| HS Code | 787643 |
| Manufacturer | Mocom |
| Product Name | ALCOM ABS+SAN A 1000/100 SV2067-06MCF |
| Polymer Type | ABS/SAN Blend |
| Filler Reinforcement | Unfilled |
| Density | 1.05 g/cm3 |
| Linear Mold Shrinkage | 0.004-0.007 cm/cm |
| Melt Flow Rate | 11 g/10 min (220°C/10 kg) |
| Tensile Strength At Yield | 45 MPa |
| Tensile Elongation At Break | 15% |
| Flexural Modulus | 2300 MPa |
| Flexural Strength | 70 MPa |
| Charpy Notched Impact Strength | 12 kJ/m2 (23°C) |
| Vicat Softening Temperature | 98°C |
| Heat Deflection Temperature | 85°C at 1.8 MPa |
| Ul Flammability Rating | HB |
| Processing Method | Injection Molding |
As an accredited Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF is packaged in 25 kg moisture-resistant bags, palletized for industrial storage and transport. |
| Container Loading (20′ FCL) | 20′ FCL loading: Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF in 25 kg bags, palletized, dry container, dunnage-secured for export. |
| Shipping | Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF is shipped as dry thermoplastic granules in sealed, moisture-proof bags or octabins. Transport in clean, dry vehicles; protect from moisture, heat, UV, and ignition sources. Store in a cool, dry, ventilated area. Not classified as dangerous goods under standard packaging. |
| Storage | Store Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF in a cool, dry, well-ventilated area, away from direct sunlight, heat, sparks, and flames. Keep containers or bags tightly closed and palletized to prevent moisture pickup and contamination. Avoid prolonged storage above recommended temperatures. Follow the supplier’s safety data sheet and local regulations for handling and storage. |
| Shelf Life | Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF typically has a 24-month shelf life when stored dry in unopened original packaging at 10–30°C. |
In SMT matrix-tray production, the ALCOM ABS+SAN A 1000/100 SV2067-06MCF compound is processed as a ready-to-mould, 6 wt% milled-carbon-fibre ABS/SAN material. The filler reduces surface resistivity into the static-dissipative range between 1×104 Ω and 1×109 Ω when tested according to IEC 62631-3-2:2016, while the ABS/SAN alloy provides lower thermal expansion than unfilled ABS and permits tray cell-wall thicknesses down to 0.5 mm with acceptable stiffness. The production route is high-speed injection moulding in 16-cavity to 64-cavity tools equipped with hot-runner valve gates; the recommended melt temperature is 240 °C to 260 °C, mould temperature is 60 °C to 80 °C, and clamping force is held at not less than 4.5 kN/cm² of projected part area. The formulation is introduced at 100 wt% virgin compound; regrind from sprues and runners is limited to 15 wt% of shot mass, and parts thinner than 1.2 mm require a 10 wt% regrind cap because fibre attrition alters aspect ratio and creates local surface-resistivity drift. Drying in a desiccant dryer at 80 °C for 2 h to 4 h until residual moisture is below 0.05 wt% according to ISO 15512:2019 is mandatory when storage relative humidity exceeds 60% RH; failure to maintain this boundary produces splay and weld-line charring that can raise local surface resistivity above 1×109 Ω. Terminal finished products are JEDEC Publication 95 outline SMT matrix trays, PCB transfer racks, ESD tote-bin shells, and semiconductor packaging trays used in assembly lines certified to ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016.
Thin-wall telecommunication rack covers and industrial instrumentation enclosures place the highest regrind constraint because carbon fibre attrition is amplified by high screw-recovery speeds and narrow gates. In this scenario, the blend ratio is held at 88 wt% virgin compound to 12 wt% regrind; at 15 wt% regrind, the flow front has been observed to split around pin gates in tools with 0.8 mm to 1.0 mm gate diameter and then re-weld with statistically higher surface resistivity. Melt temperature is kept at 250 °C to 260 °C, mould temperature at 70 °C to 90 °C, and injection speed at 120 mm/s to 200 mm/s to avoid premature jetting. The manufacturing route uses direct sprue gating or edge gates with a land length below 1.0 mm; vent depth from 0.02 mm to 0.03 mm is critical to prevent gas entrapment. When fire-enclosure performance is invoked, the grade is normally evaluated to UL 94 HB at the relevant part thickness; it is not promoted as a V-0 solution, and the product-specific UL Yellow Card should be confirmed. The relevant safety specification is IEC 62368-1:2023 for audio/visual, information and communication technology equipment, while static-dissipative performance is verified under IEC 61340-5-1:2016 using IEC 62631-3-2:2016; RoHS 2011/65/EU and REACH 1907/2006 documentation is required for EU distribution. Finished components include telecommunications rack covers, industrial automation display bezels, portable analyser shells, and wall-mount control boxes with wall thickness from 1.2 mm to 2.0 mm.
