Application of Saint-Gobain CHR A-2005 Industrial Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape
During autoclave cure of carbon fiber/epoxy prepreg laminates, the vacuum bag seal line represents a critical integrity boundary where the nylon bag film must remain bonded to the aluminum or steel tool through the full thermal-pressure cycle. Saint-Gobain CHR A-2005 Industrial Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape is applied to this boundary as a flash tape, not as a structural clamp, because the fluoropolymer surface prevents wet resin bleed from bridging the seal interface, while the silicone adhesive maintains sufficient tack to the tool flange at
177±6°C and
0.62 MPa autoclave pressure. Bag failures at the seal line occur most frequently during the initial positive pressure ramp, when the bag film contracts and shifts under differential thermal expansion. A release tape with heat-aged peel strength that falls below the shear imposed by bag movement will lift at the tool edge and permit vacuum loss. The tape is also used on the flash edges of caul plates and on tooling bosses, where its non-stick backing keeps cured resin flash from mechanically locking the part to the tool.Process parameters for
177°C cure systems typically specify a
1°C/min to
3°C/min ramp rate and a
120-minute dwell at peak temperature, with autoclave pressure held at
0.55–0.70 MPa after initial vacuum debulk at
0.08 MPa. The adhesive layer is required to survive this entire thermal excursion without cohesive splitting or transfer to the tool, because silicone residue that migrates to subsequent adhesive bonding surfaces reduces lap shear strength when tested per
ASTM D1002. On vertical tooling, the tape experiences peel forces generated by the weight of the breather/bleeder stack and the nylon bag; on horizontal tools, tensile stress dominates as the bag film shrinks during cool-down. The woven glass substrate limits elongation, with tensile strength measured per
ASTM D3759 on a
25 mm width typically sufficient to restrain vacuum bag shrinkage forces at
0.08 MPa. Published data for this specific configuration is limited; industrial release testing per
ASTM D3330 Method A on stainless steel panels after
24-hour conditioning at
23±2°C and
50±5% relative humidity is the standard method for verifying batch-to-batch adhesive consistency before release to production.Autoclave loading patterns influence the shear stress on the adhesive. When the tape is placed at the junction between the tool periphery and the caul plate, local contact pressures can exceed
1.0 MPa, causing the silicone layer to flow into the part edge and produce a visible witness mark on the molded surface. In such regions, the tape is not a suitable replacement for mechanical clamping or for a separate vacuum seal, because the adhesive is not formulated as a structural gap filler. A specific production-scale failure mode involves adhesive creep at caul plate edges after repeated cycles, where the tape moves by
2–5 mm and exposes the underlying tool to resin flash. Tool preparation for these applications requires the removal of prior adhesive residue with a low-volatility solvent and a clean-room wipe to avoid contaminating uncured prepreg with siloxane oligomers. The terminal component is a cured composite laminate with a clean flash edge, suitable for subsequent trimming and assembly without silicone-induced bond line contamination.Silicone adhesive outgassing during the initial heat-up ramp is a concern for critical structural parts. Low-molecular-weight siloxane species can deposit on tool surfaces and transfer to uncured prepreg, altering bond line surface energy. Bake-out of tooling at
200°C for
4 hours prior to first production use reduces the concentration of volatile condensables. The PTFE-glass backing itself is stable at the stated cure temperature; however, sustained exposure above
260°C leads to depolymerization of the fluoropolymer at a rate that increases with oxygen partial pressure. For
177°C autoclave cycles, the operational boundary is defined not by the backing but by the silicone adhesive's loss of cohesive strength when the tape is subjected to repeated cycles without re-tensioning. Quality control records include the number of cure cycles per tape installation and the corresponding change in
180° peel adhesion, which is measured on witness coupons placed alongside the production tool.
Why Do Constant-Heat Jaws Require PTFE-Glass Interleaves in Form-Fill-Seal Lines?
