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Saint-Gobain CHR 2042-3 Skived PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape

    • Product Name: Saint-Gobain CHR 2042-3 Skived PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 609364
    Product Name Saint-Gobain CHR 2042-3 Skived PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape
    Manufacturer Saint-Gobain Performance Plastics
    Backing Material Skived PTFE Film
    Adhesive Type Silicone Pressure Sensitive Adhesive
    Color Brown
    Total Thickness 0.0045 in (0.114 mm)
    Backing Thickness 0.003 in (0.076 mm)
    Adhesive Thickness 0.0015 in (0.038 mm)
    Operating Temperature Range -100°F to 500°F (-73°C to 260°C)
    Peel Adhesion 25 oz/in (2.7 N/cm)
    Tensile Strength 30 lb/in (53 N/cm)
    Elongation 200%
    Dielectric Strength 6000 V
    Chemical Resistance Excellent
    Water Absorption <0.1%
    Coefficient Of Friction 0.05
    Standard Length 36 yd (32.9 m)
    Core Diameter 3 in (76.2 mm)

    As an accredited Saint-Gobain CHR 2042-3 Skived PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Each 36-yard roll is individually packaged in a cardboard carton; standard quantity is one roll per package.
    Container Loading (20′ FCL) Container loading (20′ FCL): palletized rolls of Saint-Gobain CHR 2042-3 skived PTFE film backing silicone adhesive pressure-sensitive tape, secured for transport.
    Shipping Saint-Gobain CHR 2042-3 Skived PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape is not regulated as dangerous goods. Ship in original sealed cartons, protected from moisture, dust, heat, and sunlight. Maintain ambient temperature; avoid crushing or contamination. Suitable for standard ground, air, and ocean freight.
    Storage Store Saint-Gobain CHR 2042-3 tape in a cool, dry, well-ventilated area, away from direct sunlight, heat, sparks, and incompatible chemicals. Keep in original sealed packaging, protected from dust, moisture, oils, and solvents. Maintain moderate room temperature and humidity. Store at 15–30°C (59–86°F). Do not expose to ultraviolet light or extreme temperatures. Rotate stock, use first-in-first-out, and observe manufacturer shelf-life recommendations.
    Shelf Life Shelf life is 12 months from date of manufacture when stored at 21°C (70°F) and 50% RH in original packaging.
    Application of Saint-Gobain CHR 2042-3 Skived PTFE Film Backing Silicone Adhesive Pressure Sensitive Tape

    Continuous-motion vertical form-fill-seal and horizontal form-fill-seal machines running coextruded polypropylene, oriented polypropylene laminates, or low-density polyethylene seldom exceed a seal-jaw setpoint of 230°C, but the combination of dwell time, jaw pressure, and serrated or knurled jaw geometry is sufficient to drag molten polymer across the jaw face. In these lines, the 0.076 mm skived PTFE backing with silicone pressure-sensitive adhesive is applied as a full-face liner on the heated jaw and, in certain rotary configurations, on the cooled counter-jaw. Regulatory assessment is segregated by functional layer: the PTFE component is evaluated under FDA 21 CFR 177.1550 for perfluorocarbon resins, while silicone adhesive transfer potential is assessed under FDA 21 CFR 175.300 when incidental food contact is possible; European installations additionally reference Regulation (EC) 1935/2004 and Regulation (EU) No 10/2011 for plastic materials intended for indirect food contact. Application geometry is formulated as a single ply covering 100% of the film-contact area of the jaw face, with butt joints preferred over lap joints to avoid localized thickness differentials; terminal overhang is held between 3 mm and 6 mm, and any longitudinal splice must be offset from the serrated zone by at least 5 mm. Surface preparation of the jaw requires methyl ethyl ketone or isopropanol degreasing followed by dry wiping under a fume-extraction hood; the tape is wet out with a hand roller at contact pressure sufficient to eliminate air entrapment and then subjected to one elevated-temperature soak at 180°C for 15–20 min before production to stabilize adhesive creep. Rotary jaw machines with jaw circumference from 85 mm to 150 mm commonly operate at 60–100 pouches/min, and tape service life terminates at edge lift, char, backing fissure, or loss of release beyond the operator-established PM interval. Finished product types include pillow pouches, gusseted side-seal bags, premade stand-up pouches, lidding film assemblies, and flow-wrap confectionery or bakery packages.

