| HS Code | 337064 |
| Material | LATI Laticonther 82 CP1/800 |
| Base Resin | Polyamide 12 (PA12) |
| Reinforcement | Carbon fiber / thermally conductive filler |
| Thermal Conductivity | 0.8 W/m·K |
| Density | 1.20 g/cm³ |
| Tensile Strength At Break | 70 MPa |
| Tensile Modulus | 8000 MPa |
| Elongation At Break | 1.5% |
| Flexural Modulus | 7500 MPa |
| Notched Izod Impact | 25 kJ/m² |
| Heat Deflection Temperature 1 8 Mpa | 150 °C |
| Melting Point | 178 °C |
| Volume Resistivity | 100 ohm·cm |
| Ul94 Flammability | HB |
As an accredited LATI Laticonther 82 CP1/800 PA12 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied in sealed 25 kg multi-layer bags, dry and ready for processing. Protect from moisture to preserve PA12 properties. |
| Container Loading (20′ FCL) | 20′ FCL container loading of Lati Laticonther 82 CP1/800 PA12: palletized 25 kg bags, shrink-wrapped, approximately 20 metric tons per container. |
| Shipping | Ship as non-hazardous plastic granules in sealed moisture-proof bags or containers. Avoid exposure to humidity to prevent degradation. Store in dry, ventilated area away from heat sources. No special transportation restrictions; standard freight, truck, or sea shipping is acceptable. Maintain temperature below 50°C. Handle carefully to prevent bag damage. |
| Storage | Store Lati Laticonther 82 CP1/800 PA12 in its original sealed packaging in a cool, dry, well-ventilated area, away from direct sunlight, heat sources, and moisture. Keep containers tightly closed to prevent humidity absorption, which can degrade the material. Maintain stable temperatures and avoid exposure to open flames or strong oxidizing agents. Follow manufacturer’s shelf-life guidelines. |
| Shelf Life | Store in original, sealed packaging under cool, dry conditions. Typical shelf life is two years from the date of manufacture. |
LATI Laticonther 82 CP1/800 PA12 is processed as a thermally conductive polyamide 12 injection-moulding compound for applications where heat transfer from electronic or frictional heat sources must be combined with the chemical resistance, low moisture uptake and dimensional stability of the PA12 backbone. Pre-drying in a desiccant dryer at 80 °C for 4–6 h to residual moisture below 0.08 % is required before moulding; wet granulate causes surface blistering and reduces tensile strength measured on ISO 527-2:2012 Type 1A specimens. For screw recovery and metering consistency, a three-zone screw with L/D 20:1–24:1 and compression ratio 2.0:1–2.4:1 is generally used, although the high filler level reduces recovery rate compared with unfilled PA12. Melt temperature should be maintained within 240–260 °C; residence time above 8 min at maximum barrel temperature risks matrix degradation and a drop in impact resistance. The downstream use zones below are restricted to sectors where PA12 thermal-management compounds have established industrial practice, rather than speculative substitution targets.
| Application zone | Standard | Clause/method | Verification condition |
|---|---|---|---|
| LED engine housings | IEC 60598-1:2020 | Clause 13.3.2 temperature rise limits | Non-metallic live-part support |
| Battery module side plates | IEC 62660-2:2018 | Clause 6.4.2 cycling endurance | 2.0 mm moulded wall |
| Transmission sensor housings | ISO 16750-4:2023 | Temperature cycling and hot ATF exposure | 120–140 °C |
| Process valve actuator housings | ISO 175:2010 | Immersion chemical resistance | 80 °C, 28 days |
| Power electronics enclosures | IEC 62368-1:2023 | External enclosure thermal limits | 1.5 mm wall |
| Pneumatic manifolds | ISO 15552:2021 | Cylinder end cap dimensional requirements | 0.4–0.8 MPa air pressure |
Injection moulding shops running 60–120 t hydraulic machines process this compound into GU10 reflector bodies, MR16 heat sink housings, and linear track-light insulators where the board-level temperature must remain below the capacitor life limit of 105 °C. The compliance position for an LED engine is anchored to IEC 60598-1:2020 Clause 13.3.2, which defines temperature rise limits on non-metallic parts, and the end product must also meet EN 60598-1 clearance and creepage requirements where the thermally conductive compound is used as a live-part support. In these moulds the compound is used neat, with regrind limited to 15 wt% and only from hot-runner sprues that have not exceeded 260 °C residence; addition above 20 wt% creates gate blush on 1.5 mm walls and increases the coefficient of linear thermal expansion variability across the flow length. Processing uses a 25 mm single-flight screw with L/D 22:1, reverse-cut check ring, and 2.5 mm pin gates that produce radial filler orientation; mould temperature is held at 80 °C to improve surface reproduction on V-groove ribs. A documented failure mode on these lines is short-shot at the outer ring when hot-runner tips drop below 230 °C, because the high filler loading increases crystallization rate in the boundary layer and freezes the flow front. Terminal parts produced under these conditions include integrally moulded heat fins on COB chip holders, T8 tube end caps, and streetlight module thermal bases where the metal-core PCB is fixed by heat staking.
