| HS Code | 823622 |
| Appearance | White to light yellow granules |
| Softening Point C | 120-140 |
| Melt Viscosity At 190c Mpa S | 200-500 |
| Color Gardner | <=3 |
| Acid Value Mg Koh G | <=0.5 |
| Bromine Content Ppm | <=50 |
| Dielectric Constant Dk At 10ghz | 2.2-2.4 |
| Dissipation Factor Df At 10ghz | 0.001-0.002 |
| Moisture Absorption 24h Percent | <=0.05 |
| Glass Transition Temperature C | 80-100 |
| Number Average Molecular Weight Mn | 500-800 |
| Specific Gravity | 1.0-1.1 |
| Thermal Decomposition Temperature C | >=350 |
As an accredited High-Order Hydrocarbon Resin for High-Frequency CCL - Tongyu ADMT factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in 25 kg sealed bags, this high-order hydrocarbon resin ensures safe, moisture-proof delivery for high-frequency CCL use. |
| Container Loading (20′ FCL) | 20′ FCL: drums/palletized, securely stowed and braced, loading High-Order Hydrocarbon Resin for High-Frequency CCL (Tongyu ADMT). |
| Shipping | Shipping: Supplied in sealed, moisture-proof drums with clear labeling. Transport in ventilated containers by road or sea, avoiding direct sunlight and high temperatures. Handle carefully to prevent drum damage, and keep away from ignition sources. Comply with all applicable hazardous goods regulations and reference the Safety Data Sheet (SDS) for full handling instructions. |
| Storage | Store in a cool, dry, well-ventilated area away from direct sunlight, heat sources, and open flames. Keep containers tightly sealed to prevent moisture contamination and oxidation. Maintain temperatures between 5–35°C. Avoid prolonged storage beyond shelf life, and keep away from incompatible materials. Follow manufacturer’s safety data sheet. |
| Shelf Life | Shelf life is typically 12 months when stored unopened in a cool, dry, well-ventilated area away from direct sunlight. |
Tongyu ADMT resin is a high-order hydrocarbon resin applied in hydrocarbon-modified dielectric formulations for radio-frequency and high-speed copper-clad laminates. The material is relevant only where simultaneous low dissipation factor, controlled moisture uptake, and post-lamination thermal-mechanical stability are required. The application scenarios described below reflect installed downstream practice in prepreg impregnation, hot-press lamination, and PCB fabrication, not theoretical resin eligibility. Reported addition ratios are expressed on the basis of total resin solids unless otherwise indicated. Published data for this specific resin grade under every filler-curing agent combination is limited; therefore each scenario specifies boundary conditions and a working range rather than a single-point prescription. Pre-drying of Tongyu ADMT resin at 70 °C for 4 h is required when storage relative humidity exceeds 60%. Avoid combining this resin with amine-based latency modifiers in solvent-borne varnish because premature crosslinking can occur before glass fabric wet-out is complete.
In 5G active antenna unit (AAU) boards operating in n257 (26.5–29.5 GHz) and n258 (24.25–27.5 GHz), laminate dissipation factor directly affects array efficiency, thermal dissipation, and adjacent-channel isolation. Tongyu ADMT resin is formulated into polyphenylene ether/butadiene-styrene systems at 18–28 wt% of total resin solids. Below 18 wt%, the dissipation factor at 10 GHz generally remains above 0.0030 for this class of system, which may violate the dielectric budget of high-order 64T64R massive MIMO designs. Above 28 wt%, varnish viscosity can exceed 600 cps at 25 °C, requiring solvent dilution above 45 wt% that risks residual solvent retention in the prepreg. On production vertical treaters with 15 m heated tunnel zones set at 120/150/170/180/170 °C and line speed 10–14 m/min, prepreg resin content is held at 48–52%, residual solvent below 0.3 wt%, and gel time at 170 °C between 160 s and 200 s. The lamination step uses a vacuum-assisted hydraulic press at 210–230 °C, 500–650 psi, and 90–120 min, followed by cold pressing under pressure to 40 °C. Compliance anchors are IPC-4101E, IPC-TM-650 2.5.5.5 at 10 GHz, UL 94 V-0 at 0.8 mm, RoHS Directive 2011/65/EU Annex II, and REACH 1907/2006 SVHC screening. The downstream output consists of 5G AAU printed circuit boards, massive MIMO feed networks, remote radio unit boards, and base station antenna panels.
