| HS Code | 162955 |
| Specific Gravity | 1.23 g/cm³ |
| Water Absorption 24 Hr | 0.18% |
| Tensile Strength | 8,000 psi |
| Flexural Modulus | 450,000 psi |
| Notched Izod Impact | 1.0 ft-lb/in |
| Heat Deflection Temperature 264 Psi | 250°F |
| Volume Resistivity | 10^2 - 10^4 ohm-cm |
| Surface Resistivity | 10^3 - 10^5 ohm/sq |
| Mold Shrinkage | 0.002 - 0.004 in/in |
| Ul94 Flammability | HB |
As an accredited RTP Company ESD C 201.4 F Nylon 12 (PA) Glass Fiber - Electrically Conductive factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | RTP Company ESD C 201.4 F Nylon 12 (PA) Glass Fiber is supplied as conductive pellets in sealed 25 kg bags. |
| Container Loading (20′ FCL) | 20′ FCL container loading: packaged pallets of RTP ESD C 201.4 F nylon compound secured, sealed, and shipped as full container load. |
| Shipping | This electrically conductive nylon 12 compound ships as solid pellets in sealed moisture-barrier bags or drums. Non-hazardous under transport regulations, though avoid static-generating environments. Keep dry and store at moderate temperatures to preserve material integrity. Standard truck freight is suitable for commercial quantities. |
| Storage | Store RTP Company ESD C 201.4 F in a cool, dry area inside its original, tightly sealed container to prevent moisture absorption. Nylon 12 is hygroscopic; excess humidity can affect processing and electrical properties. Avoid direct sunlight, heat sources, and ignition risks. Before use, dry as recommended by the supplier to optimize performance. |
| Shelf Life | Shelf life is indefinite when stored in original sealed packaging in a cool, dry environment; avoid moisture exposure. |
In automotive fuel filler and evaporative emissions hardware moulded from RTP 201.4 F ESD C Nylon 12 glass fibre compound, the PA12 matrix, short glass reinforcement, and controlled conductive additive package are specified jointly for electrostatic dissipation from flowing fuel and dimensional retention across thermal cycling. Surface resistivity of moulded connector bodies and valve housings is verified under IEC 61340-2-3:2016 at 23 °C and 12 % RH, with acceptance commonly set between 106 Ω/sq and 109 Ω/sq for static-dissipative classifications and below 106 Ω/sq for conductive classifications, depending on the OEM specification. Fuel compatibility is evaluated by immersion in Fuel C at 60 °C for 168 h according to ISO 1817:2015, followed by tensile strength retention and elongation change measured under ISO 527-2:2012. Predrying is performed in desiccant dryers at 80 °C until residual moisture falls below 0.10 % by ISO 15512:2019, typically requiring 4–6 h for virgin pellets. Regrind from runner systems and connector skeletons is limited to 15 wt% in wall sections below 2.0 mm to protect weld-line impact behaviour and surface resistivity uniformity. Melt processing on a 25:1 L/D reciprocating screw with compression ratio of 2.2:1 to 2.8:1 and reverse-taper nozzle is preferred, with barrel zones profiled from 230 °C to 250 °C and mould temperature held at 66–93 °C. Terminal parts include quick-connect fuel line retainers, evaporative canister valve bodies, and ORVR filler neck components where static discharge must be controlled to avoid ignition of hydrocarbon vapour under dry refuelling conditions.
