| HS Code | 429734 |
| Dielectric Constant Dk At 10ghz | 3.0-3.3 |
| Dissipation Factor Df At 10ghz | 0.0015-0.0020 |
| Glass Transition Temperature Tg | >200°C |
| Moisture Absorption | <0.05% |
| Copper Peel Strength | 0.8-1.0 N/mm |
| Thermal Decomposition Temperature Td 5 | >400°C |
| Melt Viscosity At 200 C | 500-1500 mPa·s |
| Softening Point | 120-140°C |
| Weight Average Molecular Weight Mw | 3000-8000 |
| Halogen Content | Halogen-free |
| Specific Gravity | 1.02-1.05 |
| Coefficient Of Thermal Expansion Cte | <40 ppm/°C |
As an accredited M6-M9 Low-Loss Hydrocarbon Resin for AI Server CCL - Shengquan Group factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaging: 25 kg per moisture-proof multi-walled paper bag with PE liner, for M6-M9 Low-Loss Hydrocarbon Resin. |
| Container Loading (20′ FCL) | 20′ FCL loading of M6-M9 Low-Loss Hydrocarbon Resin, packed in drums on pallets, securely stowed for safe, efficient transport to AI server CCL manufacturers. |
| Shipping | M6-M9 Low-Loss Hydrocarbon Resin ships as non-hazardous solid pellets in sealed multi-layer bags with moisture-proof lining. Store in dry, ventilated area away from heat and oxidizers. Standard dry-container transport works; avoid extreme temperatures. Ensure proper labeling and handling to prevent contamination. |
| Storage | Store in a cool, dry, well-ventilated area away from direct sunlight, heat sources, and open flames. Keep the container tightly sealed to prevent moisture absorption and contamination. Maintain temperatures between 5–35°C. Avoid prolonged exposure to air. Under recommended conditions, shelf life is typically 12 months from manufacture date. |
| Shelf Life | Shelf life is 12 months from production date when stored sealed in a cool, dry place. |
In AI accelerator baseboard CCL production, the choice of low-loss hydrocarbon resin governs in-plane expansion behavior and the 10 GHz dissipation factor that ultimately determine via reliability and signal integrity in 18–24 layer boards; Shengquan Group’s M6–M9 low-loss hydrocarbon resin is typically compounded at 14–18 phr relative to the thermoset resin solids, with the lower bound applied to M6-grade formulations targeting a dielectric constant (Dk) of 3.6–3.8 and the upper bound applied to M9-grade formulations targeting a dissipation factor (Df) no greater than 0.0035 at 10 GHz. The compliance file for this segment includes IPC-4101E high-speed low-loss laminate requirements, UL 94 V-0 vertical burn rating, and IEC 61249-2-35 halogen-free laminate chemistry limits; dielectric properties are verified according to IPC-TM-650 2.5.5.9, glass transition temperature by IPC-TM-650 2.4.24.1, and moisture absorption by IPC-TM-650 2.6.2. Downstream, the resin is delivered as solid flake or prill and is pre-dissolved in a mixed aromatic/ketone solvent system at 25–35 % solids before being combined with precipitated silica, curing agents, and flame-retardant additive packages in a high-shear disperser; the varnish is then impregnated into low-profile E-glass fabric on a horizontal treater with staged zones from 80 °C to 160 °C to achieve resin content of 52–58 % in the prepreg. Lamination of the accelerator baseboard stack is performed in vacuum-assisted hydraulic presses at 190–210 °C and 2.4–3.1 MPa using a cure cycle of 180–240 min, after which the resulting CCL is subjected to inner-layer patterning, oxide treatment, and multilayer lamination. Terminal products are AI accelerator baseboards and universal baseboard assemblies for graphics-processor and custom AI accelerator sleds; a documented production boundary occurs at resin loadings above 18 phr, where prepreg tack decreases and lay-up defects increase unless the treater speed is reduced and the cooling section is held at 18–25 °C with 35–50 % RH.
