| HS Code | 390976 |
| Backing Material | Polyester Film |
| Adhesive Type | Silicone |
| Total Thickness | 2.3 mil (0.058 mm) |
| Backing Thickness | 1.0 mil (0.025 mm) |
| Adhesive Thickness | 1.3 mil (0.033 mm) |
| Color | White |
| Adhesion To Steel | 30 oz/in (3.3 N/cm) |
| Tensile Strength | 25 lb/in (44 N/10 mm) |
| Elongation At Break | 100% |
| Dielectric Strength | 5,000 V |
| Operating Temperature Range | -100°F to 400°F (-73°C to 204°C) |
| Core Diameter | 3 in |
| Standard Roll Length | 36 yd |
As an accredited Saint-Gobain CHR M758 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Each package contains one roll of Saint-Gobain CHR M758 tape, individually wrapped and clearly labeled with product and lot information. |
| Container Loading (20′ FCL) | 20′ FCL loading: palletized Saint-Gobain CHR M758 polyester film-backed silicone adhesive pressure-sensitive tape rolls, shrink-wrapped and secured for ocean transport. |
| Shipping | Saint-Gobain CHR M758 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape ships as non-hazardous goods in rolls, packed in cartons with protective wraps. Keep dry, cool, and out of direct sunlight. Avoid crushing, punctures, and extreme temperatures. Standard ground/air transport applies unless carrier specifies otherwise. |
| Storage | Store Saint-Gobain CHR M758 tape in a cool, dry, well-ventilated area away from direct sunlight, heat, sparks, flames, moisture, and incompatible chemicals. Keep in original sealed packaging, clearly labelled, upright, and protected from dust, oils, and pressure. Maintain moderate, stable temperature; avoid freezing unless specified. Observe shelf-life and stock rotation. Follow manufacturer’s SDS and local regulations, and keep containers closed when not in use. |
| Shelf Life | Shelf life is 12 months from date of manufacture when stored in original packaging at 21°C and 50% relative humidity. |
In automotive and architectural powder coating lines, Saint-Gobain CHR M758 is applied to machined flanges, threaded bosses, earth studs, and bearing bores before electrostatic spray. The converting formulation ratio sets the silicone adhesive addition at 32–38 g/m² dry coat weight over a 35 g/m² biaxially oriented polyester backing of 0.025 mm thickness; this corresponds to a dry silicone adhesive mass fraction of 48–52 wt% of the total 0.076 mm laminate and a dry-film thickness ratio of approximately 1.2:1 to 1.5:1. The silicone layer is crosslinked during solvent-borne coated web conversion. In production, the tape is applied after zinc phosphate pretreatment and before powder application in Nordson or Gema booth systems. A cure window of 190–205 °C for 12–20 min is typical for polyester-based powder chemistries; the tape remains dimensionally stable if oven air temperatures do not exceed 220 °C. Clean removal requires the part to cool below 60 °C; high-temperature peel-out attempts produce cohesive splitting of the silicone layer and transfer residues that interfere with subsequent topcoat adhesion. Compliance is anchored to ASTM D3759/D3759M-05 for tensile strength and elongation, ASTM D3652/D3652M-92 for thickness, and ASTM D3330/D3330M-04 Method A for 180° peel to stainless steel; powder-coat adhesion on the unmasked substrate is separately assessed with ISO 2409:2020 cross-cut or ASTM D3359-17 Method B. RoHS 2011/65/EU and REACH 1907/2006 documentation is maintained for export. Finished articles include coated brake calipers, cast aluminium valve bodies, extruded architectural profiles, and steel chassis brackets. The operational limit is that silicone residues on the part edge must be mechanically removed before powder coating because the adhesive will otherwise volatilize and create craters in the cured powder layer.