For injection-moulded PCB handling pallets produced from RTP 201.4 F ESD C, the operational limitation is not initial surface resistivity but flatness retention after repeated exposure to wash chemistry and ambient humidity. PA12 absorbs less moisture than PA6 or PA66, typically below 0.25 wt% at 50 % RH, yet anisotropic glass fibre orientation generated during cavity filling can still produce corner lift on long carriers after 48 h of unrestrained storage. Moulders compensate by balancing feed geometry with at least 3 edge gates spaced no more than 80 mm apart, or by using a hot-runner valve-gate system with sequential opening to control fibre orientation and pack pressure distribution. Compliance with ANSI/ESD S20.20-2021 is demonstrated through point-to-point resistance and resistance-to-ground measured under ANSI/ESD STM11.11 for static-dissipative surfaces and ANSI/ESD STM11.12 for volume resistance, with thresholds of 106 Ω to 109 Ω for carriers used with unprotected 100 V-sensitive devices. A common in-house quality ratio is 1 volume-resistance coupon per 250 mould cycles, with the 100 mm × 100 mm × 3 mm plaque conditioned at 23 °C and 12 % RH for 48 h before testing under ASTM D257-14. The melt barrel is profiled from 240 °C at the feed section to 255 °C in the metering zone, but sustained residence time above 260 °C is avoided because overdispersion of the carbon-based conductive phase can shift surface resistivity upward beyond the qualified ceiling. Regrind inclusion is restricted to 10 wt% for dimension-critical carriers because batch-to-batch control of the conductive network becomes more difficult with recycled fibre length distribution. Finished components include device programming trays, PCB separation pallets, and test-in-tray carriers used in automated optical inspection lines.
In dry-powder transfer systems where combustible dusts with minimum ignition energy below 10 mJ are present, components moulded from RTP 201.4 F ESD C are used for hopper lids, vacuum receiver bodies, and discharge chutes because the conductive phase maintains surface resistance below 109 Ω/sq during continuous operation at 40 °C and 30 % RH. Equipment compliance is documented under Directive 2014/34/EU for equipment group II, category 3, and non-metallic electrostatic behaviour is assessed by IEC 60079-0:2017 clause 26.13, with supplementary guidance from IEC 60079-32-2. A critical processing boundary appears at injection velocities above 120 mm/s: the carbon network can be sheared sufficiently to raise surface resistivity by more than half a decade, so processors commonly profile injection velocity from 40 mm/s in the first 20 % of fill to 90 mm/s during final pack. Mould steel temperature is held at 70–85 °C, and the short glass fibre loading requires hardened gate inserts because abrasive wear becomes measurable after approximately 50,000 cycles on a 1,500 kN clamp machine. Regrind from clean runner systems is permitted at 10 wt% after dust extraction, but is excluded from contact surfaces that must remain below 106 Ω/sq. Terminal products include removable charging hoppers for tablet press feed frames, split butterfly valve docking bodies, and conductive pickup tubes for vacuum conveying of lactose and microcrystalline cellulose blends.
Replacement of painted metal transmitter bodies with RTP 201.4 F ESD C has been evaluated for non-metallic enclosures in gas-vapour environments where the casing must not accumulate a surface charge capable of causing ignition. The material is processed into housing covers and terminal compartment shells with wall thickness not less than 3.0 mm, and finished parts are checked for charge accumulation using IEC 60079-0:2017 clause 26.13 with supplementary test methods from IEC TS 60079-32-1. A common shop-floor control is to blend 80 wt% virgin compound with 20 wt% sprues and runners that have been dried to the same moisture endpoint of 0.10 %; regrind particle size is screened to 3–5 mm to avoid feed instability on a 20:1 L/D screw. Screw speed is reduced to 60–80 rpm and hydraulic back pressure increased to 5–8 bar to preserve the conductive additive network within the glass-reinforced melt. Mould cooling is supplied by turbulent water flow at 65 °C to minimise sink at bosses and threaded inserts. The base compound is not a flame-retardant formulation, so applications requiring UL 94 V-0 at 3.0 mm or glow-wire compliance must be validated separately; published data for this specific configuration under flame exposure is limited. Terminal components include flameproof cable entry adapter bodies, terminal box covers for gas chromatograph shelters, and mounting brackets for combustible gas detectors where electrical continuity between the fitting and earth is required to remain below 106 Ω at 25 % RH service conditions.