A production-scale failure mode observed in this application is edge voiding at high-density via fields when prepreg resin flow falls below 18%; conversely, if resin flow exceeds 30%, squeeze-out can expose 2116 glass fiber bundles at panel edges and reduce electrical breakdown margin. The addition ratio is therefore adjusted to the specific glass style and filler package, not fixed independently. Dielectric testing per IPC-TM-650 2.5.5.5 after lamination is used to confirm that Dk shift across the sheet remains within ±0.04.
For automotive corner radar, medium-range radar, and long-range radar modules operating at 76–81 GHz, insertion loss is governed by conductor roughness, glass-fiber weave, and the dielectric loss tangent of the resin matrix. Tongyu ADMT resin is added at 15–22 wt% of total resin solids in this application because the filler package must remain high in spherical silica at 35–50 wt% to maintain dimensional stability during lead-free reflow at peak temperatures of 245–260 °C. Adding the hydrocarbon resin above 22 wt% while retaining high filler loading produces varnish viscosity increases of 20–30%; this impairs glass fabric wet-out on 1080 and 2116 styles and can generate microvoids at the base of 75 µm laser-via holes. The HDI PCB process uses a 355 nm UV laser at 15–20 µJ/pulse to form blind vias, followed by alkaline permanganate desmear at 70 °C, electroless copper deposition of 0.4–0.6 µm, and electrolytic copper plating to 20 µm. Lamination is conducted at 210–220 °C and 500–600 psi for 90 min, using low-profile electrodeposited copper foil with surface roughness Rz below 1.0 µm to reduce conductor loss. The automotive qualification path includes IPC-6012DA Class 3, IATF 16949 traceability, AEC-Q200 for assembled radar modules, UL 94 V-0, RoHS 2011/65/EU, and REACH 1907/2006. Terminal assemblies are long-range radar (LRR) boards, medium-range radar (MRR) boards, corner radar boards, and parking/backing radar sensor modules.
High-frequency CCL in automotive radar must survive 85 °C/85% RH biased humidity testing at 50 V DC without conductive anodic filament formation. The combination of high silica loading and elevated hydrocarbon resin content above the specified range increases the risk of separations along glass fiber bundles, which provides a path for CAF failure. Methods used are IPC-TM-650 2.6.25 and thermal cycling per AEC-Q200 with 1000 cycles from -40 °C to 125 °C. Published data for this specific resin-filler combination under automotive radar HDI processing is limited, so pre-production AEC-Q200 qualification lots are required.
112 Gbps and 224 Gbps PAM4 backplane and line-card designs in spine-leaf switch architectures require panel-scale dielectric constant uniformity within ±0.04 and insertion loss budgets below -0.5 dB/in at 50 GHz. Tongyu ADMT resin is incorporated into PPE/thermoset hydrocarbon hybrids at 25–35 wt% of total resin solids. In this application, the resin modifies the dielectric constant to approximately 3.2–3.4 at 10 GHz, while the dissipation factor is maintained below 0.0030 under IPC-TM-650 2.5.5.5 stripline conditions. The production process uses a co-rotating twin-screw compounding extruder with L/D 44 and side-stuffing at filler loadings above 30 wt% to disperse silica and flame retardant before varnish letdown. Prepreg treatment occurs on a horizontal treater with automatic viscosity control between 250 cps and 400 cps at 25 °C to prevent resin-rich or resin-starved fiber bundles on 1080 and 2116 glass styles. Lamination uses a 30-opening vacuum press with 1200 mm × 1800 mm platens at 210–230 °C, 450–600 psi, and 120–150 min, followed by ambient pressure cold pressing to 40 °C. Board acceptance references IPC-4101E, IPC-TM-650 2.5.5.5 at 10 GHz, UL 94 V-0, RoHS 2011/65/EU, and REACH 1907/2006. Finished board categories include spine switch boards, leaf switch boards, line cards, high-speed backplane boards, and router signal-processing cards.
For these large panels, the major processing conflict is between resin flow and fiber-weave skew. If Tongyu ADMT loading exceeds 35 wt%, the reduced melt viscosity during lamination intensifies fiber-weave-induced Dk variation with 1080 glass, especially in differential pairs routed over multiple weave pitches. Conversely, loadings below 25 wt% may leave Df too high for 224 Gbps PAM4 link budgets. In production-scale testing, panel edge-to-center Dk variation above 0.05 has been correlated with increased bit-error-rate margin closure on long serpentine lanes. Batch-to-batch viscosity variation of the letdown varnish must be held below ±10%; otherwise the horizontal treater automatic nip pressure cannot compensate and resin content drifts outside 47–53%.
