| HS Code | 903443 |
| Productname | Ensinger TECAFIL PES natural - 1,75 mm - Filament Polyethersulfone |
| Manufacturer | Ensinger |
| Material | Polyethersulfone (PES) |
| Color | Natural |
| Filamentdiameter | 1.75 mm |
| Density | 1.37 g/cm³ |
| Glasstransitiontemperature | 225 °C |
| Heatdeflectiontemperature | 203 °C at 1.8 MPa |
| Continuousservicetemperature | 180 °C |
| Tensilestrength | 90 MPa |
| Tensilemodulus | 2700 MPa |
| Elongationatbreak | 20-30% |
| Waterabsorption | 0.7% after 24 h |
| Nozzletemperature | 350-390 °C |
| Bedtemperature | 160-180 °C |
| Dryingtemperature | 150 °C |
| Dryingtime | 4 h |
| Chemicalresistance | Good against acids, bases, and hydrocarbons |
| Flammability | UL94 V-0 |
As an accredited Ensinger TECAFIL PES natural - 1,75 mm - Filament Polyethersulfone factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | One 500 g spool of Ensinger TECAFIL PES natural 1.75 mm filament, vacuum-sealed with desiccant in a labeled cardboard box. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): Ensinger TECAFIL PES natural 1.75 mm filament palletized, secured, and stowed for safe ocean transport. |
| Shipping | Ensinger TECAFIL PES natural 1.75 mm filament is a non-hazardous solid polymer. It ships in sealed moisture-barrier bags with desiccant, packed in sturdy cartons. No special dangerous-goods handling is required; standard ground or air transport applies. Store dry, away from heat, moisture, and UV. Suitable for international shipping. |
| Storage | Store Ensinger TECAFIL PES natural filament in a cool, dry, well-ventilated area away from direct sunlight, heat, sparks, and open flames. Keep in its original sealed packaging or a dry cabinet with desiccant to prevent moisture absorption. Maintain moderate temperature, low humidity, and avoid dust. Label clearly and rotate stock. Do not store near incompatible materials. Protect from UV light. |
| Shelf Life | Shelf life is indefinite if kept sealed, dry, and protected from UV; use within 12 months for optimal print quality. |
Ensinger TECAFIL PES natural in 1.75 mm filament diameter is converted into short-run surgical instrument prototypes and sterilisation fixtures when the intended device must survive repeated 134 °C saturated steam exposure without losing dimensional order. The compliance framework for this downstream category is anchored to ISO 10993-1:2018 for biological evaluation planning, ISO 17665-1:2006 for moist heat sterilisation validation, ISO 13485:2016 for medical device quality systems, and FDA 21 CFR 177.2440 for polyethersulfone resins intended for repeat-use food-contact articles; because the natural grade is unfilled, the formulation addition ratio is 100 wt% virgin polyethersulfone with 0 wt% fibre, mineral, pigment, or external processing aid. For autoclavable load-bearing parts, slicing is specified with 5 solid top/bottom layers, 5 perimeters, 80% rectilinear infill, and an extrusion multiplier of 1.00–1.03 to compensate for melt-flow variation without overpacking perimeters that later crack during annealing. The downstream production process begins with drying the spool in a desiccant dryer at 150 °C for 4 h to below 0.02 wt% moisture, followed by high-temperature FFF on an all-metal hotend with a liquid-cooled extruder, a chamber maintained at 120–130 °C, nozzle temperature 360–370 °C, bed temperature 150–160 °C, 0.15 mm layer height, and print speed 20–40 mm/s. After removal from the build sheet, the parts are annealed at 200 °C for 2 h with a ramp rate not exceeding 1 °C/min on both heating and cooling to reduce extrusion-induced residual stress and to close microvoids at the interlayer boundaries. Terminal product types in this scenario are surgical instrument handles, sterilisation trays, retractor bodies, drill guides, and bone biopsy guide blocks; published data for the exact 1.75 mm TECAFIL PES natural build path under repeated steam cycling is limited, so batch-specific sterilisation aging must be conducted before release.
