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Saint-Gobain CHR 2283-2 Extruded PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR 2283-2 Extruded PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 470574
    Product Name Saint-Gobain CHR 2283-2 Extruded PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape
    Brand Saint-Gobain
    Product Code CHR 2283-2
    Tape Type Pressure Sensitive Tape
    Backing Material Extruded PTFE Film
    Adhesive Type Acrylic
    Backing Thickness 2.0 mil
    Total Thickness 3.3 mil
    Adhesive Thickness 1.3 mil
    Color Gray
    Adhesion To Steel 25 oz/in
    Tensile Strength 20 lb/in
    Elongation At Break 100%
    Dielectric Strength 5000 V
    Operating Temperature Range -100°F to 350°F
    Chemical Resistance Excellent
    Coefficient Of Friction Low
    Available Length 36 yd
    Core Diameter 3 in
    Rohs Compliant Yes

    As an accredited Saint-Gobain CHR 2283-2 Extruded PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing One roll per carton, sealed in protective plastic wrap, clearly labeled Saint-Gobain CHR 2283-2 PTFE film tape with acrylic adhesive.
    Container Loading (20′ FCL) 20′ FCL loading palletized rolls/cases of Saint-Gobain CHR 2283-2 PTFE film tape with acrylic adhesive, secured, dry, moisture-protected, ambient conditions.
    Shipping Saint-Gobain CHR 2283-2 Extruded PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape ships as non-hazardous, non-regulated material. It is typically packaged in sealed rolls and cartons, protected from moisture, heat, and sunlight. Standard ground, air, or ocean transport is acceptable. No special DOT, IATA, or IMDG labeling required under normal conditions.
    Storage Store Saint-Gobain CHR 2283-2 tape in its original sealed packaging in a clean, dry, well-ventilated area. Maintain a moderate temperature, ideally 15–27°C (60–80°F), and 40–60% relative humidity. Keep away from direct sunlight, heat, moisture, dust, oils, solvents, and ignition sources. Do not crush rolls; rotate stock and follow manufacturer’s shelf-life instructions.
    Shelf Life Shelf life is typically 18 months from manufacture when stored in original packaging at 70°F (21°C) and 50% relative humidity.
    Application of Saint-Gobain CHR 2283-2 Extruded PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape

    In hot-bar heat sealing of biaxially oriented polypropylene and cast linear low-density polyethylene films on intermittent vertical form-fill-seal machines, the jaw face commonly cycles between 110°C and 175°C, with seal-bar pressure of 2–5 bar and dwell intervals of 0.8–2.5 s. The PTFE backing exhibits a surface free energy in the range of 18–20 mN/m at 20°C, preventing molten polyethylene and seal-bar residue from wetting the jaw face. The acrylic adhesive side is pressure-bonded to the sealing jaw after degreasing with isopropyl alcohol, abrading with 320–400 grit aluminium oxide to a final roughness of Ra 0.8–1.6 µm, and pressing with a steel laminating roller at a linear force of 20–40 N/cm. The tape is applied with a 5–8 mm overhang beyond the jaw edge and spliced as a butt joint; overlap splices are avoided because the additional 0.05 mm step can emboss thin OPP film at seal pressure. After installation, a run-in sequence of 10–20 short cycles at reduced speed is used to stabilise the bond line and reveal incipient edge lift. Long-term exposure of the acrylic adhesive to jaw temperatures above 135°C accelerates oxidative embrittlement and produces edge squeeze-out; published data for CHR 2283-2 at higher jaw setpoints is limited, so qualification should include peel adhesion after thermal aging at the intended setpoint according to ASTM D3330/D3330M and thickness retention according to ASTM D3652/D3652M. On an L-bar sealer with a top jaw width of 25 mm, the failure mode most frequently observed is not backing fracture but adhesive creep at the trailing edge, where the thermal gradient is steepest and plasticizer migration from polyolefin film creates a low-shear boundary layer. For direct food-contact applications under a functional barrier, the PTFE backing may be assessed against 21 CFR 177.1550 and the adhesive against 21 CFR 175.105; in the EU, overall migration must be verified under Commission Regulation (EU) No 10/2011 with the standard limit of 10 mg/dm². Converters should not infer food-contact compliance solely from the backing composition because the acrylic adhesive layer requires separate compositional and migration testing at the converting site.

