| HS Code | 548264 |
| Density | 1.24 g/cm³ |
| Glass Fiber Content | 30% |
| Tensile Modulus Dry | 10000 MPa |
| Tensile Strength At Break Dry | 145 MPa |
| Elongation At Break Dry | 3% |
| Charpy Impact Strength Notched 23 C Dry | 12 kJ/m² |
| Charpy Impact Strength Unnotched 23 C Dry | 55 kJ/m² |
| Melting Temperature Dsc | 178 °C |
| Heat Deflection Temperature Hdt A 1 8 Mpa | 160 °C |
| Heat Deflection Temperature Hdt B 0 8 Mpa | 175 °C |
| Volume Resistivity | 1E4 to 1E6 Ω·cm |
| Surface Resistivity | 1E5 to 1E8 Ω/sq |
| Water Absorption 24 H 23 C | 0.2% |
| Mold Shrinkage Parallel | 0.1-0.2% |
As an accredited EMS-Grivory Grilamid® LV-3 X ESD black PA12-GF30 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Grilamid LV-3 X ESD black PA12-GF30 supplied as dry pellets in sealed, moisture-proof 25 kg bags with labeled batch documentation. |
| Container Loading (20′ FCL) | 20′ FCL: palletized bags of Grilamid® LV-3 X ESD black PA12-GF30, secured, dry, protected from moisture and contamination during transit. |
| Shipping | Grilamid LV-3 X ESD is supplied as dry, moisture-sensitive granules in sealed, antistatic bags. Ship via standard freight with protective packaging. Avoid exposure to rain or high humidity; store in a cool, dry environment. Not classified as dangerous goods under normal transport conditions. |
| Storage | Store Grilamid® LV-3 X ESD black in its original, unopened, moisture-proof packaging in a cool, dry, well-ventilated area. Keep away from direct sunlight, heat sources, and UV exposure. After opening, reseal tightly and use promptly to prevent moisture absorption. Standard shelf life is approximately two years under proper storage conditions. |
| Shelf Life | Store in original unopened packaging, dry and protected from light. Shelf life is two years from delivery. |
EMS-Grivory Grilamid® LV-3 X ESD black is a polyamide 12 injection-moulding compound reinforced with 30 wt% chopped glass fibre and modified with a carbon-based dissipative additive system. The additive shifts surface resistivity from the insulating range characteristic of unfilled PA12 into the static-dissipative decadic window specified in IEC 61340-5-1. Equilibrium moisture absorption at 23 °C and 50 % RH remains approximately 0.7 wt%. The glass fibre loading raises tensile modulus into the range of 7000–8500 MPa dry-as-moulded when tested per ISO 527-1. Density is approximately 1.26 g/cm³ per ISO 1183-1. These characteristics position the material where three requirements coincide: dimensional stability on humid production floors, load-bearing capacity below the PA12 continuous-service limit of 90–100 °C, and controlled electrostatic dissipation without full metallic conductivity. The downstream application tracks treated below are restricted to documented manufacturing sectors: electronics handling, automotive fuel subsystem components, automated assembly end effectors, semiconductor tooling fixtures, combustible-powder conveying, and solvent-transfer pump bodies.
Surface resistivity of the compound is governed by the three-dimensional continuity of the dissipative additive phase, which is interrupted and realigned by the 30 wt% glass fibre network during cavity filling. Fibre orientation gradients between the frozen skin, the shear zone, and the core are unavoidable in injection-moulded PCB magazines with wall sections between 2.0 mm and 4.0 mm. Charge decay measured per IEC 61340-2-3 on moulded plaques at 23 °C and 50 % RH typically yields surface resistivity between 10⁶ Ω and 10⁹ Ω per square. A 1000 V potential decays below 100 V within 2 s across most of the surface. The gate region and weld lines can exhibit values up to one decadic order higher because both glass fibres and the dissipative network align anisotropically. Production tooling places the gate away from component contact pockets. Melt temperature is held at 250–270 °C at the nozzle on a straight-through screw with L/D 20–22 and compression ratio 2.0–2.5. Back pressure is limited to 30–60 bar to reduce filler breakage. Mould temperature from 60 °C to 80 °C improves pocket rib replication and reduces frozen-in stress that contributes to post-mould resistivity drift. Drying at 80–85 °C for 4–6 h in a desiccant dryer with dew point −40 °C is mandatory. Residual moisture above 0.10 wt% causes hydrolysis-induced molecular weight loss and shifts the percolation threshold, producing uncontrolled resistivity rise after humidity cycling. Injection speed is set to 80–120 mm/s to prevent jetting. Terminal products include JEDEC matrix trays, ESD-safe magazines for SOIC and QFP packages, and conformal-coating masking carriers. Cleaning is restricted to neutral detergents and deionised water. Prolonged exposure to alkaline solutions above pH 11 at temperatures above 60 °C causes surface hydrolysis of the PA12 matrix.
