-based visual inspection under 20× magnification. The terminal composite part remains unmasked on bond line surfaces, with the tape confined to trim waste and vacuum bag edges.

    Within selective conformal coating cells for automotive electronic control units, the tape is laser-cut to board-specific perimeter masks with a 1.0 mm standoff from through-hole vias and is applied over board-to-board headers and unpopulated test points before an acrylic urethane coating is dispensed by a three-axis robot traversing at 0.2 m/s. The coating is thermally cured for 30 min at 85 °C, which is below the polyester backing relaxation threshold; the silicone adhesive is removed after cooling to 45 °C to avoid residue transfer to the coating edge. Process engineers use the tape because its adhesive system does not contain amide or olefin curing agents that might ionize under board bias. Cleanliness after mask removal is verified by a solvent extract resistivity test consistent with IPC-TM-650 Method 2.3.25 using 75 % isopropyl alcohol and 25 % deionized water; assemblies must return above 1.0 × 10^6 Ω·cm in the extract solution. Gold contact surfaces are then inspected for residual silicone by X-ray photoelectron spectroscopy when a change in the C 1s/Si 2p peak area is suspected after residue-free visual inspection at 10×. Compliance records include a supplier declaration under REACH Regulation (EC) No 1907/2006 for the silicone adhesive and polyester film. The final assembly is a coated printed circuit board with uncoated connector land pads and no masking residue that could alter subsequent press-fit connector insertion force.

    Photovoltaic Laminator Ribbon Retention without Silicone Transfer

    During the layup of crystalline silicon photovoltaic modules, the tape is used to secure solder-coated copper bus ribbons and edge leads to the glass/backsheet layup before ethylene-vinyl acetate lamination. The lamination recipe uses a membrane vacuum laminator at 145 °C to 150 °C for 12 min to 18 min, with vacuum pressure held below 1 kPa absolute during the initial 3 min to remove air from the encapsulant package. The silicone adhesive is non-carboxylated and is supplied on a fully cured polyester carrier, minimizing volatile outgas risk during EVA crosslinking; however, the tape is not placed between glass and EVA, only on the exposed backsheet edge. Removal is completed after the laminate cools below 40 °C so that the adhesive does not pull EVA from the ribbon surface. The shear forces on the tape during module handling are below 0.05 N/mm²; if the layup is subject to an anti-reflective glass coating etch or edge trim waterjet, the tape is replaced with a polyimide tape having a higher service temperature. Published peel force data for this specific backsheet interface is limited; process acceptance relies on a 10-piece initial trial and 50-lot optical inspection for residual adhesive transfer. The final assembly is a framed module with straight ribbon paths and no residual silicone on the electrical contact zones.

    When Sulfuric Acid Anodizing Bath Time Exceeds Ten Minutes, Polyester Masking Requires a Secondary Edge Seal

    In Type II sulfuric acid anodizing of 6061-T6 aluminum machined housings, the tape is used as a temporary mask over threaded bores and O-ring counterbores that must remain electrically conductive and dimensionally unchamfered. The bath operates at 18 °C to 22 °C with a sulfuric acid concentration of 150 g/L to 200 g/L and a current density of 1.2 A/dm² to 1.7 A/dm² in accordance with MIL-A-8625 Type II; the polyester backing resists acid penetration for short cycle times, but production trials have demonstrated that immersion beyond 10 min to 15 min allows acid wicking at the adhesive edge and can produce localized anodic attack under the mask periphery. Where cycle times exceed 15 min, the tape is used only after the masked feature is sealed with an acid-resistant lacquer or elastomeric boot, because the polyester film is not a continuous barrier under mechanical agitation. The tape is applied to dry surfaces at 20 °C to 25 °C using a pressure of 0.1 MPa to 0.2 MPa and inspected for creases that form acid channels. After anodizing, the tape is removed before hot de-ionized water sealing at 90 °C, because the adhesive softens and may leave cohesive residue if sealed in place. The finished component is an anodized housing with uncoated threaded holes and a clean sealing groove; residue is inspected by optical microscopy at 20× magnification under a dark-field setting, and any adhesive transfer is rejected as a potential ingress path for hydraulic fluid.

    Stator VPI Process Windows Demand a Single-Bake Mask with Controlled Peel Adhesion

    Electric motor stator and rotor assemblies are masked before trickle impregnation or vacuum-pressure impregnation with unsaturated polyester or epoxy insulating varnish. The tape is applied to bearing bore faces, terminal lug faces, and rotor shaft journals to prevent varnish from forming a hard insulating layer that would impair eutectic aluminum bonding or press-fit concentricity. Trickle impregnation is carried out at 150 °C to 165 °C for 30 min to 60 min; the tape must remain in place despite exposure to varnish drip and air impingement from induction preheat units. The silicone adhesive is preferred because it does not carbonize at these temperatures; post-cure peel adhesion to ground cast iron is verified on witness coupons using ASTM D3330/D3330M after the same thermal profile. However, repeated processing cycles through 180 °C can embrittle the polyester backing, so the tape is rated for 1 bake cycle only; a second cycle at 180 °C on the same tape may produce transverse film cracks and leave fractured fragments in the varnish bath. Production lots are accepted when peel force remains below 10 N/25 mm and no visible residue remains on the stator face. Supplier documentation for the adhesive and backing in this application is maintained under REACH Regulation (EC) No 1907/2006 and RoHS Directive 2011/65/EU. The final product is a stator ready for bearing insertion, with no varnish coating on the ground surfaces that define the mechanical fit.

