Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape
- Product Name: Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape
- Factroy Site: Yinchuan, Ningxia, China
- Price Inquiry: sales8@ascent-chem.com
- Manufacturer: Ascent Petrochem Holdings Co., Limited
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- Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape is typically used in formulations when thermal conductivity, bond-line thickness, and adhesive wet-out and continuous operating temperature and applied mounting pressure must be controlled within specific ranges.
| HS Code | 652974 |
| Manufacturer | Parker Chomerics |
| Product Name | THERMATTACH T414 Thermally Conductive Attachment Tape |
| Adhesive Type | Acrylic |
| Carrier Material | Fiberglass |
| Color | White |
| Thickness | 0.010 in (0.25 mm) |
| Thermal Conductivity | 1.0 W/m-K |
| Peel Adhesion | 40 oz/in (11 N/25 mm) |
| Dielectric Strength | 500 V/mil |
| Volume Resistivity | 1 x 10^12 ohm-cm |
| Operating Temperature Range | -40°F to 302°F (-40°C to 150°C) |
| Flammability Rating | UL 94 V-0 |
As an accredited Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged as one 12 in. × 36 yd. roll per package of Parker Chomerics THERMATTACH T414 thermally conductive attachment tape. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): palletized Parker Chomerics THERMATTACH T414 thermally conductive attachment tape, shrink-wrapped, secured, and fully compliant for transport. |
| Shipping | Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape is generally shipped as a non-hazardous, non-regulated article. No UN number, hazard class, or packing group is assigned. It is packaged in sealed cartons or rolls and protected from moisture, dust, and temperature extremes. Normal road, sea, and air transport apply. |
| Storage | Store Parker Chomerics THERMATTACH T414 in its original, unopened packaging in a cool, dry, well-ventilated area. Keep containers closed. Store between 15–30°C (59–86°F), away from direct sunlight, heat, sparks, open flames, moisture, and incompatible materials. Maintain approximately 50% relative humidity. Do not freeze. Protect from physical damage. Observe shelf life and rotate stock. Ensure containers remain sealed until use. |
| Shelf Life | Shelf life is typically 12 months from manufacture when stored unopened in original packaging at 23°C and 50% RH. |
Thermal Bonding of Aluminum-Core LED Boards to Extruded Heat Sinks
In fixed LED luminaires, MCPCB-to-heat-sink attachment uses a die-cut THERMATTACH T414 interlayer between the aluminum-core board and the extruded aluminum heat sink. The bond eliminates screws, spring clips, and silicone thermal pads that can migrate under thermal cycling. T414 is a ceramic-filled acrylic pressure-sensitive adhesive supplied at a nominal thickness of 0.25 mm (0.010 in) with a documented through-plane thermal conductivity of 1.4 W/m-K. Thermal impedance is evaluated under ASTM D5470-17 at a mean sample temperature of 50°C; published data for this specific configuration is limited to the manufacturer's technical datasheet, which records bond-line impedance in the range expected for a filled acrylic film of this thickness. Lamination on the luminaire line is performed at 0.35–0.50 MPa nip pressure with a dwell of 24–72 h at 23°C before UL photometric testing. Aluminum surfaces are prepared with a 70% isopropanol/30% deionized water wipe and must exceed 40 mN/m surface energy before lamination. The tape is applied to the heat sink first, followed by a slow roller pass over the MCPCB to avoid out-gassing voids. This sequence is used in LED panel lights, linear high-bay fixtures, and street-lighting modules where the luminaire must pass UL 8750 end-product requirements and where field service requires no clamped joint loosening.
Outdoor 5G remote radio units impose a bonding sequence that cannot tolerate void formation across the die-cast aluminum-powder-coat interface adjacent to the GaN power stage. T414 is laminated between the copper heat spreader and the aluminum amplifier housing after the housing sealing surface has been machined flat to 0.05 mm over the module face. The pressure-sensitive acrylic layer is applied at 0.40–0.55 MPa using a table-top pneumatically actuated nip roller with a Shore A 70 roller durometer; this avoids damaging the non-woven carrier while forcing adhesive wet-out into the chromate conversion coating. Full shear strength develops after 24 h at 20–25°C, but the assembly is not subjected to IP67 water-jet testing until 72 h of dwell. The bond carries heat flux from the GaN die through the spreader and into the housing, so the continuous-use temperature at the tape plane must remain below 120°C; above that boundary the acrylic PSA embrittles and lap shear decreases. Qualification is performed under IEC 60529 for sealing and under ASTM D1002-10(2019) for retained lap shear after 100 thermal cycles from -40°C to 85°C. Production lots are die-cut on a polyethylene terephthalate carrier with a polycoated release liner that must be peeled before automated pick-and-place.