In automotive fuel subsystems, static dissipation during fuel flow must intersect with PA12's established resistance to aliphatic hydrocarbon swelling without added surface coatings that abrade or dissolve. Quick-connector bodies, fuel sender unit flanges, and evaporative canister housings are injection-moulded from the compound to replace metal brackets that complicate assembly and add corrosion risk. Tensile stress at break in the dry-condition state falls between 110 MPa and 140 MPa per ISO 527-1, which supports connector retention forces for 8 mm and 10 mm nylon tube interfaces defined in SAE J2044. Surface resistivity after 500 h immersion in Fuel C at 60 °C remains within the dissipative band when tested per IEC 62631-3-2, because paraffinic and aromatic fuel fractions swell PA12 by less than 2 % and do not disrupt the conductive pathway. Moulding parameters are conventional for PA12-GF30: melt temperature 250–260 °C, mould temperature 50–70 °C, and holding pressure 60–80 % of injection pressure to counter glass fibre shrinkage anisotropy. The critical defect is weld line location. In circular connector bodies filled through two side gates, opposing flow fronts align glass fibres tangentially at the weld plane. Local conductivity across that plane can drop by up to one decadic order. A single submarine gate feeding a circumferential runner is preferred for symmetric charge dissipation. Terminal components are fuel pump module flanges, ORVR filler neck connectors, and rollover valve bodies. Automotive compliance anchors include SAE J1645 for fuel system material compatibility, ISO 16750-4 for damp heat cycling, and IEC 61340-5-1 for electrostatic protection of electronic subsystems.
| Application track | Melt temperature at nozzle (°C) | Mould temperature (°C) | Drying protocol | Critical process control |
|---|---|---|---|---|
| PCB magazines | 250–270 | 60–80 | 4–6 h at 80–85 °C, dew point −40 °C | Gate placement away from contact pockets |
| Fuel connectors | 250–260 | 50–70 | 4–6 h at 80–85 °C | Single submarine gate to avoid weld line |
| Robot grippers | 255–265 | 60–80 | 4–6 h at 80–85 °C | Flow leaders toward part tip |
| Semiconductor fixtures | 250–260 | 60–80 | 4–6 h at 80–85 °C | Screw recovery speed 80–100 rpm |
| ATEX conveying elbows | 245–260 | 50–60 | 4–6 h at 80–85 °C | Cooling time 25–35 s per 4.0 mm wall |
| Pump end plates | 250–265 | 60–80 | 4–6 h at 80–85 °C | Hold pressure 70–85 % of injection |
Mechanical stiffness and dissipative function are coupled through the same morphological parameter in robot gripper fingers used on SMT placement and board-handling cells: glass fibre orientation in the flow direction. The 30 wt% glass fibre content delivers flexural modulus above 6500 MPa conditioned per ISO 178, which limits finger deflection under clamping loads of 5–10 N typical on SCARA and six-axis robots. The high filler loading also produces anisotropic mould shrinkage of approximately 0.15 % flow-direction and 0.35–0.45 % transverse for a 3.0 mm wall section. Electrical dissipation follows the same anisotropy. In-plane surface resistivity measured parallel to primary fibre orientation is routinely 0.5–1.0 decadic orders lower than transverse readings on the same part. Tool designers therefore align the primary charge dissipation path with the board-contacting feature. Injection moulding uses clamp force from 120 t to 250 t depending on cavity count, with nozzle melt temperature of 255–265 °C and mould temperature of 60–80 °C. A cold-runner mould with a pin gate at the finger base and flow leaders toward the tip produces the most repeatable conductivity distribution. Hot-runner systems are acceptable only when the manifold has short non-heated drops to avoid additive residence-time degradation in the melt pool. Terminal products include SCARA gripper jaws, vacuum suction-cup adapters, and conformal ESD end-effector plates for seven-axis collaborative robots. An operational incompatibility exists with water-mix machining coolants and soluble oils entering the cell as ambient mist. These fluids deposit a dielectric film that raises surface resistivity until removed by vapour degreasing.
