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Saint-Gobain CHR 2253-2 High Modulus PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR 2253-2 High Modulus PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 908016
    Brand Saint-Gobain
    Product Name CHR 2253-2 High Modulus PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape
    Backing Material High modulus PTFE film
    Adhesive Type Acrylic
    Tape Type Pressure sensitive tape
    Color Brown
    Backing Thickness 0.002 in (0.051 mm)
    Adhesive Thickness 0.0015 in (0.038 mm)
    Total Thickness 0.0035 in (0.089 mm)
    Adhesion To Steel 30 oz/in (33 N/100 mm)
    Tensile Strength 20 lb/in (350 N/100 mm)
    Elongation At Break 100%
    Dielectric Strength 5000 V
    Temperature Range -100°F to 400°F (-73°C to 204°C)
    Chemical Resistance Excellent
    Friction Coefficient Low
    Standard Roll Length 36 yd (33 m)
    Available Widths Various widths

    As an accredited Saint-Gobain CHR 2253-2 High Modulus PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Packaged as 1 roll per carton, individually wrapped in durable cardboard for shipping and storage.
    Container Loading (20′ FCL) 20′ FCL loading for Saint-Gobain CHR 2253-2 high modulus PTFE film backing acrylic pressure-sensitive tape; palletized, secured for dry transport.
    Shipping Saint-Gobain CHR 2253-2 tape is typically not regulated as dangerous goods for transport. Ship in original sealed packaging at ambient temperature, protected from moisture, direct sunlight, and extreme heat. No UN number, hazard class, packing group, or proper shipping name is normally assigned. Follow all local transport regulations.
    Storage Store Saint-Gobain CHR 2253-2 PTFE film tape in a cool, dry, well-ventilated area at 15–30°C and 40–60% relative humidity. Keep rolls sealed in original packaging, away from direct sunlight, heat, moisture, solvents, oxidizers, and ignition sources. Avoid crushing, excessive stacking, or temperature extremes. Do not freeze. Protect from physical damage. Rotate stock and follow manufacturer’s shelf-life guidance.
    Shelf Life The tape typically has a 12-month shelf life from manufacture when stored at 21°C (70°F) and 50% relative humidity.
    Application of Saint-Gobain CHR 2253-2 High Modulus PTFE Film Backing Acrylic Adhesive Pressure Sensitive Tape

    On rotary L-sealer packaging lines running LLDPE shrink film at gauge below 50 µm, molten polymer transfer to the sealing jaw becomes the dominant source of unscheduled line stoppage. Saint-Gobain CHR 2253-2 is applied to cartridge-heated sealing jaws in a single full-width wrap with edge overlap limited to 5 mm; the butt-seam alternative is preferred on side-seal bars where film gauge variation creates step marks. The nominal 2 mil high-modulus PTFE backing retains release character under cyclic jaw closure at 0.2–0.5 MPa, while the acrylic adhesive transfers shear stress into the siliconized jaw surface. Seal jaw temperature for transparent LLDPE is held at 149–177 °C on side seals and 160–205 °C on end seals; dwell timers remain between 0.4 s and 1.2 s. Seal strength is verified on a tensile tester running 300 mm/min jaw separation per ASTM F88; production acceptance requires no more than 10% loss relative to a bare jaw after tape change. Typical acrylic peel to stainless steel for this tape class falls between 0.8 N/cm and 1.6 N/cm per ASTM D3330, but plasticizer migration from printed PVC shrink sleeves reduces adhesion within 8 h of continuous contact. Wiping the jaw with 99% isopropanol at shift change removes plasticizer film but does not restore embrittled adhesive. The tape is evaluated as an indirect adhesive under 21 CFR 175.105 and the PTFE backing under 21 CFR 177.1550; no direct food-contact claim applies. Finished packages include shrink-wrapped bakery trays, multi-pack bottled water, and frozen food pouches sealed on intermittent-motion L-bar machines.

    What Governs Slot Liner Dielectric Withstand After High-Modulus PTFE Tape Application?