    What Limits Residue Transfer in Epoxy Prepreg Vacuum Bagging?

    The release interface between a silicone-free PTFE film and an epoxy prepreg stack is governed by the low dispersive and polar components of the PTFE surface, which prevent wetting by uncured epoxy constituents and inhibit mechanical interlock after cure. CHR 2283-2 is applied to aluminium cure tools, steel caul plates, and vacuum bag flanges as flash breaker tape and release separator where siloxane contamination would reduce later adhesive bonding or topcoat wetting. The tape is cut to 10–15 mm width and burnished onto degreased 2024-T3 aluminium with a polyethylene roller; the installed thickness is checked after 24 h because acrylic PSA cold-flow can alter step-edge geometry. Autoclave cycles with air temperature to 177°C and gauge pressure of 0.6–0.85 MPa are common in structural composite production; however, the steel tool face often lags the air thermocouple by 10–25°C at ramp rates of 1.5–3.0°C/min. This thermal lag can protect the acrylic bond line, but only tool-embedded thermocouple data can confirm that the adhesive remains below its softening range throughout the dwell. At tool face temperatures above 150°C, localized flow of the adhesive layer and subsequent transfer to the tool flange may occur; published data for CHR 2283-2 under exact cure profiles is limited. Adhesion on aluminium is measured after one full simulated cure cycle according to ASTM D3330/D3330M, and residue is inspected with cross-cut adhesion testing according to ISO 2409:2020. After bag removal, tool surfaces can be evaluated with a water break-free test according to ASTM F22-21; a discontinuous water film indicates hydrophobic contamination from organic residue. Ketone-based tool cleaners can attack the exposed acrylic edge, so cleaning protocol must confine solvent contact to non-taped areas. The 0.05 mm class backing produces a low step edge at the bag seal perimeter, which reduces resin bleed grooves compared with thicker glass-cloth PTFE laminates, but the film has limited puncture resistance against sharp carbon-fibre slivers; supplementary tool protection is required where automated ply cutting generates fibre splinters.

    Because solventless polyurethane laminating adhesives remain tacky for several metres after transfer, idler rollers on narrow-web coating and laminating lines accumulate partially cured adhesive, which later transfers to the web and creates visual defects in barrier laminates. A PTFE film with an acrylic pressure-sensitive adhesive is wrapped around the roller shells to create a low-energy release surface that prevents deposit build-up and reduces the frequency of line stops for cleaning. The backing surface has a dynamic coefficient of friction below 0.10 against steel, so web tension variations are smaller on high-speed lines running at 250–400 m/min. The tape is applied with a spiral wrap of 50% overlap or as a full-width butt wrap on rollers with face widths up to 1,600 mm. Spiral overlaps produce a helical ridge that can mark extensible films; full-width butt wraps are therefore preferred for polyester and oriented polyamide webs above 150 N/m tension. The roller surface temperature should remain below 80°C because the acrylic adhesive begins to lose peel strength in continuous heat above this range when plasticized by residual laminating solvent. Edge lift occurs if the roller is cleaned with ethyl acetate or methyl ethyl ketone; isopropyl alcohol is the only routine cleaning solvent that does not rapidly swell the adhesive layer. Solvent resistance is evaluated according to ASTM D5402-19, and adhesion after solvent wipe is measured according to ASTM D3330/D3330M. On gravure-coating lines where ester and ketone solvent vapours are present, the exposed acrylic glue line at the roller ends must be covered by metal end caps or wrapped around the roller shoulder; otherwise capillary wicking of solvent into the adhesive layer produces a gel boundary that reduces peel adhesion within a limited production interval. Published data for CHR 2283-2 in sustained solvent vapour exposure is limited. Cleaning cycles should be validated with residual adhesion measurement according to ASTM D3330/D3330M; if adhesion falls below the processor’s release limit, the tape is stripped at 23°C with a low-angle peel to avoid damaging ground roller surfaces.