When the target application shifts from accelerator baseboards to 800G switch fabric backplanes operating on 112 Gb/s SerDes lanes, the applicable laminate grade moves toward M9-class dielectric performance, and Shengquan Group’s hydrocarbon resin is formulated at 22–26 phr in the varnish solids to reduce the dissipation factor to ≤0.0030 at 10 GHz; this addition level is intentionally higher because the resulting dielectric must preserve the channel loss envelope referenced in IEEE 802.3df for high-speed copper backplane attachment. The material compliance matrix includes IPC-4101E low-loss rigid laminate categories, UL 94 V-0, and IEC 61249-2-35; dielectric test data is generated using IPC-TM-650 2.5.5.9, while thermal decomposition and cure completeness are checked with IPC-TM-650 2.4.25 and 2.4.24.1. In downstream processing, the filled varnish is coated onto ultra-low-profile glass fabric in a horizontal treater, but the higher resin loading narrows the drying window: treater zones must be held at 85–155 °C with a residual solvent target of ≤0.5 %, because residual methyl ethyl ketone above 0.5 % produces voiding during subsequent press cycles. Backplane laminates with 28–36 layers are pressed at 200–215 °C and 2.8–3.4 MPa, with a vacuum level of ≤5 kPa maintained during heat-up; after lamination, high-aspect-ratio drill holes of 0.25–0.35 mm are processed through plasma desmear using a CF4/O2 gas mixture, followed by electroless copper seed deposition and high-throw acid copper plating on a vertically conveyed electroplating line. The terminal products are 800G switch fabric backplanes and line cards used in AI cluster spine and leaf switches; a measurable boundary is observed above 26 phr, where peel strength on low-profile copper foil drops below 0.8 N/mm as measured by IPC-TM-650 2.4.8, and the desmear step must be extended to remove smeared hydrocarbon-rich resin from laser-drilled blind vias.
Single-phase immersion cooling subjects the laminated board to continuous contact with polyalphaolefin or synthetic ester dielectric fluid at 45–65 °C, which imposes two constraints on the CCL: the cured resin must resist plasticization from the fluid, and equilibrium moisture absorption must remain low enough to prevent electrochemical migration on powered conductors. In this segment, Shengquan Group’s M6–M9 low-loss hydrocarbon resin is incorporated at 10–14 phr into a halogen-free thermoset matrix, a lower window than M9 backplane applications because the priority shifts from minimum dielectric loss to long-term solvent resistance under sustained thermal load; the ratio is set by screening cured coupons in immersion fluid per ASTM D543 for mass and thickness change, with acceptance limits of ≤0.5 % change after 500 h at 60 °C. The compliance envelope references IPC-4101E for rigid laminate base properties, UL 94 V-0 for flammability, IEC 61249-2-35 for halogen-free composition, and IPC-TM-650 2.6.2 for moisture absorption; thermal cycling performance is additionally screened per IEC 60068-2-14 between -40 °C and 125 °C for 1,000 cycles, because single-phase immersion systems may still encounter startup and shutdown thermal gradients. Downstream production uses the same horizontal treater and vacuum press route, but the prepreg resin content is held between 48–54 % and the cure cycle is extended by 20–30 min at 190–210 °C to reduce unreacted low-molecular-weight species that could leach into the dielectric fluid; after lamination, the boards are routed into immersion tank-compatible panels and subjected to a post-cure bake at 160 °C for 2 h before shipment. Terminal parts are single-phase immersion server motherboard and power-plane assemblies used in AI compute racks that operate without air-cooled heat sinks; published data for long-term fluid compatibility with this specific resin system is limited beyond the 500 h screening point, so field qualification for 5-year immersion service remains a boundary condition for process engineers.
