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High-Gloss Kristalex 5140 Hydrocarbon Resin for Hot-Melt Adhesives

    • Product Name: High-Gloss Kristalex 5140 Hydrocarbon Resin for Hot-Melt Adhesives
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 825988
    Resin Type Styrene/alpha-methylstyrene hydrocarbon resin
    Color Gardner <1
    Acid Value Mg Koh Per G <1

    As an accredited High-Gloss Kristalex 5140 Hydrocarbon Resin for Hot-Melt Adhesives factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing High-Gloss Kristalex 5140 Hydrocarbon Resin for Hot-Melt Adhesives is supplied as free-flowing pastilles in 25 kg multi-wall paper bags.
    Container Loading (20′ FCL) 20′ FCL of High-Gloss Kristalex 5140 hydrocarbon resin, packed in bags on pallets, shrink-wrapped and securely loaded for hot-melt adhesive use.
    Shipping Kristalex 5140 is shipped as 25 kg paper bags or palletized, shrink-wrapped loads. Store in a cool, dry area away from heat sources. Material is non-hazardous per regulations; avoid dust accumulation and use proper grounding during transfer. Ensure containers are sealed to maintain product integrity.
    Storage Store in a cool, dry, well-ventilated area away from direct sunlight, heat, and open flames. Keep containers tightly sealed to prevent moisture absorption and contamination. Avoid contact with strong oxidizers. Use appropriate handling equipment and maintain temperatures below recommended limits to preserve resin quality and ensure safe processing.
    Shelf Life Store in original container, cool and dry. Shelf life is typically two years from date of manufacture.
    Application of High-Gloss Kristalex 5140 Hydrocarbon Resin for Hot-Melt Adhesives

    At packaging speeds above 800 m/min on corrugated case-erecting and closing lines, high-gloss Kristalex 5140 hydrocarbon resin is introduced into ethylene-vinyl acetate (EVA) and polyethylene-based hot-melt formulations at 15–30 wt% to raise the ring-and-ball softening point and extend the heat-fail temperature without pushing the Brookfield viscosity at 160°C beyond the working range of slot-nozzle and bead applicators. The resin is characterised by a nominal ring-and-ball softening point of 140°C per ASTM E28-18 and Gardner colour below 1 per ASTM D1544. On production-scale twin-screw extruders with L/D ratios between 40:1 and 52:1, the resin is compounded at 160–180°C with EVA containing 28–33% vinyl acetate, microcrystalline paraffin, and a secondary aliphatic C5 tackifier. The resulting adhesive enters a gear-pump-driven application system and is extruded through nozzle shims of 0.3–0.8 mm onto clay-coated or unbleached kraft corrugated board; compression belts then deliver a fibre-tearing bond within 2–6 s of application. Terminal products include regular slotted containers (RSC), die-cut trays, beverage multipacks, and point-of-purchase displays. For food-contact packaging, the system is evaluated under FDA 21 CFR 175.105 and EU 2023/2006 good manufacturing practice; the adhesive is maintained behind a functional barrier or its migration is controlled below the overall migration limit of 10 mg/dm² set by EU 10/2011 for plastic materials and articles intended to come into contact with food. Regulatory conformance for heavy metals follows CONEG model legislation with total lead, mercury, cadmium, and hexavalent chromium below 100 ppm. The addition level must be reduced toward the lower end of the 15–30 wt% range when line speed exceeds 1,200 m/min because the higher viscosity of the aromatic resin can extend open time beyond the compression window.

    StandardScopeLimit or test condition
    FDA 21 CFR 175.105Adhesives used in food packagingComponent-level clearance; functional barrier or migration control
    EU 10/2011Plastic food-contact materialsOverall migration 10 mg/dm²
    EU 2023/2006Good manufacturing practice for food-contact materialsQuality assurance and batch documentation
    REACH EC 1907/2006SVHC candidate list and Annex XVII restrictionsDeclaration of compliance
    CONEG model legislationHeavy metals in packagingSum of Pb, Hg, Cd, Cr(VI) 100 ppm
    ASTM D3236-15Apparent viscosity of hot-melt adhesivesBrookfield Thermosel at 160°C or 180°C
    ASTM E28-18Ring-and-ball softening pointNominal 140°C for Kristalex 5140

    What Limits High-Temperature Shear Resistance in SBC-Based Nonwoven Hygiene Construction Adhesives?