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    Certification & Compliance
    More Introduction

    Saint-Gobain CHR M815 is a single-coated pressure-sensitive tape manufactured from a biaxially oriented poly(ethylene terephthalate) backing and a crosslinked polydimethylsiloxane pressure-sensitive adhesive. The product is supplied in log-roll form and is specified for high-temperature masking, electrical insulation, splicing, and release-surface protection. Manufacturer-published data list a total thickness of 0.064 mm (2.5 mil) with backing and adhesive layers of 0.025 mm (1 mil) and 0.038 mm (1.5 mil) respectively. The silicone adhesive is selected over acrylic and rubber chemistries because its low glass transition temperature and siloxane backbone confer stable peel, tack, and dielectric properties across the range −73 °C to 204 °C, although the polyester backing imposes practical exposure limits below the adhesive’s oxidative ceiling. The product is not a flame-retardant glass cloth or a polyimide tape; its differentiating profile lies in clean die-cutting, controlled elongation, and compatibility with low-surface-energy substrates.

    PropertyTypical published valueTest method
    Total thickness0.064 mm (2.5 mil)ASTM D3652/D3652M
    Backing thickness0.025 mm (1 mil)ASTM D3652/D3652M
    Adhesive thickness0.038 mm (1.5 mil)ASTM D3652/D3652M
    Peel adhesion to stainless steel0.70 N/mm (25 oz/in)ASTM D3330/D3330M
    Tensile strength175 N/25 mm (25 lb/in)ASTM D3759/D3759M
    Elongation at break100%ASTM D3759/D3759M
    Dielectric breakdown voltage5.0 kVASTM D1000
    Adhesive service temperature range−73 °C to 204 °CSupplier thermal rating
    Polyester backing continuous-use practical limit150 °C to 180 °C depending on dwellSupplier backing data

    What Distinguishes a Silicone PSA from Acrylic and Rubber Tape Adhesives on the Same Polyester Backing?

    The primary technical distinction is the low glass transition temperature of the siloxane network. A polydimethylsiloxane pressure-sensitive adhesive containing silicate resin tackifier retains segmental mobility at temperatures below −73 °C, whereas many acrylic PSAs show peel-adhesion loss below −20 °C and rubber-resin systems below 0 °C. On the high-temperature side, the silicone adhesive can withstand short-term excursions to 204 °C without rapid oxidative crosslinking or charring; acrylic and rubber PSAs generally lose cohesive strength or undergo discoloration above 120 °C to 150 °C. The trade-off is room-temperature peel on high-energy metals. The M815 silicone adhesive exhibits a stainless-steel peel value near 0.70 N/mm, which is lower than many aggressive acrylics but more stable across the stated service range. This property set makes the product suitable for applications where temperature cycling is the primary stress, rather than high initial tack to porous or oxidized metal surfaces.

    Powder Coating Ovens and Thermal Exposure Boundaries

    Masking of threaded holes, bearing seats, and grounding points on powder coating lines places M815 in direct contact with e-coat residues, zinc phosphate pretreatment chemistries, and electrostatic spray deposition equipment. In convection cure ovens operating at 180 °C to 204 °C for 10 min to 30 min, the silicone adhesive remains below its decomposition threshold and the polyester backing exhibits limited shrinkage. However, production-scale lines with infrared preheat zones can elevate substrate surface temperature above 220 °C; under those conditions the PET backing may lose tensile elongation and curl along masked edges. Published peel-residue data for cyclic exposure beyond 204 °C is limited. On continuous powder lines, dwell is usually restricted to a single cure cycle because accumulated exposure above 180 °C embrittles the polyester film. Removal is typically carried out after cooling to 60 °C or lower to avoid adhesive transfer onto freshly cured powder films. Masked edges should be inspected for adhesive residue because silicone transfer is not always visible without a water-break or dyne test.

