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Saint-Gobain CHR 2355-2 FEP Film Backing Silicone Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR 2355-2 FEP Film Backing Silicone Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 130663
    Product Name Saint-Gobain CHR 2355-2 FEP Film Backing Silicone Adhesive Pressure Sensitive Tape
    Manufacturer Saint-Gobain
    Model CHR 2355-2
    Backing Material FEP (Fluorinated Ethylene Propylene) Film
    Adhesive Type Silicone Pressure Sensitive Adhesive
    Color Clear/Transparent
    Total Thickness 3.5 mil (0.089 mm)
    Backing Thickness 2.0 mil (0.051 mm)
    Adhesive Thickness 1.5 mil (0.038 mm)
    Adhesion To Steel 25 oz/in (27 N/100mm)
    Tensile Strength 9 lb/in (158 N/100mm)
    Elongation 250%
    Dielectric Strength 5000 V
    Operating Temperature Range -100°F to 400°F (-73°C to 204°C)
    Chemical Resistance Excellent
    Moisture Absorption <0.01%
    Coefficient Of Friction 0.2
    Release Liner Silicone coated paper
    Width Range 1/2 in to 12 in
    Length 36 yd (33 m)
    Core Diameter 3 in

    As an accredited Saint-Gobain CHR 2355-2 FEP Film Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Saint-Gobain CHR 2355-2 FEP tape: individually wrapped rolls, boxed, typically 36 rolls per case.
    Container Loading (20′ FCL) 20′ FCL container loaded with palletized Saint-Gobain CHR 2355-2 FEP film backing silicone adhesive pressure-sensitive tape, securely braced for transport.
    Shipping Shipping Description: Saint-Gobain CHR 2355-2 FEP Film Backing Silicone Adhesive Pressure Sensitive Tape is not regulated as hazardous for transportation. No UN number, hazard class, or packing group assigned. Ship in original packaging, keep clean, dry, and away from excessive heat, sunlight, and contamination. Follow carrier requirements.
    Storage Store in a cool, dry, well-ventilated area in original sealed packaging. Keep away from direct sunlight, heat, sparks, open flames, and moisture. Recommended conditions: 15–30 °C (59–86 °F) and 40–60% relative humidity. Avoid freezing or prolonged high temperatures. Rotate stock and use oldest first. Shelf life typically 12 months when stored properly.
    Shelf Life Shelf life: 18 months from date of manufacture when stored at 21°C (70°F) and 50% relative humidity in original packaging.
    Application of Saint-Gobain CHR 2355-2 FEP Film Backing Silicone Adhesive Pressure Sensitive Tape

    In dry-type transformer interlayer insulation, the 0.051 mm FEP backing of CHR 2355-2 is applied to copper magnet wire and rectangular bus bar before vacuum-pressure impregnation with epoxy or unsaturated polyester varnish. The 0.038 mm silicone pressure-sensitive adhesive layer maintains adhesion to bare copper at winding temperatures from 20 °C to 80 °C without oven pre-cure. The FEP backing supplies a nonporous dielectric barrier; manufacturer-reported dielectric strength of the 0.089 mm tape is 7 kV per ASTM D149. Continuous operating temperature of 204 °C supports Class H dry-type designs per IEC 60085, provided the insulation system as a whole passes thermal evaluation. During vacuum-pressure impregnation, the FEP surface resists styrene and methyl methacrylate varnish attack, but adhesive squeeze-out at slit edges must be controlled because uncured varnish can extract low-molecular-weight silicone species from the pressure-sensitive adhesive and reduce interlayer adhesion. Servo-driven taping heads on rectangular conductor lines require closed-loop unwind tension; excessive tension above the yield point of 0.051 mm FEP causes necking and loss of dielectric coverage at corner radii.

    ParameterNominal valueMethod or source
    Total tape thickness0.089 mmManufacturer nominal
    FEP backing thickness0.051 mmManufacturer nominal
    Silicone adhesive thickness0.038 mmManufacturer nominal
    Adhesion to steel2.7 N/cm (25 oz/in)Manufacturer nominal
    Tensile strength245 N/100 mm (14 lb/in)Manufacturer nominal
    Elongation at break350%Manufacturer nominal
    Dielectric strength7 kVASTM D149
    Continuous operating temperature204 °CManufacturer nominal

    What Limits Siloxane Outgassing in Engine-Zone Wire Harness Overwrap?

