| HS Code | 587555 |
| Base Resin | PA12 |
| Reinforcement | Glass fiber, 23% |
| Esd Type | Electrostatically dissipative |
| Density | 1.22 g/cm³ |
| Tensile Modulus | 9000 MPa |
| Tensile Strength At Break | 130 MPa |
| Elongation At Break | 3% |
| Flexural Modulus | 7800 MPa |
| Flexural Strength | 160 MPa |
| Charpy Notched Impact Strength | 8 kJ/m² |
| Melting Point | 178 °C |
| Heat Deflection Temperature 1 8 Mpa | 150 °C |
| Surface Resistivity | 10^6 – 10^9 Ω/sq |
| Water Absorption 24h | 0.1% |
As an accredited EMS-Grivory Grilamid® LV-23 ESD PA12-GF23 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | EMS-Grivory Grilamid® LV-23 ESD PA12-GF23 is supplied in sealed, moisture-protective 25 kg foil bags. |
| Container Loading (20′ FCL) | 20′ FCL: packed in 25kg bags on pallets, shrink-wrapped, securely loaded for safe transport. |
| Shipping | Grilamid® LV-23 ESD PA12-GF23 ships as sealed, moisture-barrier bags of pellets to protect its low-absorption PA12 matrix. Keep containers dry and avoid puncturing; ESD-safe handling is recommended due to static-dissipative additives. Store below 30°C. Transport via standard freight, protecting from impact and humidity. |
| Storage | Store Grilamid® LV-23 ESD in its original, sealed packaging in a cool, dry area away from direct sunlight and heat sources. Keep the material protected from moisture and humidity to prevent re-absorption, which can affect processing and ESD properties. Use within the recommended shelf life, and reseal any partial containers tightly. |
| Shelf Life | Store in a dry, cool place away from sunlight. Shelf life is typically 2 years from delivery when stored properly. |
Semiconductor wafer transport requires a compound whose surface resistivity remains below 1×10^11 Ω per IEC 61340-5-1:2016 without sacrificing dimensional stability under thermal cycling from 20 °C to 120 °C in front-end cassettes. In EMS-Grivory Grilamid® LV-23 ESD PA12-GF23, the 23 wt% glass-fibre reinforcement reduces longitudinal mould shrinkage to approximately 0.15–0.35 % according to ISO 294-4, while the conductive additive package renders the material static-dissipative. Production-scale injection moulding of 300 mm wafer carrier components on a 1,500 kN hydraulic press has shown that uncontrolled moisture uptake above 0.10 % prior to melting causes surface resistivity to drift from lot to lot, because hydrolytic degradation of the polyamide 12 matrix redistributes the conductive phase. The prescribed drying regime is 80 °C for 4–6 h in a desiccant dryer to a residual moisture of 0.08 % or lower; the drying-air dew point should be -30 °C or drier. Melt temperature is maintained between 250 °C and 280 °C, with maximum residence time at melt temperature limited to 8 min to avoid viscosity shift from polymer degradation. Injection speed is set at 50–150 mm/s for thick carrier walls; shear rates above approximately 10,000 s⁻¹ at the gate can orient glass fibres and create anisotropic surface conductivity, with the conductive network less continuous in the transverse direction. Mould temperature is held at 70–90 °C to promote sufficient crystallinity and reduce post-mould warpage. In this segment, processors use 100 wt% virgin compound for critical wafer-contact parts; any reprocessed material is limited to 10 wt% and only after in-house surface-resistance testing per ANSI/ESD STM11.11 shows values within the same decade as virgin lots. Terminal product types include structural components for front-opening unified pods, wafer cassettes, transport trays, robotic end-effector pads, and reticle carrier components. Applicable compliance standards include SEMI E78-0218, ANSI/ESD S20.20-2021, IEC 61340-5-1:2016, ASTM D257-14, and REACH SVHC declarations.
Electronics assembly plants use injection-moulded trays for populated printed circuit boards, where surface voltage must remain below 100 V during manual transfer according to ANSI/ESD STM97.1, though final acceptance is referenced to ANSI/ESD S20.20-2021 Table 1. For trays moulded from EMS-Grivory Grilamid® LV-23 ESD PA12-GF23, the conductive additive package is hygroscopically buffered by the PA12 matrix; saturation at 23 °C, 50 % RH typically increases bulk resistance by less than one order of magnitude, but at 70 % RH parts may shift from dissipative to insulative above 1×10^11 Ω if mould packing pressure is too low. Moulding trials on 400 mm × 300 mm trays using a 1,800 kN hydraulic injection moulding machine have shown that pack pressure between 60 MPa and 80 MPa and hold time of 8–12 s are required to compact the conductive additive network through the thickness. The recommended addition ratio for this application is 15 wt% post-industrial regrind from the same grade; higher regrind fractions above 25 wt% are not validated under IEC 61340-2-3 because of filler breakage and non-homogeneous resistivity. Drying is performed at 80 °C for 4 h, melt temperature at the nozzle is set to 265 °C, and mould temperature is 60 °C. Terminal product types include ESD-safe PCB magazines, wave-solder pallet rails, solder paste stencil holders, and component placement trays. Relevant standards are ANSI/ESD STM11.11, IEC 61340-5-1:2016, ASTM D257-14, and IPC J-STD-001 for handling-environment compatibility.
