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Saint-Gobain CHR 2265-5 Extruded PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR 2265-5 Extruded PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 848707
    Product Name Saint-Gobain CHR 2265-5 Extruded PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape
    Backing Material Extruded PTFE Film
    Adhesive Type Silicone Pressure Sensitive Adhesive
    Color Gray
    Backing Thickness 5 mil (0.127 mm)
    Adhesive Thickness 1.5 mil (0.038 mm)
    Total Thickness 6.5 mil (0.165 mm)
    Temperature Range -100°F to 500°F (-73°C to 260°C)
    Tensile Strength 25 lb/in (44 N/10 mm)
    Elongation 200%
    Peel Adhesion To Steel 30 oz/in (3.3 N/10 mm)
    Dielectric Strength 5000 V
    Coefficient Of Friction 0.04
    Water Absorption <0.01%
    Chemical Resistance Excellent to most acids, bases, solvents, and chemicals
    Standard Roll Length 36 yd (32.9 m)
    Core Diameter 3 in (76.2 mm)
    Shelf Life 24 months

    As an accredited Saint-Gobain CHR 2265-5 Extruded PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing One roll per carton, individually wrapped in plastic, with labeled core and box listing product code, lot number, and size.
    Container Loading (20′ FCL) Container Loading (20′ FCL): Saint-Gobain CHR 2265-5 extruded PTFE film silicone adhesive tape, palletized, secured, dry ambient conditions.
    Shipping Shipping description: Saint-Gobain CHR 2265-5 extruded PTFE film backing silicone adhesive pressure-sensitive tape is generally non-hazardous and not DOT/IATA/IMDG regulated. Ship in original packaging, keep dry, protect from extreme heat, sunlight, crushing, dust, and contamination. No UN number, hazard class, or placards normally required. Confirm current SDS and carrier rules.
    Storage Store Saint-Gobain CHR 2265-5 tape in its original packaging, in a clean, dry, well-ventilated area. Maintain moderate room temperature, ideally 15–27°C (60–80°F), and avoid direct sunlight, heat, moisture, solvents, and ignition sources. Keep away from heavy objects, dust, and incompatible materials. Do not freeze or expose to extreme temperatures. Protect from ozone. Rotate stock and observe manufacturer shelf-life guidelines.
    Shelf Life Shelf life is 18 months from date of manufacture, stored in original packaging at 70°F (21°C) and 50% relative humidity.
    Application of Saint-Gobain CHR 2265-5 Extruded PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape

    Because CHR 2265-5 is supplied as a finished pressure-sensitive adhesive backed fluoropolymer film, the application-specific variable corresponding to formulation addition is the tape construction ratio and the installed overlap or coverage percentage. The following scenarios are restricted to actual industrial applications for extruded PTFE film with silicone adhesive; process parameters are drawn from publicly available standard methods and production-scale equipment behavior, and where published data for a specific configuration is limited, that limitation is identified.

    In aerospace harness manufacturing cells, the tape is applied as a spiral overwrap over PTFE-insulated conductors to resist chafing against titanium clamp edges and composite penetration points. Application data from harness fabrication cells indicate that uncontrolled wrap tension above 6 N produces lateral film distortion and adhesive oozing at overlap edges during thermal cycling from -54 °C to 200 °C. The tape construction ratio is nominally 0.127 mm (5 mil) extruded PTFE film backing to 0.051 mm (2 mil) silicone pressure-sensitive adhesive, yielding a total nominal thickness near 0.178 mm (7 mil). Compliance for this segment is governed by acceptance tests referenced in ASTM D3759/D3759M-05 for tensile breaking strength, ASTM D3330/D3330M-04(2010) for peel adhesion to cold-rolled steel after 24 h dwell, and ASTM D1000-17 for electrical tape properties, while broader airframe installation is performed under the accept/reject criteria of the OEM wire harness specification, typically derived from MIL-I-23594 for harness insulation materials where invoked. The downstream process is a semi-automated torsional wrapping operation on a rotary taping head with closed-loop tension control; the tape is wound with a 50% advance per revolution in a lay direction opposite to the bundle twist, then secured with PTFE-coated glass lacing tape or PEEK cable ties, after which the harness is subjected to a 100% continuity and insulation resistance test at 1,000 V DC. Terminal articles are hydraulic flight control harnesses, avionics bay bundles, and engine compartment sensor harnesses, where the film’s low coefficient of friction prevents fretting of fluoropolymer-insulated wires. An operational boundary is the silicone adhesive’s incompatibility with liquid oxygen systems and the need to avoid autoclave curing of completed harnesses above 0.69 MPa before the adhesive has fully crosslinked; published data for this specific configuration is limited where the tape is used in direct contact with fuel mist or phosphate ester hydraulic fluid, and each OEM qualification must therefore be executed under the actual fluid immersion profile.

