| HS Code | 685427 |
| Material | RTP Company RTP 299 F X 150148 Nylon 12 (PA), ESD Protection - Permanently Static Dissipative - Preliminary Datasheet |
| Primary Form | Pellets |
| Density | 1.07 g/cm³ |
| Tensile Strength | 45 MPa |
| Tensile Elongation At Break | 10% |
| Flexural Modulus | 1800 MPa |
| Flexural Strength | 65 MPa |
| Notched Izod Impact | 5.0 kJ/m² |
| Heat Deflection Temperature At 1 8 Mpa | 60 °C |
| Melting Point | 178 °C |
| Surface Resistivity | 10^6 - 10^9 ohms/square |
| Water Absorption 24 Hr | 0.2% |
As an accredited RTP Company RTP 299 F X 150148 Nylon 12 (PA), ESD Protection - Permanently Static Dissipative - Preliminary Datasheet factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | RTP 299 F X 150148 nylon 12 ESD-protective pellets are packaged in sealed, moisture-barrier bags, with a standard quantity of 25 kg. |
| Container Loading (20′ FCL) | 20′ FCL loading of RTP 299 F X 150148 Nylon 12 (PA) ESD compound, packaged in 25 kg bags, palletized and shrink-wrapped. |
| Shipping | This static-dissipative Nylon 12 ships as solid pellets in sealed, moisture-barrier bags, typically on pallets. It is not classified as dangerous goods for ground, air, or sea transport. Protect from humidity and store in a cool, dry area. Use ESD-safe handling and grounding procedures during transfer. |
| Storage | Store in its original, unopened packaging in a cool, dry, well-ventilated area away from direct sunlight, heat, moisture, and sources of static discharge. Keep sealed to prevent nylon from absorbing humidity. Avoid contamination with dust, dirt, or other materials, and follow manufacturer’s datasheet guidelines before processing. |
| Shelf Life | Shelf life is typically 6 months from date of shipment when stored sealed, dry, and at temperatures below 90°F. |
In evaporative emission control systems, fuel vapor return line coextrusion with permanently static-dissipative PA12 addresses charge accumulation when low-conductivity hydrocarbon vapor mixtures pass through nonconductive tubing at velocities above 3.0 m s⁻¹. The grade RTP 299 F X 150148 is specified for the innermost layer of three-layer tubing in which the surface resistance after 24 h conditioning at 23°C and 50% RH is held between 1.0×10⁶ Ω and 1.0×10⁹ Ω at 100 V per IEC 61340-2-3, and the electrostatic control acceptance value is a charge decay time below 2.0 s as referenced in SAE J1645 for fuel system components. The formulation addition ratio is not a press-side dry blend but a layer-distribution control: the inner dissipative PA12 layer is 15% to 25% of total wall thickness, with unfilled PA12 outer layers and an EVOH barrier forming the remaining cross-section. Diluting the inner-layer feed with natural PA12 above 5 wt% is excluded from standard production because filler network disruption can push charge decay beyond the 2.0 s limit. The downstream production process is three-layer coextrusion through a 30:1 L/D single-screw extruder equipped with a grooved feed section, melt temperature 200°C to 220°C, vacuum sizing at 60°C to 80°C, and post-forming heat-setting at 120°C to 140°C. Processors must dry pellets at 80°C for 4 h to 6 h when moisture content exceeds 0.10 wt% measured by ISO 15512 Method A; processing above 230°C or residual moisture produces surface splay and local increases in surface resistivity. Terminal finished product types include quick-connect fittings, ORVR vapor return lines, fuel filler necks, and carbon canister purge lines.
Automated material handling systems in 300 mm semiconductor front-end fabs generate triboelectric charge when wafer backside contact pads slide against carrier nests under 0.5 N to 2.0 N normal force. Injection-molded wafer cassettes and chip trays made from RTP 299 F X 150148 maintain surface resistance between 1.0×10⁶ Ω and 1.0×10⁹ Ω at 100 V and 12% RH when the ESD control plan sets the upper dissipative limit at 1.0×10⁹ Ω under ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016. The formulation addition ratio is 100% as-supplied compound at the press; no additional carbon black masterbatch or migratory antistat is required. Regrind reintroduction is limited to 15 wt%, and the preliminary datasheet does not quantify the effect of five or more heat histories on filler network continuity, so molders must measure surface resistivity by ASTM D257 after each regrind cycle and compare with the 1.0×10⁹ Ω ceiling. The production process is injection molding on a 25:1 L/D general-purpose screw with melt temperature 200°C to 220°C, mold temperature 40°C to 60°C, injection velocity 80 mm/s to 120 mm/s, hold pressure 60 MPa to 80 MPa, and back pressure 0.5 MPa to 1.0 MPa. Running the mold below 40°C freezes the skin too quickly and can orient the dissipative filler network near the gate, creating within-part resistivity variation; the part should be conditioned at 23°C and 50% RH for 24 h before verification. Cleanroom users should request outgassing and particle-shedding data from the preliminary datasheet before qualifying wafer-contact surfaces. Terminal finished product types include 300 mm wafer cassettes, film-frame carriers, chip trays, component test sockets, and robotic end-effector contact pads.