    In SBC-based nonwoven hygiene construction adhesives, the sprayable viscosity window is measured at 150–165°C by ASTM D3236-15 using a Brookfield Thermosel; spiral-spray and melt-blown heads on production lines typically require 1,500–4,500 mPa·s to maintain uniform fibre formation without stringing or nozzle plugging. High-gloss Kristalex 5140 hydrocarbon resin is incorporated at 15–30 wt% in styrenic block copolymer formulations based on SIS or SBS triblocks with diblock content between 15% and 30% to increase the heat-fail temperature, measured by ASTM D4498-07, and to improve cohesive strength on low-surface-energy polyethylene backsheets. The addition is normally paired with an aliphatic C5-C9 resin at 15–25 wt% and a naphthenic white oil at 10–20 wt%; the triblock polymer is maintained at 25–35 wt% to keep the melt index within the spray window. In production-scale melt-blown application, the adhesive is applied through nozzles with shim widths below 0.25 mm onto nonwoven substrates at line speeds of 200–600 m/min, followed by nip lamination within 0.5–3 s. Terminal product types include diaper leg cuffs, elastic waistband attachment, core stabilisation layers, feminine hygiene pads, and adult incontinence briefs. For regulatory compliance, the adhesive is screened against the REACH EC 1907/2006 SVHC candidate list, and dermatological safety is evaluated through skin sensitisation protocols under ISO 10993-10 and cytotoxicity under ISO 10993-5 for articles with prolonged skin contact. Loadings above 30 wt% in formulations with diblock content below 15% are observed to raise Brookfield viscosity above 5,000 mPa·s at 160°C, causing intermittent melt-blown fibre breakage and accumulation on die tips, which forces either a reduction in line speed below 300 m/min or partial replacement of the aromatic resin with a lower-softening-point hydrogenated tackifier.

    Perfect-Binding Adhesives for High-Speed Book Production

    Softcover perfect-binding lines running at 12,000–18,000 cycles/h require EVA-based hot-melt spine adhesives that can be held at 165–180°C in premelt tanks and still penetrate uncoated paper stock without excessive warp. Kristalex 5140 is dosed at 20–35 wt% into EVA with 28–32% vinyl acetate, paraffin wax, and a secondary tackifier; this shifts the ring-and-ball softening point and reduces block temperature sensitivity in warehouses where case-packed books are stored at 40–60°C. The spine adhesive is applied by nozzle or counter-rotating adhesive wheel to the gathered text block, side-glue is applied at 150–170°C, and the book enters a nipping station followed by a cooling tower at 4–8°C for 3–6 min. Terminal products include softcover books, mail-order catalogues, annual directories, and magazines. Compliance is evaluated against the Library Binding Institute Specification for page-pull and flex endurance, and documentation is maintained under REACH EC 1907/2006 and EU 2023/2006 where the adhesive is incidental to food-contacting printed matter. Additions above 30 wt% have been observed to shorten open time sufficiently to reduce spine penetration into uncoated papers; the correction on production lines is either to raise glue-pot temperature within the 170–180°C window or to reduce line speed below 8,000 cycles/h when paper basis weight exceeds 80 g/m².

    Because continuous edgebanding and profile-wrapping lines apply hot-melt to preheated MDF/HDF substrates at 20–80 m/min and require handling within 8–15 s, the adhesive must develop immediate green strength while retaining heat resistance after cooling. Kristalex 5140 is incorporated at 10–20 wt% in EVA- or APAO-based edgebanding formulations, often with a hydrogenated C9 tackifier at 5–15 wt% and a high-density polyethylene wax at 2–5 wt% to control open time. The adhesive is processed in pre-melt tanks at 180–200°C and transferred by heated hose to a roller applicator or slot die; the coated edgeband is pressed onto the panel edge with pneumatic pressure rollers, and surplus adhesive is trimmed after 5–10 s of cooling. Terminal products include furniture edgebands, door and drawer fronts, decorative profile-wrapped MDF/HDF mouldings, and conference table edging. Compliance for interior wood-adhesive applications is assessed under EN 204 durability classes D2 and D3, with additional documentation under REACH EC 1907/2006 and the Kitchen Cabinet Manufacturers Association performance testing protocol for heat resistance and cold-check resistance. Loadings above 20 wt% in APAO systems may reduce melt penetration into melamine-faced boards and lower adhesion to low-energy surfaces; the aromatic resin should be pre-screened by cloud-point titration against the selected APAO grade before scaling to full production.