Automotive sensor handling trays and powertrain assembly racks manufactured from the same 6 wt% milled-carbon-fibre ABS/SAN compound are produced under IATF 16949:2016 process control rather than general commercial ESD packaging control. The formulation addition is 100 wt% prime compound with regrind capped at 10 wt% because automotive customers frequently require lot-to-lot surface-resistivity traceability below 1×108 Ω; higher regrind fractions widen the resistivity distribution beyond the acceptance window. The process employs multi-cavity injection moulding with sequential valve gating to relocate weld lines away from tray cell corners; melt temperature is 245 °C to 260 °C and mould temperature is 60 °C to 80 °C. Post-mould surface resistivity is measured on parts at 12% RH after 48 h conditioning per ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016, and the parts are marked according to ISO 11469:2016. Terminal product types are camshaft position sensor trays, throttle-body subassembly trays, ECU transport shells, and PCB module racks.
| Application scenario | Primary compliance anchor | ESD/resistivity test method | Regrind upper limit |
|---|---|---|---|
| SMT matrix trays | ANSI/ESD S20.20-2021 | IEC 62631-3-2:2016 | 15 wt% |
| Thin-wall telecom enclosures | IEC 62368-1:2023 | IEC 61340-5-1:2016 | 12 wt% |
| Automotive sensor trays | IATF 16949:2016 | ANSI/ESD S20.20-2021 | 10 wt% |
| ESD workbench fixture panels | IEC 61340-5-1:2016 | IEC 61000-4-2:2008 | 15 wt% |
| Semiconductor packaging | ANSI/ESD S541-2018 | IEC 61340-5-1:2016 | 10 wt% contact layer |
| Thin-wall card-reader panels | IEC 62368-1:2023 | IEC 62631-3-2:2016 | 0 wt% Class A surfaces |
Static-dissipative test fixture panels and workbench housings require the tightest residual-moisture control because carbon fibre can mask high moisture levels until hydrolytic degradation causes part surface blistering and brittleness after 3 months to 4 months of field use. The compound is dried at 80 °C to 85 °C for 3 h to 4 h to less than 0.05 wt% residual moisture; melt residence time is limited to 8 min at melt temperatures above 260 °C, beyond which the butadiene phase of the ABS/SAN matrix initiates thermo-oxidative yellowing and surface resistivity drifts upward. The formulation is run at 100 wt% virgin material; regrind up to 15 wt% is acceptable if ground parts are sieved to below 5 mm and regrind moisture is rechecked. Injection moulding is performed on vertical-clamp units with C-frame tools for fixture panels; a mould temperature of 60 °C to 80 °C and hold pressure of 50 MPa to 70 MPa are standard. The terminal products are test fixture top plates, ESD workbench carcasses, and ATE enclosure covers certified to IEC 61340-5-1:2016 and tested to IEC 61000-4-2:2008 for electrostatic discharge immunity.
When solvent-free ESD packaging for semiconductor subassemblies is produced, the formulation is restricted to 100 wt% virgin compound for component-contact surfaces because any regrind above 10 wt% introduces microscopic carbon fibre fragments onto the sealing surface, which can transfer to polycarbonate chip trays. Drying at 80 °C for 3 h is maintained before moulding; injection moulding takes place with melt temperature 250 °C to 260 °C and mould temperature 65 °C to 80 °C in tools with undercuts and slides to produce lid-and-base interlock features. Compliance is anchored to ANSI/ESD S541-2018 for ESD packaging and to IEC 61340-5-1:2016 for protected-area cleaning; RoHS 2011/65/EU and REACH 1907/2006 conformity is required for EU placement. Terminal forms are semiconductor component carrier reels, BGA matrix tray lids, and device-nesting assemblies.
Thin-wall office-automation panels and card-reader chassis made from the milled-carbon-fibre grade reach a processing gate where fibre orientation is governed more by gate geometry than by melt temperature. Below 1.0 mm wall thickness, the recommended gate type converts from a single edge gate to a corner diaphragm gate or fan gate because fibre alignment along the flow direction creates high in-plane shrinkage anisotropy and long-edge warp of up to 2.5 mm on a 180 mm span when measured after 24 h of post-mould conditioning at 23 °C and 50% RH according to ISO 291:2008. Published data for this specific configuration is limited, so the stated warp threshold should be verified on a production-representative tool before cutting steel. The production process uses high-speed electric injection moulding machines with injection speeds of 200 mm/s to 250 mm/s; melt temperature is maintained at 255 °C to 265 °C, mould temperature at 70 °C to 90 °C, and no regrind is used for Class A external surfaces. Compliance for the terminal products is evaluated against IEC 62368-1:2023 for card-reader enclosures and IEC 61340-5-1:2016 for static dissipation; paint adhesion testing follows ISO 2409:2020 for subsequent UV-cured topcoats. The finished products are payment terminal outer shells, access-card reader frames, office printer inner static control panels, and document feeder frames.
