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Parker Chomerics CHO-FAB CFT Shielding Tape

    • Product Name: Parker Chomerics CHO-FAB CFT Shielding Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 247243
    Manufacturer Parker Chomerics
    Product Name CHO-FAB CFT Shielding Tape
    Product Family CHO-FAB
    Product Type Conductive fabric EMI shielding tape
    Backing Material Nickel-copper plated polyester fabric
    Adhesive Type Conductive acrylic pressure-sensitive adhesive
    Thickness 0.10 mm (0.004 in)
    Surface Resistivity 0.05 ohm/square
    Shielding Effectiveness 80 dB from 30 MHz to 1 GHz
    Operating Temperature -40 °C to 125 °C
    Peel Adhesion 1.0 N/cm
    Flammability Rating UL 94 V-0
    Color Silver-gray
    Rohs Compliant Yes
    Halogen Free Yes
    Roll Width 12.7 mm (0.5 in)
    Roll Length 16.5 m (18 yd)
    Shelf Life 12 months

    As an accredited Parker Chomerics CHO-FAB CFT Shielding Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Parker Chomerics CHO-FAB CFT Shielding Tape is supplied as one roll per package, typically 0.5 inch wide by 36 yards long.
    Container Loading (20′ FCL) 20′ FCL container loaded with Parker Chomerics CHO-FAB CFT Shielding Tape, palletized, secured, and moisture-protected for safe ocean transport.
    Shipping Parker Chomerics CHO-FAB CFT Shielding Tape is non-hazardous and not regulated for transport. It has no UN number, hazard class, or packing group. Ship in original packaging, keep dry, and protect from extreme temperatures and contamination. No special labeling or placarding required under DOT/IATA/IMDG regulations. Always verify current SDS.
    Storage Store Parker Chomerics CHO-FAB CFT Shielding Tape in its original, sealed packaging in a cool, dry, well-ventilated area. Keep away from direct sunlight, heat, sparks, open flames, moisture, and contaminants. Maintain temperatures between 10°C and 30°C, with relative humidity below 80%. Protect from crushing, sharp edges, and physical damage. Rotate stock and observe the manufacturer’s shelf-life recommendations.
    Shelf Life Shelf life is 12 months from date of manufacture when stored in original packaging at 23°C and 50% relative humidity.
    Application of Parker Chomerics CHO-FAB CFT Shielding Tape

    In shielded harness assemblies for military avionics and flight-control nodes, Parker Chomerics CHO-FAB CFT is configured as a nickel/copper-plated ripstop conductive fabric tape with a pressure-sensitive conductive acrylic adhesive and a segmented release liner. At the interface between a metallized fabric overbraid and an aluminum or composite connector backshell, the cut-back transition zone is wiped with 70% isopropanol / 30% deionized water and allowed to flash for 60 s before tape application. A 50% helical overlap is formed over an 8–12 mm transition length so that the conductive adhesive contacts both the outer braid circumference and the textured backshell land. The applied wrap is burnished with a PTFE squeegee at a linear pressure of 18–25 N/cm², forcing the pressure-sensitive adhesive into the braid interstices and reducing void fraction at the braid-to-backshell interface. Finished cable assemblies are evaluated for shield transfer impedance under SAE ARP1870 or equivalent aerospace harness acceptance standards. Military programs verify radiated emissions under MIL-STD-461G RE102 and RTCA DO-160G Section 20, while vibration survival is assessed under MIL-STD-810H Method 514.8. End products include fuel-quantity harnesses, fly-by-wire signal cables, and engine-mounted sensor looms where conical backshell terminations cannot be covered by heat-shrink boot systems. The ripstop weave resists transverse tearing at variable-radius backshells during high-cycle vibration. In field-repair actions, reapplication requires full adhesive removal with 99% isopropanol because silicone mold-release residue on composite shells can reduce peel strength below 0.4 N/mm when tested under ASTM D3330.

    What Limits Near-Field Leakage from Variable-Frequency Drive Enclosures?