What Controls Peel Adhesion After Thermal Cycling in Automotive ECU Interfaces?
If an automotive ECU tape bond is exposed to repeated thermal excursions between -40°C and 85°C, the dominant failure mode is loss of adhesive wet-out at the glass-filled polyamide housing rather than bulk adhesive fracture. In this application, T414 is die-cut to isolate the aluminium heat spreader from the polyamide 66 housing containing the ADAS vision processor. The housing surface is prepared with atmospheric plasma to lift surface energy above 42 mN/m; untreated glass-filled polyamide can fall below 34 mN/m and produces peel initiation failures. Peel adhesion is measured under ASTM D3330/D3330M-04(2018) after 48 h dwell at 23°C, and production lots are rejected if adhesion drops below the supplier's control limit. The lamination fixture uses 0.25–0.35 MPa pressure to avoid cracking the plastic snap hooks that retain the die-cut part. Because the module is mounted behind the instrument panel, the continuous-use boundary of 120°C is not exceeded. Qualification testing includes 1,000 h of 85°C/85% RH damp heat followed by ASTM D1002-10(2019) lap shear testing, with failure mode recorded as cohesive within the adhesive layer rather than interfacial separation. The final assembly is a forward-facing camera controller and sensor-fusion ECU that must comply with REACH Article 33 communication requirements and RoHS Directive 2011/65/EU Annex II substance restrictions.
In automated DC-DC converter lines, kiss-cut T414 parts on a polyethylene terephthalate carrier travel to a six-axis robot that places the tape onto the stamped aluminum heat sink before the power MOSFET board is mounted. The process uses a pneumatic pressure pad with a silicone rubber face at 0.30–0.50 MPa to compress the tape over the MOSFET tab pocket. This pressure range is selected because lower pressure leaves air channels visible through the translucent acrylic film, while higher pressure extrudes adhesive beyond the heat-sink edge and contaminates the subsequent wave-soldering pallet. The converter board remains unpowered for 24 h after lamination, then is energized to 100% load in burn-in; full peel strength is recorded only after the 72 h dwell specified by the adhesive supplier. Thermal performance is verified with a thermal camera during IEC 62368-1:2018 fault-condition testing, and the bond must maintain interface temperature below 120°C. The T414 layer replaces a silicone pad and spring clip in a 48 V server rack power supply, allowing the converter to use fewer through-hole fasteners and reducing acoustic noise from fan-driven vibration. The design release package requires flame classification documentation from Parker Chomerics; the tape is not assigned a flame barrier role without customer-specific evaluation in the end-product context.
When a Heat Spreader Must Be Bonded Without Silicone Outgassing in Optical Modules
Optical transceiver assembly restricts silicone-based pressure-sensitive adhesives because volatile siloxane species migrate from the PSA layer and deposit on the transmit/receive lens. T414 is used as a silicone-free acrylic alternative to bond the metal heat spreader plate to the die-cast transceiver cage in QSFP-DD and OSFP modules. The small tape parts are die-cut with 0.05 mm positional tolerance to align with the raised thermal boss. Pick-and-place lamination applies 0.20–0.30 MPa for 5 s, and the module is then placed in a magazine for 24 h before solder reflow of the adjacent flexible circuit. This delayed handling prevents shear movement during the high-speed connector insertion process. Because the transceiver housing can be exposed to 70°C during system airflow failure, the acrylic PSA remains within its upper continuous-use boundary. For space-grade or long-haul optical modules, outgassing requirements from ASTM E595-15 may be imposed by the end customer; published data for this specific configuration is limited, and qualification by customer-specific coupon testing is required before release. The final assembly is a 400G pluggable optical module with the tape embedded under the shell, out of the optical path, and the bond line contributes no silicone oil that would create lens fog after 1,000 h high-temperature operation.
Battery Management Substrate Attachment and Electrical Isolation Windows
For battery management system boards, T414 is used as a combined mechanical attachment and electrical isolation layer between the FR-4 substrate and the aluminium cold wall of the battery enclosure. The tape is not placed in the main cell-to-cooling-plate thermal path; it attaches sense-resistor balance boards and MOSFET switching boards that generate localized heat during cell balancing. The FR-4 soldermask surface is wiped to remove no-clean flux residues and electrolyte aerosol, then laminated at 0.20–0.30 MPa to avoid cracking the 0402 and 0603 ceramic capacitors already populated on the opposite side. Full lap shear develops after 24 h at 23°C, but the pack assembly line does not subject the bond to vibration testing until 72 h. The application is qualified under IEC 62660-2:2018 for secondary lithium-ion cells and under IPC-A-610 class 2 for handling damage limits. Operational boundary includes an upper interface temperature of 120°C and a prohibition on continuous contact with carbonate-based electrolyte droplets, which plasticize the acrylic PSA and reduce lap shear. The terminal product is an automotive or stationary storage battery management board where the tape removes the need for nylon standoffs and allows a flat thermal interface to the aluminium cold wall.
