| HS Code | 975537 |
| Dielectric Constant At 10 Ghz | 2.4 |
| Dissipation Factor At 10 Ghz | 0.0012 |
| Specific Gravity | 1.02 |
| Softening Point Ring Ball | 105°C |
| Glass Transition Temperature Tg | 85°C |
| Melt Viscosity At 200 C | 200 mPa·s |
| Acid Value | <1 mg KOH/g |
| Moisture Absorption | <0.05% |
| Thermal Decomposition Temperature Td 5 Weight Loss | 380°C |
| Color Gardner | <3 |
As an accredited Modified Hydrocarbon Resin for 5G High-Frequency Materials - EM Tech factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in 25 kg moisture-proof sealed bags, ensuring stable performance for 5G high-frequency material applications. |
| Container Loading (20′ FCL) | 20′ FCL loaded with EM Tech modified hydrocarbon resin, securely packed in drums/pallets, safe, stable, no special hazard. |
| Shipping | This resin is shipped in sealed, moisture-resistant drums or bags to preserve purity. Transport in dry, ventilated containers, avoiding extreme heat and direct sunlight. Handle with care to prevent package damage. Standard chemical logistics apply, with proper labeling and documentation for safe, efficient delivery. |
| Storage | Store in a cool, dry, well-ventilated area, away from heat, open flames, and direct sunlight. Keep the container tightly sealed to prevent moisture absorption and contamination. Avoid exposure to oxidizing agents. Under recommended conditions, shelf life is typically 12 months. Use appropriate personal protective equipment when handling. |
| Shelf Life | Shelf life is typically 12 months from manufacture when stored in a cool, dry place away from sunlight. |
In 5G macro base station antenna feed networks operating from 2.6 GHz to 4.9 GHz, the cured laminate must maintain a dielectric constant (Dk) below 3.5 and a dissipation factor (Df) below 0.003 at 10 GHz, verified in accordance with IPC-TM-650 2.5.5.9. The EM Tech modified hydrocarbon resin is incorporated at 20–30 wt% of total resin solids in a PPE/PPO-hardened varnish system; below 20 wt% the measured Df remains above 0.004 after post-cure, while above 30 wt% the minimum melt viscosity falls below 1,200 Pa·s at 120°C and creates glass fabric strike-through on 2116 weaves. Compliance for the finished laminate is evaluated against IPC-4101E, UL 94 V-0, and RoHS Directive 2015/863; the UL 94 V-0 requirement is maintained by limiting the modified hydrocarbon resin to 30 wt% and selecting a phosphorus-free crosslinker at 5–10 phr relative to total resin solids.
The downstream production sequence begins with a varnish batch mixed in a 500 L planetary mixer under vacuum at 40–60°C; the resin system is then coated on 1078 or 2116 glass fabric using a slot-die coater with a 0.5–1.2 m web width. B-staging is performed in a 12-zone impingement oven at 150–170°C for 3–6 min until residual flow reaches 12–20%, measured by resin flow squeeze-out. The prepregs are then laid up with low-profile copper foil and pressed in a vacuum press with 1,200 mm × 1,800 mm platens at 190–210°C and 35–50 kg/cm² for 90–120 min. Production-scale batch data show that a flow deviation greater than 2 percentage points shifts dielectric thickness by ±5 µm and changes characteristic impedance by ±2 Ω in grounded coplanar waveguide structures. The finished product is a high-frequency copper-clad laminate, converted into active antenna unit PCBs for 5G macro base stations.
On the same lamination line, the curing exotherm must be constrained between 160°C and 190°C at a differential scanning calorimetry ramp rate of 10°C/min; if the exotherm peak exceeds 195°C, the press cycle develops volatile by-products that increase the incidence of resin voids at the copper-glass interface. Batch-to-batch variation in the EM Tech modified hydrocarbon resin melt viscosity above ±150 Pa·s at 120°C is sufficient to alter the B-stage flow window by 3–5 percentage points, requiring operator adjustment of the coater speed and oven zone temperatures. Those adjustments are recorded on the batch traveler because the final dielectric thickness tolerance of ±5 µm cannot be met without compensating for resin lot rheology differences.