    At the seam between two painted panels of a variable-frequency drive enclosure, harmonic currents generated by IGBT switching in the 2–16 kHz band couple capacitively to the panel edges. When the seam length exceeds one-twentieth of the wavelength at the highest significant harmonic, it radiates as a slot antenna rather than a simple resistive gap. At 300 MHz, λ/20 is 50 mm; therefore, unshielded seams longer than 50 mm degrade far-field attenuation. CHO-FAB CFT is centered on the seam with a 3:1 width-to-gap ratio and a 10 mm minimum conductive-fabric capture on each side of the gap. The mating surfaces are roughened with a nonwoven abrasive and degreased with 99% isopropanol before the tape is laminated with a spring-loaded wheel at 0.25–0.35 MPa nip pressure. The conductive fabric is extended to the enclosure protective-earth stud as a 20 mm tab and secured with a stainless M4 fastener to maintain low-impedance grounding. Product-level verification follows IEC 61800-3:2022 electromagnetic compatibility requirements for adjustable-speed power drive systems, with radiated emission measurements evaluated under CISPR 11 and enclosure shielding tested by IEEE 299. End products include motor control-center cabinets, regenerative drive enclosures, and gantry servo panels where removable covers require a serviceable seam shield rather than a welded continuous joint. Because pulse-width-modulation harmonics extend into the VHF range, seam continuity is rechecked after each maintenance cycle with a milliohmmeter at 0.1 A test current. A seam resistance increase above 25 mΩ relative to the original value indicates adhesive delamination or fabric oxidation.

    Robotic Lamination of Fabric Shielding Tape on EV Battery Management Module Housings

    For 400 V and 800 V automotive traction packs, battery management module housings combine a PC/ABS cover with a stamped steel base, creating a mixed-material seam that cannot be welded or permanently gasketed without losing service access. The polymer sealing surface is treated with atmospheric plasma until surface energy exceeds 40 dyn/cm, checked on every 50th part with dyne pens. CHO-FAB CFT is then applied by a Cartesian robotic end-effector fitted with a spring-loaded pressure roller operating at 0.2–0.4 MPa. The tape edge is maintained within ±0.5 mm of the interlocking lip, and a 5 mm minimum adhesive capture width is retained on both the steel flange and the plasma-treated polymer surface. The release liner is automatically split before the roller so that the conductive acrylic adhesive is not exposed to ambient air for more than 20 s, reducing moisture uptake when relative humidity exceeds 60%. The taped module is tested against CISPR 25:2021 conducted and radiated emission classes for onboard receivers and against UN ECE Regulation 10 revision 6 for type approval. End products include slave battery management modules, cell supervisory circuit enclosures, and service-disconnect housings where the shield must maintain low seam impedance after repeated service cycles. In salt-spray validation per ASTM B117-19, exposed edges of nickel/copper fabric can develop galvanic oxidation at the copper/polyester yarn boundary. Designers avoid direct contact between the tape edge and bare steel washers unless a nonconductive edge seal is added. Published data for long-term exposure at 125 °C hotspots adjacent to DC-DC converter stages is limited, so automotive programs typically require thermal soak at 105 °C for 1,000 h with peel strength retention above 60% of initial ASTM D3330 values.

    Downstream segmentGoverning standard or test methodKey verification parameter
    Military avionics harnessMIL-STD-461G RE102 / RTCA DO-160G Section 20Transfer impedance, radiated emissions 10 kHz–18 GHz
    Variable-frequency drive enclosureIEC 61800-3:2022 / CISPR 11Conducted 150 kHz–30 MHz, radiated 30 MHz–1 GHz
    EV battery management moduleCISPR 25:2021 / UN ECE R10.06Radiated and conducted emissions 150 kHz–2.5 GHz
    Medical diagnostic equipmentIEC 60601-1-2:2014+A1:2020Radiated immunity 80 MHz–2.7 GHz
    Tactical radio housingMIL-STD-461G RS103Electric field susceptibility 80 MHz–18 GHz
    5G remote radio unitETSI EN 301 489-50 / GR-1089-CORE Issue 7Radiated spurious emission, enclosure seam continuity