Competitive Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape prices that fit your budget—flexible terms and customized quotes for every order.
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- Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape is manufactured under an ISO 9001 quality system and complies with relevant regulatory requirements.
- COA, SDS/MSDS, and related certificates are available upon request. For certificate requests or inquiries, contact: sales8@ascent-chem.com.
Parker Chomerics THERMATTACH T414 Thermally Conductive Attachment Tape is a double-sided, ceramic-filled acrylic pressure-sensitive adhesive supplied as a die-cut or roll-format interface for attaching heat sinks, heat spreaders, and cooling plates to electronic components. The product is a solid tape rather than a flowable grease or curable adhesive. Its nominal thickness of 0.25 mm places it in the thin-bond-line class of thermal interface materials, where it provides a thermally conductive path between a component lid, package surface, or circuit board and a metallic heat sink. The acrylic adhesive wets aluminium, copper, and solder mask surfaces, while the ceramic filler reduces the thermal resistance of the adhesive matrix. The tape is supplied with a release liner and is converted to die-cut geometries for automated pick-and-place assembly or supplied in roll form for manual placement.
The thermal performance of T414 is evaluated under ASTM D5470-17, a guarded heat flow method that measures thermal conductivity and thickness-normalized impedance under a controlled clamping pressure. Electrical isolation is tested under ASTM D149 for dielectric strength and ASTM D257 for volume resistivity. These electrical properties are relevant when a heat sink is at chassis ground and the component package must remain galvanically separated from the sink. The acrylic matrix is insulating, but final isolation depends on filler packing, layer thickness, and the absence of voids. Batch release limits in the current manufacturer data sheet therefore control the electrical and thermal performance of each shipment.
| Property | Test method | Representative value |
|---|---|---|
| Nominal thickness | Micrometer | 0.25 mm |
| Thermal conductivity | ASTM D5470-17 | 0.8 W·m⁻¹·K⁻¹ to 1.2 W·m⁻¹·K⁻¹ |
| Dielectric strength | ASTM D149 | 500 V·mil⁻¹ typical |
| Volume resistivity | ASTM D257 | 1 × 10¹² Ω·cm typical |
| Continuous use temperature | Manufacturer thermal endurance | −40 °C to 120 °C |
| Flame retardancy | UL 94 | V-0 on specified substrate |
The values above are representative for ceramic-filled acrylic pressure-sensitive tapes of this class. Published data for this specific configuration is limited to the manufacturer’s current technical datasheet, and the appropriate revision should be consulted before production qualification because filler loading and liner type may vary by die-cut shape and lot.
When Heat Sink Attachment Must Occur Without a Cure Step or Mechanical Clamp
In power conversion modules, LED arrays, and memory DIMM cooling plates, T414 is used where a curable adhesive would require fixturing, oven capacity, and post-cure inspection. The pressure-sensitive acrylic system reaches handling strength after the application of lamination pressure. Typical process parameters include a lamination pressure of 0.7 MPa to 1.0 MPa applied for 5 seconds to 30 seconds, depending on substrate stiffness and die-cut geometry. The bond strength continues to build by adhesive flow into surface microtexture during the first 24 hours at room temperature. The component and heat sink must be flat; for a 0.25 mm tape, gap variation across the interface should be controlled below approximately 0.1 mm to avoid voiding and localized increases in thermal impedance.
The thermal path in this application is dominated by two interfaces: the adhesive-to-component interface and the adhesive-to-heat-sink interface. Surface preparation determines whether the filler-bearing adhesive can wet the substrates. For aluminium surfaces, a solvent wipe with isopropyl alcohol followed by a tissue-dry step removes silicone oils and light handling contamination. For printed circuit board solder mask, the surface energy should be at least 34 mN/m; lower-energy surfaces may require an adhesion promoter or corona treatment. The tape is not a gap filler for cast or sand-cast surfaces with deep machining marks. If the flatness requirement cannot be met, a dispensable gap filler or a thicker thermal pad is required, but T414 is not chemically interchangeable with such products because it is a pressure-sensitive tape rather than a crosslinking gel.
What Distinguishes T414 from Grease, Epoxy, and Mechanical Fastening?