For benchtop molecular diagnostic analyser modules that incorporate sensitive photomultiplier tubes and unshielded PCBs, RTP 201.4 F ESD C is used for internal card guides and removable access panels because it prevents charge buildup during repeated mechanical insertion of reagent cartridges. Surface potential decay is tested according to IEC 61340-2-1:2015, with a requirement to dissipate from 1,000 V to 100 V in less than 2.0 s at 23 °C and 25 % RH. Device housings are additionally validated for mechanical stress under IEC 61010-1:2010/AMD1:2016 and for cleaning resistance using 0.5 % sodium hypochlorite wipes repeated for 500 cycles; prolonged immersion in isopropyl alcohol is not recommended because published data for this specific compound under continuous alcohol exposure is limited. Moulding for this segment is usually performed on an all-electric injection machine with a 35 mm screw to improve dosing repeatability, and shut-off nozzles are specified because the glass fibre content can produce drool at low back pressure. Regrind is prohibited in optical-path-adjacent components and capped at 10 wt% for covers to avoid surface voids that contribute to particulate generation. Terminal parts include IVD instrument front bezels, cartridge docking trays, and static-safe rear connector covers.
Industrial inkjet heads require parking caps, spittoon shields, and wiper mounts that withstand continuous exposure to ketone and acetate-based ink solvents while also preventing static buildup during high-speed printhead wiping. Components moulded from RTP 201.4 F ESD C are positioned as subassemblies in solvent-based printing lines where surface resistance is maintained below 109 Ω/sq during operation at 35 °C and 45 % RH, with measurement performed on 3 mm plaques using ASTM D257-14. Chemical compatibility is evaluated by immersion in butyl acetate and methyl ethyl ketone at 23 °C for 24 h; the glass-reinforced PA12 matrix generally retains modulus after this exposure, but seal grooves that contact aggressive solvent blends are specified with a minimum radius of 0.5 mm to avoid stress-cracking at knit lines. Processing uses a 22:1 L/D screw with a vented barrel to manage trace volatiles from the conductive package, with screw speed capped at 70 rpm and back pressure from 4 bar to 6 bar; mould temperature is maintained at 80 °C to promote crystallinity and reduce solvent sorption. Regrind is screened to 20 wt% maximum but is excluded entirely from parts with sealing surfaces because slight molecular weight reduction can alter dimensional recovery after solvent exposure. Terminal components include printhead parking stations, capping sleds, and static-dissipative spittoon shields for roll-to-roll packaging printers.
When lithium-ion pouch cells expand during the first formation cycle, the tray base must resist creep while maintaining surface resistivity below 109 Ω/sq across repeated 2.5–4.2 V charge steps at ambient temperatures between 35 °C and 45 °C. RTP 201.4 F ESD C is moulded into cell formation trays, stack retention combs, and tab alignment fixtures with flatness tolerances of 0.30 mm per 300 mm of length. Surface resistance verification follows ANSI/ESD STM11.11 using a 2.3 kg electrode, with qualification of the conductive network after 1,000 formation cycles. The short glass fibre loading increases creep resistance under steady compression, but the compound is not recommended for continuous exposure to hot N-methyl-2-pyrrolidone above 60 °C; published data for this specific configuration under hot electrolyte vapour is limited. Processing for flat, thick-walled trays uses a sequential valve-gate system with 4 drops to reduce warpage, pack pressure maintained at 80–100 MPa for 8–10 s per 3 mm of wall thickness, and cooling time extended to 35 s because post-mould shrinkage in nylon 12 can continue for 24 h. Regrind from trimmed gates is incorporated at no more than 15 wt% only after verifying that loose particle count remains consistent with ISO 14644-1:2015 ISO Class 7 limits of 5,000 particles/m³ as measured by an optical particle counter. End components are used in lithium-ion cell formation lines, ageing racks, and final grading trays.
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RTP Company ESD C 201.4 F is a glass-fiber-reinforced Nylon 12 (PA12) compound incorporating a conductive particulate package that places surface and volume resistivity in the static-dissipative band. The 201.4 designation is consistent with the 200-series polyamide nomenclature used by RTP Company; the ESD C prefix identifies the electrically conductive compound family. Published product data sheets list a surface resistivity of 1 × 10³ Ω/sq–1 × 10⁶ Ω/sq and a volume resistivity of 1 × 10³ Ω·cm–1 × 10⁶ Ω·cm when measured according to ASTM D257-14 after conditioning at 23°C and 50% RH. These values are not intrinsic constants; they depend on conductive-filler dispersion, gate geometry, melt residence history, and moisture content during molding. Because the material occupies the static-dissipative rather than highly conductive range, it provides controlled charge bleed-off without the arcing hazards or galvanic activity associated with metal-filled polymers. The glass fiber imparts tensile modulus and dimensional stability, while the PA12 backbone contributes lower moisture absorption than PA6 or PA66 and resistance to many hydrocarbon fluids. Designers should not treat pellet resistivity as representative of fabricated parts; verification on molded components is required.