    What Are the Qualification Boundaries for Spiral-Wrapped Fluoropolymer-Insulated Aircraft Wire Harnesses?

    Spiral wrapping of lightweight polytetrafluoroethylene- or fluorinated ethylene propylene-insulated wires with a skived PTFE pressure-sensitive tape is used where abrasion resistance and high-temperature chafe protection are required in unpressurized equipment bays, avionics racks, or landing-gear harness runs. The pressure-sensitive silicone adhesive layer is exposed to the wire bundle rather than the PTFE backing, so its anchorage to low-surface-energy fluoropolymer wire jackets is the limiting design variable rather than backing temperature resistance. Qualification testing is conducted to AS4373 test methods, with voltage withstand and insulation resistance verified after wrapping; flammability acceptance follows the applicable FAR 25.853(a) demonstration for interior materials when installed in accessible cabin zones, while FAR 25.869(a)(4) applies as the electrical wiring fire-protection requirement. ASTM D149 dielectric strength of the backing is not sufficient to qualify the tape as primary insulation, and the installation remains a harness-level protection layer rather than an insulation-system component. Tape width is selected so that a 50–55% overlap produces one continuous barrier layer; on bundles from 6 mm to 25 mm diameter, this corresponds to tape widths of 12 mm to 50 mm. Terminations receive two full wraps at each end, and butt splices are not permitted in continuous-run wrap. Automated tape dispensers with adjustable slip-clutch tension of 5–10 N reduce necking of the 0.076 mm skived backing; hand wrapping requires a constant tension that prevents wrinkle but does not reduce tape width more than 3%. After wrapping, harnesses are laced and labeled, then subjected to dry dielectric and insulation-resistance checks as directed by the airframer’s harness specification. The silicone adhesive has limited compatibility with phosphate ester hydraulic fluids; in wheel-well, engine-pylon, or heavily contaminated zones, an overbraid or fluoroelastomer boot is required. Abrasion data generated on a wire-to-wire scrape test should be reviewed, but published data for this exact backing/adhesive pair in hydraulically contaminated environments is limited. Terminal end products include avionics looms, engine pylon harnesses, cabin interconnect assemblies, and ground-support cable sets.

    Autoclave Flash-Tape Release Interface and Pre-Impregnated Carbon Fiber Detail Parts

    In thermoset prepreg cure cycles from 121°C to 180°C at pressures between 0.4 MPa and 0.6 MPa, the edge of a vacuum bag can press excess epoxy resin onto the tool surface, forming hard flash that damages the mold, contaminates subsequent layups, or becomes a foreign-object risk. CHR 2042-3 is converted into 25 mm and 50 mm edge flash tape, applied as a perimeter release strip with the PTFE backing oriented toward the resin and the silicone adhesive anchoring the tape to the tool. Process control is governed by the airframe or part manufacturer’s internal cure specification; the tape is generally controlled as a shop aid or consumable with lot traceability to the manufacturer’s certificate of conformance rather than as a structural material, and supporting test data are generated to ASTM D3330 for adhesion to the tool substrate after cure. Corner laps are held to 5–10 mm; if a full-perimeter gasket is being created, tape width is chosen to exceed expected resin flow by 10–15 mm on each side. Multiple cure uses are permitted only if adhesion remains above 5 N/25 mm on 304 stainless steel after each cycle. Tool surface is prepared with acetone or an approved mold cleaner, adhesive is applied at 18–25°C and roller-consolidated under 1–2 bar; bagging layers are installed over the tape; the cure cycle is run; after demold the tape is removed with the bag or separately depending on the shop’s release-tape locking preference. Release failures occur when silicone adhesive is exposed to surface temperatures above 260°C, when the tape is contaminated with mold release before application, or when the tool surface temperature is below 15°C. Published multi-cycle autoclave release data for this exact backing/adhesive pair is limited; production facilities commonly determine replacement frequency on tooling release trials rather than relying on a universal cycle count. Terminal finished parts include wing access panels, interior monuments, control surfaces, and filament-wound drive shafts.