Wet-bench fixtures such as wafer guides, cassette rails, level sensor bodies, and tank weir plates are printed from unfilled PES because the resin resists dilute acid and hot deionised water attack better than many lower-temperature thermoplastics, while the absence of filler reduces particle shedding at machined tie points. The compliance record for this application centres on SEMI S2-0718 for semiconductor manufacturing equipment safety and ASTM D543-20 for chemical resistance screening of plastics; high-purity qualification of a specific filament lot requires ionic extraction testing according to the end-product specification, and published data for this exact 1.75 mm filament build configuration is limited. The formulation addition ratio is 100 wt% unfilled PES with 0 wt% conductive additive; parts are sliced at 100% infill, 6 perimeters, and 0.15 mm layer height to minimise interconnected porosity that would trap process chemistry at wafer-contact edges. The downstream production route starts with drying at 150 °C for 4 h, then high-temperature FFF at nozzle 365 °C, bed 160 °C, chamber 130 °C ±5 °C, and print speed 25–35 mm/s, followed by a 2 h stress-relief anneal at 180 °C. The critical process conflict is chamber temperature against part flatness: below 120 °C large weir plates delaminate at the laminate interfaces, while above 140 °C the amorphous resin becomes difficult to support on polyimide build sheets. Because unfilled PES in FDM has anisotropic tensile response, X-Y tensile strength is typically 50–70% of injection-moulded PES when tested under ISO 527-2:2012, and Z-axis interlayer tensile strength may be lower by 30–50%; tensile coupons must therefore be printed and tested per spool lot. Chemical incompatibility boundaries are narrow: ketones, esters, methylene chloride, and polar aromatic solvents stress-crack the material, and immersion in 5% sodium hydroxide above 60 °C may create surface microcrazing in thick printed sections. Terminal product types are wafer guides, cassette rails, tank weir plates, clamp handles, and level sensor bodies.
In aircraft cabin retrofit programs, the production of cable clips, clamp blocks, and air-duct brackets shifts from injection moulding to short-run filament deposition when legacy part numbers are discontinued or when replacement demand is below the economic lot size of a mould tool. The compliance checklist for this category is driven by 14 CFR 25.853(a) for the 12-second vertical Bunsen burner test, UL 94 V-0 at 1.5 mm thickness, and ASTM D638-14 for tensile verification of printed coupons. The material/additive ratio is 100 wt% unfilled natural PES with 0 wt% halogenated or phosphorus flame retardant, meaning the vertical burn rating is an inherent resin property rather than a functional additive effect; typical slicing uses 4 perimeters, 70% infill, 0.20 mm layer height, and an extrusion multiplier of 1.00. Downstream processing requires drying at 150 °C for 4 h, printing at nozzle 360 °C, bed 150 °C, chamber 120–130 °C, and no part-cooling fan above 50% duty cycle; after printing, support interface surfaces are machined or hand-fitted, and thin-walled clip features are annealed at 180 °C for 1 h to improve interlayer cohesion. Terminal product types are replacement cable clips, clamp blocks, duct brackets, panel spacers, and connector shroud clips. Published data for printed PES fuel vapour contact is limited; these parts are not specified for continuous liquid fuel contact.
