Products

Parker Chomerics CHO-MASK II ST Conductive Foil Tape

    • Product Name: Parker Chomerics CHO-MASK II ST Conductive Foil Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
    • CONTACT NOW
    VTB
    Specifications
    HS Code 314463
    Manufacturer Parker Chomerics
    Product Name CHO-MASK II ST Conductive Foil Tape
    Product Series CHO-MASK II
    Product Type Conductive foil tape
    Backing Material Copper foil
    Adhesive Type Conductive acrylic pressure-sensitive adhesive
    Total Thickness 2.5 mil (0.064 mm)
    Color Copper
    Electrical Conductivity Electrically conductive
    Volume Resistivity 0.005 ohm-cm
    Shielding Effectiveness Greater than 100 dB (30 MHz to 1 GHz)
    Operating Temperature Range -40°F to 250°F (-40°C to 121°C)
    Adhesion To Steel 40 oz/in
    Tensile Strength 25 lb/in
    Elongation 10%
    Roll Length 36 yd (32.9 m)
    Rohs Compliant Yes
    Flammability Rating UL 94 V-0

    As an accredited Parker Chomerics CHO-MASK II ST Conductive Foil Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Packaged as one roll per sealed, labeled box; the roll is individually wrapped for protection and safe handling.
    Container Loading (20′ FCL) 20′ FCL loading: palletized Parker Chomerics CHO-MASK II ST Conductive Foil Tape, shrink-wrapped, secured, labeled, and braced for safe transport.
    Shipping Parker Chomerics CHO-MASK II ST Conductive Foil Tape is not classified as dangerous goods for transport. Ship in original sealed packaging at ambient temperature. Protect from moisture, heat, and physical damage. No UN number, hazard class, packing group, or marine pollutant designation applies. Follow carrier and local regulations.
    Storage Store CHO-MASK II ST Conductive Foil Tape in its original sealed packaging in a cool, dry, well-ventilated area. Keep away from direct sunlight, heat, sparks, open flames, moisture, and incompatible chemicals. Maintain a moderate temperature, ideally 10–30°C, and avoid freezing. Keep packaging closed, protect from physical damage, and rotate stock using oldest first.
    Shelf Life The shelf life is 12 months from date of manufacture when stored in original unopened packaging at 20–25°C and 50% relative humidity.
    Application of Parker Chomerics CHO-MASK II ST Conductive Foil Tape

    In outdoor 5G remote radio unit (RRU) enclosures, seam shielding between the die-cast aluminum lid and chassis is subjected to condensation, thermal oscillation, and tower-induced vibration. CHO-MASK II ST is converted into continuous die-cut gasket strips; because it is a pre-formed conductive foil tape, no formulation addition ratio is introduced into the compound stream—the equivalent process control is 100% perimeter seam coverage using a 12 mm strip on flat sealing flanges and a 10 mm minimum splice overlap at strip ends. Downstream production uses a servo-driven rotary die cutter with product-specific liner depth control, then robotic pick-and-place lamination onto surfaces cleaned with an isopropyl alcohol/water blend and dried below 50% RH. Terminal finished products include 5G massive MIMO RRU enclosures and outdoor baseband unit chassis that require EMC compliance under EN 301 489-1 and radio product conformity under 3GPP TS 38.113, with material compliance documented under RoHS 2011/65/EU and REACH Regulation (EC) No 1907/2006. Edge lifting at the liner cut line is a known processing risk when die-cut parts are stored beyond 6 months at >60% RH without sealed desiccant packaging; because published adhesion retention data after 85°C/85% RH exposure for this exact converted part configuration is limited, qualification should include peel testing per ASTM D3330/D3330M before outdoor network deployment.

    What Solderable Tin-Plated Copper Backing Changes in Avionics Chassis Seam Sealing?

    The solderable tin-plated copper backing allows direct hand-soldering or reflow of grounding tails without drilling through the foil, but the conductive acrylic pressure-sensitive adhesive still imposes a processing ceiling before solder temperatures. No formulation addition ratio applies to the tape itself; the equivalent manufacturing control is a continuous 6.35 mm wide tape path along the full seam length, with butt splices overlapped by 5 mm and low-pressure lamination applied through a silicone rubber roller. Downstream production in avionics LRU assembly typically applies the tape after chromate conversion coating, using a benchtop heated roller laminator that brings the bond line to 25–40°C without exceeding the adhesive’s continuous service limit. Terminal finished products include airborne transponder LRU housings and navigation receiver chassis, which are validated for conducted susceptibility and radiated emissions under MIL-STD-461G test methods RS101 and RS103, and are environmentally qualified under RTCA DO-160G Section 20 radio frequency susceptibility. The adhesive should not be specified for continuous service above 110°C because thermoplastic creep reduces compression force on the seam; if the LRU is intended for vacuum service or spaceflight, outgassing data per ASTM E595 for the converted part must be generated because published data for this specific configuration is limited.