    When Convection Cure Ovens Approach 260°C While Masking Bearing Seats Prior to Powder Coating

    Powder coating lines curing epoxy, polyester, or hybrid powders run at substrate temperatures from 170°C to 210°C; a tape used to mask machined bearing seats, threaded holes, and gasket faces must not migrate, lift, or leave adhesive residue at cure. The silicone pressure-sensitive adhesive is specified for continuous service to 260°C, but the localized oven setpoint and metal heat-sink temperature may exceed this at the part surface if the convection oven has poor air-balance. Applicable coating standards include AAMA 2605-22 for architectural aluminum and Qualicoat third-edition specifications for coated aluminum, with cure confirmation by oven-profile thermocouple mapping and post-cure adhesion testing to ISO 2409. Masking bands are cut 12–25 mm wide and applied with 1–3 mm clearance to the precise bore edge; on curved surfaces, 50% overlap is used, but the overlap joint is feathered to avoid a powder trap. Parts are degreased in an aqueous alkaline washer, dried, and allowed to cool below 40°C before tape application. Powder is applied electrostatically to 60–100 μm thickness and cured for 10–20 min at 180–200°C. The tape is removed when the part reaches 30–40°C after cure to reduce silicone residue transfer. If the oven exceeds 260°C, the adhesive may become brittle or leave visible residue, particularly on cast aluminum with surface roughness Ra > 6.3 μm. Masked zones with deep bores require a two-piece masking scheme rather than a single tape cap to prevent powder ingress at the shoulder. Finished items include architectural extruded aluminum, electric motor housings, automotive brackets, and painted furniture components.

    Prior to selective tin-lead or lead-free wave soldering, printed circuit board fabricators mask gold edge-card contacts with a temperature-compatible pressure-sensitive tape to prevent solder alloy from wetting the contact metallization. On mixed-technology printed circuit boards with gold tabs plated to 0.75–1.25 μm over nickel underlay, the 0.076 mm PTFE backing presents a low-surface-energy surface to molten solder at 250–260°C while the silicone adhesive leaves minimal ionic residue. The film does not outgas sufficiently to produce voids in the solder wave at standard conveyor speeds. Acceptance is governed by IPC J-STD-001 soldered electrical and electronic assembly requirements, IPC-A-610 Class 2 or Class 3 gold finger inspection criteria, and Directive 2011/65/EU RoHS restrictions for lead-free processes; ionic contamination levels are measured by IPC-TM-650 method 2.3.25. The application ratio is one ply covering the full contact band plus 1.5 mm overhang onto the solder mask; where multiple strips meet, a butt splice is used rather than an overlap to avoid flux entrapment at the splice line. Standard converted widths of 6 mm, 12 mm, and 25 mm are applied to clean, dry boards with a roller; board handling must avoid finger oils. The board then passes through flux application, preheat at 90–110°C, and a solder pot held at 260°C; after cooling, tape is removed within 24 h to minimize adhesive residue risk. The tape is not recommended for extended in-process storage on gold contacts, nor for masking zones that will remain untinned but will be used as edge connectors without an additional ionic-cleanliness verification. Terminal products include printed circuit assemblies, backplanes, telecommunication line cards, and industrial control boards.