Thermal sealing of polyethylene and polypropylene films in horizontal form-fill-seal machines uses heated jaws that cycle between
120°C and
200°C at rates up to
120 packs per minute. Molten polymer adheres to bare steel jaw surfaces because the surface energy of the metal is higher than that of the molten film; a PTFE-glass tape interleave reduces the seal-face coefficient of friction and prevents film residue accumulation. The silicone adhesive side is bonded to the jaw body, while the fluoropolymer side contacts the packaging film. Seal pressure setpoints between
0.2 MPa and
0.4 MPa are applied through pneumatic cylinders; the tape must not delaminate under cyclic compressive and shear loads. On rotary band sealers, the tape is wrapped under tension and trimmed at the jaw edges, where protruding fiber ends from the woven glass can initiate film tearing. The applied tape width is matched to the jaw face width at a
1:1 ratio, with a
10–15 mm overlap at the seam to prevent direct steel-to-film contact.Dwell times for monolayer LLDPE films fall between
0.3 s and
0.8 s, with seal initiation temperatures of
120–140°C. Oriented polypropylene laminates with heat-sealable copolypropylene layers require jaw temperatures of
150–180°C. The PTFE-glass construction tolerates these heat fluxes, but the silicone adhesive layer introduces a thermal resistance that lowers the seal-face temperature relative to the heater setpoint. Controller compensation is determined by infrared pyrometry on the jaw surface, not by a fixed offset, because tape thickness and jaw geometry vary between machine builders. Thermal imaging on production lines shows that uncovered jaw areas run cooler than covered zones due to radiative losses, which influences seal edge integrity on wide packages. The operational window for heat sealing is bounded at the lower end by seal initiation temperature and at the upper end by film scorching or adhesive degradation. The terminal outputs are sealed pouches or overwrapped trays with consistent seal widths and no polymer buildup on jaw faces.Periodic replacement intervals are driven by adhesive degradation rather than PTFE wear. On high-speed vertical baggers, edge fraying of the woven glass occurs at the jaw knife slot where the cutting blade impacts the tape; a worn tape exhibits adhesive squeeze-out at the jaw edges, which transfers to the film as a silicone deposit and causes ink adhesion failure on printed areas. Quality control procedures measure the residual peel strength per
ASTM D3330 after
500,000 cycles; when peel strength falls below
50% of the as-installed value, the tape is replaced to avoid seal contamination. This is a production-scale observation; published data for this specific product under cyclic jaw loading is limited. The adhesive's cohesive strength at
200°C is lower than at ambient temperature, which is why tapes are not reused after removal. Replacement tape is tensioned to a specific winding tension of
2–5 N/cm to minimize air entrapment between the adhesive and the jaw surface.Food-contact packaging compliance requires the tape to meet indirect food additive regulations. The PTFE component is generally covered under
21 CFR 177.1550 for perfluorocarbon resins, while the silicone adhesive is addressed under
21 CFR 175.300 for resinous and polymeric coatings used in food contact surfaces. The tape is not intended for direct food contact; its use as an interleave on sealing jaws places it behind a functional barrier of the packaging film. Extractives testing per
21 CFR 177.1550(d) and
21 CFR 175.300 table tests are the standard compliance references for lot release in food packaging operations. In pharmaceutical blister packaging lines, the same tape is used on platen sealers where forming film temperatures reach
160–170°C, and residual solvent levels from flexographic printing must not be trapped under the tape layer.
Slot Liner Retention and Interphase Barrier Function in High-Temperature Motor Windings
Form-wound motor coils in Class 180 and Class 200 insulation systems require phase-to-phase and phase-to-ground barriers that retain dielectric integrity after vacuum pressure impregnation with epoxy or unsaturated polyester resins. PTFE-glass tapes with silicone adhesive are employed as slot liner retention wraps and as interphase barriers in random-wound stators because the fluoropolymer surface resists resin wetting, which prevents the barrier layer from becoming conductive through carbonized resin decomposition. The woven glass reinforcement provides puncture resistance during coil insertion into stator slots, while the silicone adhesive maintains position during winding. In fractional-horsepower motors, the tape is applied over slot liners made of Nomex or polyester film to prevent movement during the varnish trickle process. The tape is cut to a width equal to the slot liner overshoot length, typically
3–6 mm beyond the slot edge on each side, creating a
1:1 coverage of the liner protruding length.Electrical performance is evaluated under
ASTM D149 for dielectric breakdown voltage and
ASTM D1000 for pressure-sensitive electrical insulating tape. The tape is applied with
50% overlap on coil leads and as a full wrap on connection joints to ensure a continuous barrier without exposed edges. In a
460 V motor, the insulation system must withstand a hipot test of twice the rated voltage plus
1000 V, per
NEMA MG 1-2016 Part
12.3; the PTFE-glass tape contributes to the barrier but is not the sole insulation. Compatibility with solventless varnishes is critical: the silicone adhesive must not soften during the
150–165°C curing bake, or the wrap will shift under coil movement and create a path for turn-to-turn short circuits. The terminal product is a wound stator with stable slot liners and uniform varnish coverage, ready for rotor insertion and end-bell assembly.UL
510 recognition for polymeric adhesive tape insulation requires full construction testing including dielectric strength retention after thermal conditioning at the rated temperature. The typical test sequence exposes the tape to
60 days at
180°C or
200°C, then measures dielectric breakdown and adhesion. PTFE-glass backings demonstrate high track resistance under
ASTM D2303 inclined-plane testing, but the silicone adhesive layer can be degraded by corona discharge if the tape is placed in high-voltage gradient zones. The operational boundary for motor applications is the partial discharge inception voltage, which depends on air voids trapped beneath the tape; vacuum-assisted application or roller pressure is required to eliminate entrapped air on coil surfaces.