    Automotive ECU Die-Cut Shield Lamination and Conductive Acrylic PSA Adhesion Stability

    Die-cut CHO-MASK II ST patches are placed between PCB shield cans and magnesium or aluminum die-cast ribs in automotive electronic control units to reduce slot aperture emissions without adding a secondary compression gasket. No compounding addition ratio exists because the material is supplied as a finished pressure-sensitive foil tape; the equivalent process variable is patch area coverage on the rib, typically kept between 40% and 60% to avoid trapped volatile outgassing during subsequent conformal coating cure. Downstream production uses a flatbed steel-rule die cutter with controlled edge tolerance, then vacuum pick-and-place placement and roller burnishing; critical process control is substrate preparation because silicone-based mold release on magnesium housings is known to interfere with pressure-sensitive adhesion. Terminal finished products include ADAS front camera modules and domain controller housings that must meet conducted and radiated emission limits under CISPR 25:2021, bulk current injection immunity under ISO 11452-2, and vibration profiles under IEC 60068-2-64. If a silicone mold release is present, plasma cleaning is required before tape application; adhesion retention should be validated by thermal shock testing under ISO 16750-4 and peel testing per ASTM D3330/D3330M.

    Because radiology reading room equipment must pass both electromagnetic compatibility and repeated surface disinfection, CHO-MASK II ST is used on internal cable-routing channels of ultrasound cart display enclosures. No compounding ratio applies; the equivalent application control is 25 mm wide tape applied over the full length of each internal seam, with a 10 mm end overlap and a 2 mm edge setback from snap-fit features. Downstream production converts the tape on a laser rotary die cutter and applies it with a pneumatic rubber roller; the liner is removed at the point of placement to keep the conductive acrylic adhesive free of airborne dust. Terminal finished products are mobile diagnostic ultrasound systems and picture archiving and communication system workstations compliant with IEC 60601-1-2:2014+A1:2020 for electromagnetic disturbances and managed under FDA 21 CFR Part 820 quality system requirements. Engineering controls should prevent prolonged contact with >70% isopropyl alcohol or quaternary ammonium disinfectants because published adhesion compatibility data for this exact tape under repeated wipe cycles is limited; if disinfectant exposure is unavoidable, adhesion retention testing per ASTM D3330/D3330M is required before design release.

    When a VFD Panel Seam Is Not Designated for Field Re-Entry and Avoids Secondary Fasteners

    On the non-serviceable joint of a variable-frequency drive cabinet, a continuous foil tape path replaces fingerstock compression gaskets to seal the seam between the painted steel enclosure body and a bolted cover. No formulation addition ratio is introduced; the equivalent manufacturing ratio is 100% joint length coverage with a 20 mm tape width and a 15 mm splice overlap. Downstream production applies the tape with a semi-automatic linear gantry after the powder-coated surface is mechanically conditioned with a 400-grit conditioning pad and primed with a compatibility-tested primer; roller pressure is maintained to ensure full adhesive wet-out without crushing the foil. Terminal finished products are industrial variable-frequency drive enclosures required to meet IEC 61800-3:2017 conducted emission category C2 limits and UL 61800-5-1 enclosure construction requirements. The acrylic adhesive’s shear holding on textured powder coat is the limiting feature; sustained enclosure temperatures above 85°C can permit creep, so process validation should include 72 h static shear testing at 85°C under ASTM D3654/D3654M.