    On aircraft engine pylons and auxiliary power unit harnesses, FEP-backed silicone PSA tape is overwrapped at 50% to 60% overlap on nickel-plated and tin-plated copper conductors. The 204 °C continuous rating of the backing accommodates radiant heat soak from engine cases, but the silicone adhesive is the application boundary in sealed compartments. Low-molecular-weight siloxane fractions migrate from unreticulated silicone PSA above 150 °C; when the harness exits into an avionics bay or optical sensor housing, ASTM E595 total mass loss and collected volatile condensable material screening should be performed. Typical non-post-cured silicone pressure-sensitive adhesives may exceed the 0.1% CVCM limit used for spacecraft materials; therefore CHR 2355-2 is not a direct substitute for skived PTFE-backed, low-outgassing acrylic tapes in those enclosures. The tape does prevent chafing against titanium clamp edges and reduces foreign object debris from braided sleeving. On high-vibration lines, spiral wrapping rather than longitudinal lay-up is preferred because FEP has a low dynamic coefficient of friction and does not lock into convoluted conduit bends. Field failure analysis on engine-harness trials has documented edge lifting at clamp points when the adhesive side is contaminated with turbine oil; solvent wiping with isopropyl alcohol before wrap is required at 60% to 70% relative humidity or below to avoid condensation at the adhesive interface.

    When Heat Seal Jaw Temperatures Oscillate Near 204 °C

    Rotary heat seal jaws on form-fill-seal machines are wrapped with CHR 2355-2 to prevent molten polyethylene or polypropylene from building up on serrated and knurled surfaces. The FEP backing retains release behavior at jaw temperature setpoints of 120 °C to 140 °C for LLDPE, 150 °C to 180 °C for cast PP, and 160 °C to 190 °C for PET/PE laminate structures. The silicone adhesive transfers heat from the jaw surface while maintaining tack at the 204 °C maximum continuous limit. Temperature oscillation above 204 °C, even for 2 s to 3 s impulse spikes, can embrittle the adhesive at the exposed edge and create a release-liner-like residue on the seal area. A jaw-surface thermocouple is recommended because embedded cartridge heater setpoints often overshoot by 15 °C to 20 °C at startup. Dynamic coefficient of friction of FEP against 25 µm LLDPE film is below 0.2, which permits film slip and prevents dragging across cross seals. On reciprocating jaw machines, the tape is die-cut to cover only the sealing face; untrimmed edges can catch film at the package cut-off knife and deposit adhesive transfer.

    Autoclave cure of epoxy prepreg laminates at 177 °C and 0.69 MPa requires reusable nonporous release on aluminum or steel caul plates. CHR 2355-2 is bonded to the tool side of the caul plate with the silicone adhesive, while the FEP side contacts the bleeder or vent layer. The 0.051 mm FEP backing does not pin through peel ply, so the release side does not disturb the resin front during caul compaction. Because the adhesive is silicone, edge masking must be set back from the part trim line by at least 3 mm; contact between uncured epoxy and silicone PSA leaves a non-polar contamination layer that reduces secondary bonding lap shear. On caul plates for co-cured stringer caps, the tape is replaced after 10 to 15 autoclave cycles because repeated thermal expansion of the aluminum plate produces adhesive microcracking at the plate edges. FEP has a lower thermal expansion coefficient than aluminum but remains conformable at room temperature; removal in a refrigerated tool at 4 °C increases adhesive cohesive failure and protects the plate surface from residue. For cure cycles above 190 °C with BMI resins, published data for this specific adhesive configuration is limited and qualification should include water-break-free surface testing on subsequent bonded assemblies.

    Powder Coat Masking Line Speed and Adhesive Residue Thresholds

    Masking threaded bosses, bearing seats, and electrical contact pads before electrostatic polyester or epoxy powder coating uses CHR 2355-2 at cure temperatures from 180 °C to 200 °C for 10 min to 20 min. The FEP surface does not allow powder to fuse, so the tape strips cleanly after the oven cycle. The 2.7 N/cm adhesion to steel permits high line density in pre-coat masking cells without spontaneous flagging, but powder may enter under edges at sharp thread transitions if the tape is not pressed with conductive silicone rollers. Adhesive residue on aluminum wheels or machined bearing journals after the cure cycle is controlled by peel removal when the part temperature drops below 60 °C; hot removal above 60 °C increases cohesive splitting and leaves a visible silicone film. On parts with phosphate conversion coatings, adhesion is reduced by powder-free area; a wipe with 70% isopropanol and 30% deionized water is required before tape application. Masking line speed for threaded studs with M8 to M12 diameters is governed by die-cut tape geometry rather than backing temperature resistance; pre-die-cut pads reduce placement time compared with manual strip cutting.