    Before silicone assembly lubricants are eliminated from a display bezel joint, the interface between a painted aluminum chassis and an insert-molded plastic bezel in medical diagnostic equipment is not an electromagnetically continuous seam. CHO-FAB CFT is installed after the bezel and chassis are wiped with 70% isopropanol and verified to be free of silicone mold-release and assembly fluid, which inhibit the pressure-sensitive adhesive. The tape is cut to provide a 5 mm adhesive overlap on the aluminum chassis and a 5 mm overlap on the bezel, yielding a 1:1 split across the seam. A fixed-gap silicone rubber roller applies 0.15–0.25 MPa to consolidate the tape. Elongation is limited to 2% because stretching the ripstop fabric alters pore geometry and reduces shielding effectiveness above 1 GHz. The assembled system is tested under IEC 60601-1-2:2014+A1:2020, with radiated immunity fields set according to the intended use environment; typical professional healthcare chambers operate from 10 V/m to 30 V/m over 80 MHz–2.7 GHz. End products include ultrasound carts, patient monitors, infusion pump enclosures, and mobile imaging systems that must survive repeated disinfectant wipe cycles without delamination. The tape’s acrylic adhesive is checked for halogen release under internal extraction procedures, and salt-mist exposure per ASTM B117-19 is used to identify edge corrosion before pre-production release. Because medical enclosures are subject to reverse logistics and reuse, the tape is not applied over service access gaps that must be reopened unless the adhesive removal process is documented and re-taped with new material.

    When MIL-STD-461G RS103 Test Margins Fall Below 6 dB on Tactical Radio Housings

    When hard-anodized aluminum tactical radio housings show repeatable RS103 margin shortfalls in the 80 MHz–18 GHz test band, the dielectric hard-anodize layer on the cover land becomes the dominant seam impedance contributor. The cover land is masked during anodizing to leave a bare aluminum strip of 3 mm around the full perimeter. CHO-FAB CFT is die-cut to match the land with a 3 mm adhesive capture width on the bare aluminum and a 3 mm overlap onto the cover interior. The tape is placed at 100% perimeter coverage, with no butt joints. Corners are folded using 45° relief cuts and compressed under a vacuum bag at −0.8 bar for 10 min to eliminate trapped air pockets. The assembled housing is evaluated under MIL-STD-461G RE102 and RS103, and seam continuity is monitored by measuring DC resistance between cover and housing at 0.1 A test current; values above 10 mΩ trigger rework. End products include manpack radios, software-defined radio line-replaceable units, and airborne tactical data terminals where removable covers require service access. Because the conductive acrylic adhesive has shorter tack life than cured elastomer gaskets, rework procedures require complete removal with 99% isopropanol and replacement with fresh tape. Reseating a lifted edge does not recover peel strength under ASTM D3330. Total joint standoff is held below 0.15 mm after assembly to prevent bowing of thin 1.5 mm aluminum covers under fastener torque.

    Across field-repairable remote radio units, flange surface roughness after salt-fog exposure and repeated deck-truck maintenance produces variable gap geometry at die-cast aluminum housing seams. CHO-FAB CFT is supplied as laser-cut strips with a release liner that exposes 10 mm of tape across the flange gap; the tape overlaps the joint by 5 mm on each side and is burnished with a pneumatic roller at 0.2 MPa. The flange faces are prepared by grit-blasting to Ra 3.2 µm and cleaning with an electronics-grade solvent, allowing the conductive acrylic adhesive to wet the rough surface without trapping air. At 26 GHz, λ/20 is 0.58 mm; a 0.5 mm flange gap therefore approaches the slot-radiation threshold, and localized machining pitting can produce resonant leakage sites. The compressed conductive fabric bridges the gap and reduces slot radiation, but the tape is not a machined gasket and cannot recover severe pitting that exceeds the fabric thickness. Compliance is verified under ETSI EN 301 489-50 radiated spurious emission requirements and GR-1089-CORE Issue 7 electromagnetic compatibility requirements for network telecommunications equipment. End products include massive MIMO active antenna unit housings, point-to-point microwave transceivers, and small-cell radios where multiple access covers must be resealed in the field after duplexer filter replacement. At 5G NR FR2 bands, surface roughness-induced air gaps below the adhesive remain the primary source of seam leakage. Incoming lot acceptance therefore includes a 1,000-hour damp-heat test per IEC 60068-2-78 at 85 °C / 85% RH followed by peel strength retention measurement under ASTM D3330.

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    Certification & Compliance
    More Introduction

    Parker Chomerics CHO-FAB CFT shielding tape is a conductive fabric tape built on a ripstop woven polyester carrier metallized with copper and nickel. The conductive path is maintained across the fabric surface and through a conductive pressure-sensitive acrylic adhesive. The product is supplied on a release liner and is used in enclosure seams, cable-shield terminations, and cover edges where a die-cut conductive fabric gasket is not available. Manufacturer-published nominal construction data list a total thickness of 0.10 mm (0.004 in) and standard roll widths of 25.4 mm, 50.8 mm, and 101.6 mm. Surface resistivity determined by ASTM D4496-21 is typically not greater than 0.05 Ω/sq. Because the fabric is woven rather than continuous foil, the measured surface resistance is direction-dependent; the highest resistance may occur across the weft and warp yarn intersections under low contact pressure.