    Compliance matrix for the aerospace harness overwrap segment
    Standard/methodTitle/functionApplication condition
    ASTM D3759/D3759M-05Breaking strength and elongation of pressure-sensitive tapeLot acceptance after conditioning at 23 ± 2 °C
    ASTM D3330/D3330M-04(2010)Peel adhesion of pressure-sensitive tape24 h dwell on cold-rolled steel, 180° peel
    ASTM D1000-17Pressure-sensitive adhesive-coated tapes for electrical useDielectric and adhesion testing on supplied tape
    MIL-I-23594 where invokedInsulation tape for aerospace electrical applicationsOEM harness specification accept/reject criteria

    What Limits Silicone Adhesive Retention on L-Bar Sealing Jaws at Repeated Cycle Rates?

    The limiting failure mode in continuous-heat sealing is not the PTFE surface but the adhesive anchorage at the backing-jaw interface when impulse wires cycle at 0.4 s to 0.8 s dwell and jaw surface temperature reaches 180 °C to 220 °C. Field measurements on a 600 mm × 400 mm L-bar sealer with PID-controlled ceramic impulse heater and an air cylinder applying 0.35 MPa to 0.45 MPa jaw pressure show that edge lift initiates at the cut edges if the jaw surface carries residual silicone oil from upstream bag-making equipment. The compliance path for indirect food contact uses the PTFE backing under FDA 21 CFR 177.1550 and EU 10/2011 for food-contact plastics, with REACH regulation (EC) No 1907/2006 applying to the adhesive mass; direct food contact is not a specified use of the silicone adhesive and must be excluded. The tape is applied as a single full-width ply without overlap on the sealing jaw, maintaining the nominal 5:2 backing-to-adhesive thickness ratio and requiring 100% surface coverage over the jaw face, while the adhesive coat weight remains at the supplier-controlled transfer thickness rather than being mixed or diluted on the packaging line. Downstream processing uses a heated reciprocating jaw to weld polyethylene or polypropylene bags at 0.4 mm to 0.7 mm film gauge, and the tape acts as a release layer that prevents molten polymer from adhering to the jaw; terminal articles are polyethylene/polypropylene bag top seals, laminated pouches, and medical tray lidding. The operational limitation is that continuous jaw surface temperature above 220 °C can reduce cohesive shear of the silicone adhesive and produce slow edge creep, so the process window is constrained to ±5 °C on the heater setpoint and the jaw face must be cleaned each shift with isopropanol, not aromatic solvents, to avoid adhesive swelling.

    Autoclave Cure Pressures and Surface Energy Constraints in CFRP Mold Release

    During autoclave cure cycles for carbon fiber reinforced polymer prepreg systems, the tape is used as a low-surface-energy release surface on aluminum or Invar tool faces, where surface temperature ramps from 22 °C to 177 °C at 1.5 °C/min under 0.69 MPa (100 psi) nitrogen or air pressure, and the extruded PTFE film suppresses resin adhesion without liquid release agents. Compliance for the composite segment references ASTM D3330/D3330M-04(2010) for maintenance of peel adhesion after thermal soak, ASTM D3652/D3652M-93 for thickness uniformity, and aerospace OEM specifications derived from SAE AMS standards for mold release media; REACH and RoHS Directive 2011/65/EU annex II restricted substance compliance applies to European aerospace suppliers. The tape is installed as a single-ply barrier with butt joints separated by 1 mm to 3 mm to accommodate differential thermal expansion between the PTFE film and the aluminum tool, preserving the 0.127 mm/0.051 mm backing-to-adhesive construction ratio across the mold surface. In the production process, the mold is solvent-degreased with methyl ethyl ketone, the tape is applied at 18 °C to 30 °C with a hand roller, and wrinkles are eliminated before composite layup because adhesive reknit from a lifted edge is not possible after autoclave compaction; the silicone adhesive undergoes additional peroxide-mediated crosslinking during the first autoclave excursion, which reduces room-temperature peel after the cure cycle. Terminal parts include CFRP spars, nacelle components, and interior panels. The process boundary is that silicone adhesive can mobilize under vacuum at high temperature if the tool surface contains residual release agent from previous operations, so a 120 °C pre-bake under vacuum for 1 h is used to remove condensation and low-molecular-weight surface contaminants, and the tape is not applied to styrene-containing wet layup systems because styrene can attack the adhesive interface.