Layer-to-layer taping of dry-type transformer windings with CHR M758 is executed on coil winding lathes with controlled traverse pitch of 0.8–1.5 mm and half-lap or 50% overlap. The adhesive-to-backing construction is specified at 30–34 g/m² dry silicone coat weight over 0.025 mm polyester film, producing a dry adhesive mass fraction of 47–50 wt% of the laminate and a dielectric-compatible total caliper of 0.076 mm. The tape is applied as interlayer insulation between copper foil or round wire sections before vacuum varnish impregnation; for dry-type transformers governed by IEC 60076-11:2018, it serves as a turn-to-turn and layer barrier but not as the sole primary insulation unless validated within the complete insulation system. Electrical compliance is demonstrated through UL 510 component recognition, IEC 60454-3-1 pressure-sensitive adhesive tape requirements for electrical purposes, and ASTM D1000-17 test methods for dielectric strength and insulation resistance; the UL insulation-system file for the specific varnish is retained. Process equipment includes inline tension controls calibrated to 17.5–26.3 N/cm of tape width and automatic taping heads that press the silicone layer into the winding at 0.2–0.4 MPa. After anhydride-cured epoxy or unsaturated polyester varnish treatment, finished articles include cast-resin dry-type transformers, solenoid coils, and reactor coils. The operational boundary is that the silicone adhesive does not dissolve in varnish and may exhibit reduced peel-to-backing after full cure; therefore mechanical overwrap or tape interleaving must not rely solely on the adhesive for creepage-path integrity at Class F service temperatures.
During carbon fiber/epoxy prepreg lay-up, CHR M758 is qualified as a tool surface flash-break material to hold release film, edge breather strips, and vacuum bag edges to clean aluminium or Invar tool faces. The tape is not applied directly to uncured prepreg surfaces intended for bonding; a minimum offset of 25 mm from net trim is maintained to prevent silicone contamination of the bondline. In this configuration, the backing is 0.025 mm polyester film, the dry silicone coat weight is 32–38 g/m², and the adhesive mass fraction is 48–52 wt% of the total 0.076 mm laminate. Compliance is controlled within aerospace manufacturing quality systems aligned to SAE AS9100D, with raw-tape incoming inspection including ASTM D3330/D3330M-04 Method A peel, ASTM D3759/D3759M-05 tensile at break, and ASTM D3652/D3652M-92 thickness verification. The autoclave cure cycle is run with a 1.5 °C/min ramp rate to 180 °C, a 120 min dwell, and 0.7 MPa consolidation pressure; vacuum integrity is monitored with thermocouple and transducer arrays on the tool. Finished parts include CFRP ribs, spars, engine cowl components, and interior monument panels. The critical process conflict is that the silicone adhesive can soften and migrate at the tool edge under high pressure; removal after cooling below 50 °C is required, and any residue on the tool is removed with a demolding agent-compatible solvent before the next bagging operation. Where tape residue could contact secondary bonding surfaces, oxygen or plasma treatment is required prior to adhesive bonding.
In PCB assembly environments, CHR M758 functions as temporary solder-mask over gold finger contacts during wave solder, selective solder, and conformal coating. The tape is specified with a thinner silicone adhesive deposit of 29–33 g/m² over 0.025 mm polyester film, yielding a dry silicone mass fraction of 46–49 wt% and a total caliper of 0.076 mm; lower coat weight reduces flux entrapment at the tape edge. Assembly processes are evaluated against IPC-J-STD-001H, IPC-A-610H, and RoHS 2011/65/EU. During palletized wave solder, the tape is applied manually or by CNC selective taping fixtures to plated contacts; the board passes through flux spray, 100–150 °C preheat zones, and a 260–265 °C solder wave for 3–5 s. Removal is performed after cool-down below 50 °C, followed by automated optical inspection. Finished assemblies include server backplanes, power converter boards, and telecom line cards. The operational limitation is that silicone volatilization at wave solder temperatures can produce siloxane film on unsealed connector bodies; therefore the tape is restricted to contact mask applications, and no-clean flux compatibility is verified by solderability testing per J-STD-002D before batch release. For vacuum deposition or PECVD processes, the tape is not recommended because silicone outgassing exceeds cleanliness budgets.