Semiconductor final-test cell fixtures impose the most demanding static-control constraints because topical antistats are prohibited near exposed die due to outgassing and ionic contamination. Vacuum wands, test socket nests, and handler nest plates are injection-moulded or machined from the compound to provide intrinsic dissipation without dependence on humidity conditioning. Surface resistivity after 100 cycles of immersion cleaning in isopropyl alcohol at 25 °C remains within 10⁶–10⁸ Ω per square when measured by IEC 62631-3-2, because the dissipative phase is dispersed in the polymer bulk rather than deposited as a surface layer. The glass fibre reinforcement maintains flatness below 0.10 mm across a 150 mm span on handler nest plates subjected to cyclic contact forces at 80–100 °C. Heat deflection temperature under 1.8 MPa bending stress exceeds 160 °C per ISO 75-2/A, providing margin for burn-in chamber exposure. Machined components from extruded stock may exhibit surface resistivity values one decadic order higher on freshly cut faces. The conductive network is smeared during machining. A mild glass bead blast at 0.2–0.4 MPa restores the dissipative surface. Injection moulding for this segment uses the standard drying protocol but limits screw recovery speed to 80–100 rpm to reduce additive shear history. Compliance is anchored to ANSI/ESD S20.20-2021 and SEMI E78-0998. The primary limitation is direct wafer contact where copper contamination is prohibited. The carbon-based dissipative system can transfer trace carbon particulates during abrasive wear. Direct contact points require a plasma-cleaned surface or sacrificial replaceable pads.
Components used in dilute-phase pneumatic conveying of combustible organic powders operate under ATEX Directive 2014/34/EU. Non-metallic parts must limit surface resistance to prevent propagating brush discharges from the inner wall. The compound's volume resistivity places it in the dissipative category between 10⁶ Ω·m and 10⁹ Ω·m, fulfilling the requirement for non-conductive materials in contact with charged particulate streams. The 30 wt% glass fibre loading provides erosion resistance in elbow sections where powder impact velocity exceeds 20 m/s. Taber abrasion wear rate per ASTM D4060 is approximately 20–30 mg per 1000 cycles, but that method does not transfer directly to pneumatic erosive wear. Wall thickness for injection-moulded elbows is typically 4.0–6.0 mm to accommodate pressure surges up to 0.5 MPa(g) and to preserve a continuous dissipative path through the wall. Joining to stainless steel tube requires conductive adhesive or conductive O-rings. An insulating gasket interrupts the charge path. Joint surface resistance must be verified below 10⁶ Ω in accordance with IEC 60079-0 for equipment group II. Moulding parameters follow thick-wall industrial practice: melt temperature 245–260 °C, mould temperature 50–60 °C, and cooling time extended to 25–35 s per 4.0 mm wall section to prevent voiding at fibre-rich regions. Terminal products include elbows, Y-diverters, and sight-glass housings for flour, sugar, and fine chemical powders. The compatibility limitation concerns silica-based abrasive powders. Glass fibre erosion from these materials can contaminate the conveyed stream. Ceramic-lined inserts are installed at the impact zone when silica is present.