    Titanium Chemical Milling Uses CHR 2355-2 as an Auxiliary Mask, Not a Primary Maskant

    Titanium airframe skins are chemically milled in mixed hydrofluoric acid and nitric acid baths at solution temperatures from 35 °C to 50 °C. CHR 2355-2 is used as supplemental mask over conventional elastomeric maskants at cutouts, step transitions, and sensor-mounting pads. The FEP backing resists attack from 20% to 30% nitric acid and 2% to 5% hydrofluoric acid for short exposures up to 4 h, but the silicone adhesive is not resistant to continuous hydrofluoric acid underfilm attack. Cut edges must be overlaid with a 12 mm minimum strip of perfluoroelastomer or lead tape to prevent acid wicking and titanium pitting along the tape boundary. After milling, the tape is removed from the unmasked surface, and the underlying titanium is inspected for pitting indicators per ASTM E1417. Published data for this specific tape in hydrofluoric acid immersion is limited; qualification should include edge-wicking coupons before production masking. FEP masking does not provide the etch depth tolerance of scribed elastomeric maskant; it is an auxiliary, not a primary, maskant.

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    Certification & Compliance
    More Introduction

    Saint-Gobain CHR 2355-2 consists of a fluorinated ethylene propylene (FEP) film backing and a cured silicone pressure-sensitive adhesive. The construction is supplied in roll form and is typically converted into slit widths between 6.4 mm and 610 mm. The FEP backing is manufactured from resins classified under ASTM D2116, and the adhesive is selected for applications where acrylic or rubber pressure-sensitive systems lose peel strength above 120 °C. The product is specified for electrical insulation overwrap, release surfaces on heat-seal tooling, high-temperature masking, and dielectric splicing. Published data for this specific configuration is limited to the current Saint-Gobain technical bulletin; class-representative values cited below for film-grade FEP and silicone pressure-sensitive adhesive systems must be verified against the exact lot.

    Does Silicone Adhesive Retain Overlap Shear on FEP After Thermal Cycling Between -73 °C and 204 °C?

    Thermal cycling data for silicone pressure-sensitive adhesives on FEP show that the failure mode shifts from cohesive splitting at low temperatures to adhesive softening and interlayer shear loss at high temperatures. When peel adhesion is measured under ASTM D3330/D3330M against stainless steel, class-representative values are 0.20 N/mm to 0.30 N/mm at 23 °C. After 72 h at 204 °C, retained peel may fall to 40% to 60% of the original value depending on liner transfer, substrate oxidation, and applied tension during lamination. The practical upper limit for continuous electrical overwrap is therefore governed by the FEP film melting region, not by the silicone adhesive alone. FEP begins to lose mechanical integrity above 204 °C, and excursions above 260 °C require fixture verification because dielectric strength may remain stable while interlayer shear decreases rapidly.

    FEP Film Dielectric Strength and Silicone Adhesive Surface Resistivity

    Electrical insulation requirements for this tape class are evaluated under ASTM D1000 and UL 510. Film-grade FEP at 0.05 mm thickness exhibits dielectric strength in the range of 80 kV/mm to 150 kV/mm when tested under ASTM D149; the total tape construction may exhibit lower values around butt joints, splices, and entrapped voids. Silicone pressure-sensitive adhesive systems typically provide volume resistivity above 1014 Ω·cm and surface resistivity above 1015 Ω under ASTM D257 at 23 °C and 50% RH. Because FEP has a dielectric constant of 2.0 to 2.1 at 1 MHz, the product is applied to high-frequency busbar insulation where lower dielectric constant reduces signal distortion. In transformer lead overwrap, butt joints are preferred over lap joints when voltage stress exceeds 3.0 kV because entrapped air in lap joints lowers partial discharge inception voltage.

    When Heat-Seal Jaws Require Release Without Silicone Transfer Above 175 °C

    On rotary heat-seal lines, the FEP backing functions as a low-friction release surface, while the silicone adhesive anchors the tape to the heated jaw. Acrylic pressure-sensitive adhesives are generally avoided in this application because they can soften and transfer onto packaging films above 150 °C. Silicone adhesive migration becomes measurable when jaw pressure exceeds 0.7 MPa and dwell time exceeds 1.0 s at temperatures above 175 °C. Maintenance intervals are therefore dictated by adhesive build-up and edge lifting rather than by backing degradation. When polyethylene or polypropylene sealing films are processed, the tape may be used on hot jaws until transfer or loss of release occurs; this is an operational boundary, not a product defect under ASTM D1000 electrical tape classification.