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Mocom ALCOM ABS+SAN A 1000/100 SV2067-06MCF is an amorphous thermoplastic compound in which an acrylonitrile-butadiene-styrene matrix is combined with a styrene-acrylonitrile copolymer. The alphanumeric segment A 1000/100 identifies the base compound series and flow classification. The suffix SV2067-06MCF designates a specific color and formulation variant within the Mocom ALCOM color system. The material is supplied as pellets and is differentiated from natural ABS/SAN grades by pre-compounded pigmentation. Pre-compounded color eliminates press-side masterbatch dosing but narrows the residence-time and shear limits during melt preparation.
Lot-specific datasheets control the release values for density, melt volume-flow rate, tensile properties, impact resistance, and heat deflection. Public reproduction of certified values for this exact color formulation is limited. The following treatment uses standardized test methodologies and the documented performance envelope of unfilled ABS/SAN blends. Where product-specific data are not published, that absence is stated rather than filled with unverified values.
Moisture management is the principal process constraint. The compound is dried in a desiccant dryer at 80 °C for 2 h to 4 h. The air dew point should be no higher than -20 °C, and the residual moisture target is below 0.02 wt%. Moisture above this threshold hydrolyzes the SAN phase during plastication and produces splay, silver streaks, and gloss reduction on part surfaces. In hopper dryers with long static residence, extended exposure above 4 h may induce yellowing and color drift in the SV2067-06MCF formulation. Karl Fischer titration is preferred over loss-on-drying for moisture verification.
Melt temperatures at the nozzle should be maintained between 220 °C and 250 °C. Barrel profiles typically descend from 210 °C in the feed zone to 240 °C in the metering zone. Mold temperature is controlled between 40 °C and 80 °C, with the upper half of this range improving weld-line strength and surface replication at the cost of cycle time. A general-purpose screw with an L/D ratio of 20:1 to 25:1 and a compression ratio of 2.0:1 to 2.5:1 is adequate for homogeneous melt preparation.
Rheological characterization under ISO 1133-1:2022 is commonly reported as melt volume-flow rate. For unfilled ABS/SAN grades in the A 1000/100 flow class, public literature places MVR values between 18 cm³/10 min and 26 cm³/10 min at 220 °C and 10 kg. Shear viscosity decreases with increasing shear rate. The melt elasticity of ABS/SAN is lower than that of high-rubber ABS, which reduces die swell and improves dimensional stability in thin-wall filling but also limits melt strength in blow molding and thick-wall profile extrusion.
Specimen preparation follows ISO 294-1:2017 and ISO 20753:2018. Tensile testing is conducted to ISO 527-2:2012, flexural testing to ISO 178:2019, and notched Charpy impact testing to ISO 179-1:2010. For unfilled ABS/SAN blends, tensile modulus is generally reported between 2,300 MPa and 2,700 MPa; tensile yield stress is typically 40 MPa to 50 MPa; elongation at yield is below 3%. Notched Charpy impact at 23 °C is usually between 8 kJ/m² and 15 kJ/m². The SV2067-06MCF color package may shift these values downward relative to natural compound, particularly in impact properties, so the manufacturer’s color-specific datasheet must be used for design calculations.
The product occupies an intermediate position. Compared with unmodified SAN, the ABS fraction improves crack initiation resistance and notched impact. Compared with impact-modified ABS, the SAN-rich blend generally exhibits higher surface hardness, lower rubber-phase deformation, and reduced notched impact. Compared with PC/ABS, the ABS+SAN system has lower Vicat softening temperature and lower multi-axial toughness, but it offers easier flow and lower compound cost in non-structural housings. Compared with ASA, the ABS+SAN system has poorer long-term outdoor gloss retention because the butadiene phase undergoes photo-oxidation; unpainted exterior parts are outside the normal application boundary.