    Electrical insulation applications impose a separate set of dielectric and thermal endurance requirements. M815 is applied as interlayer insulation in solenoid coils, transformer assemblies, and harness bundling where the dielectric breakdown voltage of 5.0 kV under ASTM D1000 provides a short-term breakdown indicator. Because the backing is PET, the construction is not equivalent to a polyimide tape rated for Class H operation. Continuous thermal endurance of the polyester backing aligns with Class B or Class F limits depending on varnish impregnation and ventilation; manufacturers usually evaluate the composite under IEC 60454-2 rather than assigning a blanket insulation class. In varnished transformer windings, the silicone adhesive must be checked for compatibility with epoxy and polyester impregnating varnishes because siloxane surface energy can reduce varnish wetting at the tape edge. Solventless epoxy varnishes, in particular, may exhibit cratering if silicone contamination is present on adjacent copper surfaces. ASTM D1000 and IEC 60454-2 do not by themselves qualify a tape for reinforced insulation.

    When Silicone Adhesive Must Interface with Low-Surface-Energy Substrates

    Silicone pressure-sensitive adhesives maintain measurable wetting on release-coated and fluoropolymer surfaces where acrylic systems exhibit interfacial failure. M815 is therefore used as a splicing tape for silicone-coated release papers, fluoropolymer films, and wax-modified packaging webs. On these substrates, peel adhesion to stainless steel is not predictive; manufacturers may report dwell-dependent peel values on representative low-energy panels using ASTM D3330/D3330M. Wet-out on silicone-coated substrates typically requires a dwell of 24 h at 23 °C before maximum peel is reached because the siloxane chains reorient at the interface. This time-dependent adhesion is a recognized operational boundary: high-speed web splicing lines attempting to use M815 as a flying splice tape without allowing dwell may observe low initial tack and splice failure. The product should not be substituted for aggressive acrylic splicing tapes on porous paper or board where high initial tack and peel are required. For low-energy webs, however, the silicone chemistry provides a lower interfacial free-energy mismatch than acrylic systems, which can be a decisive factor in release-liner splicing.

    Die-cutting and slitting of M815 are performed on rotary-die presses, flatbed cutting tables, or slitter rewinders equipped with razor or rotary shear tooling. The silicone adhesive’s low glass transition temperature and high elongation produce lower cutting forces than those required for polyimide-backed tapes, but the adhesive can flow at the cut edge if blade temperatures exceed 50 °C. Adhesive build-up on die blades during continuous operation causes edge stringing and increases roll-edge tack. Production equipment with chilled die stations or anilox rollers set to 10 °C to 20 °C reduces edge adhesive flow. The 100% elongation at break of the backing permits rotary die-cut parts to be ejected without tearing under moderate vacuum, but it also causes dimensional change under high tension; slitting tensions above 0.7 N/mm of web width can induce telescoping in wound rolls. Lamination to high-density papers or polymeric films should be performed at nip pressures below 0.2 MPa to avoid adhesive bleed. Because M815 is silicone-based, die-cutting blades and release liners exposed to it may retain siloxane contamination; subsequent adhesive lamination operations can be compromised.

    Examining Solvent Resistance and Adhesive Migration Thresholds

    Chemical exposure limits for M815 are governed less by the PET backing than by the swelling response of the crosslinked siloxane network. Silicone PSAs absorb nonpolar aromatic solvents such as toluene and xylene; prolonged immersion causes adhesive swelling, loss of peel, and subsequent residue transfer. Testing under ASTM D896 or an equivalent immersion practice is appropriate when M815 must survive brief contact with cleaning solvents, cutting fluids, or conformal coating thinners. The polyester backing resists aliphatic hydrocarbons, alcohols, and dilute acids, but it is attacked by strong alkalis, concentrated sulfuric acid, and some phenolic solvents. In masking operations involving chlorinated solvent degreasing, the tape should be qualified for short-term splash contact only; published data for long-term immersion in this configuration is limited. Adhesive migration is a further boundary condition. Because the silicone PSA contains low-molecular-weight siloxane fractions, contact with electrostatically sensitive surfaces or paint systems may require silicone-free alternatives. For that reason, aerospace paint-prep operations often prohibit silicone tapes within the painting envelope unless process trials demonstrate post-wash removal of siloxane residues.

    Compliance Standards and Verification Documents

    Verification documents for M815 are application-dependent and should be requested as controlled copies from the supplier’s quality system. Electrical tape users may review conformance to ASTM D1000 test methods and applicable insulation-system approvals; the polyester backing is not generally recognized as an UL 510 polyimide or glass cloth insulation. For indirect food-contact adhesives, relevant regulatory status may be evaluated under FDA 21 CFR 175.105, but the user must confirm the specific adhesive formulation and end-use temperature. Heavy-metal restrictions are commonly assessed under RoHS 2011/65/EU; REACH obligations require that the supplier disclose candidate-list substances when present above 0.1% w/w. None of these documents eliminates the need for process-specific qualification because M815 can leave siloxane residues that interfere with subsequent printing, bonding, or coating operations. In cleanroom applications, particle count and outgassing data should be requested; standard ASTM peel and dielectric data do not quantify volatile siloxane transfer. When the tape is used as a temporary masking aid in bonding processes, plasma or corona treatment after removal may be required to restore surface energy on contaminated substrates.

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