Across chlor-alkali and sulfuric acid pilot skids, short-run unfilled PES filament is converted into pump volute prototypes, valve stem guides, flow straightener prototypes, and manifold test pieces when the process stream operates at acid concentrations and temperatures that are outside the safe service window of glass-filled nylons and standard ABS test parts. The compliance identity of the material is defined by ISO 1043-1:2011 as PES, and chemical resistance screening is performed under ASTM D543-20; the EU market entry position for the filament is covered by REACH Regulation (EC) No 1907/2006, and the natural unfilled grade contains 0 wt% glass fibre, carbon filler, or colourant, so the printed part does not create a glass-fibre wicking path for corrosive media. The resin-to-additive ratio is therefore 100 wt% unfilled polyethersulfone; the build specification uses 100% infill, 5 perimeters, 0.15 mm layer height, and an extrusion multiplier of 1.02 to reduce void volume at the wetted surface. The downstream production sequence is high-temperature FFF at nozzle 365–370 °C, bed 155 °C, chamber 130 °C, and print speed 25 mm/s, followed by a two-stage anneal at 190 °C for 2 h and a slow cool at 0.5 °C/min; after annealing, o-ring grooves and flange faces are finish-machined with carbide tooling and no coolant flood that would introduce solvent stress cracking. Terminal product types are pump volute prototypes, valve stem guides, flow straightener prototypes, manifold test pieces, and sensor protection housings. Ketones, NMP, dimethylformamide, methylene chloride, and hot concentrated nitric acid are incompatible with PES and must be kept away from processed parts.
When a laboratory switches from machined polysulfone bar stock to printed PES for autoclave-rated fixtures, the primary evaluation is not tensile strength but the ability of the extruded laminate to remain flat and free of microcracks after repeated 134 °C steam exposure. The compliance framework for these fixtures is ISO 17665-1:2006 for steam steriliser validation, ISO 15883-1:2006 for washer-disinfectors, and FDA 21 CFR 177.2440 for repeat-use resin; the resin-to-additive ratio is 100 wt% unfilled PES with 0 wt% pigment, meaning the natural amber colour is not obtained from an organic dye that could migrate during autoclave cycling. The parts are sliced with 85% infill, 5 perimeters, and 0.18 mm layer height to balance stiffness against moisture ingress at raster boundaries. The downstream production process uses drying at 150 °C for 4 h, nozzle 360 °C, bed 150 °C, chamber 125 °C, and a print speed of 30 mm/s; after printing, the fixtures are annealed at 200 °C for 2 h to reduce residual stress and then machined only with sharp, low-feed carbide cutters. Terminal product types are autoclave racks, bottle carriers, centrifuge tube supports, pH electrode holders, and filter manifold jigs. The printed PES fixture should be inspected for edge delamination after repeated steam cycles because interlayer notch sensitivity is higher than machined polysulfone sheet, and no universal cycle limit can be stated for this exact filament configuration without lot-specific testing.
High-voltage insulation parts such as terminal blocks, coil formers, insulating bushings, arc barriers, and sensor housings are produced from unfilled PES when the electrical assembly must survive a glow-wire event without dripping and without releasing conductive carbon black. The compliance envelope for this category includes UL 94 V-0 at 1.5 mm, IEC 60695-2-11 glow-wire testing, IEC 60112:2020 for comparative tracking index, ASTM D257-14 for surface resistivity, and RoHS Directive 2011/65/EU for restricted substances. The compounding formula for this application is 100 wt% unfilled polyethersulfone with 0 wt% conductive filler; to maintain dielectric homogeneity, the slicing profile uses 100% infill, 5 perimeters, 0.20 mm layer height, and no variable extrusion multiplier. The downstream production route is drying at 150 °C for 4 h, high-temperature FFF at nozzle 360 °C, bed 150 °C, chamber 120 °C, and print speed 25 mm/s, followed by a 2 h stress-relief anneal at 200 °C and a final thread-tapping or insert-moulding operation for fastener retention. Operational boundaries should be stated: unfilled PES under continuous mechanical load above its glass transition temperature near 225 °C will creep, so electrical insulators functioning as load-bearing standoffs are limited to service temperatures below 180 °C. Published data for comparative tracking index values on the exact 1.75 mm filament build direction is limited; printed test plaques must be verified per lot.