Satellite phased-array transceivers in Ka-band (26.5–40 GHz) and Ku-band (12–18 GHz) require low-outgassing printed board materials. The controlling standard is ASTM E595, with total mass loss below 1.0% and collected volatile condensable materials below 0.10% at 125 °C and 24 h under vacuum. In this application, Tongyu ADMT resin is restricted to 10–18 wt% of total resin solids because low-molecular-weight hydrocarbon fractions can elevate outgassing when the loading exceeds this window. The varnish preparation line includes hot-vacuum devolatilization at 120 °C and -0.09 MPa for 6 h before filler addition. Prepreg manufacturing uses a vacuum-assisted treater with residual solvent held below 0.2 wt% and resin content between 42–46%. Lamination occurs at 210 °C and 500 psi for 120 min in a Class 10000 cleanroom, followed by plasma desmear for high aspect-ratio through-holes. Additional board qualification uses ECSS-Q-ST-70-02C, IPC-6012 Class 3/A, UL 94 V-0, RoHS 2011/65/EU, and REACH 1907/2006. Terminal products are LEO phased-array antenna cards, Ka-band transceiver boards, satellite router cards, and phased-array beamformer printed boards.
Because published data for this specific hydrocarbon resin in vacuum outgassing is limited, each lot is pre-qualified by ASTM E595 before release to varnish mixing. A production issue encountered in this class of material is outgassing variation from residual low-molecular-weight fractions; if devolatilization time is reduced below 6 h, the condensed volatile fraction may approach or exceed the 0.10% limit.
| Scenario | Standard / method | Test condition or clause | Acceptance boundary |
|---|---|---|---|
| 5G AAU | IPC-TM-650 2.5.5.5 | 10 GHz stripline | Df ≤ 0.0030 |
| Automotive radar | IPC-6012DA Class 3 | HDI microvia reliability | Via continuity after 1000 thermal cycles |
| Data center | IPC-4101E | High-frequency resin system | Dk tolerance ±0.04 |
| Satellite | ASTM E595 | 125 °C, 24 h, vacuum | TML <1.0%, CVCM <0.10% |
| Avionics | MIL-PRF-31032 | Class 3/A | As specified |
| FWA | IPC-TM-650 2.5.5.5 | 10 GHz | Df ≤ 0.0035 |
Qualified to MIL-PRF-31032 and IPC-6012 Class 3/A, airborne avionics boards replace PTFE-based laminates where flowability and through-hole metallization constraints make PTFE difficult to process. Tongyu ADMT resin is added at 12–20 wt% of total resin solids with brominated flame retardant and silica filler. The resin content is intentionally lower than in data center boards because high aspect-ratio through-hole reliability and Z-axis CTE control dominate. The production process uses 1080/2116 glass prepreg, vacuum lamination at 215 °C, 550 psi, and 90 min, followed by plasma desmear and electroless copper for through-holes with 10:1 aspect ratio. Batch-to-batch Tg shifts are monitored by TMA per IPC-TM-650 2.4.24.5; a shift above 5 °C from lot average triggers requalification of the filler surface treatment. The resulting board classes include airborne radar boards, transponder boards, avionics power amplifier boards, and flight-control signal-processing boards.
Fixed wireless access equipment at 28 GHz and 39 GHz operates under narrower temperature extremes than base station or satellite hardware, allowing a more cost-sensitive material build that still meets dielectric requirements. Tongyu ADMT resin is incorporated at 20–30 wt% of total resin solids to maintain dissipation factor below 0.0035 at 10 GHz without requiring ceramic filler above 20 phr. The process uses standard FR-4-like lamination at 200 °C and 400 psi with 2116 glass to achieve panel-scale Dk uniformity within ±0.05. Varnish viscosity is kept between 300 cps and 450 cps at 25 °C, and prepreg resin content is held at 45–50%. Compliance requirements reference IPC-4101E, IPC-TM-650 2.5.5.5 at 10 GHz, UL 94 V-0, RoHS 2011/65/EU, and REACH 1907/2006. Downstream product forms are 28/39 GHz FWA outdoor units, subscriber modules, and integrated radio modules.
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Tongyu ADMT is a high-order hydrocarbon resin supplied as solid flakes or pellets for high-frequency copper-clad laminate (CCL) varnish systems. The product is characterized by a hydrogenated polycyclic backbone with low residual aromatic and polar functionality; this structure reduces the dielectric constant and dissipation factor contribution when the resin is co-cured with polyphenylene ether/APPE or styrene-butadiene block copolymer matrices. The grade designation ADMT is used in standard supply-chain documentation without suffix coding, although downstream laminate fabricators normally receive a lot-specific certificate of analysis rather than a generic material data sheet. The ring-and-ball softening point is controlled between 120°C and 150°C per ASTM D6493-11, and melt viscosity at 200°C is specified in the range 500 mPa·s to 1500 mPa·s per ASTM D3236-15. GPC characterization against polystyrene standards places the number-average molecular weight between 800 g/mol and 1200 g/mol. Iodine number, a measure of residual unsaturation, is controlled between 5 g I₂/100 g and 15 g I₂/100 g per ASTM D1959-97, and bulk moisture content is held below 0.10 wt% per ASTM D570-98.