    When Wire Coil Adhesive Layers Are Subjected to Class F Thermal Aging

    In dry-type motor and transformer manufacturing, PTFE film tapes are applied over slot liner extensions, phase separator joints, and lead wire anchoring points where low-friction wire insertion and chemical resistance are required. The PTFE backing has no continuous service limitation at ordinary Class F temperatures, but the acrylic adhesive layer is the limiting component. Qualification is therefore structured around thermal endurance of the adhesive bond line at 105°C, 130°C, and 155°C for exposure periods of 1,000 h. Adhesion retention is measured according to ASTM D1000-17, and dielectric breakdown voltage can be evaluated according to ASTM D149-20 on the specific coil assembly. Because the acrylic PSA is polar and may contribute to electrolysis current under high humidity, the user should compare electrolysis factor data against the insulation system specification; published data for CHR 2283-2 in this specific test configuration is limited. The tape is applied in half-lapped layers with wrap tension below 10 N/cm of tape width; PTFE exhibits cold flow under sustained load, and excessive tension thins the film at radii and reduces dielectric margin. The coefficient of friction of PTFE against steel being below 0.10, the tape improves slide-in of pre-formed coils into stator slots and reduces abrasion of enamel wire. However, because the adhesive is acrylic, it cannot be expected to retain full peel strength at Class F continuous operating temperature. Industrial failure records from rewind shops commonly show adhesive embrittlement and unwinding at end-turn areas where local hot spots exceed the average winding temperature. Use of CHR 2283-2 as a sole primary insulation or as a substitute for mica or aramid-based slot liner is outside the design boundary; it functions as a protective and positioning layer, not as a primary dielectric barrier. For batch acceptance, a dummy slot assembly is built and subjected to a 500 V insulation resistance test before and after thermal aging, with the pass/fail criterion defined by the motor insulation system standard. This is a conservative approach when published data for the specific tape configuration is absent.

    Table 1: Indicative downstream qualification matrix for CHR 2283-2 process boundaries.

    Application zoneThermal boundary at adhesive bond linePrimary test methodProduction failure signal
    Hot-bar seal jaw release≤135°CASTM D3330/D3330M, ASTM D3652/D3652MEdge squeeze-out after 24 h
    Autoclave bag flange release≤150°C tool face after thermocouple confirmationASTM D3330/D3330M, ISO 2409:2020Adhesive transfer or cross-cut loss after cure
    Converting roller wrap≤80°C roller shellASTM D5402-19, ASTM D3330/D3330MEdge lift after ester or ketone wipe
    Motor coil wrap≤105°C continuous serviceASTM D1000-17, ASTM D149-20Adhesive embrittlement and unwinding
    Polyurethane mold release≤80°C mold wall, no liquid isocyanate contactASTM D1876-08, ISO 2409:2020Flash adhesion or edge lift at tape seam
    Aircraft topcoat masking≤80°C bake, 120 min dwellASTM D3330/D3330M, ASTM F22-21Residue islands after peel

