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ETEC (EnvisionTEC) ETEC HTM140 DLP High Temperature Mold Material

    • Product Name: ETEC (EnvisionTEC) ETEC HTM140 DLP High Temperature Mold Material
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 222975
    Material Type Photopolymer
    Technology DLP
    Color Amber
    Density 1.12 g/cm³
    Viscosity 350 mPa·s at 25°C
    Heat Deflection Temperature 140 °C
    Tensile Strength 50 MPa
    Tensile Modulus 2,400 MPa
    Elongation At Break 3%
    Flexural Strength 80 MPa
    Flexural Modulus 2,500 MPa
    Hardness 85 Shore D
    Layer Thickness 25–100 µm
    Critical Energy 10 mJ/cm²
    Penetration Depth 0.15 mm
    Water Absorption 0.3%
    Shrinkage 0.5%

    As an accredited ETEC (EnvisionTEC) ETEC HTM140 DLP High Temperature Mold Material factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The ETEC HTM140 DLP High Temperature Mold Material comes in a 1 kg opaque plastic bottle with a secure cap.
    Container Loading (20′ FCL) Container loading (20′ FCL): palletized ETEC HTM140 DLP high-temperature mold material, shrink-wrapped, strapped, kept upright, dry, away from heat.
    Shipping ETEC HTM140 DLP High Temperature Mold Material is not regulated for transportation as hazardous goods. Ship as non-dangerous cargo in sealed, compatible containers. No UN number, proper shipping name, hazard class, packing group, or marine pollutant status is assigned. Follow general carrier and local regulations.
    Storage Store in original, tightly sealed containers in a cool, dry, well-ventilated area away from direct sunlight, heat, sparks, and flames. Keep away from strong oxidizers, food, and drink. Protect from UV light and moisture. Maintain 15–25°C; do not freeze. Store upright to prevent leakage. Reseal after use. Keep out of reach of children. Use within shelf life. Follow SDS and local regulations.
    Shelf Life Shelf life is 12 months when stored in original, unopened container at 20–25°C, away from light, moisture, and heat.
    Application of ETEC (EnvisionTEC) ETEC HTM140 DLP High Temperature Mold Material

    At melt temperatures of 200 °C to 230 °C for polypropylene and 180 °C to 220 °C for high-density polyethylene, a direct-printed mold insert produced from ETEC HTM 140 operates with the cavity wall below the resin’s heat deflection temperature under load, measured at 140 °C with 0.46 MPa stress per ASTM D648-18. The forming window therefore depends not on melt temperature alone but on the residence time of the melt at the cavity surface, the thermal conductivity of the tool, and the cooling-circuit configuration. Formulation charge for the DLP vat is 100 wt% HTM 140 with 0 wt% non-reactive diluent, filtered through a 25 µm mesh prior to loading; any addition of solvent or inert diluent lowers crosslink density and shifts the heat deflection temperature below 140 °C, invalidating the short-run injection molding boundary. Batch acceptance for incoming resin is anchored to ISO 527-1:2019 tensile testing and ISO 178:2019 flexural testing; supplier declarations address RoHS 2011/65/EU Annex II restricted substances in the cured state, while uncured acrylate handling follows REACH safety data sheet requirements. Cured mold inserts are handled as solid plastic tooling and require separate waste classification under local directives. In production-scale evaluation, inserts are printed on a 405 nm DLP machine with 50 µm layer thickness, washed in isopropanol to remove uncured resin from the cavity surface, and thermally post-cured according to the resin manufacturer’s documented cycle; an incomplete post-cure produces lower crosslink density at the gate and can cause localised cavity deformation under injection pressures. Terminal parts produced under these constraints are polypropylene snap-fit enclosures, HDPE cable glands, polyethylene instrument covers, and short-run packaging validation fixtures with draw depths below 12 mm. Melt temperatures above 180 °C at the cavity surface for extended injection sequences lead to softening at the gate land; glass-filled or mineral-filled feedstock should be avoided because abrasive wear removes the printed cavity surface and erodes parting-line dimensions.

    Gating and cooling design are not interchangeable with metal tooling. The printed insert has lower thermal diffusivity than P20 steel, so cooling channel pitch is reduced from the conventional 2.5d value used in steel to approximately 1.5d of the channel diameter d when cavity surface thermocouples exceed 135 °C during back-to-back cycles on an Arburg Allrounder 370 A with 600 kN clamp force. Hot runner drops set at 200–220 °C and a gate land length below 1.5 mm limit melt residence against the printed surface. Draft angles of 1.0–1.5° are applied to vertical walls because ejection forces above 500 N can tear the acrylate network at the parting edge.