    When Aromatic Tackifier Loading Exceeds 30 wt% in SBC-Based Pressure-Sensitive Hot Melts

    Styrenic block copolymer pressure-sensitive hot melts for permanent labels and graphic films are compounded from SIS or SBS triblocks with diblock content between 15% and 25%, aliphatic and aromatic tackifiers, and white mineral oil; the role of Kristalex 5140 is to raise the glass transition temperature of the styrenic endblock domains and increase holding power without shifting loop tack below the coating-line specification. At addition levels of 15–30 wt%, the resin is compounded with SIS at 25–35 wt%, white mineral oil at 10–20 wt%, and an aliphatic C5 resin at 10–20 wt%; melt viscosity is maintained at 5,000–25,000 mPa·s at 150–165°C as measured by ASTM D3236-15. The hot melt is continuously mixed in a twin-screw extruder with an L/D ratio of 44:1 and a barrel temperature profile of 155–170°C, filtered through a 100–200 µm mesh, and coated by slot die onto release liner at 50–150 µm dry coat weight. Terminal products include permanent high-gloss labels, graphic overlay films, carton-sealing tapes, and pressure-sensitive laminating films. Compliance for food-label applications is evaluated under FDA 21 CFR 175.125 for pressure-sensitive adhesives used on food labels, with supporting documentation under REACH EC 1907/2006 and CONEG heavy-metal restrictions below 100 ppm. The critical formulation boundary appears when the aromatic tackifier loading exceeds 30 wt%; at this point loop tack measured by PSTC-16 can fall below 1.5 N/25 mm in formulations with diblock content below 20%, and the viscosity increase narrows the slot-die coating window to ±3°C around the set point. Published data for this specific diblock/aromatic resin ratio is limited; compatibility at higher loadings should be pre-screened with cloud-point titration and a pilot-scale coating trial before production approval.

    Inside automotive interior laminating cells, hot-melt adhesives for door panel skins, instrument panel coverstocks, and headliner composites are applied at 170–190°C and immediately fused under vacuum or nip pressure; the adhesive must not release volatile compounds that exceed cabin air quality limits for volatile organic compounds (VOC) and semi-volatile organic compounds (SVOC). Kristalex 5140 is added at 10–20 wt% to SBC- or APAO-based hot-melt formulations to raise the storage modulus above 70°C and improve creep resistance at dashboard service temperatures. The adhesive is applied by heated roller or swirl-spray equipment with nozzle air pressures of 0.8–1.5 bar, then the coverstock is vacuum-formed over the substrate within 30–90 s. Terminal products include door panel inserts, instrument panel coverstocks, headliner laminations, parcel shelves, and centre console armrest wraps. Compliance is documented under VDA 278 for VOC and SVOC release, DIN 75201-B for fogging condensate, GADSL for declarable substances, and IATF 16949 for production part approval and process control. A typical interior specification requires fogging condensate below 2 mg per DIN 75201-B and total VOC below 100 µg/g per VDA 278; the narrow molecular weight distribution of the resin and its nominal softening point of 140°C support these limits. Formulators should avoid pre-blending the resin with moisture-curing polyurethane hot melts that contain residual isocyanate, because the aromatic resin can shift cure kinetics and reduce final crosslink density; compatibility with amine-blocked adhesion promoters should also be confirmed by differential scanning calorimetry before line trials.

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    Certification & Compliance
    More Introduction

    High-Gloss Kristalex 5140 Hydrocarbon Resin for Hot-Melt Adhesives is a water-white, low molecular weight aromatic hydrocarbon resin derived from purified aromatic monomers. The grade designation 5140 corresponds to a nominal ring-and-ball softening point of 140 °C within the Kristalex series, not to a molecular weight or viscosity value. The resin is supplied as free-flowing pastilles that reduce dusting and permit gravimetric feeding into continuous hot-melt compounding lines. The low Gardner color and absence of dark C9 resin impurities make it suitable for water-white hot-melt films where surface gloss and clarity are controlled by coating temperature and substrate surface energy.

