| HS Code | 583103 |
| Density | 1.14 g/cm³ |
| Water Absorption 23 C Saturation | 1.2 % |
| Melting Point | 178 °C |
| Heat Deflection Temperature A 1 8 Mpa | 50 °C |
| Heat Deflection Temperature B 0 45 Mpa | 110 °C |
| Tensile Modulus | 1300 MPa |
| Tensile Strength At Break | 35 MPa |
| Elongation At Break | 15 % |
| Charpy Impact Strength 23 C | 20 kJ/m² |
| Hardness Shore D | 72 |
| Surface Resistance | 10^6 - 10^9 Ω/sq |
| Volume Resistivity | 10^5 - 10^9 Ω·cm |
As an accredited EMS-Grivory Grilamid® L 25 NZ ESD PA12 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied as dry, ESD-safe PA12 pellets in sealed, moisture-proof 25 kg bags, ready for processing. |
| Container Loading (20′ FCL) | 20′ FCL: palletized, 25 kg bags of Grilamid L 25 NZ ESD PA12 granules, loaded securely for safe transport. |
| Shipping | Grilamid® L 25 NZ ESD PA12 ships as non-hazardous polymer granules. Pack in sealed, moisture-proof bags or drums to prevent moisture pickup. Store dry, cool, and away from direct sunlight. Avoid dust generation and static ignition sources during transport and handling. Standard ground freight is sufficient. |
| Storage | Store Grilamid® L 25 NZ ESD PA12 in its original, unopened packaging in a cool, dry place. Keep away from direct sunlight, UV sources, and excessive heat. Ensure the area is well-ventilated and free from moisture to prevent hydrolysis. Avoid contact with strong oxidizers. Follow standard polymer storage practices for optimal shelf life. |
| Shelf Life | Store dry, in original unopened packaging, away from heat and UV. Shelf life is typically at least two years. |
Semiconductor front-end wafer handling equipment uses static-dissipative polymer components where tribocharging on cassette racks, edge grips, and transfer nests can change device position or damage gate oxides. EMS-Grivory Grilamid® L 25 NZ ESD PA12 is specified for wafer cassettes, die-sort nest inserts, vacuum wand tips, and test socket bodies because the compound offers permanent electrostatic dissipation through the cross-section rather than a humidity-dependent surface antistatic layer. The material is produced with a conductive additive package dispersed into a PA12 carrier; process-scale compounding uses a co-rotating twin-screw extruder with L/D 40:1 and a conductive masterbatch let-down ratio of 6–12 wt%. Addition below this range can leave surface resistance above 1×109 Ω, while addition above 15 wt% tends to move the part into the conductive range and sacrifice impact stability. The dissipation performance is validated after conditioning at 23 °C / 50 % RH for 48 h using IEC 61340-2-3:2016; surface resistance in the dissipative range of 1×105–1×109 Ω is consistent with the protected-area limits in ANSI/ESD S20.20-2021. Wafer transport components in a front-end fab are also reviewed for machine compatibility under SEMI E78, which covers electrostatic protection concepts in semiconductor manufacturing tools. The downstream injection molding process requires pre-drying at 80 °C until residual moisture is below 0.1%; melt temperature is held between 240–260 °C and mold temperature between 60–80 °C. Carbon-black-filled PA12 has higher melt viscosity than unfilled PA12, so hot-runner systems and gates must be sized for injection pressures commonly 25–40% higher than a nonconductive PA12 grade, with peak cavity pressures often in the 800–1,100 bar range. A recognized process risk is the resin-rich as-molded skin: milled or machined contact surfaces can expose conductive filler and shift surface resistance downward by as much as one decade, so end-effector pads and test socket nests must be re-verified at the actual contact zone after secondary machining. Regrind content above 20% is an operational boundary because repeated shear can destroy the conductive network and create batch-to-batch resistance variation. Alkaline cleaners and strong oxidizing agents are incompatible with the PA12 matrix; isopropanol and mild aqueous detergents are preferred for routine wipe-down.