    Does Peroxide-Cure Silicone Vulcanization Exceed the Thermal Endurance of HTM 140?

    For addition-cure platinum silicone compounds, the mold cavity printed from ETEC HTM 140 remains within its 0.46 MPa HDT of 140 °C when press platens are held at 120 °C to 155 °C and cycle times are kept below 15 min. The formulation charge in this compression molding route is 100% HTM 140 undiluted; no internal release agent is compounded into the resin because common wax-based additives migrate to the cavity surface and interfere with silicone cure. Compliance for the final elastomeric article, when intended for repeated food contact, is evaluated under FDA 21 CFR 177.2600, while mold temperature uniformity is verified with a calibrated contact thermocouple against ISO 75-2:2013 HDT data for the cured tool material. The downstream process is a compression molding press with heated platens in which the printed cavity half is positioned inside a steel retaining frame, clamped at 5–10 MPa cavity pressure, and released with a silicone-compatible mold release applied at 0.5–1.0 wt% of the cavity surface mass per cycle. Terminal products include liquid silicone rubber O-rings, gaskets, keypad membranes, wire seals, and vibration isolators with Shore A hardness below 70 because harder compounds require higher cure temperatures. Peroxide-cure systems present a different boundary: cure cycles at 160–180 °C exceed the HDT limit and generate acidic decomposition byproducts that attack the exposed acrylate network when no fluoropolymer sealant is applied; published cycle-life data for this specific configuration is limited, and tool surface hardness should be rechecked after every 20 cycles using ISO 868:2003 Shore D indentation.

    Cure chemistryPlaten setpoint rangeHTM 140 cavity thermal statusReference standard
    Platinum-catalysed addition120–155 °CWithin 0.46 MPa HDT; transient soak acceptableFDA 21 CFR 177.2600, ISO 75-2:2013
    Peroxide-catalysed160–180 °CExceeds 140 °C HDT; requires reduced dwell and sealantISO 868:2003
    Tin-condensation25–50 °CNo thermal stressISO 23529:2016

    Acid-cure silicone is not recommended because acetic acid liberated during condensation cure can plasticise the cured photopolymer network. If an acid-cure grade is unavoidable, the cavity surface is sealed with a fluoropolymer barrier applied at 2–5 µm dry film thickness, and Shore D indentation is checked after every 10 cycles per ISO 868:2003; a loss exceeding 2 points indicates surface network degradation. In platinum-cure production, the compression platens are fitted with thermocouples calibrated to ±2 °C because an overshoot to 170 °C during a 15 min cure cycle shifts the cavity into the thermal distortion range even when the HDT is 140 °C at 0.46 MPa.

    Thermoforming on a single-cavity tool printed from HTM 140 requires sheet surface temperatures above 120 °C for high-impact polystyrene and amorphous polyethylene terephthalate, but below the 140 °C heat deflection temperature measured at 0.46 MPa per ASTM D648-18 to avoid cavity softening during repeated draw cycles. In this configuration, the printed forming shell is built to a 15–20 mm wall thickness and then backfilled with an aluminum-filled epoxy mixed at a 3:1 aluminium powder to epoxy resin weight ratio to increase heat extraction from the sheet; the HTM 140 itself remains an undiluted 100% resin feed, with no filler added to the DLP vat. Compliance for final food-contact packaging trays follows EU 10/2011 for plastic articles, while the tool shell is dimensionally checked against the original CAD model using ISO 286-2 tolerance grades before the first draw. The downstream process uses a vacuum thermoforming machine with top and bottom ceramic heaters, a vacuum level of at least -0.08 MPa, and vent channels drilled through the printed shell at 1.5–2.0 mm diameter to prevent air entrapment at cavity corners. Terminal products are shallow packaging trays, clamshell inserts, device covers, and prototype blister nests with draw depths below 50 mm because deeper draws increase sheet contact angle and local cavity stress on the printed tool. For sheet materials with forming temperatures above 140 °C, such as polycarbonate, the tool must be cooled below the forming temperature or solid aluminium tooling substituted.