The 77–81 GHz automotive radar transceiver laminate is processed with a lower EM Tech modified hydrocarbon resin loading than a macro base station CCL to preserve glass transition temperature above 220°C. The starting addition ratio is 18–28 wt% relative to total resin solids, combined with 35–45 wt% spherical silica of 0.5–2.0 µm D50; below 18 wt% the Df at 79 GHz increases above 0.0045, and above 28 wt% the T-300 value drops below 250°C and tensile elongation at break falls below 1.5%, increasing via barrel cracking risk in thermal shock testing at -40°C to 125°C per IPC-6012DA Class 3. The resin system is also required to maintain a Z-axis coefficient of thermal expansion below 55 ppm/°C below Tg to prevent barrel fatigue in 100 µm laser vias after 1,000 cycles of thermal shock.
In production, the resin-filler slurry is dispersed in a high-shear rotor-stator mixer at 1,500–3,000 rpm, then cast onto low-profile copper foil and B-staged to a residual flow of 16–22%. The automotive radar PCB stack-up typically uses 2–4 layer hybrid constructions with laser-drilled 100 µm vias; after CO₂ laser ablation, a CF₄/O₂ plasma desmear step removes resin smear and raises the via wall roughness to 0.3–0.6 µm Ra. In-line experience shows that filler agglomerates larger than 20 µm generate microvoids at the via-to-inner-layer interface and increase insertion loss by 0.2–0.4 dB per via at 79 GHz. The terminal product is a 77 GHz automotive radar transceiver PCB for adaptive cruise control and blind-spot detection systems.
| Parameter | 18 wt% resin loading | 23 wt% resin loading | 28 wt% resin loading |
|---|---|---|---|
| Spherical silica filler loading | 35 wt% | 40 wt% | 45 wt% |
| Minimum melt viscosity at 120°C | 1,800 Pa·s | 1,450 Pa·s | 1,100 Pa·s |
| Vacuum press temperature | 210°C | 205°C | 200°C |
| Resin flow window | 14–18% | 16–22% | 22–28% |
| Post-cure schedule | 230°C for 2 h | 225°C for 2 h | 220°C for 2 h |
Compliance requirements include IPC-6012DA Class 3, IPC-TM-650 2.5.5.9 for dielectric loss, UL 94 V-0, and REACH SVHC disclosure; the material supplier must provide batch-specific gel time and melt viscosity certificates because deviation in gel time beyond ±10 s alters via fill and plated through-hole reliability. Production records from high-volume automotive PCB qualification runs show that resin lots with gel times below 120 s at 170°C cause premature viscosity build before complete copper fill in low-flow prepreg regions, while gel times above 150 s extend lamination and increase the risk of resin starvation at the edges of the 500 mm × 600 mm panel.
Hybrid multilayer backplanes operating at 56–112 Gbps PAM4 impose a maximum effective Df of 0.004 at 10 GHz and require resin flow control tight enough to maintain 100 Ω differential impedance across 24–40 layer stack-ups. The EM Tech modified hydrocarbon resin is used in a low-flow prepreg bonding film at 15–25 wt% of total resin solids, with a bromine-free formulation and 10–20 phr of a high-Tg crosslinker; this addition ratio reduces melt viscosity sufficiently to fill 15–25 µm clearance gaps without causing resin starvation at plated through-hole knees. The bonding film is B-staged to a residual flow of 10–15%; production-line experience indicates that flow deviation above 2 percentage points produces dry glass edges and intermittent inner-layer separation during thermal stress at 288°C for 10 s per IPC-TM-650 2.6.8.