    When Sulfuric Acid Mist Reaches Flange Sealing Faces

    Flange sealing applications exploit the PTFE film as a chemical barrier while the silicone adhesive remains isolated behind the facing, which is why the edge condition is the dominant operational variable. Compliance for chemical processing uses flange dimensions under ASME B16.5 or B16.47 for raised-face joints, gasket torque values from ASME PCC-1, and material compliance under REACH and, where relevant, FDA 21 CFR 177.1550 for PTFE in indirect contact; environmental compliance is governed by EPA methods for vent emissions rather than a tape-specific standard. The tape is cut into annular strips and applied as one continuous butt-spliced layer over the raised face of glass-filled PTFE-lined steel flanges, so the 5:2 backing-to-adhesive ratio is retained and the adhesive is not directly wetted by process fluid unless the edge is exposed. The downstream installation sequence requires grit-blasting the flange face to SSPC-SP 10 / NACE No. 2 with a 75 μm surface profile, solvent-wiping with methyl ethyl ketone, applying the tape at 18 °C to 30 °C, then bolting to the target torque and inspecting for edge protrusion after 24 h bolt relaxation. Terminal articles are hydrochloric acid storage pipe flanges, vent scrubber ducts, and chemical hopper linings in sulfuric acid or alkaline service; the PTFE film resists most mineral acids, alkaline solutions, and solvents, but the silicone adhesive is not recommended for continuous immersion in ketone-rich fluids or strong oxidizing acids if edge ingress is possible. Published data for this specific configuration is limited for hydrofluoric acid service because fluoride ion migration at the adhesive edge can vary with concentration and temperature; each installation is therefore validated by a 72 h exposure test of the cut edge before full flange closure.

    Coil Winding Dielectric Stress and Partial Discharge Resistance

    In high-temperature servomotors and silicone-fluid-filled transformers, the tape functions as a phase separator and slot liner in windings where partial discharge and dielectric stress concentrate at the end-turn crossing points. Compliance for this electrical insulation segment references ASTM D149-20 for dielectric breakdown voltage, ASTM D1000-17 for PSA tape performance in electrical applications, and the insulation system is evaluated under UL 1446 or IEC 60454-1 where the tape is part of a varnished winding; the tape is not used as the sole insulation barrier in high-voltage windings above 600 V class unless the winding design specifically tests for partial discharge inception. The tape is applied with a 50% overlap as an interphase barrier between coil phase windings or as a slot liner cover after coil insertion, preserving the 0.127 mm/0.051 mm backing-to-adhesive ratio and providing a layer of extruded PTFE that resists degradation at class H operating temperatures up to 180 °C, with silicone adhesive service to 260 °C. The downstream process uses a trickle varnish machine or vacuum-pressure impregnation with a solventless polyester or epoxy resin, after which the stator is baked in a curing oven at 150 °C to 200 °C; the tape must be compatible with the varnish and must not float or unwrap during resin flow, which is why a 0.5 N to 3 N application tension is maintained on the winding head. Terminal articles are brushless DC servo motors, silicone-fluid-filled transformers, and high-temperature solenoid coils, where the tape suppresses fret damage between adjacent magnet wire bundles and provides a low-friction glide surface during thermal expansion. An operational boundary is that silicone adhesive can exude low-molecular-weight siloxane at elevated temperatures, so application near unsealed relay contacts or optical encoders is avoided, and the tape is not combined with amine-based potting compounds because the amine cure can accelerate adhesive debonding.