    High-speed interconnect test fixtures use CHO-MASK II ST applied to the underside of removable shielded module lids to create a repeatable grounding contact with the fixture ground plane after each lid closure. No formulation addition ratio exists; the equivalent process variable is a 5 mm wide tape strip placed along the full shield-can perimeter with 45° angled butt joints to avoid raised edge oxide shorts. Downstream production uses a benchtop digital cutting plotter with tangential blade control and placement under an illuminated magnifier; no heat is applied because the pressure-sensitive adhesive is designed for room-temperature bonding. Terminal finished products include USB4/Thunderbolt compliance test fixtures and vector network analyzer calibration carriers that must satisfy radiated and conducted disturbance limits under CISPR 32:2015 and reference impedance requirements under IEC 62680-1-3. Because the foil is tin-plated rather than nickel-plated, galvanic compatibility with nickel-plated shield frame surfaces should be assessed; contact resistance should be verified at <0.05 Ω initially and after 500 mate/demate cycles.

    Free Quote

    Competitive Parker Chomerics CHO-MASK II ST Conductive Foil Tape prices that fit your budget—flexible terms and customized quotes for every order.

    For samples, pricing, or more information, please contact us at +8618005193850 or mail to sales8@ascent-chem.com.

    We will respond to you as soon as possible.

    Tel: +8618005193850

    Email: sales8@ascent-chem.com

    Inquiry

    Get Free Quote of Ascent Petrochem Holdings Co., Limited

    Flexible payment, competitive price, premium service - Inquire now!

    Certification & Compliance
    More Introduction

    Parker Chomerics CHO-MASK II ST Conductive Foil Tape is a copper-foil-backed pressure-sensitive adhesive tape in which the acrylic adhesive is filled with a conductive particulate to provide electrical continuity through the bond line. The product is supplied on a silicone-coated release liner and is used for enclosure seam shielding, cable harness shielding, ground-plane repair, and aperture closure in electronic enclosures. The suffix ST denotes the smooth-texture copper foil surface specified in the manufacturer’s datasheet; this topography is selected to reduce sliver formation at die-cut edges and to provide more uniform solder-wetted termination during prototype and rework operations.

    The conductive adhesive distinguishes CHO-MASK II ST from CHO-MASK I, which uses a nonconductive pressure-sensitive adhesive and requires direct foil-to-substrate contact for grounding. The ST surface condition also distinguishes it from standard CHO-MASK II, which is supplied with a standard bright copper surface. In manufacturing environments where conductive sliver contamination is a documented failure mode, such as power supply PCB assembly, the ST variant is specified because smoother foil edges are less prone to break away during cutting. Available configurations include slit rolls and custom die-cut shapes; published data for the adhesive chemistry and conductive filler are limited, because the adhesive is described by Parker Chomerics as a filled acrylic pressure-sensitive system rather than as an unfilled film adhesive.

    Manufacturer-reported values place total tape thickness between 0.08 mm and 0.09 mm, copper foil thickness near 0.035 mm, surface resistivity below 0.05 Ω/sq when tested per ASTM D257, and through-adhesive resistance below 0.05 Ω. Peel adhesion to stainless steel is published in the range of 3.5 N/cm to 5.5 N/cm under ASTM D3330. Shielding effectiveness is reported above 70 dB from 30 MHz to 1 GHz; the manufacturer’s published data for higher frequencies and for assembled seam geometries is limited.

    What Electrical and Shielding Performance Values Are Published for CHO-MASK II ST?

    The tape is used where a conductive pressure-sensitive adhesive must eliminate the need for mechanical compression along an EMI seam. Its shielding effectiveness is not controlled by the adhesive alone; the copper foil carrier provides the primary shielding function, while the adhesive provides a low-impedance return path. Reported shielding effectiveness values are therefore sensitive to aperture size, seam overlap, and enclosure resonance effects. For seam applications, the installed shielding effectiveness should be verified at the enclosure level using IEEE Std 299-2006 or the legacy MIL-STD-285 method, because the material-level specification does not account for slot antennas formed by enclosure discontinuities.

    Typical published physical and electrical values for CHO-MASK II ST
    PropertyReference methodValue or range
    Total tape thicknessmanufacturer micrometer inspection0.08 mm–0.09 mm
    Copper foil thicknessmanufacturer inspection0.035 mm
    Surface resistivityASTM D257-14<0.05 Ω/sq
    Through-adhesive resistanceinternal contact-pressure fixture<0.05 Ω
    Shielding effectivenessIEEE Std 299-2006>70 dB, 30 MHz–1 GHz
    Peel adhesion to stainless steelASTM D3330/D3330M-043.5 N/cm–5.5 N/cm
    Service temperaturemanufacturer-rated-40 °C–150 °C

    Published data for frequencies above 10 GHz should be treated as application-dependent, because surface roughness, adhesive thickness, and seam geometry dominate the high-frequency impedance path. The conductive adhesive provides through-bond conductivity, but its resistance may increase after repeated thermal cycling if the acrylic binder loses contact with the foil or substrate. Acrylic pressure-sensitive adhesives also exhibit viscoelastic behavior; initial adhesion is not final adhesion, and full wet-out at room temperature can require 24 h to 72 h.