When the same hydrocarbon resin is pushed to 18–22 phr in HDI mezzanine and riser CCL for AI rack-scale node interconnects, blind via reliability no longer correlates with dielectric loss alone and becomes a function of Z-axis expansion control through sequential lamination cycles. The addition range is selected to achieve dielectric constant ≤3.7 and dissipation factor ≤0.0038 at 10 GHz while retaining sufficient copper peel strength for ≤0.4 mm pitch routing on low-profile copper foil; the upper boundary at 22 phr is set by Z-axis coefficient of thermal expansion measurements on cured laminates, where values above 55 ppm/°C between 23 °C and 150 °C increase the probability of blind via corner cracking in reflow assembly. Industry compliance for this HDI segment is governed by IPC-4101E high-speed laminate requirements, IPC-6012 rigid printed board qualification, UL 94 V-0, and IEC 61249-2-35 halogen-free limits, with dielectric properties measured by IPC-TM-650 2.5.5.9, moisture uptake by IPC-TM-650 2.6.2, and glass transition temperature by IPC-TM-650 2.4.24.1. Downstream production begins with a thin core laminate treated with the resin at 18–22 phr through the horizontal treater; the core is then processed through UV laser and CO2 laser drilling to form 75–100 µm blind vias, followed by a plasma desmear step using a CF4/O2 ratio of 80:20 and a high-throw electroless copper bath. Sequential lamination of additional resin-coated copper layers is performed at 190–200 °C and 2.0–2.6 MPa with a vacuum level below 8 kPa; after final lamination, the HDI panel is subjected to thermal stress per IPC-TM-650 2.6.8 on representative coupon specimens. Terminal finished products are HDI riser cards, mezzanine trampoline modules, and rack-level slimline interconnect boards used in AI server racks; production records show that resin loadings beyond 22 phr reduce glass fabric wet-out in thin prepregs, requiring a reduction in treater line speed to ≤6 m/min to prevent dry-fabric streaks.
Forty-eight-volt power distribution boards inside AI server racks rely on CCL with elevated comparative tracking index and flame resistance rather than the lowest possible dielectric loss; Shengquan Group’s hydrocarbon resin is therefore incorporated at a reduced loading of 8–12 phr to limit the amount of combustible hydrocarbonaceous material in the cured laminate while still suppressing moisture uptake to below 0.12 % as measured by IPC-TM-650 2.6.2. The applicable compliance framework is IPC-4101E for rigid base materials, UL 94 V-0, and halogen-free composition per IEC 61249-2-35, with comparative tracking performance verified using IEC 60112 on the finished power assembly. The production route differs from high-speed signal CCL mainly in filler and cure formulation: the resin is compounded with a high fraction of silane-treated silica at a varnish solids of 60–65 %, coated onto medium-profile E-glass fabric on a horizontal treater with staged drying zones at 85–155 °C, and pressed into laminates at 190–210 °C and 2.0–2.8 MPa. Terminal products are 48 V busbar carrier boards, power shelf distribution panels, and DC/DC converter mounting boards used in AI rack power delivery networks.
Thermal oxidative stability of M6–M9 hydrocarbon resin CCL becomes the dominant qualification metric when the finished laminate is intended for 400 W GPU node motherboards that see continuous 90–110 °C local board temperatures beneath the processor package. In this segment, the resin is formulated at 12–16 phr, an intermediate loading that balances the need for a dissipation factor below 0.0038 at 10 GHz with the need to minimize thermo-oxidative chain scission of the hydrocarbon backbone over a service life that can exceed 60,000 h in data hall operation. The compliance envelope references IPC-4101E for base laminate performance, UL 94 V-0 flammability, IEC 61249-2-35 halogen-free chemistry, and the relevant thermal methods are IPC-TM-650 2.4.24.1 for glass transition, IPC-TM-650 2.4.25 for cure degree and thermal decomposition, and IPC-TM-650 2.6.2 for moisture absorption; long-term aging is screened by exposing coupons to circulating air ovens at 150 °C for 1,000 h and then re-measuring dissipation factor at 10 GHz to confirm that the increase remains below 0.0005. In downstream CCL production, the prepreg resin content is held at 50–56 % on the horizontal treater and the press cycle uses a staged ramp to 200–210 °C with a vacuum plateau of ≤4 kPa; after lamination, the inner-layer panels are etched, black-oxidized, and then sent through multilayer pressing for 14–18 layer mainboard stacks. Assembly of the terminal product involves lead-free reflow with a peak temperature of 245–260 °C for 2–3 cycles, and the cured laminate must retain ≥80 % of its initial flexural strength as measured by IPC-TM-650 2.4.4 after thermal aging. Terminal finished products are 400 W GPU node motherboards and artificial intelligence server board assemblies; an operational boundary is observed when resin addition drops below 12 phr, at which point the glass transition temperature can decline by 5–8 °C and the aged loss tangent may exceed the 0.004 threshold for production acceptance.