Sequential lamination is performed in a 1,000 mm × 1,500 mm vacuum press at 180–210°C and 25–40 kg/cm², with each lamination cycle held for 60–120 min. Prepregs are preconditioned at 23±2°C and 50±10% RH for 24 h before layup; if the moisture content exceeds 0.2 wt%, the rolls are pre-dried at 80°C for 2 h because residual moisture accelerates void formation in high-layer-count stack-ups. The copper foil used in this construction is a very-low-profile grade with an Rz of 2–3 µm to reduce conductor loss at 56 Gbps and 112 Gbps; the low-flow resin must nevertheless achieve a peel strength above 0.8 N/mm on that smooth copper surface under IPC-TM-650 2.4.8. Compliance is verified under IPC-4101E, UL 94 V-0, and RoHS Directive 2015/863. The terminal product is a high-layer-count backplane PCB used in 400G and 800G data center switch fabrics and optical module evaluation boards.
The primary process conflict in this application is not curing kinetics but lateral flow uniformity. High-layer-count sequential lamination creates asymmetric pressure distribution at the book edges; with the EM Tech modified hydrocarbon resin at 25 wt%, the melt viscosity at 150°C is approximately 2,500–3,200 Pa·s, which is low enough to wet internal copper features but still high enough to prevent uncontrolled squeeze-out. If the resin loading is pushed to 30 wt% to reduce Df further, edge-flow increases to 22–28%, and the outer layer dielectric thickness drops below the 50 µm minimum required for 100 Ω differential pairs. Published data for this specific high-layer-count configuration is limited; qualification work therefore includes impedance testing across the full 600 mm × 600 mm panel rather than relying on coupon-level data alone.
For antenna-in-package substrates that integrate a 28 GHz patch array with a flip-chip die, the low-loss dielectric build-up film must balance high stiffness after cure with a sufficiently low melt viscosity to fill 50 µm lines and spaces. The EM Tech modified hydrocarbon resin is added at 22–32 wt% of total resin solids, together with 50–65 wt% fused silica and 5–10 phr crosslinker; the starting formulation yields a cured CTE below 60 ppm/°C below Tg and a Df below 0.004 at 10 GHz. Compliance for the package substrate includes IPC-4101E, IPC/JEDEC J-STD-020 moisture sensitivity classification, and IPC-TM-650 2.6.2.1 water absorption; the laminate is expected to remain below 0.1% water absorption after 168 h at 85°C/85% RH.
Manufacturing uses a carrier film coater with a film thickness tolerance of ±2 µm, followed by vacuum lamination onto patterned copper at 120–140°C and 3–5 kg/cm². The wet film is coated at 25–40 µm and dried at 90–110°C for 5 min to remove solvent while leaving enough flow for lamination into 50 µm lines and spaces. Laser via drilling with a UV laser at 355 nm and 20–40 µJ pulse energy creates 40–60 µm blind vias; the subsequent plasma desmear step in CF₄/O₂ at 200–300 W removes organic residue and prepares the via wall for electroless copper. Process data from production-scale equipment indicate that film thickness variation above ±2 µm shifts the 28 GHz patch impedance by ±3 Ω and degrades return loss by 3–5 dB. If the filler loading exceeds 65 wt%, the B-staged film becomes brittle and cracks during roll handling; if the filler loading falls below 50 wt%, the CTE rises above 70 ppm/°C and solder joint reliability at 260°C reflow deteriorates. The terminal product is an antenna-in-package or antenna-on-package substrate for 5G smartphones, small cells, and fixed wireless access terminals.
In RF front-end module substrates, the dispersion of high-Dk ceramic fillers within the EM Tech modified hydrocarbon resin matrix determines whether embedded filter cavities and couplers maintain a consistent dielectric constant across a 300 mm × 300 mm panel. The starting formulation uses 20–30 wt% modified hydrocarbon resin, 40–60 wt% rutile TiO₂ or strontium titanate filler, and 5–10 phr of a silane coupling agent; the resin loading is adjusted so that the cured Dk spans 6.0–8.0 at 10 GHz while keeping Df below 0.005. If the filler is not silane-treated, the melt viscosity at 120°C rises from approximately 1,200 Pa·s to above 4,000 Pa·s, and the cured Df increases by 0.001–0.002 due to interfacial polarization at filler-resin boundaries.