    Polyurethane Mold Release Interface and Isocyanate Exposure Boundaries

    Open casting of two-component polyurethane systems in steel or aluminium molds creates flash adhesion at the parting line; a PTFE film tape with an acrylic PSA is used as a silicone-free release interface when later painting or structural bonding of the cast part is required. The tape is applied to degreased mold walls and along the flash line with a roller; the PTFE surface prevents the cured urethane from forming mechanical locks, while the acrylic adhesive holds the tape against mold temperatures that rarely exceed 80°C during low-pressure casting. The critical process risk is not thermal softening but capillary attack at exposed adhesive edges by liquid isocyanate prepolymer. Aromatic and aliphatic isocyanate mixtures are aggressive toward many acrylic PSAs, causing gel-layer swelling and localized release failure. Therefore the tape edge must be encapsulated by a mechanical frame, set back from the liquid resin pool, or protected by a compatible edge sealant; published data for CHR 2283-2 in direct prolonged MDI immersion is limited. Demold release force is measured with a universal testing machine in a T-peel geometry at 50 mm/min, following the sample preparation concept of ASTM D1876-08, and compared against a bare mold control. Silicone-free performance is validated after demolding by cleaning the cast part and applying a cross-cut adhesion test according to ISO 2409:2020 to a representative painted or bonded area; delamination at the coating interface is a typical failure signal for residual siloxane contamination. The tape is inspected after every shift for scratches and edge lift; one deep scratch in the PTFE surface can create a mechanical lock that increases local demold force. Mold surface preparation before tape application is limited to isopropanol degreasing and fine abrasive conditioning to Ra 0.8–1.6 µm, because phosphoric acid-based aluminium brighteners may attack the acrylic adhesive and reduce peel strength. When mold geometries include deep draw features, the tape is pre-formed with a heat gun at 120°C to avoid wrinkles; overheating above 150°C discolors the acrylic adhesive and is not recommended.

    Thermal Endurance of the Acrylic Bond Line During Aircraft Topcoat Bake Cycles

    Aircraft masking operations around fuel tank seal planes, bushings, and bearing surfaces use PTFE-backed acrylic pressure-sensitive tapes because the PTFE surface resists paint adhesion, while the acrylic adhesive provides clean removal from aluminium and titanium substrates after polyurethane topcoat bake cycles of 60–80°C for 60–120 min. In this thermal window, the acrylic bond line remains below the range at which rapid oxidative breakdown occurs; however, peel force increases with dwell time and substrate temperature. Removal is performed after the surface has cooled below 40°C, using a 180° peel angle and a controlled rate of 300 mm/min; peel force can be recorded according to ASTM D3330/D3330M. Residue inspection is conducted under 10× magnification, and surface cleanliness is confirmed with a water break-free test according to ASTM F22-21; a break in the water film indicates residual adhesive or low-surface-energy contaminant. Where repair specifications require bake cycles above 120°C, acrylic transfer becomes difficult to predict, and published data for CHR 2283-2 in this configuration is limited. The absence of silicone in the adhesive system is a significant processing constraint in topcoat facilities; silicone migration from liner or adhesive components can produce fish-eye defects in adjacent wet paint. The PTFE backing, having a surface free energy in the range of 18–20 mN/m, does not retain paint pigment and can be removed without tearing under a controlled tensile load. On titanium substrates, certification programs often require that the tape not leave chloride-bearing residues; therefore the adhesive composition and cleaning agents must be reviewed against the relevant aircraft manufacturer specification. Tape is applied to the mask perimeter with a soft roller and should not be stretched beyond 5% elongation; PTFE cold flow can produce edge thinning and sliver tears. Once the bake cycle is complete, the tape is removed in a single continuous pull where geometry permits, avoiding jerking motions that fracture the adhesive layer and leave isolated residue islands.

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    Certification & Compliance
    More Introduction
    Saint-Gobain CHR 2283-2 is a pressure-sensitive tape constructed from a 0.05 mm extruded polytetrafluoroethylene film backing and a 0.038 mm acrylic adhesive layer, producing a total nominal caliper of 0.089 mm. The product designation places it in the CHR tape series in which the 2283 sequence identifies the extruded PTFE/acrylic combination and the -2 suffix indicates the 2.0 mil backing thickness. The material is supplied in slit log rolls with a release liner over the adhesive. It is specified for coil wrapping, bus-bar insulation, heat-sealing release, and roller covering where silicone-free construction, high dielectric withstand, and low-friction release are simultaneous requirements. The product is distinguished from skived PTFE tapes by the extruded film’s caliper uniformity and from silicone-adhesive PTFE tapes by the absence of silicone in the adhesive system.