Lamination of crystalline silicon modules requires temporary positioning of pre-soldered copper tabbing ribbons, edge isolation strips, and junction box dams before EVA cross-linking. CHR M758 is used on glass or backsheet edges, not on cell surfaces; for this application, the silicone adhesive is specified at 28–32 g/m² dry coat weight over 0.025 mm polyester film, corresponding to a dry adhesive mass fraction of 44–48 wt% of the total laminate. The vacuum-bag lamination process runs with a plate temperature of 145–150 °C, a lamination time of 10–14 min, and pressures of 0.9–1.0 bar; the tape must maintain tabbing ribbon registration during EVA melt flow and cure. Finished modules are qualified against IEC 61215-1:2021 design qualification, UL 1703, RoHS 2011/65/EU, and REACH 1907/2006. The critical boundary is that silicone migration to cell solder pads can reduce solderability in downstream stringing; the tape is therefore qualified by post-lamination electroluminescence to ensure no busbar shadowing or residue. Published data for this specific configuration is limited, and lot-level peel-to-glass testing on the actual backsheet grade is recommended before production release.
Automatic flying splicers on heatset web coating lines specify CHR M758 for splice preparation of polyester film, silicone release liner, and specialty coated paper at unwind stations feeding solvent-based coating heads. The standard laminate is 0.076 mm total caliper with 0.025 mm polyester backing and 32–38 g/m² dry silicone adhesive; the dry silicone mass fraction is 48–52 wt%. Splicing equipment includes Martin Automatic butt splicers or inline zero-speed splicers with splice overlap of 2–4 mm and web tension held at 17.5–26.3 N/cm; the tape traverses dryer ovens at 200–204 °C without backing breakage, as verified by ASTM D3759/D3759M-05 tensile retention and ASTM D3652/D3652M-92 thickness before and after aging. Compliance includes PSTC-101 peel adhesion methodology for release-surface adhesion screening, RoHS 2011/65/EU, and REACH 1907/2006. Finished roll stock includes coated papers, release films, and metallized films for pressure-sensitive label converting and industrial lamination. The operational boundary is that adhesion to silicone release surfaces may be lower than on polyester film; therefore aging at 204 °C for 24 h should be validated on each liner chemistry because low-siloxane release coatings can shift splice performance.
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Saint-Gobain CHR M758 Polyester Film Backing Silicone Adhesive Pressure Sensitive Tape is constructed as a single-faced polyester film carrier coated with a cured silicone pressure-sensitive adhesive. The construction places the product in the polyester/silicone tape class rather than in glass-cloth-backed, polyimide-backed, or acrylic-adhesive polyester tape categories. Published data for this specific configuration is limited; therefore, numerical limits discussed below are class-typical values for stabilized polyester films and silicone pressure-sensitive adhesive systems and must be verified against the supplier’s lot-specific certificate of analysis or technical data sheet before process qualification.
Incoming inspection of this tape class commonly uses ASTM D3330/D3330M-04(2018) for peel adhesion, ASTM D3654/D3654M-06(2019) for shear adhesion, ASTM D3759/D3759M-05(2019) for tensile strength and elongation, and ASTM D1204-14 for dimensional stability at elevated temperature. When the tape is used in electrical or electronic applications, ASTM D1000-17 is the over-arching test method because it covers adhesion, dielectric breakdown, and temperature resistance for pressure-sensitive adhesive-coated tapes used in electrical insulation. Thickness should be confirmed with ASTM D3652/D3652M-20, and unwind force should be characterized with ASTM D3811/D3811M-21 or PSTC 8 when the material is dispensed from automated equipment.