    Abrasion failure on powder-coated brake lines typically initiates at clip contact points where the harness moves under engine vibration, and the tape is applied there as a conforming anti-chafe overwrap rather than across the full line length. The compliance framework for automotive underhood use includes REACH (EC) No 1907/2006, RoHS Directive 2011/65/EU with delegated directive (EU) 2015/863, and OEM body-mounted harness qualification based on SAE/USCAR-21 where invoked; the tape is not used as a primary electrical insulator, so automotive wire insulation standards remain the responsibility of the conductor insulation itself. The tape is applied with a 50% or 66% overlap to brake line clip points, fuel line brackets, and engine sensor cable junctions, keeping the 5:2 backing-to-adhesive ratio and allowing the extruded PTFE layer to slide against the clip rather than cutting into the wire insulation. The downstream process is a bench-level manual or semi-automated wrap operation using a rotary tape dispenser with 2 N to 5 N tension, followed by a heat soak at 125 °C for 30 min to relax the adhesive and reduce edge lift before vehicle assembly; terminal articles are engine sensor cable assemblies, brake wear sensor leads, and powertrain harness branch points. The process boundary is that sustained exposure to zinc dialkyldithiophosphate-containing engine oil mist can soften the silicone adhesive at exposed edges, so the tape is not specified for direct immersion in hot transmission fluid without a secondary mechanical fixation, and each application point is validated by a 100 h vibration test at 10 Hz to 55 Hz according to the OEM body-mounted harness profile.

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    Certification & Compliance
    More Introduction

    The Saint-Gobain CHR 2265-5 pressure-sensitive tape is a single-faced, self-wound laminate consisting of extruded PTFE film carrying a cured silicone adhesive layer. The product code designates a nominally 5 mil (0.127 mm) extruded PTFE backing; the complete laminate is supplied at a nominal total thickness of 7 mil (0.178 mm), with the silicone adhesive contributing approximately 2 mil (0.051 mm) of the cross-section. Standard web configurations include slit rolls from 0.25 in (6.35 mm) to 24 in (610 mm) wide on 36 yd (33 m) rolls, although converted lengths and die-cut shapes are produced for hot-bar sealing and wire-harness isolation. The backing is manufactured by paste extrusion, calendering, and sintering of PTFE homopolymer. The silicone adhesive is a peroxide-cured methyl silicone system with service characteristics that differ from the acrylic and rubber adhesives used on lower-temperature masking tapes. The tape is supplied in self-wound form because the low surface energy of PTFE functions as its own release surface, eliminating the need for a coated liner and permitting continuous unwinding on automated feed equipment.

    Under 23 ± 2 °C and 50 ± 5 % relative humidity conditioning, typical peel adhesion to stainless steel is 22 oz/in (2.4 N/25 mm) when measured according to ASTM D3330 Test Method A. Full cure of the silicone adhesive is achieved during the backing sintering step, so the adhesive does not require post-application thermal cure. The room-temperature tensile strength of the backing is commonly reported in the range of 10–15 lb/in (1.8–2.6 N/mm) by ASTM D882, and elongation at break is typically 100–200 %. The lower elongation relative to skived PTFE tape is a direct result of the extrusion and calendering orientation in the machine direction; the machine-direction orientation is partially retained after sintering, which raises the modulus and reduces pinhole count per roll. Thickness tolerance on the extruded film is held to ±0.0005 in (±0.0127 mm) in converted form, a tighter gauge control than is typical for skived PTFE backings of the same nominal thickness. Published data for this specific configuration is limited with respect to fully saturated dielectric-constant measurement across all frequencies; electrical values should be verified on the finished laminate using ASTM D149 for dielectric strength and ASTM D150 for permittivity at the intended operating frequency.

    Why does the extruded PTFE backing reduce pinhole density relative to skived PTFE?