| Standard or Test Method | Parameter Evaluated | Typical Test Condition | Application Relevance |
|---|
| ASTM D3330/D3330M-04 Test Method A | 180° peel adhesion to stainless steel | 300 mm/min, 20 min dwell, 23±2°C, 50±5% RH | Verifies adhesion for tool surface mounting |
| ASTM D3652/D3652M-93 | Total tape thickness | Micrometer, 0.1 N force | Thickness measurement for jaw gap setting |
| ASTM D3759/D3759M-05 | Tensile strength and elongation of backing | 25 mm width, 300 mm/min | Mechanical integrity at elevated temperature |
| ASTM D149-20 | Dielectric breakdown voltage | 500 V/s rise, 25 mm electrodes | Electrical insulation suitability |
| UL 510 | Polymeric adhesive tape insulation | Full construction test | Recognized component rating |
| FDA 21 CFR 177.1550 | PTFE resin extractives | Extraction tests | Indirect food contact for sealing jaws |
In compression molding of sheet molding compound and bulk molding compound, mold temperatures of
135–170°C and clamping pressures of
3–10 MPa create conditions where uncured resin flows into mold flash lines and parting lines. External mold release agents based on zinc stearate or semi-permanent siloxane coatings reduce sticking on the cavity surface but may contaminate post-mold painting. The PTFE-glass/silicone tape is applied to the shear edges and flash traps of the mold, not to the cavity face, where its non-stick backing prevents cured flash from bonding to the tool. The silicone adhesive permits repositioning during mold setup but does not replace mechanical attachment under injection pressures. Die-cut strips are replaced during periodic mold maintenance rather than every cycle, because the woven glass cannot conform to complex three-dimensional mold surfaces without wrinkling. Application width is typically
10–20 mm, matching the flash land width at a
1:1 ratio, with no overlap on curved sections where buckling would occur.Rubber compression molding of EPDM and FKM compounds at
150–190°C presents similar flash adhesion problems. Sulfur and peroxide cure systems generate acidic or peroxide decomposition byproducts that attack uncoated tool steel. The PTFE-glass tape acts as a sacrificial release layer; however, its use is limited to flat flash areas because wrinkles create resin traps that increase adhesion rather than reduce it. During SMC molding, styrene emissions and zinc stearate accumulation reduce tape adhesion if the mold surface is not cleaned with isopropanol before application. A surface preparation step of wiping with 2-butanone increases initial wet-out but may swell the silicone adhesive if residue remains. The tape is not suitable for cavity surfaces on Class A painted parts because silicone transfer can produce fish-eye defects in subsequent topcoats. The terminal molded part exits the press with clean flash lines and no molded-in release agent residue, which is critical for downstream bonding or painting operations.