    Motor rewinding shops apply the tape as a supplemental slot liner over formed aramid paper or polyester-Mylar cell before coil insertion. Half-lap spiral wrapping with 50% overlap produces two tape layers over the coil bundle and three layers at the overlap; the effective film thickness is built incrementally rather than by increasing tape gauge. Wrapping tension is controlled to 2.5–5 N/cm tape width on constant-tension coil winding lathes to prevent enamel wire cutting. Dielectric withstand is measured after insertion with opposing cylindrical electrodes per ASTM D149; typical high-modulus PTFE backing with a nominal 2 mil thickness shows breakdown voltage above 6 kV at 50 µm film thickness, but the acrylic layer is disregarded in dielectric calculations. Surface resistivity measured after 48 h at 23 °C and 50% RH per ASTM D257 remains above 10^16 Ω/sq for the PTFE outer face, which limits static accumulation on fan-cooled motor windings. The adhesive bond line softens above 130 °C continuous; slot liner telescoping at the exit edge occurs when the coil pressing tool is preheated above this limit. For such conditions, the tape is mechanically anchored with polyester lacing cord at 25 mm intervals. Varnish dip after insertion must withstand 120 °C cure for 4 h without flagging; partial discharge inception voltage measured with a 10 kV discharge detector drops by 15–25% where edge burrs or voids exist. The tape is used as a component in electrical insulation systems qualified under UL 510 and assessed under IEC 60454-2. Dimensional stability is verified per ASTM D3652. In-service components include servo motors, appliance motors, and dry-type transformers where phase segregation and slot-wall protection are required.

    Test methodMeasured propertyEquipment or conditionAcceptance criterion
    ASTM D149dielectric breakdown voltageopposing cylindrical electrodes, 23 °C≥ 6 kV for 50 µm film
    ASTM D257surface resistivityguard-ring fixture, 500 V DC≥ 10^16 Ω/sq
    ASTM D3652thickness variationdigital micrometer, 0.5 mm foot± 5% of nominal
    UL 510insulation component temperature classaging laboratory qualificationmatching end-product class

    When autoclave cure cycles exceed 150 °C and require multiple reuses of a stainless-steel caul plate, silicone-coated release films often fail through resin bleed and edge transfer. The tape is applied to caul plate perimeter and tool flange surfaces at 10–25 mm width as a release barrier for carbon fiber/epoxy prepreg layups. Unlike extruded low-modulus PTFE tapes, the high-modulus backing resists buckling when vacuum debulk at 0.08–0.09 MPa is cycled before autoclave closure. Overlap is avoided on the caul plate surface; butt splices at corners are pressed with a 1 kg rubber roller. Adhesive peel to aluminum per ASTM D3330 typically falls between 1.0 N/cm and 2.0 N/cm at room temperature, but exposure to 177 °C for 72 h reduces room-temperature peel by 40–60% due to acrylic oxidation; coupon testing before production is not optional. Outgassing is evaluated per ASTM E595; acrylic pressure-sensitive adhesives can exceed the 1.0% total mass loss criterion when tested above 150 °C, so the tape is not considered a vacuum-bag sealant replacement. Autoclave cure pressure of 0.6 MPa with laminate temperature ramped at 1–3 K/min leaves no mark-off through the peel ply if the tape edge is outside the trim line. Vacuum bag-to-tool seal must withstand 0.95 bar vacuum with leak rate below 10 mbar/min. The tool surface remains free of siloxane contamination; X-ray photoelectron spectroscopy survey data commonly detects silicon at 2–3 atomic% after silicone release film transfer, whereas PTFE tape leaves no silicon-containing residue. Finished parts include autoclave-cured CFRP wing ribs and floor panels where release properties are required only on tool surfaces, not on the composite part itself.

    Process variableFailure pathwayThresholdCorrective action
    autoclave ramp rateadhesive blister at tape edge> 5 K/minreduce to ≤ 3 K/min
    cure temperatureacrylic outgassing and peel loss> 160 °C continuouslocate tape outside vacuum bag or mechanically clamp
    debulk vacuumbacking buckling< 0.05 MPa may fail to consolidateapply with roller at 25 N force

    When Flange Faces Must Survive Abrasive Blasting Prior to Polyurethane Lining

    In chemical plant maintenance, the tape masks raised-face flanges before abrasive blasting and subsequent polyurethane or epoxy novolac lining. It is applied from the outer flange edge inward with 50% overlap and trimmed around bolt holes with a rounded-tip knife to avoid notch-initiated tearing. Steel grit G40/G50 is propelled at 80–120 psi through a venturi nozzle with standoff maintained at 300–450 mm and angle 60–75° from the surface. Direct particle dwell on the tape beyond 3 s removes the PTFE backing and exposes adhesive, so operators rotate the blast stream continuously. The acrylic edge resists short-term contact with mineral spirits and water-soluble coolants but lifts under toluene, methyl ethyl ketone, or aromatic hydrocarbon wipes; solvent cleaning before tape removal is therefore restricted to 99% isopropanol. After blasting, the tape is peeled at a low angle of 30°; residues are checked against ISO 8501-1 surface cleanliness photographs and by water-break testing per ASTM F22. The tape is not specified for methyl ethyl ketone resistance per ASTM D4752; acrylic adhesive double-rub performance is below 25 rubs. The finished surface is a lined flange face on chemical reactor nozzles, tank manways, and pipe spools, where gasket contact areas must remain free of blast profile and lining overspray.