    Low-Pressure Blow Molds for Short-Series Parison Forming

    In extrusion blow molding of small high-density polyethylene containers, the parison is extruded at 180–200 °C and brought into intermittent contact with a printed HTM 140 cavity, which has a heat deflection temperature of 140 °C at 0.46 MPa per ASTM D648-18; the permissible contact time is therefore shorter than in injection molding and is controlled by internal cooling air at 0.4–0.6 MPa blow pressure and a backing frame that conducts heat away from the cavity shell. The resin charge remains 100% HTM 140 undiluted, with 0 wt% diluent; a two-part epoxy-based surface sealant may be applied at a wet film thickness below 0.1 mm to reduce parison abrasion and prevent water ingress into microvoids during wash cycles. Final container compliance for polyethylene bottles intended for food contact is assessed under EU 10/2011, and the mold insert itself is subject to incoming batch checks per ISO 527-1:2019 tensile data supplied with the resin lot. The process equipment includes a reciprocating screw extruder with a blow-mold clamp unit, a blow pin delivering compressed air, and a cooling mandrel that maintains cavity surface temperature below 140 °C; this is essential because a continuous parison feed without active cooling drives cavity floors beyond the HDT. Terminal products are short-series HDPE calibration vessels, dropper bottles, splitter housings, and non-aseptic technical containers with wall thickness below 1.2 mm. Wall sections thicker than 1.2 mm increase parison heat load and are not recommended without metal cooling inserts.

    When Polyurethane Casting Exotherms Exceed 120 °C in Printed Cavities

    Vacuum casting of polyurethane elastomers in a printed HTM 140 cavity requires a processing rule rather than a resin formulation change: the mixed polyurethane system should be selected or filled so that its exotherm at the intended section thickness remains below 120 °C, because the mold material’s 0.46 MPa HDT of 140 °C leaves a narrow safety margin when the exotherm is superimposed on a 60 °C pre-warmed mold. The printed cavity itself is used at 100% resin solids with no reactive diluent; no internal mold release is compounded into the resin because additive migration into the cast polyurethane surface alters adhesion and hardness. For a typical Shore A 60 polyurethane elastomer with a polyol-to-isocyanate ratio of 100:80 by weight, section thickness above 20 mm can push the centerline exotherm beyond 120 °C; published data for HTM 140 under this specific dynamic exotherm is limited, and cavity surface temperature telemetry is required for sections above 15 mm. Compliance for the final cast polyurethane article is anchored to ISO 604:2002 compressive property testing and ISO 527-1:2019 tensile testing, while uncured isocyanate handling follows REACH safety data sheet controls and local occupational exposure limits. The downstream process is a vacuum casting chamber operating at -0.095 MPa, with the printed mold shell backfilled with aluminum-filled epoxy to act as a heat sink and with a steel frame limiting cavity deflection during cure. Terminal products are polyurethane grommets, rollers, seals, impact bumpers, and vibration damping mounts with Shore A hardness between 40 and 80. Above 80 Shore A, the higher exotherm and shorter gel time generate a double thermal and chemical load that can soften the printed parting line.

    Thermal telemetry in the cavity floor is recorded with embedded K-type thermocouples, and when the temperature exceeds 120 °C during gel, the cure schedule is switched to a forced-air cooling cycle at 25 °C between shots. A mold temperature above 140 °C inside an unfilled polyurethane block of 30 mm thickness has been observed to leave a permanent parting line indentation because the clamping pressure acts on the softened network. For that reason, the maximum recommended section thickness for unfilled Shore A 60 systems is 20 mm, and sections above this require aluminum inserts or active cooling channels.

    Vacuum Casting Master Pattern Geometry Retains 140 °C Dimensional Stability During RTV Toolmaking

    As a master pattern material for room-temperature vulcanising silicone tooling, ETEC HTM 140 is printed at 100% undiluted solids, and the resulting master is used to transfer surface texture and geometry to a silicone rubber mould that will later cast polyurethane or epoxy prototypes. In this route, the high-temperature HDT of 140 °C at 0.46 MPa per ASTM D648-18 is not used as a continuous service temperature but as a dimensional stability reserve during room-temperature toolmaking, preventing creep and surface distortion when the silicone rubber is degassed and cured at 25–40 °C around the master. Compliance for the dimensional handoff from printed master to cast mould is verified using ISO 286-2 tolerance grades, and the final prototype parts are tested per ISO 527-1:2019 tensile properties when specified. A surface sealant is applied to the master at a dry film thickness of 1–2 µm; this barrier prevents platinum-cure silicone inhibition caused by residual uncured photopolymer or leachable acrylate species, and it is the only surface formulation addition in the workflow. The downstream process involves DLP printing at 405 nm, support removal, wash, thermal post-cure, application of the surface barrier, and casting of a two-part RTV silicone mould under vacuum at -0.095 MPa. Terminal products are vacuum-cast polyurethane prototype enclosures, connector housings, and functional test articles in lot sizes below 20 units. This master-pattern route is limited to silicone tooling; direct casting of high-temperature epoxy or urethane systems against unsealed HTM 140 patterns is not recommended.