    Typical physical property data for High-Gloss Kristalex 5140 Hydrocarbon Resin
    PropertyTypical valueTest standard
    Ring-and-ball softening point140 °CASTM E28-14 / ISO 4625:2005
    Melt viscosity at 190 °C15,000 mPa·sASTM D3236-15
    Gardner color<1ASTM D1544-80
    Density at 25 °C1.07 g/cm³ASTM D792-20
    Flash point, Cleveland open cup260 °CASTM D92-18
    Acid number<0.1 mg KOH/gASTM D974-14
    Ash content<0.01 %ASTM D5630-13

    Typical datasheet values are given in the table; certificate of analysis values vary by lot and should be used for machine setup calculations. Application of the resin in hot-melt adhesives is concentrated in SIS and SBS block-copolymer systems, where aromatic end-block reinforcement raises cohesive strength at elevated temperatures. The addition level is commonly 20 wt% to 40 wt% of the total compounded adhesive, depending on styrene content and the balance between shear and tack. Below 15 wt%, the resin acts mainly as a low-viscosity diluent relative to the base polymer; above 45 wt%, aromatic phase saturation may reduce loop tack as measured by ASTM D6195-03. Published data for this specific configuration is limited for low-styrene SIS grades, and a formulation gradient on a 250 mL laboratory hot-melt mixer is normally required before scale-up.

    What processing-window conflicts arise from a 140 °C ring-and-ball softening point?

    The 140 °C softening point creates a hard lower boundary for melt processing. Pumps and applicators must be maintained above 150 °C to avoid viscosity spikes and nozzle plugging, while the resin's 15,000 mPa·s melt viscosity at 190 °C adds to the pressure drop across filtration elements. On continuous co-rotating twin-screw extruders with L/D ratios between 32:1 and 44:1, barrel temperatures of 150 °C to 180 °C are typically required through the mixing section; a feed-throat temperature below 120 °C can reduce pastille conveying and increase resin build-up on the first mixing element. Production-scale gear pumps rated for 2,500 psi may approach their upper pressure limit when handling filled formulations containing more than 30 wt% Kristalex 5140 if filter mesh sizes below 100 µm are installed. Because the resin is amorphous, no crystallization exotherm appears in differential scanning calorimetry runs from 25 °C to 180 °C at 10 K/min per ISO 11357-1. The primary process risk is not melting but thermal-oxidative degradation at extended high-temperature hold times. Holding the resin alone or in a hot-melt formulation at 200 °C for more than 4 h can shift Gardner color upward, particularly in copper or brass transfer lines that catalyze oxidation. Published data for this specific configuration is limited; addition of 0.1–0.3 wt% hindered phenolic stabilizer is common when residence times exceed 6 h.

    Rheologically, the resin exhibits shear-thinning behavior in the melt only when compounded with high molecular weight block copolymers; as a neat resin it behaves as a Newtonian low-viscosity liquid above 170 °C. Hot-melt coaters with positive-displacement gear pumps should therefore not rely on shear thinning for pressure reduction until the polymer fraction is included. In slot-die lines, the minimum die lip temperature is typically 10–20 °C above the resin softening point to avoid skinning, giving a practical lip set point of 160 °C. When processing low-viscosity packaging adhesives below 5,000 mPa·s total formulation viscosity, the addition of the resin at 25 wt% may raise the upper clear point of the formulation and reduce stringing. Stringing is quantified by formulator-specific extensional rheology, not by a single ASTM method; published data for this specific configuration is limited.

    Observed production failure modes include filter blinding, die-lip char, and incomplete pastille melting. Filter blinding occurs when adhesive containing Kristalex 5140 is held below 150 °C and passed through screens finer than 80 µm, because the resin can form high-viscosity domains that plate out on the filter surface. Die-lip char occurs at line stoppages longer than 30 min at temperatures above 180 °C without set-back, particularly on chrome-plated lips. Incomplete pastille melting appears when gravimetric feeders deliver the resin to extruders with L/D ratios below 24:1 at screw speeds above 250 rpm; the resin exits as soft domains in the melt string and produces clear surface bumps in continuous coating. These are operational boundaries derived from manufacturing trials; published data for this specific configuration is limited, and batch-to-batch variation in pastille size may require feeder calibration.