    Directly after slitting and before final rewind, biaxially oriented polypropylene webs commonly track laterally across bare steel idlers and develop static discharge marks. The tape is applied to idler roller faces at 25 mm width in a single spiral with 30–50% overlap; the seam direction is aligned with web travel so that the exposed adhesive edge does not face the web path. Dynamic coefficient of friction between the PTFE surface and oriented polypropylene film measured on a sled fixture per ASTM D1894 typically stays between 0.05 and 0.10, reducing baggy-edge wrinkle in unsupported spans under 0.5–2 N/mm web tension. Converting lines operate at 10–120 m/min; above 120 m/min, fringe static discharge on PTFE surfaces can exceed 5 kV per ASTM D257 unless a grounded copper brush with 10^6 Ω resistance is mounted downstream. The adhesive layer is not a replacement for roller balancing; eccentricity remains below 0.02 mm total indicator reading. Finished converting output includes tobacco overwrap, metallized snack packaging, and self-adhesive label stock where low friction and static control are both required.

    Spiral Wrap Tension and Skydrol Resistance in Harness Bundles

    Aerospace harness fabrication uses the tape as a chafe protection layer over wire bundle breakouts and high-motion sections. Spiral wrapping at 50% overlap with controlled tension of 1.0–2.0 N per tape width prevents telescoping under repeated flexing; the high-modulus backing limits cold flow when lacing cord compresses the bundle at breakout junctions. The PTFE outer face is inert to phosphate ester hydraulic fluid, but the acrylic adhesive layer is the limiting component: long-term immersion in Skydrol LD-4 at 70 °C can soften the bond line within 72 h, so splice ends are sealed with fluorosilicone curing compound after wrap termination. Flammability of the PTFE backing is low, with limiting oxygen index above 95 per ASTM D2863; however, the acrylic component contributes to smoke and is not considered a fire barrier. Wire harness marking is performed with separate marker sleeves because fluoropolymer surface energy below 20 dyn/cm per ASTM D2578 prevents durable ink adhesion. Harness flex testing under ±15° cyclic deflection is performed on a 25 mm mandrel; tape flagging at overlap edges occurs if wrap tension exceeds 2.0 N. Compliance for the harness assembly remains under SAE AS50881, while tape peel adhesion is monitored per ASTM D3330. In-service components include flight-control harness bundles, cabin loom breakouts, and power feeder protection sleeves.

    Phenolic Resin Squeeze-Out at 130–160 °C Tests Platen Release Durability

    In multi-opening hydraulic hot presses used for high-pressure decorative laminate, the tape is placed on top and bottom platen edges where phenolic resin squeeze-out accumulates. Press temperature is maintained between 130 °C and 160 °C at specific pressure of 70–100 bar; cycle time ranges from 20 min to 45 min depending on laminate thickness. The acrylic adhesive bond line degrades above 140 °C continuous exposure, producing a residue that must be removed from the laminate edge with solvent wipe before back-sanding. The tape is applied as a single strip with no overlap across the platen width; overlap creates a double-thickness ridge of 2 mil that embosses into the laminate surface under high pressure. Published data for replacement intervals in this specific configuration is limited; visual inspection after each opening cycle determines whether the tape remains intact. The PTFE backing resists phenolic resin adhesion at release, but thickness loss is monitored with a digital caliper of 0.01 mm resolution at shift change; no universal wear rate is established for all pressing configurations. Release performance is verified by peeling a cured phenolic button at 150 °C; the tape is rejected if residue exceeds 5% of the contact area. Compliance with EN 438-3 applies to finished laminate surfaces; the tape is not a direct food-contact material. The end laminate is a decorative worktop or compact laminate panel where platen-edge cleanliness controls surface quality.