Cured-resin electrical properties are evaluated on compression-molded plaques after peroxide cure at 200°C for 120 min under nitrogen. Representative values measured by split-post dielectric resonator at 10 GHz per IPC-TM-650 2.5.5.13 fall within 2.35–2.50 for relative permittivity and 0.0012–0.0020 for loss tangent. These values are not a universal guarantee; they are process-dependent and must be confirmed on the converted laminate because glass fabric, copper foil roughness, and B-stage residuals all shift the final dielectric response. The resin contains no epoxy oxirane groups and no polar secondary amine adducts, which distinguishes its moisture absorption behavior and high-frequency dielectric signature from polar thermosets such as epoxy novolac.
Conventional hydrocarbon resin grades based on DCPD or C9 feedstocks contain aromatic or olefinic structures that raise dielectric loss through orientational polarization and moisture interaction. Tongyu ADMT is produced with a higher degree of hydrogenation and a controlled molecular-weight distribution; this reduces residual double bonds and polar catalyst residues. The molecular architecture difference is measurable by iodine number: a standard DCPD resin may retain 50–100 g I₂/100 g, whereas ADMT is controlled at 5–15 g I₂/100 g. Low residual unsaturation reduces oxidative crosslinking during lamination and long-term dielectric drift. In addition, the ADMT ash level is maintained below 0.05 wt% per ASTM D5630, which limits ionic conduction mechanisms that can degrade high-frequency loss tangent.
Table 1 compares dielectric and moisture data for the resin classes most often considered for low-loss laminates. The values are compiled from publicly available resin-class datasets and supplier technical literature, not from a single universal test; published data for this specific configuration is limited and lot-specific certificates should govern production decisions.
| Resin type | Dk at 10 GHz | Df at 10 GHz | 24 h water absorption | Typical process limitation |
|---|---|---|---|---|
| Tongyu ADMT | 2.35–2.50 | 0.0012–0.0020 | <0.10 wt% | Requires free-radical co-crosslinker |
| Hydrogenated DCPD | 2.40–2.55 | 0.0015–0.0025 | 0.10–0.20 wt% | Lot-to-lot unsaturation and lower thermal-oxidative stability |
| C9 petroleum resin | 2.60–2.80 | 0.005–0.010 | <0.10 wt% | Aromatic content increases Dk and Df |
| PPE/APPE resin | 2.45–2.55 | 0.0010–0.0020 | <0.10 wt% | High melt viscosity; difficult glass wet-out |
| Epoxy novolac | 3.5–4.2 | 0.020–0.030 | 0.20–0.50 wt% | Hydroxyl and oxirane polar groups |
Compared with a straight PPE/APPE resin system, ADMT lowers the melt viscosity of the B-staged prepreg and permits greater filler loading without sacrificing wet-out. The trade-off is a lower glass-transition temperature and reduced toughness in the resin-rich region; therefore the resin is normally used as a co-crosslinker or modifier rather than as the sole binder. Compared with epoxy novolac, ADMT shifts the dielectric constant from approximately 3.5–4.2 to 2.35–2.50, which is the primary reason it enters high-frequency CCL formulations despite requiring free-radical initiators. Because ADMT is not based on brominated epoxy, it supports halogen-free laminate formulations; however, flame retardancy must be supplied by phosphorus-based additives or inorganic fillers, which may raise Dk depending on filler loading.
On a four-zone vertical prepreg treater running 7628 E-glass at 3.0 m/min, ADMT-containing varnishes are prepared at 40–60 wt% solids in a toluene/MEK blend using a jacketed high-shear disperser with a tip speed of 8–15 m/s. The resin is dissolved first at 60–80°C, then PPE/APPE is added at 50–70 wt% of the total resin solids, followed by initiator and filler. The ADMT component reduces varnish viscosity at constant solids, enabling either higher web speed or increased filler loading before the occurrence of glass-fiber starvation. Impregnation is controlled to a resin content of 55–65 wt% after B-stage; volatiles are held below 0.5 wt% per IPC-TM-650 2.3.16. First-zone drying is set at 90–110°C for solvent removal, and second-zone partial cure is set at 130–155°C. Premature gelation is observed when the second-zone temperature exceeds 175°C or when dicumyl peroxide exceeds 3.0 phr in the varnish; this produces resin-starved board edges and increased press rejects. In one production-scale failure mode, improper pre-dilution of ADMT flakes in cold solvent created gel seeds that plugged the treater doctor bars and generated periodic dry bands across the fabric. This is prevented by maintaining the dissolution vessel above 60°C and filtering the varnish through a 20 μm bag filter before the treater pan.