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    Certification & Compliance
    More Introduction

    ETEC HTM140 is a filled photopolymer resin formulated for digital light processing additive manufacturing of high-temperature mold inserts, thermoforming tools, and thermally loaded fixtures. The product is intended for ETEC/EnvisionTEC DLP platforms operating in the 385–405 nm projector wavelength band and is supplied as a low-viscosity dispersion that transitions from a green printed state to a rigid, high-heat-deflection polymer network after washing and post-cure. Manufacturer-published typical data list a heat deflection temperature of 140 °C at 0.45 MPa when tested in accordance with ASTM D648. Tensile elongation at break remains below 10%, and Shore D hardness falls in the 85–90 range, indicating a high-modulus, low-ductility response. Compared with unfilled prototype resins in the same printer family, such as E-Model or PIC 100, whose published HDT values are generally below 60 °C, HTM140 shifts the service window upward for short-run tooling but reduces fracture tolerance and requires tighter process control.

    What Operational Boundaries Constrain HTM140 in Injection Tooling Applications?

    Injection tooling produced from HTM140 is qualified for short-run inserts where melt-contact temperature and clamp pressure remain within the material’s compressive strength and thermal stability limits. Tooling trials on small-tonnage injection machines with clamp force settings between 300 kN and 800 kN have shown that insert survival is often governed by thermal gradients near the gate rather than by peak cavity pressure alone. Because the filled photopolymer exhibits lower thermal conductivity than tool steel or aluminum, heat does not dissipate rapidly from the cavity wall. Published data for filled photopolymer systems generally place thermal conductivity in the range of 0.2–0.5 W/m·K. This lower heat transfer slows cycle time and raises the local surface temperature at the gate. As a result, processing guidelines limit continuous mold surface contact to approximately 120 °C for sustained duty, while cycle time is typically extended 1.5–3× relative to equivalent steel tooling unless conformal cooling channels are printed directly into the mold body. Thin ribs and sharp corner transitions should be avoided unless supported by a metal bolster, because crack initiation at these locations occurs before bulk thermal softening.

    Rheologically, HTM140 behaves as a filled suspension rather than a homogeneous monomer solution. The dispersed filler phase raises heat deflection temperature but also produces shear-thinning behavior and can settle during idle vat periods. The manufacturer’s recommended layer thickness is usually 50 µm or 100 µm, with the finer layer setting used where maximum green strength and surface resolution are required. Before each build, the resin must be reconditioned by vat agitation or manual stirring; settling during overnight shutdowns changes local viscosity and can produce layer-to-layer density variation. Build chamber temperature should be maintained within the recommended processing window. Thermal excursion below 18 °C raises viscosity and disrupts recoating, while excursion above 35 °C can accelerate dark polymerization and produce vat film fouling. These control points are particularly relevant on top-down DLP systems where the printed surface is immersed in resin and a wiper blade passes across a constrained meniscus after each exposure cycle.

    When HTM140 Replaces Aluminum or Filled Epoxy Tooling Boards in Thermoforming Tools, Which Design Rules Apply?

    Thermoforming and vacuum-forming tools made from HTM140 replace machined aluminum or epoxy board where intermediate surface temperatures and low thermal mass are required. The resin permits rapid digital fabrication of curved tool faces, vacuum channels, and low-volume production aids. However, the material’s localized bearing strength is lower than metallic equivalents. Toggle clamps, alignment pins, and ejector points should be backed by a steel bolster or embedded insert because point loads can exceed the resin’s local bearing capacity. Manufacturer case studies describe HTM140 tools used with polycarbonate and ABS sheet at surface temperatures up to 100 °C, with tool campaigns limited to avoid accumulated thermal fatigue. Edge radii below 3 mm are generally avoided unless the geometry is reinforced, because repeated heating and cooling initiate cracks at sharp corners. Vacuum hole drilling after printing requires low cutting speeds and coolant-free machining to prevent melt-smear and microcracking around hole perimeters. Carbide drill bits with 90–120° point geometry are recommended for producing clean apertures in the cured polymer without delaminating printed plies.