Battery module side plates moulded from LATI Laticonther 82 CP1/800 PA12 are evaluated under IEC 62660-2:2018 Clause 6.4.2 for cycling endurance and under UN 38.3 transport shock profiles where the material must hold a cell stack dimensionally after a 25 kN clamping load at 60 °C. In this use the formulation is not diluted with unreinforced PA12 because even a 20 wt% dilution reduces through-plane thermal transfer enough to raise the cell-to-stack temperature difference by 3–5 K in a 2.0 mm wall; regrind is kept below 10 wt% and is dry-blended with virgin pellets using a gravimetric dosing unit to avoid conductivity banding. The downstream production route is injection moulding on 120–180 t clamp cells with a 40 mm screw, valve gates at the centre of the side plate, and a mould temperature of 90 °C; after demoulding the flatness is checked on a granite plate with a 0.2 mm feeler gauge because anisotropic filler orientation causes warp if the cooling circuit is unbalanced. Terminal products include prismatic cell end plates, module side insulation panels, and busbar support brackets where UL 94 V-0 at 1.5 mm is verified against the grade yellow card rather than assumed from a generic PA12 value. Operators report that screw torque rises 12–18 % compared with neat PA12 and that hot-runner nozzles require purge cycles every 200 shots to remove filler deposits on 0.5 mm tips.
Transmission-mounted sensor housings require chemical resistance to hot ATF at 120–140 °C for 3000 h cycles; the PA12 matrix provides lower water and oil absorption than PA6, and the thermally conductive filler reduces the surface temperature measured at the boss by 5–10 K under a 50 W internal load. Compliance is tested to ISO 16750-4:2023 temperature cycling, ISO 20653:2013 protection class IP67, and automotive OEM-paired standards such as LV 214 for connector housing insertion force retention and SAE J1455 for underhood exposure. The in-mould formulation is used neat; black masterbatch is added at 1.0–2.0 wt% only when the colour must be depth-stable after laser marking, and impact modifiers are avoided because they reduce heat deflection temperature after conditioning. Production runs use a two-shot injection moulding machine with a first-shot sealing ring and a second-shot thermally conductive body; barrel temperatures are profiled from 240 °C at the hopper zone to 255 °C at the nozzle, and the mould is held at 70 °C to reduce post-mould warpage. Terminal finished part types include transmission speed sensor housings, oil pressure sensor bodies, automatic transmission oil temperature sensor bodies, and shift actuator position sensor covers. A recurrent failure observed in production is cracking at ultrasonic weld lines when mould release agent used on the second shot has migrated into the weld zone; the corrective action is to use vacuum degassing and avoid external release agents.