    Slot Liner Retention in Random-Wound Electric Motor Varnish Cure

    Random-wound stators require folded aramid or polyester-film slot liners to be held in position with tape prior to winding and vacuum-pressure impregnation. The narrow-width form of CHR 2042-3 is used because the 0.076 mm PTFE backing withstands 150–170°C varnish cure and the silicone adhesive maintains its bond at the tape-to-liner interface during thermal cycling. Motor insulation systems are evaluated under UL 1446 insulation-system requirements and IEEE Std 117 temperature-rise evaluation methods, with dielectric proof testing by ASTM D149; the tape is not a substitute for ground-wall or phase insulation. Tape width of 6–12 mm is used on slot liners for stator stack heights from 25 mm to 150 mm; adhesion length at each slot end is 5–8 mm onto the lamination end face, and one full wrap around the liner is standard. Stator lamination stacks must be free of stamping oil, moisture, and burr debris before tape application. After winding and lead dress, the stator is vacuum-pressure impregnated with a 100% solids epoxy or unsaturated polyester varnish and cured at 150–170°C for 1–2 h. The tape remains in the motor after cure; the adhesive temperature limit of 260°C is above both the cure and the normal hot-spot rating. In motors with encapsulated lead connections, adhesive residue is not a concern, but tape edges should not be folded into the slot gap where they could reduce slot fill. Terminal products include fractional-horsepower appliance motors, power tools, traction motors, and industrial servo motors.

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    Certification & Compliance
    More Introduction

    Saint-Gobain CHR 2042-3 is a pressure-sensitive adhesive tape constructed from a skived polytetrafluoroethylene (PTFE) film carrier with a silicone adhesive on one side. The backing is machined from a sintered PTFE billet rather than cast or extruded, producing an unoriented film with a nominal backing thickness of 0.003 in (0.076 mm). The product designation identifies the CHR 2042 series with a 0.003 in skived PTFE film; the silicone adhesive distinguishes it from acrylic and rubber adhesive variants. The tape is supplied in roll form with a release liner on the adhesive face.

    What Specification Values Govern Incoming Inspection?

    The values below are nominal manufacturer-reported data for the product and should be verified against the certificate of analysis for each lot. Skived PTFE film thickness can vary across the roll, so incoming thickness measurement under ASTM D3652 is required where the tape is used as a dielectric barrier or release layer in automated lines.

    PropertyNominal valueTest method or reference
    Backing thickness0.003 in (0.076 mm)ASTM D3652
    Total tape thickness without liner0.004 in (0.10 mm)ASTM D3652
    Peel adhesion to stainless steel25 oz/in (27 N/100 mm)ASTM D3330
    Tensile strength at break24 lb/in (420 N/100 mm)ASTM D3759
    Elongation at break300%ASTM D3759
    Dielectric strength500–1000 V/mil (19.7–39.4 kV/mm)ASTM D149 short-time
    Continuous operating temperature-73°C to 260°C (-100°F to 500°F)Manufacturer technical data
    Coefficient of friction0.1 or lowerASTM D1894

    On constant-heat sealers processing low-density polyethylene films at 115°C to 160°C and polypropylene films at 140°C to 200°C, the tape is applied to sealing jaws as a release barrier. It prevents molten polymer from accumulating on heated stainless steel surfaces and reduces cleaning frequency on form-fill-seal lines. Full bond development is achieved after 24 h dwell at 20°C to 25°C; initial tack is sufficient for immediate start-up after roller application, but peel strength increases as the silicone adhesive wets the substrate.

    In coil-winding and slot-liner operations, the tape functions as a dielectric barrier and chafe-resistant overwrap. The skived PTFE backing provides a low-friction surface that resists cut-through during winding and withstands intermittent varnish curing cycles. When used as phase insulation or interlayer insulation, dielectric thickness should be confirmed under ASTM D149 because electrode geometry, humidity, and backing thickness variation affect breakdown results.

    Dielectric and Release Performance Under Thermal Load

    The dielectric response of skived PTFE is thickness-, frequency-, and temperature-dependent. At frequencies below 1 MHz, the dissipation factor of many skived PTFE films remains below 0.001, and relative permittivity is approximately 2.1. The silicone adhesive introduces a polar phase that can affect surface insulation resistance measurements after thermal aging; users should reference ASTM D257 when surface leakage is a concern. Thermal aging at 260°C for extended periods oxidizes the silicone adhesive and reduces peel adhesion even though the PTFE backing remains dimensionally stable. Intermittent excursions above 260°C can cause tack loss and transfer of degraded adhesive to the substrate.