| Standard | Property measured | Relevance to polyester/silicone tape qualification |
|---|---|---|
| ASTM D1000-17 | Adhesion, dielectric strength, thermal resistance, and physical properties of electrical tapes | Primary method for electrical-grade polyester-backed pressure-sensitive tapes |
| ASTM D3330/D3330M-04(2018) | Peel adhesion of pressure-sensitive tape | Quantifies bond to stainless steel, low-surface-energy substrates, or the intended production surface |
| ASTM D3654/D3654M-06(2019) | Holding power and shear adhesion | Differentiates silicone systems from higher-shear acrylic and rubber alternatives |
| ASTM D3759/D3759M-05(2019) | Tensile strength and elongation at break | Verifies carrier mechanical limits during dispensing, tensioning, and removal |
| ASTM D1204-14 | Linear dimensional change at elevated temperature | Measures heat-induced shrinkage that can cause edge lift or masking failure |
| ASTM D149-20 | Dielectric breakdown voltage | Used for insulation applications only when thickness, humidity, and electrode configuration are controlled |
| ASTM D257-14 | DC resistance or conductance | Assesses surface and volume resistivity for electrical insulation or static-safe use |
The silicone pressure-sensitive adhesive layer is differentiated from acrylic and rubber systems by its low glass transition temperature and its retention of tack across a wide temperature window. Silicone pressure-sensitive adhesives as a class remain flexible below -60°C, whereas many acrylic systems become hard and lose wet-out at temperatures below 0°C to -20°C. This low-temperature performance is the result of the siloxane backbone, which exhibits high segmental mobility and low interfacial tension. The adhesive is therefore capable of wetting low-surface-energy substrates such as silicone release liners, polytetrafluoroethylene surfaces, and certain powder-coated or plasma-treated polymers without relying on the polar monomer content characteristic of acrylic formulations.
At elevated temperature, silicone pressure-sensitive adhesives generally exhibit short-term thermal stability above 260°C, although the polyester carrier is the limiting layer. Acrylic systems typically show more rapid loss of peel and cohesive strength above 120°C to 150°C, while rubber-based systems may soften and leave residue at even lower thresholds. The silicone system also displays lower room-temperature shear holding power than a crosslinked acrylic or rubber-modified adhesive. This is an operational boundary, not a defect: silicone pressure-sensitive adhesives are selected for temperature range, low-surface-energy adhesion, and clean removal, not for structural shear resistance.
Adhesive coat weight is a critical process variable. Industrial silicone pressure-sensitive tapes are often coated in the range of 25 g/m² to 50 g/m², and a shift of 5 g/m² can alter peel force, conformability, and contamination potential. For CHR M758, the target coat weight and tolerance must be obtained from the supplier’s technical data sheet or certificate of analysis. Peel values are therefore not interchangeable between lots unless the substrate, dwell time, peel angle, and conditioning environment are controlled according to ASTM D3330.
Silicone pressure-sensitive adhesives can migrate or transfer to adjacent surfaces if the adhesive network is undercrosslinked or if the tape is aged above its rated temperature. This contamination mechanism is particularly relevant in liquid painting, powder coating, and electronics assembly because transferred silicone can reduce subsequent coating adhesion. Surface control is commonly assessed by water-break-free inspection or by wetting tension measurement using ASTM D2578. If silicone contamination is suspected after removal, surface-sensitive techniques such as X-ray photoelectron spectroscopy are used to confirm the presence of silicon species.
The polyester carrier, not the silicone adhesive, usually defines the maximum continuous service temperature of CHR M758. Biaxially oriented polyethylene terephthalate film exhibits a glass transition near 70°C to 80°C, a cold crystallization exotherm near 130°C, and a melting endotherm near 250°C. Dimensional stability, however, is degraded well below the melting point because oriented films can begin to shrink as the oriented molecular structure relaxes. Stabilized polyester films intended for high-temperature tape backings are often qualified for limited exposure at 150°C to 180°C. Free-shrink testing under ASTM D1204 is required because the amount of shrink depends on the heat history, film grade, and oven air temperature.
For a stabilized polyester tape class, free shrink after 30 min at 150°C is frequently specified below 2%. This value is not a product guarantee for CHR M758; it is a class-typical acceptance criterion. If the tape is used in a powder coating oven dwell of 10 min to 25 min at 180°C to 200°C, the carrier can shrink, lift at the edges, or embrittle before the silicone adhesive itself fails. The lower thermal threshold of the backing therefore governs the process ceiling, and any process qualification must include dimensional stability testing at the actual oven temperature and dwell time.