Inside a diaphragm pump used for 60 °C dilute sodium hydroxide and water-glycol mixtures, the PA12 compound resists stress cracking better than polycarbonate, but published data for this specific thermally conductive configuration against sodium hydroxide are limited; immersion screening is therefore performed according to ISO 175:2010 at 80 °C for 28 days before release. The compliance anchor is ISO 1043-1:2011 for material marking on the housing, with the end assembly tested to IEC 61010-1 for actuator controls, and the wetted components are evaluated under the end user’s pressure-equipment documentation rather than a single harmonised plastic standard. The formulation should not be blended with external lubricants; if increased flow is required in a 0.8 mm rib section, a 5–10 wt% addition of a PA12-based low-viscosity carrier masterbatch is used, but this reduces thermal conductivity by 10–20 % and is only acceptable for ambient-temperature housings. Moulders use a 90 t injection machine with a 30 mm three-zone screw, cold runner with full-round gates, and melt cushion of 3–5 mm to maintain consistent plastication history. The terminal parts include valve actuator covers, diaphragm pump bodies, dosing head enclosures, and pH/ORP sensor housing sleeves. A production bottleneck caused by the filler is slower screw recovery; the existing screw must be set with back pressure below 0.5 MPa because higher back pressure shears the filler and drops through-plane conductivity at the gate.
A 1.5 mm wall stock in power supply enclosures converts the need for a discrete aluminium heat spreader into an overmoulded thermal-management feature; the compound is inserted around copper busbars in a vertical injection moulding cell with clamp force 80 t. Compliance is driven by IEC 62368-1:2023 for external enclosure thermal limits, IEC 60664-1:2020 for creepage and clearance, and UL 746A for relative thermal index; electrical insulation is characterised by ASTM D257-14 volume resistivity and dielectric strength according to IEC 60243-1. The formulation for these enclosures allows 10 wt% maximum regrind from clean runners, but no post-industrial mixed-colour regrind is introduced because carbon-black-rich flows show dielectric hot spots at weld lines. Moulding is performed with melt temperature 245–255 °C and mould temperature 70–80 °C; injection speed is reduced to 20–30 mm/s for the first 0.5 s to avoid jetting on the busbar insert. Terminal finished parts include AC/DC power adapter shells, PoE injector housings, uninterruptible power supply heat spreader plates, and solar micro-inverter mounting bases. The specific failure mode seen in production is surface blistering caused by moisture trapped in pre-dried granules; a residual moisture analyser is used to verify 0.06 % before moulding.
Pneumatic manifolds operating at 0.4–0.8 MPa with air dew point −40 °C require dimensional stability and low moisture absorption to prevent seal groove swelling; the PA12 compound is processed into multi-cavity blocks on a 100 t injection machine with sequential valve gates. Compliance includes ISO 15552:2021 for pneumatic cylinder dimensions, ISO 4414:2020 for system safety and leakage, and REACH/RoHS documentation for the supply chain; since the part acts as a pressure boundary in some configurations, the end product is also assessed under the appropriate EU pressure equipment directive category based on internal volume. The recommended formulation is neat compound; regrind is held below 15 wt% and only first-generation sprue/runner material dried to 0.06 % moisture, because higher regrind levels destabilise the hole diameter tolerance of IT9 after 1000 h of compressed air aging. Injection moulding uses melt temperature 240–250 °C, mould temperature 60 °C, and holding pressure 60–80 MPa for 6 s on a 2 mm wall, with cooling time of 25 s per cycle due to the high thermal conductivity of the compound. Terminal part types include ISO 15552 cylinder end caps, manifold blocks, air preparation unit housings, and valve island sub-bases. An industrial failure mode observed at the press is sticking in the runner system when mould temperature exceeds 80 °C; ejector pins are therefore limited to 4 mm diameter and positioned within 8 mm of the gate.
Competitive LATI Laticonther 82 CP1/800 PA12 prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615365186327 or mail to admin@ascent-chem.com.
We will respond to you as soon as possible.
Tel: +8615365186327
Email: admin@ascent-chem.com
Flexible payment, competitive price, premium service - Inquire now!