    In release applications, the PTFE layer provides a non-porous, low-energy surface that minimizes adhesion of molten polymers, adhesives, and many aqueous slurries. Release performance is not equivalent to a coated release liner; the surface is mechanically skived and may contain microgrooves from the skiving tool. For high-gloss films or optical films, these microgrooves can transfer a slight texture under high sealing pressure.

    When Silicone Adhesive Chemistry Constrains Process Temperatures

    Silicone pressure-sensitive adhesives retain softness over a broad temperature range because the siloxane backbone has a glass-transition temperature below -70°C. The adhesive contributes low-temperature flexibility but imposes the upper-temperature limit. Above 200°C, prolonged exposure can oxidize methyl groups and increase crosslink density, leading to embrittlement and peel-strength loss. Above 260°C, chain scission and adhesive residue become more likely; continuous operation above 260°C is outside the stated product boundary. The PTFE backing has a melting point near 327°C, but the silicone adhesive is the limiting layer.

    Silicone adhesives swell in nonpolar solvents and low-molecular-weight silicone fluids, which can reduce anchorage to the backing and leave transfer residue. Applications involving prolonged immersion in toluene, xylene, or chlorinated solvents require evaluation of adhesive extraction and bond loss. Strong alkaline solutions at elevated temperature can attack the silicone adhesive but generally do not affect the PTFE carrier. The tape is not recommended for direct bonding to untreated polyethylene, untreated polypropylene, or powder-coated surfaces without corona treatment, plasma treatment, or mechanical abrasion.

    Storage should be maintained at 21°C and 50% RH in original packaging. Shelf life is generally 12 months from date of manufacture. Substrate temperatures below 10°C may reduce initial wet-out. A silicone rubber laminating roller at moderate pressure is used to remove entrapped air during application; excessive pressure can distort the skived backing and reduce dimensional stability on long roll lengths.

    Comparing Skived PTFE to Extruded Film and Glass-Cloth Carriers

    The skived construction produces a carrier without significant machine-direction orientation. Compared with extruded or cast PTFE films, this increases conformability and transverse elongation while reducing tensile strength and stiffness. The 0.003 in backing provides higher puncture resistance and dielectric withstand than the 0.002 in CHR 2042-2 variant but is less flexible around small radii. Compared with acrylic adhesive PTFE tapes, CHR 2042-3 retains peel strength at 200°C and can survive short excursions to 260°C; acrylic adhesives generally become brittle and lose bond strength above 150°C. Acrylic tapes may provide higher initial peel to stainless steel at room temperature and are typically lower in cost, but they are not suitable for the same upper temperature range.

    AttributeCHR 2042-3Acrylic PTFE film tapeGlass cloth PTFE tape
    Continuous service temperature-73°C to 260°C-40°C to 149°C-73°C to 260°C depending on adhesive
    Room-temperature peel to stainless steellowerhighermoderate
    Tensile strength24 lb/in (420 N/100 mm)mediumhigh
    Release surfacesmooth, low-frictionsmoothtextured weave
    Dielectric efficiency per unit thicknesshighhighlower

    Compared with PTFE-impregnated glass cloth tapes, CHR 2042-3 has a smoother release surface, lower thickness for a given dielectric requirement, and lower tensile strength. Glass cloth carriers are specified where high tear resistance and dimensional stability under tension are required. Published data for direct comparison under identical test methods is limited; substitution between constructions requires application-specific qualification.

    Regulatory status must be confirmed from the manufacturer’s current compliance certificate. The PTFE backbone is generally covered by FDA 21 CFR 177.1550 for perfluorocarbon resins; silicone adhesive compliance under FDA 21 CFR 175.300 is application-specific and may require extraction testing. EU RoHS 2011/65/EU restrictions on lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers are not expected to affect the product as supplied, but verification against lot-specific declarations is required. REACH candidate-list declarations should be obtained for the specific grade and manufacturing location.

    In cleanroom semiconductor tooling, the tape is used as a low-particle chemical barrier on guide rails and clamp faces. The silicone adhesive can introduce siloxane contamination in oxygen-sensitive environments; bake-out or adhesive selection testing is required before use in such areas. The product is not intended for direct food contact unless a full migration study under the relevant food-contact regulation is completed.

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