When printed circuit board assembly workstations introduce polyester smocks, acrylic fixtures, and PVC gloves into ESD-protected areas, contact and frictional charging on process-required insulators is expected to remain below 200 V per IEC 61340-4-5. Static-dissipative PA12 fixtures molded from RTP 299 F X 150148 are processed with 0% secondary conductive masterbatch addition; the pellet feed is the as-supplied compound, and in-plant reprocessed material is held at 10 wt% to 20 wt% depending on dryer dew point and the number of prior heat cycles. The addition ratio is qualified by measuring surface resistance per ASTM D257 and charge decay per IEC 61340-2-3 after molding, because the preliminary datasheet does not quantify the effect of three or more regrind cycles on surface resistivity. Pre-drying at 80°C for 4 h to 6 h is mandatory when pellets have been exposed to RH above 60%, and residual moisture above 0.10 wt% leads to splay, dimensional drift, and longer cycle time. The production process is injection molding on a 22:1 L/D three-zone screw with melt temperature 195°C to 210°C, mold temperature 50°C to 70°C, clamp force 4.0 kN to 6.0 kN per cm² of projected area, and post-mold conditioning at 23°C and 50% RH for 24 h. The grade is not recommended for reflow soldering pallets or selective soldering pallets because localized contact temperatures exceed the short-term thermal upper limit of PA12; this boundary must be observed when converting from PPS or PEEK fixtures. Terminal finished product types include ESD-safe enclosure covers, PCB transport pallets, stencil cleaning frames, insertion machine nests, adjustable guide rails, and connector assembly fixtures.
| Scenario | Standard designation | Measured parameter | Acceptance limit |
|---|---|---|---|
| Automotive fuel vapor return | SAE J1645 | Surface resistance via IEC 61340-2-3 | 1.0×10⁶ Ω–1.0×10⁹ Ω, decay <2 s |
| Semiconductor wafer handling | ANSI/ESD S20.20-2021 | ESD control item resistance | <1.0×10⁹ Ω at 12% RH |
| PCB assembly fixtures | IEC 61340-5-1:2016 | Surface resistance | <1.0×10⁹ Ω |
| Solvent/powder transfer ATEX | ISO 80079-36, IEC TS 60079-32-1 | Surface resistance at 100 V | <1.0×10⁹ Ω, decay <2 s |
| Field instrument enclosures | IEC 60079-0 | Surface resistance | <1.0×10⁹ Ω |
Rotating and sliding components within solvent recovery skids and powder transfer lines installed in Zone 2 or Zone 22 fall under the non-electrical equipment provisions of Directive 2014/34/EU and ISO 80079-36. Static charge accumulation on polymer wear parts must provide a relaxation path to grounded steel frames; the RTP 299 F X 150148 PA12 grade is machined into chain guides, wear strips, and valve shaft bushings, with surface resistance measured at 100 V per IEC 61340-2-3 and an acceptance limit below 1.0×10⁹ Ω plus charge decay below 2.0 s through a 1.0 MΩ ground connection. The formulation addition ratio is not a dry-blend operation; the extruder or injection molder feeds the as-supplied permanently dissipative compound with 0% let-down into natural PA12. Reclaimed in-plant material is limited to 10 wt% and must be requalified after drying because pellet moisture above 0.10 wt% increases melt viscosity and disrupts filler dispersion. Production of wear strips is profile extrusion through a 30:1 L/D grooved-barrel extruder at 190°C to 210°C melt temperature, followed by CNC machining to ±0.05 mm flatness and parallelism; injection-molded sprockets use a 25:1 L/D screw with mold temperature 40°C to 60°C. The PA12 base offers lower water absorption than PA6 at 0.7% at 23°C and 50% RH per ISO 62, which stabilizes dimensions in humid solvent environments; continuous exposure above 100°C or contact with strong mineral acids is outside the operational boundary. Terminal finished product types include tensioner chain guides, bulk bag filling spouts, screw feeder inlet liners, conveyor roller bearing inserts, and diverter gate liners.