In electronics assembly, SMT solder-paste stencil frames and depaneling fixtures are often machined from extruded or compression-molded L 25 NZ ESD blank because the application requires flatness tighter than 0.05 mm over 300 mm and a wear-resistant dissipative contact surface. The ESD control program follows ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016, which require working surfaces and fixtures in an electrostatic protected area to have point-to-point resistance below 1×109 Ω. The formulation uses conductive filler dispersed into PA12 at an addition ratio of 8–12 wt%; the filler network is permanent through the part, not a conductive coating that can flake or wear away after repeated stencil cleaning. During CNC machining of the blank, the resin-rich outer skin is removed and conductive agglomerates become exposed, so point-to-point resistance measured directly on the machined surface can be 0.5–1.0 decade lower than on an unmachined as-molded surface. This creates a production conflict: the part may become more dissipative but also more prone to surface particle release if cutting speed is excessive or the tool edge is dull. Field data from 3-axis milling centers indicates carbide end mills at spindle speeds of 8,000–12,000 rpm with feed rates around 1,500 mm/min are typical for this filled PA12; coolant must be oil-free because residual esters or mineral oils can contaminate solder paste contact zones. After machining, the parts are annealed at 120 °C for 2 h under nitrogen to relieve residual stress, then conditioned at 23 °C / 50 % RH for 48 h before IEC 61340-2-3:2016 verification. Terminal products in this segment are solder-paste stencil frames, wave solder pallet edge strips, selective solder masking plates, and depaneling fixture nests. Flammability of the final machined part depends on component wall thickness and conductive filler loading; if a higher UL 94 classification is required, a dedicated flame-retardant ESD PA12 should be evaluated because published data for this specific L 25 NZ ESD configuration is limited.
| Verification parameter | Standard | EPA acceptance range | Validation note for L 25 NZ ESD |
|---|---|---|---|
| Point-to-point resistance | IEC 61340-2-3:2016 | 1×105–1×109 Ω | Measure after CNC machining on actual contact zones, not as-molded skin only |
| Surface resistivity | ASTM D257-14 | 1×106–1×109 Ω/sq | Condition at 23 °C / 50 % RH for 48 h before testing |
| Static decay | IEC 61340-2-1:2016 | Decay from 1,000 V to 100 V in <2 s | Clip electrodes placed on flat fixture zones |
After injection molding, cleanroom automation components such as vacuum grippers, wafer transfer blades, mini-environment rollers, and cassette locators made from L 25 NZ ESD must satisfy both particle-release limits under ISO 14644-1:2015 and static-dissipation requirements under IEC 61340-5-1:2016. The additive package is loaded into the PA12 melt at 6–12 wt%, and the molar mass distribution of the base resin is selected to reduce plate-out on the mold surface, which directly influences particle-count performance in an ISO Class 5–7 cleanroom. The downstream production route is injection molding at melt temperature 230–250 °C and mold temperature 60–80 °C, followed by ultrasonic cleaning in deionized water and drying with filtered compressed air at 0.3–0.5 MPa. Acetone, N-methylpyrrolidone, and aqueous strong bases are incompatible with PA12 and must not be used for cleaning because they can cause microcracking and surface-resistance drift. In laminar-flow cleanroom equipment, static dissipation is not solely a workplace compliance issue; charged polymer end effectors can attract airborne particles and increase defect density on wafers or flat-panel substrates. The 70% isopropanol wipe used in routine cleanroom sanitation does not remove the conductive network because the additive is dispersed through the cross-section and not deposited as a topical layer. One operational boundary is dimensional: PA12 absorbs a small amount of moisture, and at relative humidity above 80% RH, hygroscopic swell can reduce clamping force in press-fit inserts on robotic end effectors. For vacuum end-effector pads used inside load-lock chambers, outgassing should be reviewed by ASTM E595-15; absorbed moisture on freshly molded parts can release volatiles and condense on optical surfaces if the pre-drying and conditioning sequence is skipped. Terminal products in this cleanroom automation segment are vacuum tube adapters, end-effector fingertips, sensor brackets, cassette locators, and mini-environment guide rails.