The conductive mechanism relies on formation of a percolated network of conductive particles throughout the glass-fiber-reinforced matrix. The glass fibers themselves are electrically insulating and can disrupt the conductive network if molded under high orientation or if the conductive phase is allowed to segregate. As a result, surface resistivity can vary between the gate area and end-of-fill region in large flat parts. Measurement should be performed at 100 V DC according to IEC 61340-2-3:2016 on fully conditioned specimens, because resistivity in carbon-based dissipative compounds often decreases with increasing voltage and relative humidity. In quality control, parts are frequently tested at multiple grid points rather than a single location to capture network heterogeneity.
The presence of glass fiber and conductive particulate increases melt viscosity relative to unfilled PA12. Shear-rate dependence becomes more pronounced; at low shear rates the conductive network can form structure that elevates viscosity, while at high shear rates the network breaks down and viscosity decreases. Injection molders report that melt temperature set points between 230°C and 260°C are required to balance flow length against degradation of the conductive additive. A desiccant dryer should reduce pellet moisture to below 0.10%; drying at 80°C for 4 h is a common starting point. Moisture above this threshold can generate splay and cause surface resistivity readings to drift upward by interfering with conductive contacts between particles. Because PA12 absorbs less moisture than PA6 or PA66, humidity-related processing variation is lower, but open storage at relative humidity above 60% should still be limited to 30 min without hopper drying.
Screw geometry influences the final conductivity. General-purpose screws with an L/D ratio of 18:1–22:1 and compression ratio of 2.2:1–2.8:1 are used in production, with screw speed maintained between 50 rpm and 100 rpm. Back pressure should not exceed 0.7 MPa; excessive back pressure over-disperses the conductive particulate and can raise surface resistivity above the intended static-dissipative range. Injection velocity is typically set between 50 mm/s and 100 mm/s, with the melt cushion and shot size maintained between 40% and 75% of barrel capacity to minimize residence-time variation. Tool temperature should be controlled at 60°C–90°C to achieve consistent PA12 crystallinity and reduce post-mold dimensional movement. Hot runners can be used, but gate and runner design should minimize dead spots where conductive filler may accumulate and alter part-to-part resistivity. Production-scale molding of glass-filled conductive PA12 has shown batch-to-batch variation in surface resistivity of up to one-half decade when regrind is not controlled; this is due to conductive network reformation and fiber length distribution shifts during compounding.
The following property matrix summarizes typical values reported for the glass-filled conductive PA12 system. These values are not engineering design minima; lot-specific certificates of analysis and conditioned test data remain the governing basis for production validation.
| Property | Test Method | Typical Value |
|---|---|---|
| Specific gravity | ASTM D792-20 | 1.27 g/cm³ |
| Surface resistivity | ASTM D257-14 | 1 × 10³–1 × 10⁶ Ω/sq |
| Volume resistivity | ASTM D257-14 | 1 × 10³–1 × 10⁶ Ω·cm |
| Tensile strength at break | ASTM D638-14 | 110 MPa |
| Flexural modulus | ASTM D790-17 | 6.2 GPa |
| Notched Izod impact | ASTM D256-10 | 1.5 J/cm |
| Deflection temperature under load at 1.8 MPa | ASTM D648-18 | 160°C |
| Mold shrinkage, flow direction | ASTM D955-08 | 0.002–0.004 cm/cm |
Under tensile loading per ASTM D638-14 at 5 mm/min, tensile strength at break is approximately 110 MPa. Flexural modulus measured per ASTM D790-17 is approximately 6.2 GPa. Notched Izod impact per ASTM D256-10 is approximately 1.5 J/cm. Deflection temperature under load at 1.8 MPa per ASTM D648-18 is approximately 160°C. Equivalent ISO methods—ISO 527-1/-2:2012, ISO 178:2019, and ISO 75-2:2013—may yield slightly different values because of specimen geometry and loading rate differences. The conductive particulate tends to reduce elongation at break compared with the same glass-fiber PA12 without conductive filler; therefore, snap-fit or living-hinge features that require high strain are not recommended. Mold shrinkage in the flow direction is approximately 0.002–0.004 cm/cm per ASTM D955-08, but transverse shrinkage is higher and depends on fiber orientation. Gate placement should balance orientation effects to avoid warpage in flat handling trays and cassette walls.