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    Certification & Compliance
    More Introduction

    Saint-Gobain CHR 2253-2 is a pressure-sensitive tape constructed from a high-modulus skived polytetrafluoroethylene (PTFE) film backing and a solvent-acrylic adhesive layer. The product is specified for applications requiring low dynamic friction, broad chemical inertness, high dielectric withstand, and resistance to longitudinal deformation during wrapping, roller covering, or insulation. Manufacturer-published typical total thickness is 0.127 mm (5.0 mil), with the PTFE backing accounting for approximately 0.076 mm (3.0 mil) and the acrylic adhesive layer accounting for approximately 0.051 mm (2.0 mil). The tape is supplied in slit roll or log roll form on a release liner. Because the backing is processed to raise tensile modulus, CHR 2253-2 differs from standard skived PTFE tapes in edge-tear resistance, dimensional stability under wrap tension, and reduced necking during coil or harness taping.

    What Distinguishes High-Modulus PTFE Film from Standard Skived PTFE Backings?

    The distinction resides in the orientation and densification of the PTFE sheet. Standard skived PTFE film is more compliant and can deform under sustained tension. High-modulus grades are produced from fully sintered billets with controlled post-skiving calendering, orientation, or densification that increases film stiffness and lowers elongation under load. Published tensile strength for CHR 2253-2 is typically reported at 6.1 kN/m (35 lb/in) with elongation at break near 85% when tested per ASTM D3759/D3759M. Standard skived PTFE tapes of equal thickness can exhibit lower tensile strength and higher elongation, which permits thinning at the insulation edge during high-tension winding on coils or cables. The high-modulus backing resists this thinning, allowing tighter coil wraps without reduction in dielectric thickness at the turn edges. The trade-off is conformability: high-modulus PTFE film does not drape as readily around sharp radii below approximately 3.0 mm. Taping of small-gauge wire bundles below that radius can produce lifting unless the tape is applied with controlled tension and, where available, heated de-curl equipment.

    Pressure-sensitive bonding does not require heat, solvent, or mixing. Adhesion to stainless steel is measured by ASTM D3330/D3330M at 180° peel angle; typical published values for CHR 2253-2 are in the range of 2.2 N/10 mm to 2.7 N/10 mm (20–25 oz/in) at room temperature. Bond formation is time-dependent because acrylic pressure-sensitive adhesives develop adhesion through wetting and chain mobility. On clean stainless steel and epoxy-faced panels, functional handling strength is reached after 10–15 min of dwell; near-full adhesion is reached after 48–72 h. Substrate surface energy should be at least 38 dyn/cm for reliable wetting. Contamination by silicone mold release, processing oil, or amide wax inhibits wetting and can reduce peel strength by more than 50%. A solvent wipe with isopropyl alcohol or methyl ethyl ketone is required before lamination unless the substrate is verified clean by water-break testing in accordance with ISO 8296 or equivalent.

    Acrylic Adhesive Performance Boundaries Under Thermal Load and Solvent Exposure

    The PTFE backing can tolerate continuous exposure well above 260°C, but the acrylic adhesive controls the upper service temperature of the composite. Published product data for CHR 2253-2 typically list an operating range of -73°C to 204°C (-100°F to 400°F). This range is conditional. Long-term exposure above 120°C under peel or shear load can produce adhesive softening and creep. In coil insulation and heat-sealing bar applications, short excursions to 204°C are tolerated when the adhesive is confined between the PTFE backing and the substrate without peel stress. Sustained peel loading above 150°C should not be designed into a bonding joint without application-specific aging tests because acrylic adhesives undergo thermal oxidative degradation and lose chain entanglement at elevated temperature.

    Chemical resistance of the acrylic adhesive layer is lower than that of the PTFE backing. Ketones, esters, chlorinated solvents, and toluene can attack the adhesive at room temperature and should be excluded from continuous contact. Acrylic adhesives are generally resistant to dilute acids, alkalis, and aliphatic hydrocarbons, but immersion in aggressive solvent mixtures can lead to edge lift, adhesive dissolution, and subsequent tape delamination. For solvent-spray environments, the exposed adhesive edge should be sealed with a compatible overcoat or a silicone-adhesive PTFE tape should be specified.

    In automated horizontal tape heads, CHR 2253-2 has been reported on high-voltage stator winding lines operating at wrap speeds below 8 m/min. Tension control at 2.0 N to 4.0 N prevents longitudinal creep of the backing and maintains insulation coverage. Higher tensions induce cold flow in the PTFE at the turn edges, which can reduce dielectric thickness by up to 10% on the compression side of the wrap. For manual application, a roller applicator with a Shore A durometer of 60–70 and nip pressure of 0.2–0.4 MPa consolidates the adhesive without stretching the backing. Release liners should be removed at a constant peel angle of 90–135° to avoid adhesive transfer from liner to backing and to prevent fold-over of thin slit edges.