The dispersion process runs through a planetary mixer at 25–50 rpm for 30–45 min under vacuum at 50 mbar, followed by a three-roll mill with a 5–15 µm gap to break agglomerates. Laser diffraction particle analysis is used to verify that the filler D90 remains below 5 µm before coating; if the D90 exceeds 10 µm, the embedded filter line width varies by more than ±5 µm and the resonator center frequency shifts by 50–100 MHz. Panel lamination is conducted at 190–210°C and 40–55 kg/cm² for 90–120 min; after cure, embedded passive features are formed by subtractive etching and laser ablation. Air bubbles larger than 20 µm must be removed before lamination because they lower the breakdown voltage below 1 kV/mil and create point-field failure sites in high-power RF front-end modules. Compliance for the RF front-end module substrate includes IPC-TM-650 2.5.5.9 for Dk/Df, UL 94 V-0, REACH SVHC disclosure, and RoHS Directive 2015/863. The terminal product is an RF front-end module substrate with embedded filter cavities and couplers for 5G n77/n79 band radios.
Production-line records show that viscosity rise during three-roll milling is non-linear when the silane coupling agent is added too early in the mixing sequence. The coupling agent is therefore pre-hydrolyzed on the ceramic filler for 15–20 min before resin addition; reversing this sequence generates a 20–30% higher slurry viscosity after milling and increases roll wear from abrasive filler agglomerates. The same line requires a nitrogen blanket over the mixer headspace because the filler surface area exceeds 8 m²/g and adsorbed moisture can accelerate resin hydrolysis at 200°C during lamination.
Radome shells for 5G mmWave small cells are produced by vacuum-assisted resin infusion or resin transfer molding at 60–80°C, where the EM Tech modified hydrocarbon resin is added at 10–20 wt% of the resin formulation to lower viscosity and improve quartz glass fabric wet-out. The resin is combined with a cycloaliphatic epoxy or vinyl ester backbone and an internal release agent; at 60°C the mix viscosity must stay below 800 mPa·s to avoid dry spots in 3-layer 200 g/m² quartz fabric layups. The radome laminate must display a Df below 0.004 at 30 GHz and a water absorption below 0.2% after 24 h immersion per ASTM D570. Mechanical acceptance is tested under ASTM D3039 and ISO 527-4; tensile strength above 300 MPa and tensile modulus above 18 GPa are typical acceptance thresholds for glass-reinforced radome shells.
Post-cure is performed at 150–180°C for 2–4 h in a forced-air oven. The outer surface is treated with a hydrophobic topcoat to limit moisture ingress and ice adhesion; environmental qualification includes ASTM D4329 cyclic UV/B exposure and ASTM D5229 moisture aging for 2,000 h. Published data for this specific resin-filler combination at 30 GHz after 2,000 h UV aging is limited; qualification programs should therefore add a 30 GHz Df measurement before and after aging using a split-post dielectric resonator. The terminal product is a glass-reinforced radome shell for 5G mmWave small cells and fixed wireless access outdoor units.
| Requirement | Test method | Acceptance threshold |
|---|---|---|
| Dissipation factor at 30 GHz | Split-post dielectric resonator | ≤0.004 |
| Water absorption, 24 h immersion | ASTM D570 | ≤0.2% |
| Tensile strength, glass-reinforced laminate | ASTM D3039 | ≥300 MPa |
| Tensile modulus, glass-reinforced laminate | ISO 527-4 | ≥18 GPa |
| UV/B weathering | ASTM D4329 | No surface cracking after 2,000 h |
In the infusion process, the quartz fabric stack is held under a vacuum differential of 0.1–0.3 bar and the resin inlet pressure is kept below 0.5 bar to prevent fiber wash. The modified hydrocarbon resin tends to raise the resin mix viscosity by 150–250 mPa·s at 60°C when compared with an unmodified vinyl ester control, but the same addition reduces water absorption by 0.05–0.1 percentage point after 24 h immersion. This trade-off is managed by preheating the resin bath to 45°C and using a static mixer with a 16-element geometry ahead of the injection port; production records show that this configuration reduces void content below 1.5% in the cured radome shell.