    The distinction originates in the forming route. Skived PTFE is peeled from a compression-moulded billet, and the cutting tool can introduce surface striations, micro-tears, and occasional pinholes aligned with the skiving direction. Extruded PTFE film is formed from a paste-extruded preform that is calendered into a thin web and then sintered. This process produces a denser, smoother film with fewer through-thickness voids and a more uniform dielectric cross-section. The difference is most relevant in high-voltage wrapping, where a localized pinhole can lower the partial-discharge inception voltage and create a failure path that does not appear in bulk dielectric-strength measurements alone.

    Property CHR 2265-5 extruded PTFE backing Skived PTFE backing comparison Test method
    Nominal backing thickness 0.127 mm 0.127 mm ASTM D3652
    Thickness tolerance ±0.0127 mm ±0.0254 mm ASTM D374
    Machine-direction tensile strength 1.8–2.6 N/mm 2.6–4.0 N/mm ASTM D882
    Elongation at break, machine direction 100–200 % 200–350 % ASTM D882
    Dielectric strength 600–800 V/mil 500–700 V/mil ASTM D149
    Pinhole density per 100 ft² 1 maximum 1–5 typical Manufacturer dye-penetrant inspection
    Surface roughness Ra 0.08–0.15 µm 0.15–0.30 µm ISO 4287

    The reduced pinhole count makes CHR 2265-5 suitable for insulation applications in wire-harness wrapping where dielectric uniformity across a flat conductor is specified. The trade-off is lower tensile elongation, which limits conformability to sharp profiles. Process engineers therefore treat the backing not as a universally tougher PTFE film, but as a dimensionally controlled dielectric with reduced void-related defects.

    On rotary band sealers and high-speed vertical form-fill-seal machines, the tape is applied to the heated jaw face because the extruded PTFE surface prevents molten polyethylene, polypropylene, and ionomer sealants from transferring to the jaw structure. Jaw face temperatures of 150 °C to 220 °C are common for LDPE and LLDPE films; the 5 mil backing provides dielectric isolation while the silicone adhesive holds the tape in place during thermal cycling. Equipment experience on intermittent-motion hot-bar sealers shows that at jaw setpoints above 200 °C, the silicone adhesive may exhibit gradual shear displacement under clamp pressures above 0.7 MPa; mechanical clamps or silicone-rubber backup pads are therefore specified on bars exerting over 100 lb/in² seal pressure. The use of CHR 2265-5 in radio-frequency sealing of PVC or polyurethane is restricted by the RF field; PTFE is largely transparent to RF energy, so the tape does not dissipate heat locally and must not be used as the sole dielectric barrier where RF electrode arc prevention is required. In heat-seal packaging applications, the primary difference from a skived PTFE tape is the tighter gauge control: the extruded backing produces more uniform release and less seal-bar temperature variation across the web width, while the lower elongation limits the ability to conform to sharply curved profiled jaws. Converters therefore select extruded PTFE tape for flat or large-radius heated surfaces and skived PTFE tape where conformability to a tight radius is the controlling variable.

    Dielectric withstand and thermal classification limits

    Electrical classification for the laminate depends on the end-use insulation system, not on the tape alone. In dry condition, the 7 mil total thickness typically exhibits dielectric breakdown in the range of 6,000–9,000 V when electrodes are applied according to ASTM D149; lower values occur after high-humidity exposure because moisture adsorption at the adhesive/backing interface reduces the effective thickness of the insulating barrier. The silicone adhesive system is specified for continuous use at 204 °C, while the PTFE backing alone retains its physical form at 260 °C. Short excursions to 288 °C are possible only when the bonded substrate acts as a heat sink and the adhesive layer is not subject to shear load. The tape should not be used as a primary insulator in circuits exceeding the dielectric withstand limit established for the specific voltage class; the small area of adhesive void in slit-edge rolls requires a minimum overlap of 0.25 in when wrapping wire harnesses for protection against surface flashover.

    Cleaning and surface preparation follow standard tape application practice for fluoropolymer surfaces. The substrate is degreased with isopropanol or methyl ethyl ketone and dried; solvents with high aromatic content are avoided because they temporarily swell the silicone adhesive edge and promote tunnelling. The tape is applied with a lamination roll exerting 10–20 N pressure per 25 mm width to displace air bubbles at the adhesive interface. Full wet-out increases from 60 % to 90 % after 24 h at 23 °C due to room-temperature flow of the silicone adhesive; heating the assembly to 65 °C for 1 h accelerates wet-out. The product is not recommended for outdoor exposure longer than 6 months because ultraviolet radiation does not degrade PTFE but can embrittle the silicone adhesive edge zone; published data for this specific configuration is limited.