Connector bodies and fieldbus node housings made from ESD PA12 are used where the assembled device must not retain charge on an assembly line but the polymer body is not intended as primary electrical insulation. The L 25 NZ ESD compound is formulated with conductive carbon black in a PA12 carrier at an addition ratio of 6–10 wt%, which maintains surface resistance below 1×109 Ω while preserving enough impact-modified ductility for snap-fit closure and insert retention. In the injection molding of M12 and M8 circular connector bodies, the process uses melt temperature 240–260 °C and mold temperature 60–70 °C; balanced runner layouts are necessary because the filled PA12 is shear-thinning and unbalanced flow can create preferential filler orientation, leading to surface-resistance variation of approximately 0.5 decade between cavity positions. The downstream process includes overmolding of brass or phosphor bronze contacts into the connector body; post-molding thermal cycling from -40 °C to 80 °C is required to re-qualify contact retention because the coefficient of linear thermal expansion of PA12 is higher than that of the metal insert. Industry compliance for finished connectors is evaluated under IEC 61984:2020, and the material must also conform to the electrostatic protected area handling limits in IEC 61340-5-1:2016. Terminal products include M12 circular housings, field-attachable sensor connectors, terminal block shells, and fieldbus node enclosures. The operational boundary is explicit: the dissipative conductive network reduces dielectric strength compared with unfilled PA12, so L 25 NZ ESD should not be used as the sole electrical insulation barrier above the connector manufacturer’s voltage class without separate dielectric testing.
When high-velocity fuel or pneumatic flow creates charge on polymer fittings, the PA12 base of L 25 NZ ESD provides resistance to mineral oil, fuel, and aliphatic hydrocarbons while the conductive filler network prevents the fitting from becoming an isolated charged conductor. Components in this segment include antistatic quick-connect bodies, vapor canister brackets, fuel-pump module flanges, and pneumatic hose couplings used in locations where static accumulation must be controlled. For potentially explosive atmosphere applications, the installed assembly is evaluated under IEC 60079-0:2017 and ISO 80079-36:2016; the component surface resistance should be below 1×109 Ω, and the resistance from the installed conductive part to earth should generally be below 1×106 Ω. The conductive masterbatch is added at 7–13 wt% before injection molding; pre-drying is carried out at 80 °C for 4–8 h until residual moisture is below 0.1%, and melt temperature is maintained between 230–250 °C. Externally heated hot-runner tips are preferred because carbon-black-filled PA12 can accumulate conductive deposits in cold sprue bushings, causing short shots or inconsistent fill. Assembly of automotive-style quick connectors involves press-fit insertion of SAE J2044-compliant latch clips; low-temperature clip loading must be validated at -40 °C without fracture because the conductive filler can reduce notched impact resistance relative to unfilled PA12. Chemical resistance validation for fuel-contact parts uses immersion testing according to ISO 1817:2015 in fuel CM15 at 60 °C for 72 h; the supplier’s published data for this specific L 25 NZ ESD grade is limited, so long-term swell, extraction, and conductivity retention testing is required before the material replaces a standard PA12 fuel-system grade. Terminal products are antistatic quick-connect bodies, vapor canister brackets, fuel-pump module flanges, and pneumatic hose couplings intended for use in zones where charge accumulation is a defined ignition risk, with final earth-bonding verification at the production line.