For gas detection and process transmitter housings installed in Zone 2 and Zone 22, non-metallic enclosure designs must prevent static charge accumulation that could discharge to an accessible metal part; IEC 60079-0 addresses electrostatic charge on non-metallic enclosures and permits static-dissipative compounds with surface resistance below 1.0×10⁹ Ω at 50% RH. RTP 299 F X 150148 is processed as a fully compounded pellet, so the addition ratio is 100% as supplied; no carbon black masterbatch or conductive fiber additive is introduced at the press, and regrind above 10 wt% is excluded from impact-critical enclosures because the preliminary datasheet does not quantify low-temperature impact retention after multiple heat histories. Injection molding uses a melt temperature of 200°C to 220°C, mold temperature 40°C to 60°C, and wall sections of 2.5 mm to 4.0 mm to satisfy impact tests at -40°C under IEC 60079-0. The production process includes post-molding annealing at 80°C for 2 h to relieve internal stress in snap-fit and threaded features. Terminal finished product types include intrinsically safe barrier junction boxes, gas detector housing shells, terminal compartment covers, and antenna radome bases for wireless field instruments. The PA12 base offers resistance to aliphatic hydrocarbon vapors and salt mist, but the compound is not suitable for continuous exposure to strong acids or steam above 100°C.
Competitive RTP Company RTP 299 F X 150148 Nylon 12 (PA), ESD Protection - Permanently Static Dissipative - Preliminary Datasheet prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615365186327 or mail to admin@ascent-chem.com.
We will respond to you as soon as possible.
Tel: +8615365186327
Email: admin@ascent-chem.com
Flexible payment, competitive price, premium service - Inquire now!
RTP Company RTP 299 F X 150148 Nylon 12 (PA), ESD Protection - Permanently Static Dissipative - Preliminary Datasheet is supplied as a preliminary polyamide 12 compound configured for permanent electrostatic-discharge protection in moulded parts that must dissipate charge without relying on a secondary antistatic coating or a humidity-dependent surface film. The grade combines the low-moisture-absorption, low-temperature impact, and chemical-resistance profile of PA12 with a static-dissipative modification distributed through the bulk polymer. Because the datasheet status is preliminary, property values, rheology data, and processing limits are derived from initial production campaigns and should be revalidated against the current datasheet revision before specification-controlled tooling release.
Surface and volume resistivity values for permanently static-dissipative systems are normally reported under controlled conditions of 23 °C and 50% RH using ASTM D257 or IEC 62631-3-2. Field verification at low humidity, such as 12% RH, is recommended for electronic packaging because many antistatic additives are humidity-dependent. RTP 299 F X 150148 is not classified as a conductive compound; it is designed to operate in the static-dissipative region rather than the conductive region below 1.0 × 105 Ω.
Conventional antistatic additives function by blooming to the polymer surface, attracting atmospheric water, and forming a conductive microscale layer. That mechanism is transient, washable, and strongly degraded at low relative humidity. A permanently static-dissipative compound instead contains an immobile conductive or semi-conductive phase distributed through the matrix. In PA12, the saturated moisture uptake at 23 °C and 50% RH is approximately 0.7%, whereas PA66 can exceed 2.5% under similar conditions. Consequently, the electrical performance of RTP 299 F X 150148 is less governed by water absorption and more governed by filler network geometry, so drying and conditioning practice must still be controlled but does not dominate surface resistance to the same degree as in a migratory antistat system.
The relevant acceptance criterion for many electronics manufacturers is surface resistance between 1.0 × 104 Ω and 1.0 × 1011 Ω as referenced in IEC 61340-5-1 and ANSI/ESD S20.20. Some assembly operations tighten the target to 1.0 × 106 Ω–1.0 × 109 Ω to limit charge accumulation without creating a hard ground path that can produce an electrostatic discharge from a highly conductive part to a sensitive device. In a static-dissipative moulded part, the discharge time constant is proportional to the product of surface resistance and capacitance. A part with surface resistance near 1.0 × 109 Ω may therefore require a defined ground contact, particularly in fast automated handling where triboelectric charging is continuous.
In semiconductor packaging, burn-in sockets, and automated test handler components, charge generation on polymer surfaces arises from contact electrification and triboelectric separation. A surface resistivity in the dissipative range permits charge to drain to ground over a controlled time constant, reducing the probability of device damage. For moulded trays and carriers, the ease of grounding through part geometry often determines whether the final discharge time falls within a specified limit measured with charged-plate monitors per IEC 61340-2-3. Published data for this specific configuration is limited outside the preliminary datasheet, but the product’s positioning as permanently static dissipative indicates that electrical performance is intended to survive washing, dry storage, and repeated service cycles better than a topically antistatic part.