Lamination is performed in a vacuum-assisted hydraulic press at 200–220°C under 2.5–3.5 MPa for 120–180 min. The press cycle must include a slow ramp through 120–150°C to allow melt flow and wet-out of the copper foil surface. Rapid heating directly to full press temperature can cause viscosity collapse and resin squeeze-out before sufficient wet-out occurs; the result is low peel strength at the board perimeter and increased void content. On a horizontal treater, resin starvation is less severe, but solvent condensation in the first zone can drip onto wet prepreg and create localized dielectric hot spots. This is controlled by keeping the exhaust rate above 40 m³/min per 1 m of web width and monitoring dew point in the first zone.
The production acceptance envelope for ADMT is controlled by four interlocking parameters: softening point, melt viscosity, moisture uptake, and post-cure dissipation factor contribution. A shift in softening point above the specified band reduces prepreg flow and creates dry laminate edges; a shift below the band increases cold flow and causes blocking of B-stage rolls. Table 2 lists the specification envelope used for incoming lot acceptance and the associated test methods.
| Property | Test method | Typical control range | Unit |
|---|---|---|---|
| Appearance | Visual | Off-white pellets or flakes | — |
| Softening point, ring-and-ball | ASTM D6493-11 | 120–150 | °C |
| Melt viscosity at 200°C | ASTM D3236-15 | 500–1500 | mPa·s |
| Number-average molecular weight | GPC vs polystyrene | 800–1200 | g/mol |
| Iodine number | ASTM D1959-97 | 5–15 | g I₂/100 g |
| Moisture content | ASTM D570-98 | <0.10 | wt% |
| Cured-resin Dk at 10 GHz | IPC-TM-650 2.5.5.13 | 2.35–2.50 | dimensionless |
| Cured-resin Df at 10 GHz | IPC-TM-650 2.5.5.13 | 0.0012–0.0020 | dimensionless |
| TGA 5% mass loss under N₂ | ASTM E1131 | >400 | °C |
| Ash content | ASTM D5630 | <0.05 | wt% |
The 10 GHz dissipation factor window is valid only when the resin is cured under nitrogen or vacuum lamination. Oxidative cure at temperatures above 200°C in air increases the loss tangent by 0.0003–0.0005 because carbonyl and hydroperoxide species are formed. Moisture exposure of fully cured plaques at 85°C/85% RH for 168 h increases Df by less than 0.0004; partially cured prepregs are more sensitive because residual unsaturation can hydrolyze and oxidize during storage. The melt-phase processing window is narrow: below 120°C the resin does not flow sufficiently for uniform web wet-out, and above 165°C the viscosity falls below 500 mPa·s, which leads to resin drainage on vertical fabric edges and inconsistent resin distribution. In full-scale lamination, this viscosity cliff-edge translates into a practical press soak window of 15–25 min at 150°C when no additional co-crosslinker is used; with 5–15 phr of triallyl isocyanurate or divinylbenzene, the soak window can be extended but the post-cure Df may increase by 0.0002–0.0005 depending on the purity of the co-crosslinker.
Because ADMT participates in free-radical crosslinking rather than polar addition cure, the selection of co-crosslinkers and initiators directly determines peel strength, thermal stress resistance, and long-term Df stability. Typical initiator systems include dicumyl peroxide or 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane at 1.5–4.0 phr; co-crosslinkers include divinylbenzene, triallyl isocyanurate, or trimethylolpropane trimethacrylate at 5–30 phr of total resin solids. Amine-based additives, strong Lewis acid catalysts, and high-acid-number phenolic hardeners should be avoided because they deactivate peroxide initiators or introduce polar reaction products that increase high-frequency loss. The resin should be stored below 35°C in unopened packaging and re-sealed under nitrogen after opening if storage extends beyond 90 days. Material exposed to RH > 60% should be pre-dried at 80°C for 4 h before varnish compounding to prevent moisture-induced deactivation of peroxide initiators and uncontrolled gel-time drift. In high-frequency CCL construction with RTF copper foil, peel strength is typically limited to 0.6–1.0 N/mm; if higher adhesion is required, a polar adhesion promoter must be used, but it will raise the laminate dissipation factor by a measurable amount and should be evaluated with an IPC-TM-650 split-post measurement on the final laminate rather than on the cured resin plaque alone.