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Modified Hydrocarbon Resin for 5G High-Frequency Materials, designated EM-Tech MHR-5G, is supplied in two grades: MHR-5G-300 and MHR-5G-500. The suffix denotes the midpoint of the ring-and-ball softening point range determined in accordance with ASTM E28-99. For MHR-5G-300, softening point is 125–145 °C, melt viscosity at 180 °C is 1,800–3,500 mPa·s, and glass transition temperature by differential scanning calorimetry is 85–110 °C. For MHR-5G-500, softening point is 145–165 °C, melt viscosity at 180 °C is 3,500–6,000 mPa·s, and glass transition temperature is 100–125 °C per ASTM D3418-21. Both grades are saturated aliphatic-aromatic copolymers with number-average molecular weight 800–1,200 g/mol and dispersity 1.5–1.8 as measured by size exclusion chromatography against polystyrene calibration. Residual polar volatiles are held below 0.03 % by weight after hydrogenation and thin-film devolatilization. Density at 25 °C is 1.02–1.06 g/cm³ per ASTM D792-20, and Cleveland open-cup flash point is above 250 °C per ASTM D92-18.
The product is intended as a low-loss hydrocarbon binder for copper-clad laminates, pre-impregnated glass fabrics, antenna radomes, and high-speed digital substrates operating in the 24.25–52.6 GHz range. In formulated plaques containing 30 wt% fused silica and 20 wt% chopped E-glass fiber, dielectric constant is 2.15–2.45 and dissipation factor is 0.0018–0.0024 at 10 GHz and 0.0022–0.0030 at 28 GHz, measured by split-post dielectric resonator per IEC 61189-2-721:2015 at 22 ± 2 °C and 50 ± 5 % RH after 48 h conditioning. These values distinguish the modified resin from unmodified C9 hydrocarbon resins, which typically exhibit dissipation factor values of 0.006–0.020 at 10 GHz under the same resonator conditions. The MHR-5G series does not require reactive end groups to achieve adhesion, avoiding the esterification side reactions associated with hydroxyl-terminated polybutadiene binders during high-temperature extrusion.
Unmodified C9 and C5 hydrocarbon resins retain residual unsaturation, acidic catalyst fragments, and a broad oligomer distribution. These structural features create dipolar relaxation at microwave frequencies and increase equilibrium moisture uptake. In a typical unfilled C9 resin, dissipation factor at 10 GHz ranges from 0.006 to 0.020 depending on aromatic content and moisture uptake. EM-Tech MHR-5G grades employ a saturated backbone and reduced polar end-group concentration, which lower dissipation factor below 0.003 under equivalent split-post test conditions. The difference is most pronounced after conditioning at 85 °C/85 % RH for 168 h. Conventional resins absorb 0.15–0.20 % moisture and shift dissipation factor by 0.004–0.008, while the modified resin absorbs 0.06–0.09 % moisture and shifts dissipation factor by less than 0.001.