LATI Laticonther 82 CP1/800 PA12 is a thermally conductive injection-moulding compound built on a semicrystalline polyamide 12 matrix and supplied within the Laticonther range. The base polymer is selected because polyamide 12 absorbs less moisture than polyamide 66 under equilibrium humid conditions and provides greater dimensional stability in components exposed to varying relative humidity. The CP1/800 suffix is a supplier-specific compound code covering filler package, filler loading, and melt-viscosity variant; the exact filler composition is proprietary and should be confirmed against the manufacturer’s technical datasheet. The 82 series is positioned as a higher thermal conductivity class than lower-numbered Laticonther families, but the final heat-transfer performance of a moulded article depends on filler orientation, wall thickness, flow pattern, and measurement direction rather than on a single nominal material constant.
The grade is heavily filled relative to unfilled polyamide 12, which raises density, increases tensile modulus, and reduces elongation at break. These changes are typical of thermally conductive compounds in which a percolating filler network creates conductive paths through an otherwise low-conductivity polymer matrix. Unfilled polyamide 12 has a thermal conductivity in the region of 0.2–0.3 W/m·K. Thermally conductive grades raise this value by introducing high-aspect-ratio or particulate filler systems, but the filler network is sensitive to shear history, part thickness, and mould flow. Published numerical specifications for this exact CP1/800 variant are not restated here to avoid test-method mismatch; LATI’s technical datasheet remains the source for conditioned property values.
Thermal conductivity in filled polyamide 12 is not a fixed scalar. Platelet-shaped or fibre-shaped fillers orient during injection, producing higher conductivity in the flow direction and lower conductivity through the wall. Laser flash methods, transient plane source methods, and guarded heat-flow methods sample different volumes, thickness directions, and contact conditions. A value obtained by laser flash on a thin plaque cannot be directly compared with a value obtained by guarded heat-flow on a thicker moulded plate. The effective through-plane conductivity of a housing wall is the value that governs heat transfer from a heat source to an external surface, but this value is almost always lower than the in-plane conductivity of the same moulded material.
| Property | Standard designation | Function in material specification |
|---|---|---|
| Density | ISO 1183-1 | Confirms filler loading and supports part mass calculations |
| Tensile properties | ISO 527-1 | Provides short-term strength and stiffness for structural analysis |
| Flexural properties | ISO 178 | Evaluates bending stiffness for housing ribs and flat sections |
| Heat deflection temperature | ISO 75-2 | Indicates short-term stiffness retention under temperature |
| Thermal conductivity/diffusivity | ISO 22007-2 | Measures bulk thermal transport through a moulded specimen |
| Thermal diffusivity | ASTM E1461 | Supports laser flash calculation of thermal conductivity |
| Surface resistivity | IEC 62631-3-2 | Characterises electrical behaviour where earth leakage or dissipation is relevant |
The supplier-reported thermal conductivity value should be interpreted alongside the test specimen preparation, flow direction, and conditioning history. In a moulded part, the cooling rate decreases from the surface to the core, producing a layered skin-core morphology. The skin layer may contain highly oriented filler and different thermal transport behaviour from the core. Where a design relies on through-plane heat conduction, a separate measurement on a plaque of the intended wall thickness is more authoritative than a generic datasheet value. Interfacial contact resistance at the component interface, thermal interface material thickness, and surface flatness also influence the total thermal resistance more heavily in thin-wall polymer parts than in aluminium or copper.
Pre-drying is required before melt processing. Polyamide 12 absorbs less moisture than polyamide 66, but high filler loadings can magnify surface defects if residual moisture exceeds approximately 0.1%. A dehumidified hopper dryer set at 80 °C for 4–8 h is a practical starting condition for many PA12 compounds, but the required time depends on initial moisture, granule shape, and dryer dew point. Melt temperatures for PA12 injection moulding are commonly kept between 220 °C and 250 °C. The filled grade should not be exposed to unnecessary high-temperature residence because thermal degradation of the polyamide 12 matrix can discolour the part and reduce molecular weight. Barrel residence time should be minimised, and start-up purging should avoid prolonged hold periods above 260 °C.