When Silicone Adhesive Residue Limits Release Performance in Solvent-Exposed Roll Coverings
Web handling rollers in coating and laminating lines are wrapped with PTFE-glass tape to reduce accumulation of adhesives, waxes, and polymers on steel idler surfaces. The silicone adhesive bonds to the roller at ambient temperature and eliminates the need for mechanical fasteners or heat-shrink sleeves. In solvent-rich environments, the silicone layer absorbs ketones, esters, and aromatic hydrocarbons; swelling is more pronounced in ketone and ester solvents than in aliphatic hydrocarbons, consistent with solubility parameter differences. Swelling reduces cohesive strength and allows the tape to lift at the overlap seam. Continuous immersion in methyl ethyl ketone or dibasic ester solvents leads to adhesive edge lifting within
24–72 hours, while intermittent wipe-off service may extend the replacement interval. Production-scale observations indicate that the overlap seam is the primary failure initiation point, where the exposed adhesive edge absorbs solvent and loses tack before the central wrap area.Chemical resistance of the PTFE backing is evaluated under
ASTM D543 by immersion of the composite in test fluids at
23°C and
70°C for
7 days. The fluoropolymer glass cloth remains inert to hydrochloric acid up to
37%, sodium hydroxide up to
50%, and most aliphatic solvents. The adhesive layer is the limiting component; continuous immersion in ketone or dibasic ester solvents leads to adhesive edge lifting, while the backing shows no visible degradation. For roller coverings used in dry or intermittent wipe-off service, the operational boundary is defined by the maximum web temperature of
260°C for continuous operation. Thermal cycling between ambient and process temperatures above
150°C accelerates adhesive embrittlement if the roller is subjected to frequent wash-down cycles. The terminal application is a coated web with uniform thickness and no pickup of coating solids on idler surfaces.Roller diameter and wrap angle determine the shear stress imposed on the adhesive bond. On a
100 mm diameter idler, a web tension of
50 N per linear cm produces a tangential force that must be transmitted through the adhesive layer; peel forces are concentrated at the trailing edge of the wrap, where the tape overlaps. Production-scale failure modes include adhesive ooze at the overlap, accumulation of coating solids under the lifted edge, and web tracking errors caused by local diameter changes. Inspection intervals of
200–400 operating hours are common, with replacement when edge lifting exceeds
3 mm along the roller face. Surface preparation of the roller with a solvent wipe prior to tape application improves initial adhesion, but the presence of residual oil or release agents reduces the bond strength and shortens service life.In powder coating cure ovens operating between
180°C and
200°C, threaded holes, bearing journals, and grounding pads require masking to prevent coating deposition. PTFE-glass tape with silicone adhesive is die-cut into discs and strips and applied to machined surfaces before powder application. The fluoropolymer surface prevents electrostatic powder from adhering to the masked area, while the woven glass backing withstands the cure cycle without charring or leaving fibrous debris. After curing, the tape is removed and disposed of; adhesive residue on the part is a known failure mode when the silicone layer exceeds its short-term temperature limit. The process boundary for this application is the short-term exposure temperature: silicone adhesives in this product class typically withstand
220°C for
30-minute cure cycles without excessive crosslinking, but excursions above
250°C during infrared pre-gel or oven overshoot zones accelerate adhesive embrittlement. Masking coverage is applied as a
1:1 ratio to the surface area to be protected, with an additional
1–2 mm oversize on die-cut discs to compensate for thermal movement of the part.Embrittled adhesive leaves a tenacious residue that requires solvent wiping with isopropanol or methyl ethyl ketone. Masking quality is verified under
ASTM D3359 cross-hatch adhesion testing on the underlying coated surface, but the tape itself is not part of the final coating system. For powder coaters using automated masking cells, the tape is applied by pneumatic dispensers and must maintain consistent unwind tension to prevent stretching; the woven glass backing has low elongation, which reduces the risk of die-cut dimension change during application. In thermal spray operations, the tape is used to mask overspray on turbine airfoil fixtures, where grit blasting and plasma arc temperatures exceed the silicone adhesive's long-term limit, limiting the tape to single-use masking in low-heat zones. The terminal output is a coated part with clean, unmasked threaded connections and bearing surfaces ready for assembly without mechanical rework.
Saint-Gobain CHR A-2005 Industrial Glass-PTFE Backing Silicone Adhesive Pressure Sensitive Tape is a single-faced, heat-resistant, non-stick surfaced tape. The base carrier is a woven glass fibre fabric impregnated and coated with polytetrafluoroethylene (PTFE); the adhesive is a crosslinked silicone pressure-sensitive film supplied on a removable liner. The A-2005 model is differentiated from other CHR A-series glass-PTFE tapes primarily by its nominal total thickness of 0.005 in (0.127 mm).
The glass weave supplies mechanical strength and dimensional stability during hot-bar contact. The PTFE component lowers the exposed-face surface energy and provides release against molten polyethylene, polypropylene, ionomer, and many cured adhesives. The silicone adhesive is selected for thermal endurance rather than maximum room-temperature peel; it retains tack after short-term excursions to the upper temperature band where acrylic adhesive systems soften or outgas.