| Property | EM-Tech MHR-5G-300 | EM-Tech MHR-5G-500 | Conventional C9 resin | Test method |
|---|---|---|---|---|
| Softening point | 125–145 °C | 145–165 °C | 90–120 °C | ASTM E28-99 |
| Melt viscosity at 180 °C | 1,800–3,500 mPa·s | 3,500–6,000 mPa·s | 500–2,000 mPa·s | ASTM D3236-19 |
| Dissipation factor at 10 GHz | 0.0018–0.0024 | 0.0020–0.0026 | 0.006–0.020 | IEC 61189-2-721:2015 |
| Dissipation factor at 28 GHz | 0.0022–0.0030 | 0.0024–0.0032 | 0.008–0.025 | IEC 61189-2-721:2015 |
| Water absorption after 168 h at 85 °C/85 % RH | 0.06–0.09 % | 0.06–0.09 % | 0.15–0.20 % | ASTM D570-22 |
| Thermal decomposition, 5 % weight loss | >380 °C | >380 °C | 320–360 °C | ASTM E1131-20 |
| Acid value | <0.5 mg KOH/g | <0.5 mg KOH/g | 0.5–2.0 mg KOH/g | ASTM D974-22 |
Compared with hydrogenated DCPD resins, the MHR-5G series has a narrower dispersity of 1.5–1.8 versus 2.0–3.0 for many hydrogenated DCPD grades. That narrower distribution reduces phase separation in polyphenylene ether blends and permits filler loading to increase by 10–15 wt% before melt viscosity exceeds 5,000 mPa·s at 180 °C. Broad-dispersity DCPD resins reach equivalent viscosity at 8–12 wt% lower filler loading. In addition, MHR-5G grades lack the high acid value and reactive vinyl groups that cause premature gelation in unsaturated aliphatic hydrocarbon binders. After 500 h at 150 °C in circulating air, yellowness index increases by less than 2 units per ASTM E313-20, compared with 8–15 units for unmodified C9 resin.
For melt compounding, MHR-5G-300 is pre-dried at 80 °C for 4 h in a desiccant dryer with dew point −40 °C when ambient relative humidity exceeds 60 %. Moisture content above 0.10 % at the die can generate microvoids in extruded strands and increase final laminate dissipation factor by 0.0005–0.0010. Compounding is performed on a co-rotating twin-screw extruder with L/D 44:1, 12-barrel configuration, vacuum venting at −0.08 MPa in barrel 10, and barrel temperatures of 240–280 °C in zones 2–8. The feed sequence introduces the resin after the primary polyphenylene ether melt seal to limit shear heating. At feed rates of 150–250 kg/h, melt flow rate variation between campaigns remains within ±10 %. Screw speeds above 600 rpm are not recommended; adiabatic temperature spikes above 300 °C initiate free-radical coupling and raise melt viscosity by 15–20 %, producing strand breakage and die-face build-up.
For pre-impregnated glass fabric, a solution impregnation route is preferred. The resin is dissolved in a 60:40 toluene/butanone blend at 30–40 wt% solids, applied to NE-glass fabric in a vertical treater at 25–35 % dry resin content by weight, and dried through a 3 m heated zone at 150–170 °C. Press lamination is conducted at 190–210 °C and 1.5–3.0 MPa for 90–120 min. Laminates filled with 45 wt% fused silica achieve dielectric constant 2.8–3.2 at 10 GHz and copper adhesion above 0.8 N/mm per IPC-TM-650 2.4.8 after thermal stress. In production-scale impregnation, resin viscosity below 1,800 mPa·s at 180 °C causes resin strike-through and uneven glass wetting, while viscosity above 6,000 mPa·s reduces treater line speed below 3 m/min and increases dry content variability beyond ±2 %.
Dielectric constant of MHR-5G-300 remains 2.15–2.45 from 10 GHz to 40 GHz when compounded with 30 wt% fused silica and 20 wt% chopped E-glass fiber. Dissipation factor does not drift by more than 0.0004 over the temperature range −40 °C to 120 °C. The saturated backbone and low polar end-group concentration reduce free-volume fluctuation and moisture dipole contribution. In contrast, unmodified DCPD resins often show dissipation factor increases of 0.003–0.006 over the same thermal interval because of higher moisture absorption and phase separation in polyphenylene ether blends. Laminate-level dielectric measurements are performed at 10 GHz using stripline test methods per IPC-TM-650 2.5.5.5.