    Shielding effectiveness should be specified by test configuration. Plane-wave attenuation measured with a modified IEEE 299 fixture on an aluminum aperture plate is typically reported at ≥ 60 dB from 20 MHz to 10 GHz for a single layer with proper grounding. At lower frequencies the tape is not a magnetic absorber. Magnetic-field shielding below 1 MHz depends on the joint inductance and enclosure geometry rather than the fabric alone. Peel adhesion at 180° to stainless steel under ASTM D3330-04 Method A is frequently used as the incoming-materials control method. The continuous service temperature range is normally stated as -40 °C to 121 °C, with short excursions above 150 °C permitted only for reflow or bake cycles documented by the manufacturer.

    How Does a Nickel-Copper Ripstop Fabric Tape Compare with Solid Copper Foil and Aluminum Foil Shielding Products?

    In a comparison against solid copper foil tape, CHO-FAB CFT has lower longitudinal conductivity because current flows through a plated woven scrim rather than a continuous foil. Copper foil tape typically shows surface resistivity below 0.01 Ω/sq and higher plane-wave attenuation above 80 dB in the same fixture. The fabric tape compensates with higher tear strength and flex endurance. Solid foil products wrinkle and crack when stretched over curved returns, whereas the ripstop polyester fabric can be formed around a radius below 6 mm without tearing. Aluminum foil tape provides continuous lower surface resistivity, but its galvanic potential is more negative than the nickel-copper fabric when coupled to steel or aluminum. Oxidation of aluminum surfaces can raise contact resistance over time unless the conductive adhesive is applied under sufficient pressure and the joint is protected from moisture.

    Comparative construction and typical test methods for shielded tape types
    ParameterCHO-FAB CFTSolid copper foil tapeAluminum foil tape
    CarrierNickel-plated copper ripstop polyesterRolled copper foilRolled aluminum foil
    Conduction pathPlated yarn grid with conductive acrylic PSAContinuous metal foil with conductive acrylic PSAContinuous metal foil with conductive acrylic PSA
    Surface resistivity methodASTM D4496-21ASTM D4496-21ASTM D4496-21
    Shielding effectiveness methodModified IEEE 299Modified IEEE 299Modified IEEE 299
    Continuous service temperature-40 °C to 121 °CSupplier-specific for acrylic foil tapeSupplier-specific for acrylic foil tape

    For cable shield termination, the tape is typically wrapped around a braided or foil cable shield and a metal connector backshell with 50% overlap. The conductive acrylic adhesive provides electrical contact only when the liner is removed cleanly and the tape is burnished with a rigid roller. Joint resistance measured from connector backshell to cable shield with a four-wire milliohm meter should be below 0.05 Ω on first article units. Production lines using automatic tape dispensers require controlled unwind tension because the ripstop carrier can telescope on the roll when the release liner is pulled at high speed.

    In enclosure seam applications, the tape is often die-cut into strips rather than applied directly from the roll. Die-cut strips reduce tolerance stack-up in high-volume assembly because the tape width can be matched to the flange land. A pneumatic or manually operated roller conforms the adhesive to the plating topography. Plating thicknesses of 5 μm to 15 μm on steel or aluminum flanges have been sufficient when the chromate conversion coating is sealed and dry. Electrical contact to bare aluminum should be verified for galvanic corrosion risk. Field data from metal enclosure lines show that edge lift is the dominant failure mode when the tape is applied over a powder-coated flange because the adhesive bonds to the powder surface rather than the conductive substrate. If the flange is not masked before powder coat, a separate conductive insert or masked conductive land is required. On electroless nickel-plated flanges, phosphate residues from pretreatment can survive alkaline cleaning and produce a nonconductive boundary layer. A contact-resistance test or four-wire probe should be used after cleaning on a first article basis.