The primary difference between T414 and a thermal grease is the nature of the bond line. A grease remains fluid and accommodates very thin gaps by hydraulic displacement; however, it can be displaced by pump-out during thermal cycling, and it does not provide mechanical attachment. T414 provides a solid, peelable bond line and can serve as the only attachment mechanism for low-mass heat sinks. Compared with a curable epoxy, T414 does not require mixing or a cure schedule, but the shear strength of a pressure-sensitive adhesive is typically lower than that of a crosslinked epoxy. Compared with mechanical fasteners, T414 eliminates drilled holes and point loads at the component edges, but the attachment strength is governed by adhesive peel resistance and surface preparation rather than clamp force.
| Attachment system | Cure or rework behaviour | Gap-filling range | Thermal conductivity class | Electrical isolation |
|---|---|---|---|---|
| T414 PSA tape | No cure; reworkable with heat and peel | 0.05 mm to 0.15 mm effective on flat substrates | 0.8 W·m⁻¹·K⁻¹ to 1.2 W·m⁻¹·K⁻¹ | Yes |
| Thermal grease | No cure; pump-out and clean-up during rework | Very thin bond line; low viscosity may fill micro-roughness | 2 W·m⁻¹·K⁻¹ to 8 W·m⁻¹·K⁻¹ | Not unless specified |
| Curable epoxy | Cure required; low reworkability | 0.05 mm to 0.25 mm depending on spacer control | 1 W·m⁻¹·K⁻¹ to 3 W·m⁻¹·K⁻¹ | Often yes |
| Mechanical fastener | No adhesive cure; torque-controlled | Accommodates larger tolerances via compliant springs | Interface material dependent | Bare metal is conductive |
In production, T414 is often applied from a die-cut liner with a vacuum pick-and-place head. The head should not touch the exposed adhesive; pickup should be made from the liner side. A placement force of 20 N to 50 N is applied to the component or heat sink, depending on the pad area. Placement pressure for a 10 cm² pad is therefore in the range of 0.02 MPa to 0.05 MPa, lower than the final lamination pressure. The final bond pressure must be applied through a flat anvil or roller to avoid edge crushing of the ceramic-filled adhesive. If the adhesive is compressed beyond the 0.25 mm thickness by more than 10%, the filler loading may become locally concentrated and the dielectric strength may be reduced below the 500 V·mil⁻¹ typical value.
Incoming inspection of T414 includes thickness measurement with a micrometer, liner release verification, and visual inspection for filler agglomerates or voids. Batch-to-batch variation in filler loading can appear as shifts in thermal conductivity and dielectric strength; therefore the manufacturer’s certificate of analysis should be compared against drawing tolerances. For high-volume lines, a subset of die-cut pads is tested for compression set and peel adhesion on stainless steel panels. The results should be charted as a moving range to detect lot changes before the material reaches the assembly line.
Adhesion Build, Surface Energy, and Continuous Use Boundary
The pressure-sensitive acrylic adhesive in T414 displays viscoelastic flow at room temperature. Initial tack is sufficient for positioning, but ultimate peel strength requires dwell. The manufacturer’s shelf-life guidance for acrylic PSA tapes of this class is typically 12 months from date of shipment when stored at 23 °C ± 5 °C and 50% ± 10% RH in the unopened liner. Storage outside these conditions can shift the adhesive loss modulus and reduce the wet-in of the ceramic-filled matrix. The product should not be stored in direct sunlight or near sources of ultraviolet radiation because acrylic adhesives are susceptible to photolysis and chain scission at the free surface.
The upper continuous use temperature is limited by the acrylic adhesive rather than the ceramic filler. Long-term exposure above 120 °C can accelerate oxidative degradation, reduce peel strength, and increase liner release issues. The tape is not recommended for applications with continuous immersion in hydrocarbon or ester-based coolants. Compatibility with dielectric fluids should be verified by immersion testing according to the coolant manufacturer’s method. Where volatile outgassing is a concern, the product should be assessed under ASTM E595 because acrylic pressure-sensitive adhesives contain low-molecular-weight fractions that can evolve under vacuum.
Rework of a T414-bonded assembly is performed by warming the heat sink to 60 °C to 80 °C and applying a slow peel force. The cohesive failure mode within the adhesive can be exploited to separate the parts without damaging the component leads. Residual adhesive may be removed with isopropyl alcohol or a manufacturer-approved cleaning solvent. After rework, the surface energy of the substrate must be re-established; repeated solvent cleaning can deplete the oxide layer on aluminium and alter bond strength. If a heat sink is reused, the old adhesive must be removed completely because a second tape layer over residual adhesive creates a lower-modulus interlayer and raises thermal impedance.