For robot end effectors operating in ISO Class 5 or ISO Class 6 cleanrooms, the combination of 23 wt% glass-fibre reinforcement and a static-dissipative PA12 matrix reduces particulate shedding relative to unfilled conductive thermoplastics while maintaining surface resistance below 1×10^9 Ω per ANSI/ESD STM11.11. In qualification builds on a 1,000 kN injection-compression press, flatness of gripping plates was maintained within 0.5 mm/m when a compression stroke of 1.5–2.0 mm was applied after fill; without compression, unreinforced areas showed warpage exceeding 1.2 mm/m. The formulation addition ratio for this application is 20 wt% re-compounded material from rejected end-effector housings combined with 80 wt% virgin compound, provided that the re-compounded fraction is re-qualified after 24 h conditioning at 23 °C, 50 % RH using IEC 61340-2-3. Drying of both fractions is carried out at 80 °C for 5 h; melt temperature is 270 °C and mould temperature 80 °C. Downstream processing includes CNC machining of moulded blanks for flatness-critical mounting faces, with feed rates kept below 1,500 mm/min to prevent delamination at glass-fibre-rich surfaces. Terminal product types include robot gripper fingers, wafer pick-up tools, SCARA arm covers, vacuum end-effector housings, and cleanroom automation brackets. Applicable standards include SEMI S2-0718, SEMI E78-0218, EN 61340-5-1:2016, and ISO 14644-1:2015 for cleanroom compatibility.
| Application scenario | Compliance standard | Test method designation | Typical required range |
|---|---|---|---|
| Wafer carrier components | ANSI/ESD S20.20-2021 | ANSI/ESD STM11.11 | surface resistance 1×10^4 Ω to 1×10^11 Ω |
| PCB transport trays | IEC 61340-5-1:2016 | IEC 61340-2-3 | resistance change ≤1 decade after 24 h at 23 °C, 50 % RH |
| Cleanroom robotic end effectors | SEMI E78-0218 | ASTM D257-14 | surface resistance 1×10^4 Ω to 1×10^9 Ω |
In pharmaceutical powder-dispensing isolators, electrostatic discharge from polymer surfaces is controlled because process dusts may have minimum ignition energies below 1 mJ; non-metallic guards and frames therefore require a surface resistance below 1×10^9 Ω at 23 °C, 50 % RH under the electrostatic requirements of IEC 60079-0:2017. EMS-Grivory Grilamid® LV-23 ESD PA12-GF23 is processed as 100 wt% virgin compound for these components; regrind is not permitted under the ignition-hazard assessment because re-melting alters the conductive network and may create localised surface resistance above the permitted threshold. Moulding trials for a 350 mm × 250 mm sight-glass frame with wall thickness of 6 mm on a 1,200 kN injection moulding machine have shown that residual moisture must be below 0.08 % before plastication; pre-drying is therefore performed at 80 °C for 6–8 h. Melt temperature is kept at 250 °C and mould temperature at 70 °C to reduce post-mould warpage in thick sections. Injection speed is limited to 40–80 mm/s to avoid turbulent filling and gas trapping at the glass-fibre-rich melt front. Downstream processes include deflashing with diamond-coated tools and dimensional stabilisation for 4 h at 80 °C before surface-resistance verification. Terminal product types include sight-glass frames, isolator glove-port rings, control-panel enclosures, and static-dissipative separator plates. Published data for LV-23 ESD evaluated as a component under IEC 60079-0:2017 is limited; final certification for explosive-atmosphere equipment remains the responsibility of the integrator or notified body. Additional applicable standards include ATEX Directive 2014/34/EU, IEC 61340-5-1:2016, and ASTM D257-14.