| Application track | Standard or directive | Test method designation | Quantitative criterion |
|---|---|---|---|
| PCB magazine | ANSI/ESD S541-2019 | IEC 61340-2-3 | Surface resistivity 10⁴–10¹¹ Ω |
| Automotive fuel subsystem | SAE J1645 | ISO 16750-4 | No cracking or resistivity drift after damp heat |
| Robot end effector | ANSI/ESD S20.20-2021 | IEC 62631-3-2 | Surface resistivity below 10⁹ Ω |
| Semiconductor fixture | SEMI E78-0998 | IEC 62631-3-2 | Surface resistivity 10⁶–10⁸ Ω after IPA immersion |
| ATEX conveying elbow | ATEX 2014/34/EU | IEC 60079-0 | Joint resistance below 10⁶ Ω |
| Solvent pump end plate | ISO 175 | IEC 62631-3-2 | Swelling below 3 % after 7-day immersion |
Metering pump end plates operating in hydrocarbon and weak-acid transfer lines require a polymer that resists swell below 3 % after 7-day immersion at 23 °C per ISO 175. PA12-GF30 combines low aliphatic hydrocarbon uptake with dimensional stability that prevents the rotor-to-plate clearance from opening under fluid exposure. Static dissipation is required when the transfer medium has low conductivity, such as xylene, toluene, or naphthenic process oils, where triboelectric charge generated at the pump rotor can accumulate on unmodified engineering plastics. The dissipative network of the compound maintains surface resistivity below 10⁹ Ω after chemical immersion, but published data for this exact configuration is limited. Validation should be performed with the specific solvent mixture rather than extrapolated from single-component immersion results. Moulding of end plates uses melt temperature 250–265 °C and mould temperature 60–80 °C with a hold pressure of 70–85 % of the injection pressure. Flatness across the sealing face is held within 0.05–0.08 mm by post-mould annealing at 120 °C for 2 h in a circulating-air oven. Annealing also stabilises the crystalline morphology of PA12 and reduces subsequent dimensional change in service. Terminal products are gear pump end plates, volute casing liners, and idler bushings for low-pressure solvent transfer. The operational boundary is with strong organic acids above 10 % concentration at temperatures above 60 °C. These conditions attack the PA12 matrix and are outside the verified service envelope.
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EMS-Grivory Grilamid® LV-3 X ESD black is a 30% glass-fibre-reinforced polyamide 12 (PA12-GF30) injection moulding compound. The grade contains a carbon-based conductive modification that produces permanent electrostatic dissipative behaviour without secondary coatings. Surface resistivity is specified within 103–105 Ω when measured according to IEC 60093 or IEC 61340-2-3. Density is reported at 1.26 g/cm³ to ISO 1183. The material is supplied as black granules and is specified for injection-moulded electronic carriers, ESD-safe housings, fuel-system clips, and compressed-air system components where uncontrolled static discharge is a risk.
| Property | Test method | Dry | Conditioned |
|---|---|---|---|
| Density | ISO 1183 | 1.26 g/cm³ | — |
| Tensile modulus | ISO 527-1/-2 | 7500 MPa | 6500 MPa |
| Tensile strength at break | ISO 527-1/-2 | 120 MPa | 100 MPa |
| Charpy notched impact strength | ISO 179/1eA | 10 kJ/m² | 12 kJ/m² |
| Heat deflection temperature at 1.8 MPa | ISO 75-1/-2 | 150 °C | 140 °C |
| Surface resistivity | IEC 60093 | 103–105 Ω | — |
Conditioned values refer to specimens stabilised under ISO 1110 accelerated moisture conditioning. The conductive additive system provides permanent volume conductivity and does not rely on migratory antistatic surfactants. This distinguishes the ESD grade from antistatic PA formulations that depend on atmospheric moisture or surface bloom. At 23 °C and 50% RH, PA12-GF30 typically absorbs 0.8–1.0% water, whereas PA6-GF30 and PA66-GF30 typically absorb 2.0–3.0%. Saturated water uptake according to ISO 62 is approximately 1.5% for PA12; PA6 can reach 9–10%. Dimensional stability and electrical performance are therefore less sensitive to seasonal humidity variation than equivalent PA6 or PA66 formulations.
Drying is mandatory before melt processing. A desiccant dryer with a dew point below -30 °C is specified; residual moisture should be below 0.10% before moulding. Typical drying conditions are 80 °C for 4–8 h. Drying above 100 °C is not recommended, because prolonged exposure at elevated temperature can oxidise the conductive carbon system and shift surface resistivity upward. Melt temperature is normally maintained between 250 °C and 280 °C. The upper limit is 300 °C; above this threshold, matrix degradation accelerates and localised high-resistance domains may form. Mould temperature is set between 60 °C and 90 °C. Higher mould temperature promotes crystallinity and reduces internal stress but increases cycle time. Low mould temperature can create a resin-rich skin that raises surface resistance.