    Post-print cleaning and mold-release selection are chemically constrained. Green parts are washed in isopropyl alcohol or a glycol-ether solvent to remove uncured resin. Extended solvent contact beyond 10 min can produce edge swelling and reduce critical feature accuracy. After washing, parts are dried and post-cured in a UV flood chamber followed by an optional thermal post-cure. The cured surface is compatible with water-based mold releases and silicone-free demolding agents. Solvent-based releases containing strong ketones or chlorinated species can attack the polymer matrix and should be avoided. Because the material is hygroscopic at elevated relative humidity, pre-drying at 40–50 °C for 4–6 h is recommended before exposing tooling to high-humidity shop air to minimize dimensional drift during use.

    Thermal Fatigue, Post-Cure Shrinkage, and Vat-Settling Control Points

    Thermal fatigue appears on HTM140 tool faces as microcrack networks after repeated cycling from ambient to 100–120 °C. The mechanism is driven by differential expansion between the filled polymer surface and reinforcing supports rather than by bulk softening alone. Support structures should be placed on non-functional tool surfaces, and the CAD model should taper transitions from thick flanges to thin walls to redistribute thermal strain. Post-cure shrinkage is anisotropic. Published dimensional studies for filled DLP resins report aggregate linear shrinkage in the range of 0.1–0.3%, with the Z-axis generally exhibiting higher shrinkage than X/Y because of layerwise polymerization. Compensation factors are applied in slicing software and verified on a first-article tool before production geometry is finalized. Vat settling is controlled by continuous agitation during builds longer than 2 h. Printers without automated vat stirring require periodic interruption and manual re-dispersion, which can produce visible knit lines in the tooling surface if not managed. The thermal post-cure temperature window is typically held to a tolerance of ±5 °C around the specified setpoint; excursions outside that window create gradient conversion and measurable warpage in unsupported sections.

    High-Temperature Mold Material Classification Under ASTM D648 and ISO 75

    The material is classed as a high-temperature mold material on the basis of heat deflection temperature and not as a continuous-service engineering thermoplastic. Reporting of mechanical and thermal properties follows the standard designations listed in the table below. Batch certificates should be consulted for lot-specific values, because filler dispersion and post-cure protocol influence final properties.

    Property or Compliance Category Standard Designation Typical Reporting Condition
    Heat deflection temperature ASTM D648-18 / ISO 75-1:2020 0.45 MPa flatwise
    Tensile properties ASTM D638-14 / ISO 527-2:2022 10 mm/min crosshead speed
    Flexural properties ASTM D790-17 / ISO 178:2019 Three-point loading, 16:1 span-to-depth ratio
    Hardness ASTM D2240-15 / ISO 868:2003 Shore D, 15 s dwell
    Regulatory status REACH EC 1907/2006; RoHS 2011/65/EU Per SDS and compliance certificate

    Crack Propagation Along Layer Boundaries in High-HDT DLP Inserts

    Layer boundaries in HTM140 tooling act as preferred paths for crack propagation when tensile stress is applied normal to the build plane. The effect is more pronounced than in unfilled DLP resins because the stiff filler phase increases modulus but does not arrest interlayer fracture. Tooling designers commonly orient the mold face away from the platform and incline the part 15–30° relative to the Z-axis to avoid placing layer boundaries perpendicular to major tensile stress. In printed conformal cooling channels, wall thickness should be at least 2 mm to prevent coolant leakage through interlayer microcracks. Channel diameters as small as 1.5 mm can be produced, but pressure testing of printed channels is required before use in injection tooling. Failure observed on production-scale equipment most often occurs as gate-area erosion, thin-rib breakage during demolding, or corner cracking after repeated thermal cycling rather than bulk thermal collapse. Published data for high-cycle shot counts with this specific tooling configuration is limited; short-run campaigns should be qualified empirically on production geometry before scale-up.

    Compared with cast urethane or epoxy tooling boards, HTM140 offers a direct digital workflow that eliminates machining handwork and permits curved internal cooling geometry. However, the material has lower continuous service temperature than metal-filled epoxy tooling boards and lower fracture toughness than machined aluminum. In contrast to metal powder bed fusion tooling, HTM140 can be produced on lower-cost DLP hardware within a working day for small inserts, but it is not intended for high-volume injection production. Used as a bridge tooling resin, HTM140 is positioned between general-purpose DLP prototyping materials and metal tooling: it provides a higher thermal ceiling than unfilled resins but introduces filler settling, anisotropic shrinkage, and interlayer crack sensitivity that require disciplined build preparation and post-cure control.

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