Mould temperature has a direct effect on surface appearance, weld-line strength, and dimensional stability. A mould temperature between 40 °C and 80 °C is typical for semicrystalline PA12 grades, with the higher end used where improved flow definition and less frozen orientation are required. High filler loading reduces melt elongation and may cause jetting in thick sections if gates are undersized. Gates, runners, and sprues should be larger than those used for unfilled polyamide 12. Sharp runner corners, thin submarine gates, and restrictive hot-runner tips increase shear heating and can disrupt the filler network. Screw and barrel wear is accelerated by abrasive fillers; bimetallic barrels, hardened screw surfaces, and screw designs with low compression are commonly specified for long production runs.
Injection speed should be moderate to high enough to fill the cavity before the high-viscosity compound freezes, but excessive injection speed can create high shear, delamination, or uneven filler orientation. Hold pressure and cooling time should be determined by gate-seal studies because the compound solidifies rapidly in thin walls. Packing pressure influences internal voiding and sink mark formation. High filler loadings reduce shrinkage compared with unfilled PA12, but differential shrinkage between flow and cross-flow directions can still cause warpage, especially in flat parts with ribs or bosses on one side. Cooling layout must therefore balance mould surface temperature across both halves.
Weld lines in thermally conductive PA12 compounds represent a boundary where filler orientation, melt adhesion, and mechanical strength are interrupted. The strength reduction at a weld line in a heavily filled grade is typically greater than in an unfilled grade, particularly when the weld line occurs downstream of holes, bosses, or multiple gates. For load-bearing or pressure-containing housings, weld-line location should be mapped during mould-filling simulation and moved away from stress concentration areas. Where an external surface is visible, weld lines may also appear as surface disruptions because the filler locally changes reflectivity and roughness.
Differential shrinkage arises because the filler network restricts flow-direction shrinkage more than cross-flow shrinkage. In rectangular housings, this can produce warpage that becomes more severe with higher mould surface temperature, uneven cooling, or non-uniform wall sections. Conformal cooling channels, high-conductivity tool inserts, or localised cooling of thick sections may be required. For flat heat-sink bases, asymmetric cooling between the cavity and core can bend the part and degrade contact with the heat source. The tooling design should include sufficient venting because high filler loading can generate gas trapping and burn marks at flow fronts. Vent depths for filled materials are generally kept shallow enough to prevent flash while allowing air and volatiles to escape; exact vent dimensions should be confirmed for the specific compound viscosity.
Applications reported for thermally conductive PA12 grades include LED heatsinks, housings and brackets for power electronics, battery-cell holders, sensor bodies, and enclosures where metal replacement reduces mass, corrosion, and secondary machining. In each application the design must account for the lower through-plane conductivity of a polymer compound and for contact resistance at the heat source and exterior surface. A thin aluminium or graphite spreader may be needed when the heat source is highly concentrated. Continuous-use temperature limits for PA12 are below those of high-temperature polymers or metals, and the part must be validated under the specific duty cycle rather than by short-term heat deflection data alone.
Grade selection against other thermally conductive materials requires separation of matrix effects from filler effects. A PA66-based Laticonther grade may offer a higher heat deflection temperature, but polyamide 12 absorbs less moisture and shows smaller property shifts under changing relative humidity. Compared with glass-fibre-reinforced PA12, Laticonther 82 CP1/800 PA12 provides a greater heat-conduction path but lower tensile elongation and potentially lower weld strength. Compared with a short-glass-filled PA12 housing, the thermally conductive grade may also be more sensitive to abrasive screw wear and to gate-induced shear. Published data for this specific configuration is limited for food-contact, potable water, and medical use; such applications require explicit supplier certification against the applicable end-use standards.
Documentation for components in electrical equipment should include supplier declaration against RoHS 2011/65/EU and its Delegated Directive (EU) 2015/863, together with REACH (EC) No 1907/2006 SVHC candidate-list verification. Flammability classification should be taken from the final part geometry under UL 94 or IEC 60695-2-12 where the end-product standard requires a glow-wire or flame rating. Because thermally conductive compounds derive their properties from filler networking, incoming quality control should monitor density, tensile modulus, and thermal conductivity on conditioned specimens rather than relying on melt flow rate alone. The usable processing window narrows as filler loading rises, and any process deviation that alters orientation, moisture, or thermal history will change the part-level thermal resistance even when the compound formulation remains within specification.