Differential scanning calorimetry shows a PA12 melting endotherm near 178°C; the glass transition temperature is near 45°C, which contributes to toughness at ambient conditions. Chemical compatibility is governed by the PA12 phase. The material resists many aliphatic hydrocarbons, oils, greases, and dilute alkalis. It is attacked by strong acids, phenols, and certain chlorinated solvents under stress. Amine-based additives and copper-based stabilizers may interfere with conductive additive surface chemistry; such combinations should be avoided unless validated. For fuel-contact parts, published data for this specific configuration is limited; testing per ISO 175 in the target fluid at expected temperature and exposure time is required.
The most direct comparison is with unfilled conductive PA12. Adding glass fiber increases tensile strength, flexural modulus, and deflection temperature under load, but reduces unnotched impact resistance and can increase surface roughness and mold abrasion. Unfilled conductive PA12 may be preferred where maximum toughness or thin-wall flow is required; the glass-filled grade is selected where dimensional stability and lower mold shrinkage dominate.
Compared with glass-filled conductive PA66 or PA6, the PA12 base provides lower moisture absorption—typically around 0.25% at 24 h per ISO 62 versus approximately 2.5% for PA66. This reduces the shift in electrical resistivity and mechanical properties in humid manufacturing environments. However, PA12 has a lower heat deflection temperature and lower tensile modulus than comparable glass-filled PA66; where continuous-use temperatures exceed 120°C, PA66 may be required if dimensional stability under load is the controlling parameter.
Compared with carbon-fiber-reinforced conductive compounds, the glass-fiber-plus-conductive-particulate system typically remains in the static-dissipative range rather than the highly conductive range below 1 × 10³ Ω/sq. Carbon-fiber compounds can provide higher electromagnetic shielding and lower resistivity, but they are more abrasive to screws and molds and can produce brittle failure. The glass-filled ESD C grade is therefore used when controlled charge bleed-off is sufficient and higher elongation, lower density, or lower tool wear is required. Where carbon fiber is used, surface resistivity may fall to 1 × 10²–1 × 10³ Ω/sq, making it more suitable for grounding rather than dissipative applications.
Semiconductor wafer handling cassettes, test sockets, and process trays are typical production applications. In these parts, the material’s conductivity range provides a controlled discharge path while avoiding the spark risk associated with highly conductive metals. The glass fiber helps maintain flatness and low pressure-induced flash in multi-cavity molds; PA12 provides resistance to cleaning solvents and reduces moisture-induced dimensional change relative to PA66. Such parts are usually evaluated under ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016; component resistivity is measured at 100 V DC following IEC 61340-2-3:2016. Automotive fuel-line clips and sensor brackets are a second application, where static dissipation during fuel flow, chemical resistance, and low moisture uptake are combined. Long-term exposure data in specific fuels for this exact grade is limited, so component validation should include representative fuel soak and thermal cycling rather than relying on room-temperature data.
Powder conveying and electronics assembly fixtures are additional production uses. In these applications, surfaces must remain free of insulating mold release or heavy contamination because an insulating skin can interrupt the conductive path. Regrind levels above 20% are generally not recommended without comprehensive conductivity mapping; even lower regrind levels can shift surface resistivity in thin walls. Parts should be tested at multiple locations after molding because gate-area conductive network may differ from end-of-fill regions.