    When CHO-FAB CFT Replaces Die-Cut Fabric Gaskets in Flanged Enclosure Seams

    Die-cut gaskets impose tooling lead time and require a continuous groove or retaining feature. CHO-FAB CFT can be laminated directly onto a flat flange with no groove, provided the flange width is at least 3 mm and the mating cover applies uniform pressure. The adhesive system is not a foam core and does not provide low closure force or compression set. Therefore, the joint should be designed with continuous metal-to-metal contact along the tape edge to carry current. If the cover is bowed, intermittent contact can produce slot-antenna leakage at frequencies where the seam opening approaches a half wavelength.

    Because the acrylic pressure-sensitive adhesive is a polyacrylate system, it should not be specified in continuous contact with plasticized polyvinyl chloride, low molecular weight hydrocarbons, or ketones at elevated temperature. Plasticizer migration softens the adhesive and can cause edge lifting on cable jackets. The tape is not designed for fluid sealing. Pressure differentials across an enclosure seam require a separate elastomer gasket. At relative humidity above 60% RH, reels should be conditioned in sealed packaging to prevent water condensation on the release liner. Application at substrate temperatures below 10 °C is not recommended because the adhesive does not wet surface roughness well enough to maintain stable electrical contact.

    Surface preparation is the main factor that changes production yield. Alcohol wiping with 70% isopropyl alcohol is common for removal of light process oils, but high-load stamping lubricants may require methyl ethyl ketone or a hydrocarbon degreaser followed by a clean wipe. Solvent flash-off should be complete before tape placement. Retained solvent at the adhesive-substrate interface reduces peel adhesion and raises joint resistance after temperature cycling. A lint-free poly-cellulose wipe should be used because paper wipes leave sulfate residues that can accelerate corrosion on nickel-plated fabric. Substrate surface energy should exceed 38 dyn/cm. Untreated polyethylene and polypropylene are not recommended without corona or plasma pretreatment.

    On high-volume enclosure lines, batch-to-batch variation in release-liner release force can shift die-cutting kiss-cut depth. An incoming inspection fixture run at 300 mm/min peel rate is used to verify release force before die-cutting. Automatic dispensers with uncontrolled brake torque can telescope the roll after partial use. Constant torque clutches or diameter-compensating unwind spindles are specified. Liner fragments left in the die-cut tape cause insulating regions that may not be visible under low magnification.

    Galvanic Compatibility and Low-Frequency Shielding Limits of the Nickel-Copper System

    Shielding effectiveness below 10 MHz is governed less by the tape surface resistivity than by the geometry of the seam and the inductance of the enclosure. A conductive fabric tape cannot replace magnetic steel or high-permeability shielding for near-field magnetic absorption. The nickel outer layer provides corrosion resistance and a stable contact surface, but the copper-nickel couple can still participate in galvanic corrosion when the tape is terminated on certain magnesium alloys or when the joint is exposed to salt spray. In salt fog testing conducted under IEC 60068-2-52 or equivalent, the edge of the tape and the exposed metal flange should be inspected for white corrosion products. Pass/fail criteria should be established by the end user because laboratory atmosphere and salt concentration vary.

    Incoming inspection and compliance data matrix for Parker Chomerics CHO-FAB CFT
    Standard or regulationTest method or clauseValue or status
    Surface resistivityASTM D4496-21≤ 0.05 Ω/sq
    Peel adhesion at 180°ASTM D3330-04 Method AReported on stainless steel substrate
    Plane-wave shielding effectivenessModified IEEE 299≥ 60 dB typical
    Continuous operating temperatureSupplier datasheet-40 °C to 121 °C
    RoHS Directive 2011/65/EU amended by (EU) 2015/863Restriction declarationCompliant per supplier declaration
    REACH Regulation EC 1907/2006Article 33 SVHC disclosureNo added SVHC above 0.1% w/w

    The tape is used in printed circuit board shield partitions when a low-profile conductive surface is needed without through-hole fasteners. Strips are cut to length, placed across the junction between a board-mounted fence and a cover, and rolled with a silicone-covered mandrel. Electrical integrity is checked by a four-wire probe on a sampling basis. For cable harnesses, the tape replaces copper foil wrappers in applications where repeated flexing causes foil cracking. Because the tape is conductive across its face, overlapping wraps must be burnished to avoid insulating air gaps between the first wrap and the overlapping layer. If a solder connection is brought through the tape, the polyester carrier will melt and the nickel-copper plating will wick. Solder terminations are therefore made to a metal terminal or connector body, not directly to the fabric.

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