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Ensinger TECAFIL PES natural – 1.75 mm – Filament Polyethersulfone is an unfilled polyethersulfone monofilament produced for fused filament fabrication of high-temperature thermoplastic components. The “natural” grade designation indicates an unpigmented, transparent amber appearance; the polymer backbone contains alternating ether and sulfone linkages, giving the material an amorphous morphology and a high glass-transition temperature. The filament is specified at a nominal diameter of 1.75 mm with a manufacturer datasheet diameter tolerance of ±0.05 mm. Published density for the PES grade is 1.37 g/cm³ to ISO 1183-1. Glass transition temperature is typically reported at 225 °C by differential scanning calorimetry to ISO 11357-2. Typical mechanical values reported for the base polymer or filament according to ISO 527-2 include tensile modulus near 2,800 MPa, tensile stress at break near 85 MPa, and elongation at break near 6%. Heat deflection temperature under 1.8 MPa is reported near 205 °C to ISO 75-2, and Vicat softening temperature is reported near 215 °C to ISO 306. The amorphous character reduces crystalline shrinkage relative to PEEK or polyamide, but melt processing must be controlled to avoid thermal degradation and residual stress.
Moisture absorption at saturation is approximately 2.1% by weight when tested to ISO 62 at 23 °C. The filament should not be considered process-ready from a newly opened spool unless the package contains desiccant and a vacuum barrier; after exposure to ambient air at relative humidity above 60%, pre-drying is required. Residual moisture above 0.02 wt% entering the hot end can hydrolytically degrade the sulfone backbone and produce gas voids, splay, and reduced interlayer weld strength. The glass-transition temperature of 225 °C defines the lower boundary for chamber and bed heating, while the upper boundary is set by discoloration, gel formation, and crosslinking when melt temperature exceeds 380 °C for extended residence. The unfilled grade has a reported tensile modulus near 2,800 MPa and tensile stress at break near 85 MPa to ISO 527-2; these values apply to conditioned test specimens and may shift downward in printed parts with incomplete interlayer fusion. Hardness, abrasion resistance, and long-term creep data for printed PES are less complete than injection-molded reference data, so load-bearing designs should use injection-molded PES datasheets as conservative starting points whenever printed-part validation has not been performed.
Because the material is amorphous, drying conditions must be more aggressive than those used for PLA or PETG but are comparable to PEI and polycarbonate. Water removal occurs by diffusion through the filament cross-section, so pre-drying at 150 °C for 4 h to 6 h in a desiccant dryer with a dew point below -30 °C is recommended for filament spools. Circulating-air ovens can be used only if the spool is loosely wound or if the spool is rotated to expose the filament surface uniformly; dense spools may require 6 h or longer because the diffusion path length is set by the winding depth rather than the 1.75 mm filament diameter. After drying, spools should be transferred to a sealed feed box purged with dry air or nitrogen and maintained below 20% RH at 25 °C during printing. A spool left in ambient air at 50% RH can regain enough surface moisture within a few hours to produce cosmetic splay and weak layer adhesion, which is a stricter handling requirement than for many lower-temperature filaments.
For PES, the processing window is narrow and thermal homogeneity across the build volume is critical. Extrusion-based FFF requires an all-metal hot end rated to at least 400 °C, with nozzle temperature set between 360 °C and 380 °C. Build chamber temperature should be held at 120 °C minimum, with 140 °C preferred for larger parts; bed temperature is normally 140 °C to 160 °C. Layer heights from 0.10 mm to 0.20 mm and print speeds from 20 mm/s to 40 mm/s are used, with volumetric flow limited to avoid excessive shear heating. At chamber temperatures below 120 °C, the high glass transition produces steep thermal gradients through the part, leading to edge lifting, corner curl, and interlayer delamination. In production-scale filament extrusion, the melt temperature profile is typically zoned from 340 °C at the feed throat to 360–370 °C at the metering zone and die, with melt pressure held stable by closed-loop diameter gauging and haul-off tension. On single-screw filament extrusion lines with L/D ≥ 24:1, melt-temperature overshoot or excessive backpressure can produce diameter wander and surface microvoiding; closed-loop laser diameter control is used to maintain ±0.05 mm tolerance.