Vicat softening temperature under ISO 306:2022 method B50 for unfilled ABS/SAN blends is commonly reported between 95 °C and 105 °C. Heat deflection temperature under ISO 75-2:2013 method B is typically 5 K to 10 K lower. Continuous use above 80 °C in load-bearing geometries should be validated by creep and thermomechanical testing rather than by single-point heat deflection data.
| Material family | Tensile modulus | Notched Charpy at 23 °C | Vicat B50 | Primary limitation |
|---|---|---|---|---|
| SAN | 3,400 MPa to 3,700 MPa | 2 kJ/m² to 3 kJ/m² | 100 °C to 108 °C | Low impact strength |
| Medium-impact ABS | 1,900 MPa to 2,400 MPa | 15 kJ/m² to 30 kJ/m² | 95 °C to 105 °C | Higher formulation cost than SAN |
| ABS+SAN A 1000/100 | 2,300 MPa to 2,700 MPa | 8 kJ/m² to 15 kJ/m² | 95 °C to 105 °C | Limited UV resistance |
| PC/ABS | 2,200 MPa to 2,600 MPa | 40 kJ/m² to 60 kJ/m² | 120 °C to 130 °C | Higher melt viscosity |
| ASA | 2,100 MPa to 2,500 MPa | 10 kJ/m² to 20 kJ/m² | 95 °C to 105 °C | Cost and availability |
Color-specific processing constraints are more severe for the SV2067-06MCF designation than for natural resin. Pre-compounded color eliminates lot-to-lot metering variation associated with press-side masterbatch, but it also means that excessive shear can damage pigment dispersion and create visible streaking. Screw surface speed should be limited to approximately 0.3 m/s, and hydraulic back pressure should be held between 5 MPa and 10 MPa. If the formulation contains effect pigments, the supplier’s recommended screw geometry and gate size should be followed; abrupt transitions and small gates increase shear heating and may produce flow marks.
Application selection for this grade is restricted to indoor, non-load-bearing and low-to-moderate thermal environments. Representative uses include appliance bezels, personal care housings, office equipment covers, consumer electronics enclosures, and light-duty automotive interior trim that is not exposed to direct sunlight. The material is not specified for safety-critical structural components, underhood parts, or unpainted exterior panels because the butadiene phase and the SAN matrix do not provide long-term UV stability or continuous-load creep resistance at elevated temperature.
The butadiene phase and SAN phase respond differently to chemical environments. Aromatic hydrocarbons, chlorinated hydrocarbons, esters, and ketones are aggressive toward ABS/SAN systems and should not be used as cleaning agents or process aids. Mineral oils, plasticizers, and certain citrus-based cleansers can reduce notched impact and promote environmental stress cracking. Chemical compatibility should be evaluated under constant tensile load or bent strip methods described in ISO 22088-2:2006 and ISO 22088-3:2006. Mold-release agents and assembly greases must avoid phthalate and cinnamate derivatives that plasticize the SAN matrix.
The grade must be evaluated against substance-control obligations before shipment into end markets. Compliance is established through supplier declarations rather than through the polymer chemistry alone. The table summarizes the threshold documents that processors commonly request for ABS/SAN compounds.
| Requirement | Standard or directive | Boundary condition |
|---|---|---|
| RoHS restricted substances | Directive 2011/65/EU Annex II | Lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE below maximum concentration values; supplier declaration required. |
| REACH SVHC communication | EU 1907/2006 Article 33 | Candidate list substances above 0.1 wt% trigger duty to communicate; grade-specific confirmation required. |
| Food-contact suitability | FDA 21 CFR 181.32 or relevant national migration standard | Applicable only to specified repeat-use conditions and end-use food types; not an automatic property of the compound. |
| Flame classification | IEC 60695-11-10, UL 94 | Unfilled ABS/SAN grades generally require flame-retardant modification to achieve V-1 or V-0; end-use thickness and color influence classification. |
| Density | ISO 1183-1:2019 | Unfilled ABS/SAN blends are commonly reported at 1.06 g/cm³ to 1.08 g/cm³. |
Production-scale experience with precolored ABS/SAN compounds identifies gate blush, jetting, and weld-line weakness as recurring defects. Gate blush occurs when injection velocity is too high at small gate cross-sections; reducing velocity or increasing gate diameter is more effective than raising mold temperature alone. Jetting is minimized by positioning the gate so that the melt stream interrupts against a cavity wall. Weld-line strength in effect-pigmented grades is lower than in unfilled natural compound; weld lines should be positioned away from structural or impact-loaded regions. On injection molding machines with clamp force between 800 kN and 4,000 kN, shot size should be between 20% and 80% of barrel capacity to avoid long residence time. At melt temperature, residence time should not exceed 8 min. On hot-runner systems, internally heated nozzles require temperature overshoot protection. Local hot spots above 260 °C produce black specks and color drift. Purging after the run should use SAN or acrylic-based purge compound; PVC and acetal purges are incompatible because their degradation products can corrode hot-runner components and contaminate the melt stream.