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For copper-clad laminates in artificial-intelligence server backplanes, accelerator daughtercards, and 800G Ethernet switch fabric, Shengquan Group supplies the M6-M9 low-loss hydrocarbon resin series as a curable binder for halogen-free prepreg and core formulations. The model range comprises M6, M7, M8, and M9, differentiated by melt viscosity at 150 °C, crosslink density after lamination, filler acceptance in varnish, and dielectric loss at 10 GHz. In typical CCL varnish work, the resin is blended with low-Dk epoxy or poly(phenylene ether) at 20–45 wt% of resin solids and filled with spherical silica at 65–72 wt%. The resulting laminates exhibit relative permittivity of 2.4–2.6 and loss tangent of 0.0015–0.0030 at 10 GHz measured according to IPC-TM-650 2.5.5.13; these are screening values typical of the hydrocarbon resin class, and current Shengquan datasheets should be consulted for grade-specific release limits.
Low dielectric loss arises from the saturated, low-polarity hydrocarbon backbone, which limits dipole orientation losses relative to bisphenol-A epoxy networks. The higher-numbered grades increase aromatic/alicyclic ratio and reactive unsaturation, raising cured storage modulus while narrowing the flow window. Neat resin viscosity in cyclohexanone at 40% solids is 40–120 mPa·s at 25 °C on a Brookfield LV DVNext viscometer with LV-4 spindle at 30 rpm. At 150 °C, M6 melt viscosity is 0.8–1.2 Pa·s, while M9 shifts to 2.0–3.5 Pa·s; the higher viscosity reduces resin squeeze-out during vacuum lamination of thick, high-layer-count panels.
In prepregging, the varnish is applied to 1080 or 2116 E-glass fabric at a dry resin thickness of 60–80 µm, then B-staged at 140–155 °C for 90–120 s. Residual solvent after B-staging is held below 0.5 wt% by headspace gas chromatography. Prepreg resin flow at 171 °C and 100 psi ranges from 18% to 34%, depending on grade; this parameter controls thickness variation in final laminates.
Grade selection is driven by signal-loss budget and layer count. M6 is used where an existing epoxy-PPE system already meets Df near 0.0030 but requires lower moisture uptake and better filler loading stability. M7 and M8 shift the Df floor toward 0.0020 and 0.0018, respectively, while M9 is intended for ultra-low-loss cores and prepregs in 3.2–4.0 mm thick backpanels where 28 GHz NRZ or 112 Gb/s PAM4 signaling constrains design margin. The practical boundary is not solely dielectric: M9 requires a higher lamination temperature for full conversion and exhibits higher cured modulus, which affects drilling smear control and desmear dwell time.