Interlayer failure in PES is primarily a consequence of insufficient local polymer diffusion across the weld plane. The weld temperature must remain above the glass transition for enough time to allow chain interdiffusion, but the high melt viscosity of PES limits molecular mobility at temperatures just above 225 °C. Raising nozzle temperature beyond 380 °C can reduce melt viscosity, but it also accelerates thermal degradation and crosslinking. The processing compromise is to operate at 360–380 °C, use a high-temperature chamber, and minimize layer cooling time by disabling part-cooling fans or by using a controlled low-volume fan only for small features. Residual stress is also influenced by part geometry: abrupt thickness changes, sharp corners, and large planar areas increase delamination risk because differential shrinkage concentrates tensile stress at the interlayer boundary. When PES is printed on open-bed machines without a chamber, published data for reliable large-part fabrication is limited because the required ambient temperature cannot be maintained.
Printing support structures for PES require separate consideration. Soluble supports that dissolve in alkaline water may not survive the 140 °C chamber temperature, and some support materials may be attacked by PES processing temperatures. Breakaway supports printed from PES or from a high-temperature modified polysulfone are generally more practical. If support material is left in place during annealing, thermal expansion differences can distort thin walls; supports should therefore be removed before post-printing thermal treatment unless the support material has been verified for matched thermal expansion.
Compared with polysulfone, TECAFIL PES natural raises the glass transition by about 35 °C and improves stiffness and high-temperature load-bearing capacity, but it also raises nozzle and chamber setpoints and reduces notched impact strength. Published PSU values typically place glass transition near 190 °C and heat deflection temperature near 170 °C, whereas PES is reported at 225 °C and 205 °C respectively. PPSU has a similar glass transition but significantly higher notched impact and better resistance to repeated steam autoclaving; PES may be selected when higher modulus or creep resistance is required, but sharp corners and notches should be designed with larger radii because PES is notch-sensitive. PEI is the closest processing analogue, with typical nozzle temperatures near 350–370 °C and chamber temperatures above 120 °C; PES offers a similar processing envelope and can replace PEI when sulfone-based chemical resistance or different transparency is required. Compared with PEEK, PES does not require crystallization management and can be processed at a lower nozzle temperature, but PEEK retains superior continuous-use temperature, fatigue resistance, and chemical resistance. The absence of a crystalline melting point in PES means that solidification occurs by vitrification rather than crystallization, so warpage is lower than PEEK but stress relaxation and solvent sensitivity must still be controlled.
Material substitution should be based on operating temperature, chemical exposure, mechanical load, and sterilization requirement. PES is a candidate for short-run high-temperature fixtures, autoclave-tolerant guides, electronic test sockets, and under-hood covers where printed geometry must retain stiffness above 150 °C. It should not be selected for applications requiring high notched impact at room temperature or for contact with polar aprotic solvents. When replacing PEI with PES, the chamber and bed settings are similar, but PES may require longer drying and more careful support removal because of its moisture uptake and notch sensitivity. When replacing PSU with PES, the higher glass transition extends the upper use temperature but narrows the processing window and increases the probability of stress-cracking if residual thermal stress is not annealed. Published data for this specific configuration in cyclic load-bearing FFF applications is limited; performance must be verified with printed test coupons under the expected thermal and chemical service conditions.
Printed PES parts can be annealed at 180 °C for 2 h in an air-circulating oven; the parts should be supported and heated slowly to avoid distortion. The grade has hydrolytic resistance at elevated temperature and is generally compatible with 134 °C steam autoclave cycles, but published data for the specific performance of FFF parts after repeated sterilization is limited. Microvoids and interlayer weld lines may reduce sterilization robustness compared with injection-molded PES, especially if the printed part contains under-extruded regions or poor layer bonding. The material resists many aqueous acids, bases, and aliphatic hydrocarbons, but polar aprotic solvents such as N-methyl-2-pyrrolidone, dimethylformamide, and dimethyl sulfoxide, chlorinated hydrocarbons such as methylene chloride, and ketones such as acetone and methyl ethyl ketone cause swelling or stress-cracking, particularly under residual thermal stress. PES should not be assembled with aggressive solvent-borne adhesives or cleaned with ketone-based solvents unless compatibility has been verified with the specific part geometry and loading.
