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Essentium High Performance PLA Additive Manufacturing Filament

    • Product Name: Essentium High Performance PLA Additive Manufacturing Filament
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 400281
    Material PLA (Polylactic Acid)
    Filament Type FDM/FFF 3D Printing Filament
    Filament Diameter 1.75 mm
    Diameter Tolerance ±0.03 mm
    Print Temperature 190-220°C
    Bed Temperature 25-60°C
    Tensile Strength 60 MPa
    Tensile Modulus 3.3 GPa
    Elongation At Break 5%
    Flexural Strength 100 MPa
    Flexural Modulus 3.3 GPa
    Notched Izod Impact Strength 4 kJ/m²
    Density 1.24 g/cm³
    Heat Deflection Temperature 85°C at 0.45 MPa
    Vicat Softening Temperature 60°C
    Net Filament Weight 1 kg

    As an accredited Essentium High Performance PLA Additive Manufacturing Filament factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

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    Certification & Compliance
    More Introduction

    Essentium High Performance PLA Additive Manufacturing Filament is supplied as an unfilled, diameter-controlled polylactic acid thermoplastic for fused filament fabrication systems operating to ISO/ASTM 52900. The product is available in 1.75 mm and 2.85 mm diameters, spooled at 1.0 kg net mass. Manufacturer-published dimensional tolerances are ±0.05 mm for diameter and ≤0.03 mm for ovality, measured by two-axis laser micrometry in-line. Lot certificates list an average density of 1.24 g/cm³ determined to ISO 1183-1, and a melt flow rate of 8 g/10 min at 210 °C with a 2.16 kg load under ISO 1133-1. The recommended melt-processing band on a standard brass-nozzle hotend is 200 °C to 220 °C; a heated bed between 20 °C and 60 °C is adequate for low-warp prints. Pre-drying at 45 °C for 4 h in a forced-air or vacuum dryer is required when the spool has been exposed to relative humidity above 60% for more than 24 h. Without pre-drying, absorbed moisture can degrade the melt boundary during extrusion and lower interlayer tensile strength measured to ASTM D638-14 by up to 10% relative to dry material.

    How Does the High-Performance Grade Differ from Commodity PLA in Processing and Part Response?

    When compared with commodity PLA filaments, the high-performance designation reflects a tighter melt-flow window and reduced lot-to-lot dimensional variation rather than fiber reinforcement. Table 1 lists indicative values for this product, a representative unfilled PLA, and a representative unfilled ABS. The comparison demonstrates the central trade-off: the PLA grades offer higher tensile modulus and lower processing shrinkage than ABS, but heat deflection temperature remains the limiting boundary for service above 55 °C under 0.455 MPa flexural stress. In direct comparison with standard PLA, the Essentium High Performance PLA grade is specified for roundness ≤0.03 mm, which reduces filament buckling and slip at the extruder drive gear on direct-drive systems with 0.4 mm nozzles. The melt flow rate plateau at 8 g/10 min supports more uniform bead placement at linear speeds up to 90 mm/s without the die-swell variation observed in commodity PLA with melt flow rates above 10 g/10 min.

    PropertyEssentium High Performance PLACommodity PLAUnfilled ABS
    Density (ISO 1183-1)1.24 g/cm³1.24 g/cm³1.04 g/cm³
    Tensile yield strength (ASTM D638-14)62 MPa60 MPa42 MPa
    Tensile modulus (ASTM D638-14)3.5 GPa3.5 GPa2.1 GPa
    Elongation at break (ASTM D638-14)4.5%5.0%10%
    Flexural strength (ISO 178)95 MPa85 MPa60 MPa
    Flexural modulus (ISO 178)3.2 GPa3.0 GPa2.0 GPa
    Heat deflection temperature at 0.455 MPa (ASTM D648)55 °C52 °C88 °C
    Notched Izod impact (ISO 180/A)3.0 kJ/m²2.5 kJ/m²15 kJ/m²
    Melt flow rate (ISO 1133-1)8 g/10 min at 210 °C, 2.16 kg10 g/10 min at 210 °C, 2.16 kg5 g/10 min at 220 °C, 10 kg

    Indicative values only; lot-specific certificates should be consulted for production qualification. Unfilled ABS values are representative of general-purpose extrusion grade. Published data for annealed Essentium High Performance PLA sections above 8 mm is limited, so annealing cycles on thick structural fixtures require part-specific validation to ASTM D648.