| Grade | Melt viscosity at 150 °C (Pa·s) | Dk at 10 GHz | Df at 10 GHz | Filler acceptance (wt%) | Gel time at 171 °C (s) |
|---|---|---|---|---|---|
| M6 | 0.8–1.2 | 2.55–2.60 | 0.0028–0.0030 | 68–70 | 180–240 |
| M7 | 1.0–1.6 | 2.50–2.55 | 0.0022–0.0025 | 69–71 | 160–210 |
| M8 | 1.4–2.2 | 2.45–2.50 | 0.0018–0.0022 | 70–72 | 140–190 |
| M9 | 2.0–3.5 | 2.40–2.45 | 0.0015–0.0018 | 70–72 | 120–160 |
On a production-scale CCL treater with a comma-roll gap of 150–220 µm and line speed of 4–8 m/min, the M6-M9 varnish maintains stable wet-out while viscosity is held between 60 mPa·s and 110 mPa·s. Above 120 mPa·s, the 1078 and 1080 fabric edges show microvoids after B-staging, not from bulk dewetting but from capillary starvation at glass-filament boundaries. The observed correction on pilot lines is reduction of filler top-size from 5 µm to 1.5 µm, rather than higher solvent addition. For M9 formulations, the lower resin flow at 171 °C requires a 10–15% reduction in prepreg resin content to prevent squeeze-out and control laminate thickness variation within ±8 µm.
Filler dispersion is a further critical threshold. In a high-shear disperser with tip speed 8–12 m/s, the 68–72 wt% silica slurry in M6-M9 varnish reaches a Hegman grind of 7 after 30 min at 25 °C. Extending dispersion beyond 45 min does not improve laminate Df but raises varnish temperature to 40–45 °C, shortening pot life and increasing viscosity drift from 3% to 8% over 8 h. Slurry filtration through 10 µm absolute polypropylene cartridges is required to remove agglomerates that become drill-bit hotspots in 0.25 mm microvias. The hydrocarbon matrix has lower hydrogen bonding than epoxy, so silane coupling agents such as methacryloxypropyltrimethoxysilane at 0.3–0.8 wt% of filler are necessary to maintain copper peel adhesion above 0.7 N/mm; silane levels above 1.0 wt% plasticize the interface and reduce solder shock resistance.
In a 24-layer stack-up with 3.6 mm final thickness, substitution of M6 by M9 changes the vacuum lamination cycle. A press with 500-ton clamping force and 200 °C platen setpoint is used; pressure is held at 0.7 MPa for the first 20 min, then raised to 2.5 MPa only after the centre ply reaches 160 °C. Applying full pressure before the centre reaches 150 °C produces glass-fabric strike-through and core-edge resin starvation. Because M9 has lower flow, air entrapment at 5–8 µm copper foil roughness below Rz 4 µm increases unless vacuum is maintained below 5 kPa absolute during the first 30 min of cure. After lamination, the M9-containing core typically shows Df of 0.0016–0.0018 at 10 GHz, compared with 0.0028–0.0030 for M6, when measured by IPC-TM-650 2.5.5.13.
Compared with DCPD-based hydrocarbon resins, the M6-M9 series exhibits lower melt viscosity at equivalent loss tangent, but the cured network is less flexible. Copper peel strength on roughened HTE copper is typically 0.7–0.9 N/mm, lower than the 1.0–1.2 N/mm typical of toughened epoxy systems under IPC-TM-650 2.4.8 after thermal stress. Compared with cyanate ester or polyphenylene ether homopolymers, the hydrocarbon resin lowers varnish cost but does not reach the 0.0010 Df tier; therefore M9 is usually blended with PPE at 30–50 wt% of resin solids to achieve 0.0015–0.0018. The hydrocarbon resin also shows lower moisture absorption than bisphenol-A epoxy: 0.06–0.09% after 24 h at 23 °C per ASTM D570-22, which supports stable insertion loss under 85 °C/85% RH biased humidity testing.
To reduce M9 brittleness, formulators add 5–10 phr of hydrogenated styrene-butadiene block copolymer or maleated polybutadiene. Addition of 10 phr SEBS lowers cured flexural modulus from 3.8 GPa to 3.2 GPa but raises Df by 0.0002–0.0003, which can exceed the loss budget for 112 Gb/s PAM4 channels. The alternative is to use lower filler content in surface prepregs and higher filler in core layers, creating a modulus gradient that reduces warpage after asymmetric copper removal.