Representative A-2005 property values from published manufacturer technical literature
| Property | Value | Test method or condition |
| Total thickness | 0.005 in (0.127 mm) | Micrometer, ASTM D3652 |
| Backing type | Woven glass fibre, PTFE-coated | — |
| Adhesive type | Silicone pressure-sensitive | — |
| Warp tensile strength | 120 lb/in (21.0 kN/m) | ASTM D3759 |
| Fill tensile strength | 75 lb/in (13.1 kN/m) | ASTM D3759 |
| Elongation at break | 7% warp, 5% fill | ASTM D3759 |
| Adhesion to stainless steel | 28 oz/in (0.31 N/mm) | ASTM D3330 |
| Dielectric breakdown voltage | 3,600 V full thickness | ASTM D149 |
| Continuous service temperature | −73°C to 260°C | Manufacturer data |
These values are representative and should be used for initial selection rather than as procurement acceptance limits. Glass fabric basis weight, PTFE coating weight, and silicone coat weight can vary by batch; incoming thickness and peel tests are recommended for critical sealing applications.
What Limits the Silicone Adhesive System at the Upper Thermal Boundary?
In continuous use, the performance boundary is controlled by two simultaneous degradation vectors: oxidative hardening of the silicone adhesive and stress-transfer loss at the glass-PTFE interface. The first vector is observable as a decline in room-temperature loop tack after 500 h at 260°C; the second appears as adhesive stringing when the tape is removed after repeated thermal cycling from 25°C to 205°C on an aluminium sealing jaw. Both failure modes are cohesive within the silicone layer, not adhesive failure at the molten-film contact face.
Above 260°C, the PTFE surface remains non-stick, but silicone outgassing of low-molecular-weight cyclic siloxanes can occur. This outgassing may contaminate adhesion-sensitive processes such as solvent-based film laminating or electronics assembly. For this reason, A-2005 is excluded from cleanroom or electronics-grade bonding operations where volatile silicone species are prohibited. The practical outgassing threshold is below the short-term thermal rating, but accumulated deposits on surrounding tooling have been observed on high-duty-cycle shrink tunnels.
Low-temperature service is acceptable after proper installation. Silicone pressure-sensitive tack at −40°C is lower than at ambient, but the bond line survives when the tape has been applied under warm conditions. The backing is not the limiting factor; glass fibre retains flexibility and tensile strength at cryogenic temperatures. The more severe low-temperature failure is adhesive transfer during liner removal at −18°C, because release liner separation force rises sharply. Liner removal should be conducted at >10°C.
The second process limitation arises from thermal expansion mismatch. Glass-PTFE backing has a lower coefficient of expansion in the warp direction relative to aluminium and stainless steel. On heated platens longer than 1 m, repeated cycling between 25°C and 205°C can impose shear stress at the adhesive interface. This stress is relieved by edge lifting unless the tape is applied in longitudinal strips with spacing rather than as a single continuous piece. Published manufacturer application guidance for continuous sealing-bar lengths exceeding 1.2 m recommends segmented application.
On a side-seal horizontal form-fill-seal machine, the tape is cut with a 45-degree scarf at the ends to prevent film snagging. Surface preparation of the sealing bar follows standard silicone pressure-sensitive adhesive procedure: degrease with isopropanol or heptane, abrade with a 600-grit nonwoven pad, degrease again, and apply at 20°C to 30°C without moisture condensation. Maximum bond formation occurs after 24 h at 23°C and 50% RH; immediate tack is present, but shear holding develops more slowly.
When A-2005 Replaces Polyimide, Aluminum Foil, or Acrylic-Adhesive Glass Tapes
In hot-bar release duty, polyimide/silicone tape is often replaced by A-2005 when the application requires broader platen coverage and non-stick release rather than high dielectric strength per unit thickness. Polyimide film typically provides higher dielectric breakdown per unit thickness and a thinner cross-section for low-thermal-mass bars; A-2005 supplies greater tensile resistance and slash resistance from the glass scrim. Therefore, the selection decision turns on web width, bar temperature, and whether electrical isolation is the primary requirement. For a sealing jaw operating at 180°C with a polyethylene web, A-2005 is specified when molten-polymer release is the dominant failure; polyimide is specified when 0.003 in (0.076 mm) or lower thickness is required for faster heat transfer.
Aluminium foil tapes deliver higher thermal conductivity and can be used where the sealing bar must sense temperature quickly, but they conduct electricity and may react with acidic or alkaline film additives. A-2005 is non-conductive and presents a PTFE release face that aluminium foil cannot provide without an additional coating. Conversely, aluminium foil tape is often selected for grounding or heat-shrink tunnel linear guides where static dissipation is needed.