    Release, Dielectric, and Frictional Performance in Electrical and Thermal Equipment

    Electrical insulation applications rely on the dielectric withstand of the PTFE backing. Typical published dielectric breakdown voltage for the 0.127 mm construction is 9.0 kV when tested by ASTM D149 using short-time AC voltage rise. Volume resistivity of unfilled PTFE is routinely above 10^18 Ω·cm per ASTM D257, although the acrylic adhesive is not the primary dielectric path once the tape is applied. Surface tracking resistance of PTFE is high; comparative tracking index values for unfilled PTFE generally exceed 600 V per IEC 60112. The backing coefficient of friction is very low, with static values against polished steel commonly reported between 0.05 and 0.10 per ASTM D1894. This makes the product suitable for release surfaces on heat-sealing bars, form-fill-seal jaws, and chute liners where polymer films or hot-melt adhesives must not stick. The same low-friction surface limits paint adhesion and requires specialized sodium-naphthalene or plasma treatment before the non-adhesive side is bonded permanently.

    PropertyTypical published valueTest method
    Total tape thickness0.127 mm (5.0 mil)ASTM D3652/D3652M
    PTFE backing thickness0.076 mm (3.0 mil)ASTM D3652/D3652M
    Adhesive layer thickness0.051 mm (2.0 mil)ASTM D3652/D3652M
    Peel adhesion to stainless steel2.2–2.7 N/10 mm (20–25 oz/in)ASTM D3330/D3330M
    Tensile strength at break6.1 kN/m (35 lb/in)ASTM D3759/D3759M
    Elongation at break85%ASTM D3759/D3759M
    Dielectric breakdown voltage9.0 kVASTM D149
    Service temperature range-73°C to 204°CManufacturer published data

    Compared with silicone-adhesive PTFE tapes in the same product family, CHR 2253-2 offers higher room-temperature peel strength and more consistent wet-out on polar substrates such as copper, epoxy, and steel. Silicone-adhesive PTFE tapes typically provide lower initial tack but maintain peel strength above 200°C; acrylic-adhesive grades are selected when the substrate is not exposed to sustained temperatures above 150°C or when silicone contamination is prohibited in painting, soldering, or bonding operations. Compared with glass-cloth PTFE composites, CHR 2253-2 is thinner and smoother, with lower bulk and less particle generation, but it has lower tear resistance and lower conformability. Compared with polyimide tapes, the PTFE backing provides lower dielectric constant, lower moisture uptake, and lower surface friction, but lower cut-through resistance. Compared with UHMW polyethylene tapes, CHR 2253-2 operates at higher temperatures and provides broader chemical resistance, but at higher cost and with lower abrasion resistance.

    When CHR 2253-2 Replaces Silicone-Adhesive PTFE Tapes in Insulation

    Silicone-adhesive PTFE tapes are often specified for high-temperature electrical insulation because of their clean burn and low outgassing. However, silicone adhesive can migrate and interfere with soldering, conformal coating adhesion, or paint. In such processes, CHR 2253-2 is substituted to eliminate silicone contamination. The acrylic adhesive is compatible with most epoxy and urethane potting compounds when cured at temperatures below 120°C; post-cure above 150°C can soften the adhesive and allow void formation at the tape edge. Substitution in an electrical insulation system must be evaluated under the applicable thermal class standard, such as UL 1446 or the IEC 61857 series, because the adhesive thermal aging behavior differs from silicone adhesives. A candidate system should be aged at the design class temperature and then subjected to dielectric proof testing to confirm that acrylic adhesive degradation has not reduced insulation integrity.

    When used on production equipment, CHR 2253-2 appears in heat-sealing bar maintenance, chemical processing enclosures, and high-voltage connection insulation. In heat-sealing bar maintenance, a single layer over the bar reduces hot-melt residue adhesion, but the bar surface must be flat and free of pits; pits deeper than 0.05 mm can trap adhesive and create localized release failure. In semiconductor wet-process tooling, the tape is used as a temporary mask for chemical baths, but continuous exposure to hot phosphoric acid above 60°C can attack the acrylic edge. For all wet-process applications, adhesion coupons should be tested with the specific chemical blend at the process temperature before full deployment.

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