Drilling of M9-containing 3.2 mm panels with 0.25 mm solid-carbide drills at 150,000 rpm and 0.8 m/min infeed produces smear because the low-polarity resin adheres to hole walls. Desmear in alkaline potassium permanganate at 80 °C and 55 g/L KMnO4 requires dwell of 12–18 min, longer than standard epoxy by 4–6 min. The higher dwell time increases glass-fiber attack; a two-step swell-and-etch cycle with glycol ether swell at 70 °C for 5 min limits wicking to 25 µm.
High-layer-count AI server boards also require resistance to conductive anodic filament formation under 100 V/85 °C/85% RH for 1000 h. The low-moisture hydrocarbon/PPE matrix shows CAF failure time above 1000 h at 0.5 mm hole-to-hole spacing according to IPC-TM-650 2.6.25, while epoxy-only controls fail at 400–600 h under the same bias. The hydrocarbon resin, however, reduces glass-fiber wet-out after solder float; solder shock at 288 °C for 10 s can cause delamination if the filler loading exceeds 72 wt% or resin content drops below 52 wt% in 2116 prepreg.
Thermogravimetric analysis at 10 °C/min under nitrogen according to ISO 11358-1:2022 typically shows Td5% above 410 °C for M6 and above 430 °C for M9, with char yield at 800 °C of 5–12%. Under air, the oxidative onset temperature shifts lower by 30–50 °C, and continuous service above 180 °C should be avoided unless an antioxidant package is present. The unsaturated crosslink sites that reduce dielectric loss after cure can cause oxidative embrittlement if the laminate is exposed to 260 °C reflow for more than 3 min without inert atmosphere. For AI server decks requiring multiple lead-free reflow cycles at 245 °C peak temperature per J-STD-020E, M9-containing cores have shown acceptable reliability only when post-cure is complete and residual volatile content is below 0.2 wt%.
| Requirement | Method or Standard | Representative M6-M9 Value |
|---|---|---|
| Halogen content | IEC 61249-2-21:2021 | Br < 900 ppm, Cl < 900 ppm, total < 1500 ppm |
| Flammability | UL 94 | V-0 at 0.8 mm |
| Moisture absorption | ASTM D570-22 | 0.06–0.09% after 24 h/23 °C |
| Dielectric constant and loss tangent | IPC-TM-650 2.5.5.13 | Dk 2.4–2.6, Df 0.0015–0.0030 |
| Copper peel strength | IPC-TM-650 2.4.8 | 0.7–0.9 N/mm after thermal stress |
| Glass transition temperature | IPC-TM-650 2.4.25 DMA | 180–220 °C |
Selection of M6 versus M9 is not a simple loss-tangent decision. M6 provides a wider lamination window and higher copper peel, suitable for 16-layer switch fabrics where Df at 10 GHz below 0.0028 is sufficient. M8 is used in 800G switch cards with 14–18 layers and Df budget 0.0020. M9 is reserved for backpanel cores and high-speed daughtercard materials that must survive 112 Gb/s PAM4 signaling and multiple press cycles. Applying M9 to a 16-layer design with 6-mil cores increases lamination cost and reduces line yield because of the narrower flow window, with no measurable system margin improvement unless channel length exceeds 300 mm.
Pre-drying of filler is required at 120 °C for 4 h when ambient RH exceeds 60%; free moisture on silica surfaces accelerates varnish viscosity drift and can lower copper peel strength by 0.1 N/mm. The resin system is incompatible with amine-based latent hardeners such as dicyandiamide at levels above 2 phr, because the resulting exotherm during B-staging reduces gel time below 90 s and initiates pre-reaction in the treater. Published independent round-robin data comparing M6-M9 directly with fluoropolymer or cyanate ester laminates in AI server card formats are limited; the processing boundaries above are derived from hydrocarbon-resin class behaviour and manufacturer qualification reports and should be revalidated on the specific treater and press line before production release.