    Die Cutting, Liner Control, and Adhesive Build-Up Limits

    Rotary kiss cutting is the dominant mass-production process for this tape. The die strike is set to penetrate the copper and adhesive layers while leaving the release liner intact. If the liner is cut, automated peel-off can tear and produce adhesive transfer to the anvil. The ST smooth-texture surface reduces edge sliver formation relative to bright copper foils, but sliver control remains primarily a function of die sharpness, draw speed, and anvil condition. Steel-rule or matched-metal dies with polished cutting edges are preferred; rotary die stations typically run at controlled draw speeds below 10 m/min for clean edge quality, although published data for specific die configurations is limited.

    Surface preparation consists of removing hydrocarbon films with a solvent wipe of 70% isopropanol and 30% deionized water, followed by drying for a minimum of 30 s. The tape is applied at room temperature and burnished with a 2 kg silicone roller; adhesion builds as the acrylic pressure-sensitive adhesive wets the substrate. Continuous bond line temperatures above 100 °C under shear load can produce creep, and the upper service temperature of 150 °C should not be interpreted as a continuous load-bearing rating. The product is not a structural fastener; mechanical seam compression must be maintained when the assembly is exposed to vibration or thermal cycling.

    In automated placement cells, the release liner is peeled immediately before placement to limit contamination of the adhesive surface. Adhesive transfer to the placement nozzle is reduced by using low-tack nozzle tips and by avoiding dwell times longer than a few seconds after liner removal. Clean-room use may require a visible sliver inspection step, particularly when the tape is die-cut beside exposed high-voltage nodes. Conductive slivers generated from copper foil can bridge isolated pins; the ST smooth-texture grade is selected for reduced sliver risk, but process capability must be confirmed with inspection data from the specific die-cutting station.

    When Bare Copper Foil Is Galvanically Incompatible with the Substrate

    Bare copper foil is not galvanically compatible with aluminum, magnesium, or zinc-plated steel in moist environments. On an aluminum flange, the copper foil acts as a cathode and accelerates aluminum pitting at the tape edge. For outdoor enclosures with aluminum flanges, a tin-plated copper tape or a nonconductive corrosion-inhibiting barrier should be considered. Published data for CHO-MASK II ST on salt-spray-tested aluminum joints is limited; industry validation frequently follows ASTM B117 salt fog exposure, but performance depends on joint sealing, drain geometry, and enclosure gasket design.

    Compared with aluminum foil tape, CHO-MASK II ST provides lower foil resistivity and solderable terminations but higher mass and greater galvanic incompatibility risk. Compared with tin-plated copper tape, it provides lower initial contact resistance but lower resistance to sulfidation and oxidation. Copper oxide films can raise contact impedance if the tape is not burnished or sealed. The conductive acrylic adhesive is vulnerable to ketones, esters, and chlorinated solvents; long-term immersion in such media is outside the product rating. Adhesive compatibility should be validated by the end user using ASTM D896 when solvent cleaning or chemical exposure is expected.

    Compliance and rating summary for CHO-MASK II ST
    ClassificationReferencePublished status
    Flammability of adhesive tapeUL 510recognized where specified
    RoHSEU 2011/65/EU, (EU) 2015/863compliant per supplier declaration
    REACH SVHCRegulation (EC) No 1907/2006per supplier declaration
    Protective earthingIEC 62368-1:2023not suitable as sole protective conductor

    CHO-MASK II ST is not suitable for use as a primary safety grounding conductor under IEC 62368-1:2023 because the copper and adhesive cross-sectional area and mechanical robustness do not satisfy protective conductor requirements. It is also not rated for continuous immersion in fuel, hydraulic fluid, or strong polar solvents unless validated per ASTM D896. In medical or aerospace applications, lot-level traceability, outgassing, and ionic cleanliness must be verified against the relevant procurement specification, because the standard commercial datasheet does not include NASA ASTM E595 outgassing or USP Class VI data.

    Top