    Compared with polyester-backed silicone tapes, CHR 2355-2 offers a lower coefficient of friction and greater continuous heat resistance than polyethylene terephthalate, which is typically rated at Class 105 to Class 130 under IEC 60085. Compared with polyimide-backed silicone tapes, the FEP construction has lower tensile strength but lower dielectric constant, making it preferable for high-frequency busbar wraps where stress on the backing is limited. Compared with PTFE/glass cloth tapes, the FEP film is nonwoven and smooth; this reduces particulate generation in motor winding and clean-room applications, but it also reduces tear resistance and conformability over sharp edges. Acrylic adhesive FEP tapes are suitable for lower-temperature applications, but silicone pressure-sensitive adhesive versions maintain tack below -73 °C and above 200 °C, whereas acrylic systems typically harden below -30 °C and oxidize above 150 °C.

    In stator winding lines, the tape is applied under 0.5 N/mm to 1.5 N/mm tension with a semi-automatic taping head. Tension below 0.2 N/mm produces edge curl and misregistration, while tension above 2.0 N/mm may stress-crack the FEP backing at windings with a bend radius below 2 mm. For busbar insulation, the tape is spiral-wrapped with 50% overlap and then heated to 100 °C for 30 min to relax backing stresses and improve adhesive wet-out. In corona treater electrode insulation, the tape is wrapped over a ceramic dielectric sleeve and held at 180 °C for 2 h to stabilize silicone migration. Surface preparation with isopropanol or methyl ethyl ketone is required for steel and aluminum; contamination with mold-release agents reduces peel adhesion by more than 30% when measured under ASTM D3330/D3330M. Incoming roll-to-roll variation in liner release force can shift unwind tension by ±0.1 N/cm; liner release is therefore checked under ASTM D3330/D3330M before high-speed slitting.

    Substrate Preparation and Application Tension Boundaries

    Adhesion to untreated polyethylene or polypropylene is limited; corona or plasma pre-treatment to a surface energy of at least 40 mN/m is required for continuous film adhesion. On silicone rubber surfaces, the silicone adhesive may bond too aggressively during high-temperature cure and leave residue that must be removed mechanically. The tape is not recommended for continuous immersion in ketones, esters, or strong bases: the FEP backing is chemically resistant, but the silicone adhesive can swell and lose interlayer shear. Storage at 10 °C to 30 °C and 30% to 70% RH in the original liner is required. Pre-drying is unnecessary for dry substrates because FEP absorbs less than 0.01% moisture by 24 h immersion under ASTM D570, but wet substrates must be dried to prevent interfacial condensation.

    Property CHR 2355-2 FEP/Silicone Polyester/Silicone Polyimide/Silicone PTFE/Glass Cloth/Silicone
    Continuous use temperature, backing-limited 204 °C 130 °C 260 °C 260 °C
    Dielectric constant at 1 MHz 2.0–2.1 3.2–3.4 3.4–3.5 2.5–3.0
    Tensile strength, class-representative 20–30 N/10 mm 30–50 N/10 mm 40–70 N/10 mm 50–100 N/10 mm
    Surface resistivity 1015 Ω minimum 1012 Ω minimum 1015 Ω minimum 1014 Ω minimum
    Release character Low-friction FEP film Resin-rich polyester Polyimide film Woven glass, particulate-prone
    Typical failure mode above rated temperature Backing softening above 204 °C Backing shrinkage above 150 °C Adhesive embrittlement above 260 °C Adhesive oxidation and edge lifting above 260 °C
    Standard or Regulation Test Method or Clause Relevance
    ASTM D1000 Electrical pressure-sensitive tape test methods Total construction dielectric and physical testing
    ASTM D149 Dielectric breakdown voltage and dielectric strength FEP film and finished tape insulation rating
    ASTM D257 DC resistance or conductance of insulating materials Surface and volume resistivity verification
    ASTM D3330/D3330M Peel adhesion of pressure-sensitive tape Adhesive bond to stainless steel and backing release
    ASTM D3652 Thickness of pressure-sensitive tapes Incoming thickness tolerance and lot comparison
    UL 510 Electrical insulating tape component recognition Agency approval for electrical insulation use
    FDA 21 CFR 177.1550 Perfluorocarbon resins FEP backing compliance for repeated food-contact components
    REACH Registration, evaluation, authorisation and restriction of chemicals European Union chemical compliance for fluoropolymer and silicone components

    Roll geometry and liner selection affect high-speed application. Edge lifting on motor winding lines typically occurs when the tape is applied over a radius below 2 mm because the FEP backing has higher bending stiffness than unsupported skived PTFE film. In such configurations, a longer dwell at 100 °C to 120 °C improves adhesive wet-out but does not eliminate the mechanical stress concentration at the bend. For continuous immersion or high-pressure sealing applications, published data for this specific configuration is limited; qualification must include the actual substrate, temperature cycle, and pressure profile.

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