Acrylic adhesive versions of PTFE-coated glass tape are less costly and offer higher room-temperature peel on some plastics. However, their upper service limit is commonly 177°C, and continuous exposure beyond 150°C can soften the adhesive and permit edge ooze. Silicone adhesive A-2005 is the choice when the line runs at sealing temperatures between 190°C and 260°C or when low-temperature service remains required.
Selection matrix for high-temperature pressure-sensitive tapes
| Requirement | A-2005 | Alternative |
| Continuous hot-bar release at ≥200°C | Silicone adhesive, glass-PTFE backing | Acrylic adhesive grades may soften |
| Thin profile below 0.003 in | Not preferred; nominal 0.005 in | Polyimide/silicone tape |
| Electrical isolation plus release | Glass-PTFE backing, dielectric breakdown 3,600 V | Aluminium foil tape not suitable |
| High thermal transfer to a heated bar | Lower than foil | Aluminium foil tape |
| Solvent immersion in ketones or esters | Limited; silicone adhesive swells | Chemical-resistant acrylic-backed tape may be selected |
In heat-sealing operations, the tape is applied to the heated side of an L-bar sealer after the platen has been cleaned and degreased. The tape is burnished with a rubber squeegee to eliminate trapped air pockets; air voids can create hot spots and cause localised adhesive oxidation. The edge seam should be arranged away from the contact zone of the sealing blade.
On rotary heat-sealing drums, A-2005 is used as a surface covering on curved sections because the glass fabric allows some bias stretch when cut on the 45-degree bias. The tape can accommodate curvature down to a radius of approximately 50 mm without creasing if cut to narrow widths; wider sections require mechanical clamping or a high-temperature silicone adhesive primer.
Silicone adhesives are not suitable for continuous immersion in toluene, xylene, methyl ethyl ketone, or ethyl acetate. Swelling is progressive and accelerates above 35°C. If solvent vapour is present on a sealing line, the tape should be evaluated by immersion per ASTM D471 for hardness change and adhesion retention before full-width application. The PTFE face is inert to most acids and bases, but alkaline glass attack can occur when concentrated sodium hydroxide penetrates cut edges. Edge sealing is therefore recommended in chemical wash-down areas.
The exposed PTFE surface has a critical surface energy below 20 mN/m, which inhibits wetting by molten polyethylene and other nonpolar polyolefins. The practical result is that peel forces for hot-melt adhesives against the PTFE face are lower than against metal or polyimide. However, the low surface energy also means that a silicone primer or mechanical fastening is required when the tape must be bonded to silicone rubber rolls; silicone adhesive alone may not achieve adequate structural shear on silicone substrates.
In composite curing, A-2005 is used as a release separator on vacuum-bag tooling and as a protective wrap on thermocouple wires. The product is not a structural composite tape; its thickness and adhesive layer may leave an imprint on Class A surfaces unless vacuum pressure is uniform. The glass weave pattern can telegraph through very thin films, so a polished release plate may be preferred for aesthetic parts.
For electrical wrap, the tape is used as overwrap on wire harnesses in high-temperature zones. The glass-PTFE backing provides abrasion resistance and dielectric isolation. The 3,600 V full-thickness breakdown is a material property, not a system insulation coordination rating; device-level dielectric tests should be performed according to the applicable end-use standard.
Converting A-2005 from master logs to finished slit rolls requires controlled winding tension. Adhesive offset to the PTFE face occurs when winding tension is high and ambient temperature exceeds 30°C; the condition appears as random release-force changes rather than gross adhesive stringing. Slitting through glass-PTFE generates hard particulate, so carbide or polycrystalline diamond blades are used to reduce microcracking at the edge. Published data for the effect of slit-edge glass fracture on tensile retention is limited.
In terms of product differences, A-2005 is not the only PTFE-coated glass tape in the CHR family. It is the 0.005 in nominal thickness member with silicone adhesive; heavier products in the same A-series supply greater cut-through resistance and thicker dielectric barriers for applications where sealing-bar clearance can tolerate the added thickness. The selection between A-2005 and a 0.010 in (0.254 mm) glass-PTFE tape depends on the required heat transfer and drape around curved sealing fixtures. Published data for the specific case of heat-seal bar thermal response with A-2005 versus the 0.010 in product is limited.