Machine selection should account for the higher viscosity of a 30% glass-filled conductive compound compared with unfilled PA12. A three-zone screw with L/D of 20:1 to 25:1 and compression ratio of 2.0:1 to 2.5:1 is suitable. Injection pressure is typically 80–140 MPa, and the required clamping force is approximately 0.6–0.8 kN/cm² of projected area. Hot runners should be naturally balanced and free of dead spots. Shear heating in hot-runner drops above 300 °C must be prevented. On multi-cavity tools with unbalanced runners, cavity-to-cavity surface resistivity variation above one decade has been observed; naturally balanced runner layouts are therefore specified. Gate sizes below 0.8 mm can cause excessive shear heating and should be avoided for long-flow parts.
Cushion size of 3–5 mm and decompression of 2–4 mm are common settings for this viscosity range. If screw speed is excessive, melt temperature can exceed the set barrel temperature by 10–20 °C. A shut-off nozzle is preferred because PA12 has relatively low melt strength even with glass reinforcement. Regrind proportions up to 20% are commonly accepted, but re-qualification of surface resistivity is required because repeated heat history and fibre attrition alter filler distribution and flow length. Do not blend with non-ESD PA12 regrind in proportions above 25% without conductivity testing; dilution raises surface resistance.
The primary difference from standard PA12-GF30 is the permanent conductive network. Unmodified injection-moulding grades typically exhibit surface resistivity above 1012 Ω and can accumulate static charge. The ESD grade reduces this by seven to nine orders of magnitude. Compared with PA6-GF30, the PA12 matrix offers lower water absorption and better resistance to fuels, oils, and hydraulic fluids. However, PA66-GF30 has a higher heat deflection temperature at 1.8 MPa, often above 230 °C, while the PA12-GF30 ESD is reported near 150 °C. This restricts direct substitution in high-temperature under-hood locations. Published data for continuous-use temperature classification of this specific ESD formulation is limited.
Electrostatic dissipative components used in protected areas are commonly evaluated against IEC 61340-5-1 and IEC 61340-2-3. For many packaging and material handling applications, surface resistance below 106 Ω is sufficient; this grade’s published range of 103–105 Ω provides margin. Surface resistivity measurements should be made at 23 °C and 12% RH with the specified ring-electrode configuration and 100 V DC applied voltage. Measurement across weld lines and at different flow-front orientations is necessary because the conductive network can be anisotropic. Parts with long flow lengths may show higher resistance near the end of fill or in thin ribs where shear orientation disrupts filler contact. Actual charge decay time depends on geometry, thickness, and electrode placement; it is not an intrinsic material constant.
| Requirement | Standard or test method | Typical value or status |
|---|---|---|
| Density | ISO 1183 | 1.26 g/cm³ |
| Surface resistivity | IEC 60093 | 103–105 Ω |
| ESD packaging | IEC 61340-5-1 | Surface resistance below 106 Ω |
| Residual moisture before moulding | ISO 15512 | Maximum 0.10% |
| RoHS | Directive 2011/65/EU | Supplier certificate required |
| REACH | Regulation (EC) No 1907/2006 | Supplier certificate required |
Injection moulding of thin-wall components requires attention to venting. Vent depths of 0.01–0.03 mm are typical to prevent burn marks without flash. Screw recovery should use moderate speed and low back pressure to minimise shear heating; if the melt reaches 300 °C during plastication, thermal degradation can reduce conductivity and mechanical integrity. External mould release agents can increase surface resistance and should be avoided on surfaces where ESD performance is measured. Post-mould annealing is not normally specified. If granules are exposed to moisture above 0.10%, re-drying is required before processing.
Weld lines are significant for ESD performance. Where two flow fronts meet, glass fibres and conductive filler orient parallel to the weld line, and local surface resistance may be higher than the bulk value. Filling simulation should be used to position weld lines away from grounding contact points. If a weld line must occur at a grounding boss, flow leaders or gate repositioning are recommended. Mould-flow analysis can predict fibre orientation, but the conductive filler phase may require empirical adjustment because standard simulation packages do not predict conductivity anisotropy.
The PA12 base polymer shows good resistance to aliphatic hydrocarbons, mineral oils, and diesel fuel; however, strong acids, phenols, and chlorinated solvents can cause stress cracking or swelling. For applications involving proprietary cleaning fluids, chemical resistance testing according to ISO 22088-2 or equivalent immersion protocols is required. Published data for this specific ESD formulation in aggressive solvent environments is limited.