When substituting EMS-Grivory Grilamid® LV-23 ESD PA12-GF23 for unfilled conductive nylon in functional test fixtures, the 23 wt% glass-fibre reinforcement increases flexural modulus and reduces creep under repeated probe loading, but it also alters warpage behaviour in large plates. For a 500 mm × 400 mm base plate machined from an injection-moulded blank, the moulding process uses a 2,000 kN injection moulding machine with sequential valve-gate opening, because simultaneous filling from all gates produces knit lines with localised surface-resistance deviation greater than one decade. The formulation is processed as 100 wt% ready-to-mould compound; addition of carbon-black masterbatch is not recommended because it shifts mechanical properties and can create hard spots at machined surfaces. Annealing at 90 °C for 4 h after moulding reduces internal stress before CNC machining; tool speed below 3,000 rpm and feed rates below 800 mm/min prevent fiber pull-out on probe-mounting faces. Drying before moulding is 80 °C for 4–5 h; melt temperature is 260 °C and mould temperature 60 °C. Terminal product types include functional test fixture base plates, probe holders, connector alignment plates, pressing tools, and conveyor guides for automated test cells. Compliance standards for this segment include IEC 61340-5-1:2016, ASTM D638-14 for tensile properties, ISO 178:2019 for flexural properties, and UL 94 HB where the application does not require V-0 classification.
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EMS-Grivory Grilamid® LV-23 ESD is a polyamide 12 grade reinforced with 23% glass fibre by weight and classified as PA12-GF23. The ESD designation denotes a permanent electrostatic-dissipative modification, normally achieved through a conductive carbon-based filler system. Unmodified PA12-GF23 shows surface resistivity above 1012 Ω, whereas the LV-23 ESD grade is supplied with a typical surface-resistivity range of 106–109 Ω when tested according to IEC 60093. The measured value depends on moulded skin-core morphology, glass-fibre orientation, local packing pressure, weld-line formation, and environmental moisture. The 23% glass-fibre content raises the dry-as-moulded tensile modulus of PA12 to approximately 6900 MPa and reduces shrinkage compared with unreinforced conductive PA12. The grade is used where tribocharging must decay through a component to ground, but it is not a low-impedance conductor and should not be specified as an EMI-shielding material.
Addition of the conductive phase to PA12-GF23 moves the compound above the electrical percolation threshold, but it also changes solid-state ductility and melt flow. Notched impact strength is the most sensitive mechanical property. Dry Charpy notched impact results for the ESD grade typically fall in the range 8–12 kJ/m² under ISO 179/1eA, which is below values commonly reported for non-ESD 23% glass-filled PA12. The reduction is most evident at weld lines, where glass-fibre orientation and carbon-filler accumulation combine; weld-line tensile strength should be verified on moulded plaques with weld lines rather than on flash-free tensile bars. Tensile modulus and strength remain comparatively high because the glass fibre dominates the fibre-dominated stress path. Published dry-state tensile strength is typically near 115 MPa, falling to 85 MPa after conditioning at 23°C and 50% relative humidity.
Rheologically, the ESD grade is shear-thinning. Injection-moulding spiral-flow testing under identical barrel and mould conditions shows that the conductive modification reduces flow length relative to standard PA12-GF23, especially in sections below 1.5 mm. The practical consequence is that gate diameter may need to increase by 0.3–0.5 mm and the number of gates may need to increase for long flow paths. On production-scale reciprocating-screw machines, surface resistivity is not homogeneous across the moulding. The gate region frequently shows a lower surface resistivity than the last-filled edge because conductive filler concentration and glass-fibre length vary along the flow path. A measurement plan using three defined positions—gate, mid-flow, and end-fill—is required before freezing process parameters.
Representative physical and electrical values for EMS-Grivory Grilamid® LV-23 ESD are summarised below. The data are typical published values for dry-as-moulded and conditioned states, not specification limits. Batch-specific certification and the current technical datasheet should be used for design and incoming inspection.
| Property | Test standard | Dry / as moulded | Conditioned 23°C / 50% RH |
|---|---|---|---|
| Density | ISO 1183-1 | 1.23 g/cm³ | — |
| Tensile modulus | ISO 527-1/-2 | 6900 MPa | 5100 MPa |
| Tensile strength at break | ISO 527-1/-2 | 115 MPa | 85 MPa |
| Elongation at break | ISO 527-1/-2 | 3.5% | 6.0% |
| Charpy notched impact strength | ISO 179/1eA | 10 kJ/m² | 14 kJ/m² |
| HDT/A at 1.8 MPa | ISO 75-1/-2 | 155°C | — |
| Surface resistivity | IEC 60093 | 106–109 Ω | — |
| Volume resistivity | IEC 60093 | 104–106 Ω·m | — |
Conditioning for the wet-state values is performed in accordance with ISO 291 at 23°C and 50% relative humidity. The dash indicates that the property is either not normally reported for that condition or is not a matrix-dependent value.