Differences from polyimide-backed silicone tapes become most visible above 200°C. Polyimide carriers retain dimensional stability and tensile properties at higher temperatures than polyester, but they are generally higher in cost and have different caliper and stiffness characteristics. Glass cloth-backed silicone tapes provide greater tear resistance and better conformability over rough surfaces, but they are thicker and can leave adhesive residue in the interstices of the woven carrier. Polyester-backed constructions offer uniform caliper, a smooth surface, and lower thickness, which can improve edge line definition in masking and reduce the step height around masked zones.
Compared with acrylic adhesive on polyester, the silicone adhesive version is preferred when the tape must contact silicone release papers, silicone-treated films, or low-surface-energy molded articles. It is also selected when clean removal after elevated-temperature exposure is required. The trade-off is that silicone systems often show lower initial room-temperature peel on stainless steel than aggressive acrylic systems and may exhibit cohesive splitting at high peel speeds. This is why peel adhesion must be evaluated on the actual production substrate rather than inferred from stainless steel values alone.
In high-temperature masking applications, the practical question is whether the polyester carrier can maintain edge contact during the entire cure cycle. The silicone adhesive can typically withstand short-term excursions above 260°C, but the polyester backing will begin to lose dimensional control, shrink, and potentially distort before that temperature is reached. The tape therefore cannot be used at the full upper thermal capability of the silicone adhesive. Any upper service temperature statement for CHR M758 must be derived from the supplier’s stabilized-film data and the measured free shrink under ASTM D1204, not from the silicone adhesive’s thermal stability alone.
Processing equipment also influences the permissible thermal exposure. Infrared ovens, convection ovens, and induction-heated tooling do not heat maskants uniformly. When the tape is applied to threaded holes, bearing seats, or connector mounting surfaces prior to powder coating, the local metal temperature may exceed the air temperature by 10°C to 30°C depending on part mass and heat transfer. The tape must therefore be qualified on the actual part fixture, not only on a flat test panel, because edge lift on a curved or recessed surface is the dominant failure mode.
For electrical coil insulation and splicing of silicone-coated release papers, the tape’s dielectric performance should be evaluated under ASTM D149 and ASTM D257. Dielectric breakdown is thickness- and humidity-dependent. A 25 μm to 50 μm polyester carrier may show short-time breakdown in the range of 3 kV to 6 kV, but this is a class estimate and lot-specific values must be confirmed. The value is not a design constant because electrode configuration, edge flash, relative humidity, and mechanical damage during application reduce the measured breakdown voltage. If the tape is supplied as a UL-recognized component, recognition is construction-specific under UL 510, and the UL Yellow Card lists the exact thickness, temperature class, and electrical test conditions.
For solvent-exposed environments, the silicone adhesive should be pre-qualified because aromatic hydrocarbons, ketones, and some esters can swell the siloxane network. Alcohols and water are generally less aggressive, but contact with toluene, xylene, or methyl ethyl ketone can reduce peel strength and increase the risk of adhesive transfer. The polyester carrier is also sensitive to hydrolysis in prolonged humid or alkaline environments. Aging under ASTM G154 or equivalent ultraviolet exposure is necessary if the tape remains in place outdoors, because unstabilized polyester films can yellow and lose tensile strength under ultraviolet radiation.
In automated dispensing, unwind force is a critical process variable. A silicone adhesive with excessive adhesion to the backing can cause telescoping or jerky unwind on servo-driven dispensing heads. Unwind force should be measured after conditioning at 23°C and 50% RH according to ASTM D4332, and the value should be correlated with the dispensing head’s torque limit. If the material is supplied with a release liner, liner removal force is measured separately because differential release between the liner and the tape is required for reliable high-speed peel-away automation.
Compared with silicone-coated glass cloth, CHR M758 is expected to provide a lower-profile edge and a more uniform blocking line during masking. Compared with silicone-coated polyimide, the polyester carrier is lower in cost per unit area but sacrifices high-temperature dimensional stability. Compared with polyester-backed acrylic tape, the silicone adhesive expands the service temperature window and improves adhesion to silicone-bearing surfaces while reducing room-temperature shear and initial peel on polar substrates. These distinctions are material-class properties; product-specific selection must be based on lot-specific peel, shear, free shrink, and contamination data generated under the intended cure cycle.