    Thermal-oxidative stability limits and nitrogen-blanketed holding tanks

    The resin is not UV-stable due to its aromatic structure; extended xenon-arc exposure can form chromophores that reduce the high-gloss appearance. For clear hot-melt films intended for outdoor service, hydrogenated C9 tackifiers should be evaluated instead. In indoor packaging and bookbinding lines, the initial Gardner color of <1 reduces the need for optical brighteners. When line design requires melt holding above 180 °C for more than 2 h, nitrogen blanketing of the reservoir and replacement of copper fittings are standard controls. Moisture sensitivity is low because the resin is hydrophobic; however, storage of bulk bags below dew point can introduce surface condensation. When relative humidity exceeds 60 %, pre-drying of pastilles in a desiccant hopper at 40 °C for 2 h prevents steam-induced bubbling in slot-die coating. The resin should not be combined with primary amine-based curing agents at high temperature because amine-catalyzed oxidation and color formation may occur. Published data for this specific configuration is limited for polyurethane reactive hot-melt systems, and compatibility must be tested separately.

    Compatibility with paraffinic and naphthenic oils is limited at high dilution because the resin is aromatic. For formulations containing more than 20 wt% paraffinic or naphthenic oil, cloud point testing by ASTM D6116 is required before production. A 1:1 resin/mineral oil mixture may separate on cooling; no single cloud point number applies across all oil grades.

    When substituting Kristalex 5140 for lower-softening-point aromatic resins or hydrogenated tackifiers

    Relative to Kristalex 3100 and Kristalex 3085, which carry nominal ring-and-ball softening points of 100 °C and 85 °C, Kristalex 5140 provides a higher upper-use temperature but also raises melt viscosity at a given application temperature. Formulators replacing a lower-grade Kristalex resin at equal loading in a sprayable hot-melt adhesive may need to increase application temperature from 160 °C to 180 °C or reduce resin loading by 5–10 wt% to maintain equivalent nozzle spray pattern and bead geometry. Compared with hydrogenated C9 tackifiers, Kristalex 5140 is more polar and has stronger interaction with polystyrene end-blocks, but it is less suitable for outdoor applications because the aromatic rings absorb ultraviolet radiation and can yellow. Compared with aliphatic C5 tackifiers, it reinforces styrenic domains rather than the rubber midblock, so peel adhesion and tack may decline while shear resistance increases. Quantitative substitution studies should compare loop tack per ASTM D6195-03, 180° peel per ASTM D3330/D3330M-04, and shear adhesion failure temperature per ASTM D4498-13 at identical cohesive-to-adhesive ratios rather than at identical resin weight loading.

    Hot-melt adhesives containing Kristalex 5140 are applied by slot-die coating, spiral spray, and bead extrusion. The resin's narrow melt transition above 150 °C makes it suitable for high-speed packaging lines, but its high aromatic content can cause charring on die lips if line stops exceed 30 min without temperature setback. Processors operating intermittent lines are advised to program automatic setback to 140 °C during idle periods and to purge with low-viscosity mineral oil before shutdown. In bookbinding, the resin increases cohesive strength without adding crystallinity, and page-pull resistance is monitored with formulator-specific tensile testing because no universal hot-melt bookbinding standard exists. Coating weights from 15 g/m² to 50 g/m² are typical for slot-die applications, but the exact window depends on paper porosity and press speed. Published data for this specific configuration is limited for speeds above 250 m/min, where adhesive transfer and fiber tear become controlling factors.

    Regulatory and compliance checklist for High-Gloss Kristalex 5140 Hydrocarbon Resin
    Standard/regulationDesignationVerification requirement
    EU REACHEC 1907/2006Confirm substance registration and tonnage band with the current supplier safety data sheet
    EU RoHS recast2011/65/EUConfirm absence of restricted substances below maximum concentration values by supplier certificate; X-ray fluorescence screening alone is not sufficient
    US FDA indirect food contact21 CFR 175.105Compliance depends on final adhesive formulation, coating weight, and extraction testing; supplier food-contact statement is required
    US FDA indirect food contact21 CFR 175.125Not automatically applicable; confirm status with manufacturer

    Because the resin has ash <0.01 %, it does not introduce significant ionic impurities into hot-melt adhesives used for electrical assembly. The base resin contains no deliberately added light stabilizer, so any outdoor hot-melt application requires either a compatibility-tested light stabilizer package or selection of a hydrogenated grade. For formulations containing more than 20 wt% paraffinic or naphthenic oil, cloud point testing by ASTM D6116 is recommended before production. No single number defines compatibility across all polymers; the resin's aromatic character favors polystyrene domains and limits use in high-volume aliphatic diluent systems.

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