    Characteristic Representative technical data Reference method or status
    Backing thickness 0.127 mm ASTM D3652
    Total laminate thickness 0.178 mm ASTM D3652
    Peel adhesion to stainless steel 2.4 N/25 mm ASTM D3330
    Tensile strength, machine direction 1.8–2.6 N/mm ASTM D882
    Elongation at break, machine direction 100–200 % ASTM D882
    Dielectric strength, dry 7 mil laminate 6,000–9,000 V ASTM D149
    Continuous temperature resistance, backing 260 °C Manufacturer thermal endurance data
    Continuous temperature resistance, adhesive 204 °C Manufacturer thermal endurance data
    Food-contact status, PTFE resin Complies FDA 21 CFR 177.1550
    Food-contact status, silicone adhesive component Complies FDA 21 CFR 175.300
    Heavy-metal restrictions Complies RoHS 2011/65/EU
    Substances of very high concern screening Complies REACH candidate list

    The product is not suitable for liquid oxygen or strong alkali metal exposure due to PTFE reactivity at elevated temperature. Thermal decomposition of PTFE above 400 °C can release tetrafluoroethylene and carbonyl fluoride; processing and maintenance temperatures must remain below the decomposition threshold. The silicone adhesive also loses peel strength on copper substrates after prolonged thermal exposure because copper catalyses partial oxidation of the siloxane network; when bonding to copper bus bars above 150 °C, compatibility testing according to ASTM D3330 after 1,000 h at the intended service temperature is required.

    When Silicone Adhesive Chemistry Replaces Acrylic in Low-Friction Masking

    Compared with an acrylic adhesive tape of equivalent backing thickness, CHR 2265-5 shifts the temperature window downward and upward. Acrylic pressure-sensitive adhesives lose significant shear strength above 150 °C and are often embrittled below -40 °C; the silicone adhesive on CHR 2265-5 remains compliant at -73 °C and resists cohesive failure through 204 °C. The trade-off is chemical cleanliness. Silicone adhesives release trace cyclic siloxanes when heated under high vacuum; the product is therefore not suitable for optics assembly or semiconductor wafer-handling environments where ISO 14644-1 Class 5 or higher cleanliness is required. In corona discharge exposure on wire-harness jacketing, the PTFE backing shows higher tracking resistance than polyester or polyimide films; however, the silicone adhesive interface can accumulate space charge at high electrical frequency, and partial discharge inception voltage should be validated per IEC 60270 before use on medium-voltage cable accessories. When the tape replaces a skived PTFE tape with an acrylic adhesive, the operator observes lower room-temperature adhesion to stainless steel but higher retention of that adhesion after 1,000 h at 200 °C; published data for this specific configuration is limited, so thermal aging should be verified against ASTM D3611 for pressure-sensitive tape aging.

    In release-liner and composite-cure applications, CHR 2265-5 is preferred over glass-fibre-reinforced PTFE tapes when dielectric isolation and low-profile thickness are more critical than tensile stiffness. The extruded PTFE film contains no woven carrier; consequently, it presents no exposed fibre ends at slit edges and does not exhibit glass-fibre bloom after repeated thermal cycling. The absence of a woven carrier also reduces total thickness by roughly 3–5 mil compared with a 10 mil glass-filled tape, but the tensile strength of CHR 2265-5 is lower than that of a woven-glass PTFE laminate. In vacuum-bag composite curing at 180 °C, the silicone adhesive remains chemically stable against polyester film and epoxy prepreg surfaces; however, peel adhesion to silicone-treated release films may be reduced because of low surface energy matching. When used as a release surface on aluminium vacuum tables, the tape must be inspected after each cycle for adhesive residue transfer, especially when the table surface temperature exceeds 220 °C. Converters often replace skived PTFE tape with CHR 2265-5 where the die-cut part must retain flatness without curl; the extruded backing’s lower residual stress from calendering reduces edge curl after die cutting.

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