    What separates extruded PTFE from skived PTFE when tape must insulate sharp-radius conductors?

    Extruded PTFE is produced by mixing PTFE fine powder with a volatile hydrocarbon extrusion aid, ram-extruding a preform, and calendering the extrudate into film before sintering above the 327 °C crystalline melting point. Skived PTFE, by contrast, is machined from a molded and sintered billet. The extrusion-calendering route permits tighter gauge control on the 2.0 mil backing and a smoother exposed surface. For sharp-radius conductor insulation, gauge variation directly affects wrapped thickness at the bend: a 10% local thickness reduction can reduce voltage withstand because breakdown stress is proportional to insulation thickness. The extruded film also has lower porosity, which reduces the number of entrapped air pockets at overlap edges. PTFE undergoes reversible crystalline transitions near 19 °C and 30 °C; these transitions are common to both extruded and skived PTFE but become more visible in wrapped assemblies that experience thermal cycling because small dimensional changes can alter overlap pressure. Lot-qualification data for the product are commonly generated under the test designations listed in the table below. The values are manufacturer-published nominal data points; specific reel lots may deviate within the supplier’s release tolerance, and users should verify against the current product data sheet before setting winding or die-cut parameters.
    Property Nominal published value Reference method
    Backing thickness 0.05 mm (2.0 mil) ASTM D3652
    Adhesive thickness 0.038 mm (1.5 mil) ASTM D3652
    Total thickness 0.089 mm (3.5 mil) ASTM D3652
    Peel adhesion to stainless steel, 180° 25 oz/in (2.7 N/cm) ASTM D3330
    Tensile strength, machine direction 15 lb/in (26.3 N/10 mm) ASTM D3759
    Elongation at break 125% ASTM D3759
    Dielectric breakdown voltage, total tape 5,000 V ASTM D149
    Backing lower and upper temperature limits -73 °C to 204 °C Manufacturer data
    Peel adhesion is measured after a controlled dwell on stainless steel. In production, adhesion to copper or aluminium varies with surface oxidation and roughness; adhesion to low-surface-energy substrates such as silicone rubber or polyethylene is lower. The acrylic layer flows into surface irregularities as a function of time and temperature, so initial tack is not used as the release criterion. The supplier’s current data sheet remains the controlling document for lot release.

    Adhesion Onset and Solvent-Dry-Out Failure Modes in Acrylic PSA Layers

    Acrylic pressure-sensitive adhesives used on PTFE backings are usually solution-cast or transfer-laminated to a treated PTFE surface. The adhesive layer is polar and contains no polysiloxane; this avoids the cyclic-siloxane outgassing associated with silicone PSA systems at elevated temperature. Silicone migration risk becomes relevant above 120 °C because low-molecular-weight species volatilize and can condense on nearby optical surfaces, corona electrodes, or wire-bond pads. Acrylic PSA does not release silicones, but it is susceptible to plasticization by esters, ketones, and aromatic hydrocarbons. Solvent cleaning before application must use fast-drying reagents such as isopropanol or heptane and a lint-free wipe; residual isopropanol under the adhesive can form bubbles during thermal operation. On production lines, a 30 s flash-off after solvent cleaning is commonly observed before tape placement. Application below the acrylic PSA glass transition near -20 °C reduces tack; substrates should be warmed to at least 10 °C before application. Automated coil-winding machines slit the tape to widths of ±0.1 mm. With elongation at break of 125% under ASTM D3759, winders operate at low tension so that the backing remains in a controlled deformation region and does not neck down excessively. A target unwind tension below 10 N per 25 mm width is used on traversing wrap heads to limit caliper loss at conductor corners. Edge wander on duplex slitter rewind stations above 0.2 mm creates telescoped rolls and inconsistent overlap on the winding head. The tape’s PTFE surface has low surface energy; because the exposed backing does not accept inks or coatings, the tape is used as a release surface in heat sealing. On impulse sealing jaws operating between 150 °C and 200 °C, the backing prevents molten polyethylene or ionomer films from building up on the jaw, but the acrylic adhesive at the jaw interface experiences the full thermal load. Repeated cycles above the adhesive’s continuous rating cause edge lifting, adhesive oxidation, and transfer residue at the exposed edges.