On production-scale injection-moulding lines, the main source of batch-to-batch variation is not pellet conductivity but moulded-part conductivity. Conductive filler dispersion is influenced by screw geometry, back pressure, shot size, and melt residence time. A high-shear screw with aggressive mixing elements can shorten glass fibres and over-disperse the conductive phase, raising surface resistivity above the intended upper limit. A low-shear screw can leave carbon-rich agglomerates that create localised low-resistivity spots. In automotive connector production, the practical approach is to use a moderate-compression screw, keep back pressure moderate, and verify filler dispersion by measuring surface resistivity across multiple cavities over at least 20 consecutive shots.
Grilamid® LV-23 ESD is used in fuel quick connectors, sender flanges, pump retainers, vapour-management housings, and electronic module brackets. In these geometries, the material must dissipate charge generated by hydrocarbon flow without forming a low-resistance path to adjacent circuits. The 106–109 Ω surface-resistivity band is suitable for electrostatic dissipation in many 12 V and 24 V vehicle systems under dry conditions, but the part-level resistance must be validated because connector geometry, mating surface area, and moulded texture can shift the reading. Charge-decay performance should be evaluated using IEC 61340-2-3 or the applicable enterprise ESD-control standard; the material itself is not a substitute for system-level ESD protection under IEC 61340-5-1 or ANSI/ESD S20.20.
For fuel-contact components, the PA12 matrix retains broad resistance to aliphatic hydrocarbons, diesel, lubricating oil, and automotive greases. The glass reinforcement reduces swelling relative to unreinforced PA12, and the conductive carbon phase does not create a hygroscopic antistatic layer that washes away. However, compatibility with oxidised fuel, ethanol-blended fuel, acid rain salts, and hot zinc chloride solutions must be confirmed by immersion testing at 60°C for extended duration, because stress-cracking behaviour in moulded connectors is geometry-dependent and cannot be inferred from PA12 alone.
Compared with the non-ESD Grilamid® LV-23 PA12-GF23, the ESD variant differs primarily in surface resistivity, weld-line tensile strength, and spiral-flow length. The surface-resistivity reduction is intentional; the weld-line and flow-length penalties are design constraints. Compared with an unreinforced conductive PA12, the glass-filled ESD grade provides higher tensile modulus, lower mould shrinkage, and better dimensional stability, but it has lower elongation and lower weld-line strength. Compared with a 30% glass-filled PA66, the PA12-GF23 ESD grade offers lower water absorption—typically below 1.5% at saturation by ISO 62, versus 7–9% for PA66—and better low-temperature impact retention, but its heat-deflection temperature is lower and continuous service under load above 120°C is not recommended.
Pre-drying is specified at 80°C for 4–8 h in a dry-air dryer with a dew point of −20°C or lower. The maximum residual moisture before processing is typically 0.10%. Melt temperature is normally maintained between 230°C and 250°C. Mould temperature should be 40–80°C; the lower end shortens cycle time but produces a frozen skin with less uniform filler distribution. In hot-runner systems, manifold temperature should not exceed 250°C, and total residence time should be kept below 8 min to avoid degradation of the conductive carbon-rich phase and loss of glass-fibre length. Regrind use above 20% is generally not recommended for ESD-critical parts because repeated processing shifts fibre length and conductive-filler dispersion.
Compliance status for automotive and electronic applications should be verified against the current supplier declaration for the specific black ESD grade. Relevant frameworks include REACH (EC) No 1907/2006, RoHS 2011/65/EU, and the receiving plant’s IMDS entry. The product is not claimed for food-contact or medical use unless that status is explicitly stated in the current technical datasheet. Electrical acceptance should be based on moulded-part tests, not raw-pellet conductivity, because the conductive network forms during mould filling and cooling.
When mould surface temperature is reduced below 60°C to shorten cycle time, the outer polymer skin freezes before the conductive filler can form a stable dissipative network. The consequence is a measurable rise in surface resistivity toward the upper end of the ESD range and higher standard deviation across a moulding batch. On production equipment, occasional parts may exceed 109 Ω at weld lines and in textured areas. Raising mould temperature to 70–80°C and reducing injection velocity during the final 20% of the stroke improves filler-network formation. If fast cycles remain mandatory, designers should increase minimum wall thickness from 1.0–1.2 mm to 1.5 mm or move the gate to a non-cosmetic area to reduce end-of-fill resistance variability. Published data for textured surfaces on this specific ESD grade is limited; conditioning trials at 23°C/50% RH and 40°C/95% RH are required before release of a fixed process window.