Thermomechanical properties support the dielectric stability. Coefficient of linear thermal expansion below glass transition is 65–75 ppm/K and above glass transition is 150–180 ppm/K by ASTM E831-19. The filled system retains tensile strength of 12–16 MPa and elongation at break of 5–8 % on Type IV specimens per ASTM D638-14 at 23 °C. These values are lower than those of rubber-modified hydrocarbon binders, so radome thermoforming must be limited to draw ratios above 0.8 and part thickness above 2.0 mm to avoid microcracking.
Regulatory compliance is supported by a halogen-free design. The resin is formulated without intentionally added halogenated flame retardants or antimony trioxide. It meets REACH SVHC 0.1 % threshold under EC 1907/2006 and conforms to RoHS Directive 2011/65/EU Annex II substance restrictions for lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. The following compliance matrix applies to the MHR-5G series.
| Regulatory or test parameter | Standard/code | Reported value or status |
|---|---|---|
| REACH SVHC | EC 1907/2006 | Below 0.1 % w/w |
| RoHS | 2011/65/EU | Conforms to Annex II substance limits |
| Halogen content | IEC 61249-2-21 | Cl <900 ppm, Br <900 ppm, total <1500 ppm |
| Flame retardancy | UL 94 | Neat resin HB; V-0 achievable with phosphorus-based synergist at 12–18 phr |
Storage is specified in sealed containers at ≤40 °C and relative humidity below 60 %. Retest after 24 months for softening point and moisture. Freeze-thaw cycles should be avoided because condensation on cold resin increases moisture absorption. The resin is soluble in toluene, xylene, cyclohexane, and 60:40 toluene/butanone; it is insoluble in methanol and water. Acid value is held below 0.5 mg KOH/g, which maintains compatibility with metal foil adhesion promoters. However, amine-functional silane coupling agents above 0.5 phr raise dissipation factor and accelerate crosslinking during press lamination. Strong Lewis acid catalysts such as boron trifluoride complexes are incompatible at melt temperatures above 250 °C, where viscosity increase above 50 % within 10 min has been observed.
Formulations containing 45–55 wt% polyphenylene ether, 20–30 wt% MHR-5G-300, 25–35 wt% fused silica, and 0.5–2.0 phr antioxidant exhibit stable melt tension during extrusion coating. The MHR-5G series functions as a nonreactive diluent that reduces melt viscosity without increasing dielectric loss. However, replacement of vinyl-functional silane with amine-functional silane at levels above 0.5 phr raises dissipation factor by 0.002 at 10 GHz and shortens gel time at 200 °C by 30–50 s, leading to flow marks and interlaminar voids. Published data for this specific configuration is limited for 60 GHz antenna-in-package modules; therefore, resonator measurements on final laminates are required before qualification.
For antenna radome applications, the resin is combined with 20–30 wt% of a hydrogenated styrenic block copolymer and 10–20 wt% fused silica to provide a low-density dielectric layer. The unfilled resin has tensile strength of 12–16 MPa and elongation at break of 5–8 % per ASTM D638-14. The low elongation requires that part design avoid sharp corners and that thermoforming be conducted at draw ratios above 0.8. For high-speed digital backplane substrates, the resin is used at 15–25 wt% of the total organic binder to reduce viscosity during glass-fabric impregnation while maintaining copper adhesion above 0.8 N/mm after solder float at 288 °C for 10 s per IPC-TM-650 2.4.13.
Published data for long-term aging in 85 °C/85 % RH beyond 1,000 h is limited; extended qualification should include peel strength and dielectric loss after moisture exposure. The resin is not intended for direct food contact; compliance with FDA 21 CFR 177.1520 has not been established for this grade. For 60 GHz final-laminate qualification, the absence of a uniformly accepted resonator standard requires the use of both split-post and free-space methods to bound process variation.