    When application temperatures exceed the acrylic adhesive’s continuous service capability

    In continuous high-temperature service, acrylic PSAs lose shear holding capacity before the PTFE backing degrades. The PTFE layer itself can withstand excursions to 204 °C, but the acrylic adhesive should be validated above 149 °C because cohesive strength decreases with temperature and dwell time. The relevant comparison is therefore with silicone-adhesive PTFE tapes, which maintain peel and shear at higher continuous temperatures but release low-molecular-weight siloxanes.
    Selection attribute CHR 2283-2 Silicone-adhesive PTFE tape Polyimide film tape
    Adhesive chemistry Acrylic Silicone Silicone or acrylic
    Silicone contamination risk None Present above 120 °C Present for silicone types
    Backing dielectric constant 2.1 2.1 3.5
    High-temperature continuous adhesive capability Limited by acrylic; validate above 149 °C Higher than acrylic Higher for silicone
    Release surface performance High High Moderate
    The presence of silicone in the comparison tape does not disqualify it; it becomes a problem only when downstream coating, conformal coating, or wire-bonding processes are sensitive to siloxane residues. CHR 2283-2 is chosen when silicone-free status is more important than maximum hot shear. In comparison with polyimide film tape, the PTFE backing offers a lower dielectric constant of 2.1, which reduces parallel capacitance in wrapped coils, and a much lower critical surface tension, which prevents adhesive and varnish wet-out. Polyimide film has a higher tensile modulus and better cut-through resistance, so it is preferred when sharp edges or abrasion are present. The selection is therefore governed by whether silicone-free release and low dielectric constant are more important than mechanical toughness. Chemical compatibility of the composite tape is limited by both layers. The PTFE backing is resistant to nearly all solvents, acids, and bases at room temperature, but molten alkali metals and elemental fluorine attack PTFE. The acrylic adhesive is the weak layer: ketones, esters, and strong polar solvents soften it, and prolonged contact with hot transformer oil can extract low-molecular-weight adhesive fractions. In oil-filled apparatus, testing per ASTM D3455 for compatibility with electrical insulating oils is used; published data for this specific configuration is limited. The tape should not be specified where continuous immersion in strong oxidizing acids at elevated temperature is present, because edge ingress attacks the adhesive and causes premature lifting.

    Overlap edges in coil-wrapped bus bars impose a different dielectric stress mode

    When the tape is wrapped with 50% overlap on rectangular copper bus bars, the dielectric system is not the bulk PTFE but the adhesive interface and air pocket at each overlap edge. Partial discharge inception can occur below the breakdown voltage listed in ASTM D149; discharge testing per IEC 60343 or ASTM D1868 is necessary for high-voltage designs. Edge contamination from fingerprints, adhesive squeeze-out, or copper burrs creates field enhancement. On production lines, bus bars are deburred and cleaned with isopropanol-linted wipes before wrapping; a final inspection with magnification 5× to 10× is used to reject gaps greater than 0.2 mm at the overlap. The tape’s caliper uniformity reduces the number of high points that could generate partial discharge, but the designer must still verify creepage and clearance distances under IEC 60664-1. Because the acrylic layer is polar, its presence changes the interfacial stress distribution at the overlap when the coil is impregnated with varnish; voids left during varnish cure are more likely to initiate discharge than the PTFE layer itself.
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