Pre-drying should be performed in a desiccant dryer at 80 °C for 4 h to 8 h, with a dew point of ≤ -40 °C and a target moisture content below 0.10% before melt processing. PA12 pellets with residual moisture above this threshold may exhibit surface splay, dimensional drift, and increased melt-flow variability. Equipment trials on general-purpose reciprocating-screw injection moulding machines should use a three-zone screw with an L/D ratio of 18:1 to 24:1 and a compression ratio of 2.2:1 to 2.8:1. High-shear hot-runner systems and narrow gates may overwork the dissipative filler network and shift resistivity upward, so direct sprue gates or wide edge gates are preferred for first-article trials.
Nozzle melt-temperature start points typically fall between 220 °C and 250 °C, with mould temperatures from 40 °C to 80 °C. Backpressure in the range of 0.3 MPa to 0.7 MPa is usually sufficient to maintain shot-to-shot density without introducing excessive shear. Production-scale moulding of static-dissipative PA12 has shown that residence time is a more sensitive variable than in unfilled PA12. If barrel residence exceeds 10 min, surface resistance can rise as the dissipative network is disrupted by degradation products, even when the melt thermocouple reading remains within the nominal range. Operators should document barrel zone temperatures, screw recovery time, and cushion stability, and should not infer material quality from melt pressure alone.
Batch-to-batch variance in static-dissipative compounds is typically higher than in unfilled PA12 because the electrical performance sits on a percolation threshold that is sensitive to compounding energy, filler dispersion, and regrind concentration. The use of 25% regrind may shift surface resistance lower or higher depending on regrind source, drying history, and particle size distribution. For initial process validation, the regrind fraction should be fixed and recorded. If surface resistance after moulding approaches the upper end of the static-dissipative range, the first equipment change should be a reduction in screw speed or backpressure rather than an increase in melt temperature.
| Property | Test Method | Preliminary Value / Range |
|---|---|---|
| Specific gravity | ISO 1183-1 | 1.10–1.20 |
| Tensile strength at yield | ISO 527-2 | 35 MPa–45 MPa |
| Tensile elongation at break | ISO 527-2 | 5%–20% |
| Flexural modulus | ISO 178 | 1,300 MPa–1,800 MPa |
| Surface resistance | ASTM D257 | 1.0 × 106 Ω–1.0 × 109 Ω |
| Volume resistivity | ASTM D257 | 1.0 × 107 Ω·cm–1.0 × 1010 Ω·cm |
| Moisture absorption at saturation | ISO 62 | 0.7%–1.0% |
Published data for this specific configuration is limited, and the values above are representative initial ranges for permanent dissipative PA12 rather than final specification limits. The product code should be re-certified against the current datasheet revision before tooling release.
PA12 is selected when moisture-conditioned dimensional stability, low-temperature impact, and resistance to fuel, oils, and zinc chloride solutions are required alongside static dissipation. Carbon-black-filled PA6 or PA66 is often lower in cost and offers higher heat-deflection temperatures, but the higher equilibrium moisture absorption of those matrices can alter both part dimensions and surface resistivity after conditioning. In a PA66 ESD compound, moisture uptake may reduce surface resistance and increase the risk of hard-static or conductive behaviour, whereas PA12 maintains a narrower electrical drift in humid and dry service because the base resin absorbs less water. The trade-off is that PA12 normally exhibits lower short-term heat-deflection performance than PA66 at 1.8 MPa; if the component is exposed to sustained temperatures above 120 °C, a high-temperature polyamide or conductive PEEK grade may be required.
Against carbon-nanotube or conductive-fiber PA12 grades, a permanently static-dissipative PA12 is formulated for controlled bleed-off rather than maximum conductivity. Conductive grades with surface resistance below 1.0 × 104 Ω are often specified for shielding or rapid charge decay, but they may present greater sloughing, higher filler loading, and reduced impact resistance. RTP 299 F X 150148 is positioned for applications where the discharge path should be intentionally resistive, such as device carriers that must not become a low-impedance conductor during high-potential testing or automated handler contact.
For fuel-system sensor housings, tubing clips, and pneumatic control covers, the combination of permanent static dissipation and PA12 chemical resistance is relevant because surfaces may contact hydrocarbon vapours or cleaning solvents. The material should still be validated for the specific fluid, temperature, and oil-swelling conditions; permanent static dissipation does not imply universal solvent resistance. In such service, retention of surface resistivity after chemical immersion should be checked per IEC 61340-2-3 or a defined customer protocol. If the part operates in flammable solvent environments, static dissipative behaviour is not a substitute for proper grounding and area classification; the compound only provides a moderate bleed-off path and does not eliminate the need for engineering controls.