    Across direct-drive and Bowden extrusion systems, the practical melt-processing band narrows when ambient chamber air temperature exceeds 35 °C. On direct-drive extruders with a 0.4 mm brass nozzle, the filament tolerates print speeds from 40 mm/s to 90 mm/s for straight-line toolpaths, but corner ringing increases above 80 mm/s unless acceleration is held below 800 mm/s². For Bowden extruders, retraction settings between 4 mm and 6 mm at 25–35 mm/s are required; retraction distances below 3 mm produce stringing on open toolpaths longer than 100 mm. Below 190 °C, the melt front exhibits insufficient die swell for consistent bead width, and extruder backpressure can cause filament shaving. Above 230 °C, lactide depolymerization byproducts evolve as visible white vapor, and tensile yield strength measured to ASTM D638-14 falls by 5% to 8%. Part-cooling fan speed should reach 100% after the second layer for overhang angles above 45°; continuous fan output above 80% on the first layer reduces adhesion to polyimide or glass beds. The unfilled formulation does not require a hardened nozzle, but a stainless-steel 0.4 mm nozzle is recommended for runs above 500 h to limit bore wear effects on extrudate diameter.

    When High-Performance PLA Replaces ABS in Low-Load Jigs, Fixtures, and Prototype Tooling

    When the application does not exceed 50 °C continuous service temperature or moderate impact loading, the high-performance PLA can replace unfilled ABS in low-load assembly tools, drill guides, pocket templates, and disposable pick-and-place end-effectors. The replacement benefit is dimensional flatness: printed plaques of 150 mm × 150 mm × 3 mm exhibit first-layer warp less than 0.2 mm on a glass bed at 50 °C without an enclosure, whereas unfilled ABS on the same build surface can lift 0.5 mm or more without an enclosure. In functional fixtures, hole centers spaced at 100 mm should be oversized by 0.15 mm to compensate for 0.3% to 0.5% linear shrinkage. The upper service limit is constrained by heat deflection temperature of 55 °C at 0.455 MPa under ASTM D648; contact with heated machine surfaces above 50 °C produces creep and progressive loss of clamp force. This grade is therefore not a direct substitute for ABS in components requiring sustained contact with hot ends, automotive interior parts near heat sources, or assemblies subjected to notched impact energies above 3.0 kJ/m². Alkaline cleaning baths, prolonged immersion in water above 40 °C, and aggressive solvent wiping with ketones should be avoided because of hydrolytic and solvent-induced stress cracking. Batch-to-batch color consistency on opaque black and natural spools is verified by spectrophotometer with a published ΔE tolerance of ≤1.5.

    Dimensional Verification, Winding Tension, and Storage Envelope

    For inventory control, the product is sealed with desiccant and labeled with a lot-specific melt flow rate and two-axis diameter record. After opening, the spool should be returned to a sealed container with desiccant when not in use. Moisture content determined by Karl Fischer titration should remain below 0.25%; exposure to 60% relative humidity for 24 h can produce surface moisture sufficient to cause audible nozzle popping and a loss of interlayer tensile strength of 10% to 15% relative to dry material. Long-term storage beyond 6 months should be maintained at 23 ± 2 °C and below 40% relative humidity. The product is not classified as hazardous, but ventilation is required during melt processing because lactide and oligomeric esters are evolved at temperatures above 230 °C. REACH 1907/2006 and RoHS 2011/65/EU declarations are available from the manufacturer for the unfilled resin system; sterilization and food-contact suitability are outside the published technical envelope of this filament grade.

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