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EMS-Grivory Grilamid® L 25 NZ ESD is a semi-crystalline polyamide 12 (PA12) injection-moulding and extrusion grade supplied by EMS-CHEMIE AG. The designation places the material in the Grilamid L family, where L identifies the laurolactam-based PA12 backbone, the 25 viscosity designation is associated with medium-viscosity processing behaviour, NZ indicates impact modification, and ESD identifies a permanent electrostatic-dissipative additive system. The compound is formulated to avoid the surface-charge accumulation observed with unfilled PA12 while retaining the lower moisture uptake, aliphatic fuel resistance, salt-spray tolerance and low-temperature ductility characteristic of PA12.
Published processing guidance for this grade positions it for static-safe parts in electronics handling, automotive fuel-system retaining clips and quick connectors, conveyor chain guides, and housings for devices requiring a controlled surface-resistivity window. Surface resistivity is typically maintained in the electrostatic-dissipative range of 106–109 Ω when measured under IEC 61340-2-3; volume resistivity is normally reported in the range 103–107 Ω·m under IEC 60093. Exact values depend on filler dispersion, wall orientation, weld-line location, regrind ratio and moisture state.
Electrostatic-dissipative behaviour in conductive-filler-modified PA12 arises when the filler concentration exceeds the percolation threshold, forming a continuous path for charge bleed-off. Below that threshold, surface resistivity remains above 1012 Ω; above it, resistivity falls abruptly by several orders of magnitude. In the ESD grade, the filler system is controlled to keep the moulded part in the 106–109 Ω surface-resistivity band required for static-safe handling rather than into the conductive region below 105 Ω, which can create spark-discharge hazards in electronics assembly.
Dispersion intensity during melt processing controls this window. On production-scale twin-screw compounding lines with L/D ratios of 40:1 or higher, excessive specific energy input can fracture the conductive filler or over-disperse the network, shifting surface resistivity above the dissipative limit. The opposite failure mode—low compression screw design or insufficient back pressure—leaves resistivity non-uniform because filler agglomerates remain undispersed. Injection moulders observe this as flow-dependent variation: weld lines and highly orientated skin layers can measure 101–103 Ω higher than bulk surfaces on the same part. Production validation therefore requires surface-resistivity measurement at gate, weld-line and last-filled regions, not only at the part centre.
Moisture conditioning affects PA12 ESD less than PA6 ESD because PA12 reaches an equilibrium water absorption of 0.7–1.0 wt% at 23 °C and 50 % RH according to ISO 62. PA6 ESD grades may absorb 2.5–3.0 wt% moisture under the same atmosphere, producing larger dimensional changes and greater humidity-driven movement in surface resistivity. Conditioning for test specimens is normally performed according to ISO 291 at 23 °C/50 % RH unless dry-as-moulded data are explicitly required.
Representative property ranges for impact-modified PA12 ESD formulations are summarised below. Lot-to-lot values require the current EMS-Grivory data sheet for Grilamid® L 25 NZ ESD.
| Property | Test method | Representative range or value | Conditioning |
|---|---|---|---|
| Density | ISO 1183-1 | 1.04–1.06 g/cm³ | Dry |
| Tensile modulus | ISO 527-1/-2 | 1.30–1.60 GPa | Dry |
| Yield stress | ISO 527-1/-2 | 35–45 MPa | Dry |
| Nominal strain at break | ISO 527-1/-2 | >20 % | Dry |
| Charpy notched impact strength at 23 °C | ISO 179-1/1eA | 25–45 kJ/m² | Dry |
| Charpy notched impact strength at −30 °C | ISO 179-1/1eA | 5–12 kJ/m² | Dry |
| Melting temperature | ISO 11357-3 | 176–180 °C | Dry |
| Surface resistivity | IEC 61340-2-3 | 106–109 Ω | 23 °C, 50 % RH |
| Volume resistivity | IEC 60093 | 103–107 Ω·m | 23 °C, 50 % RH |
| Water absorption at 23 °C, 50 % RH | ISO 62 | 0.7–1.0 wt% | Equilibrium |
Pre-drying is mandatory when the resin has been exposed to ambient humidity above 60 % RH or stored in opened containers. Residual moisture above 0.10 wt% can generate surface splay and viscosity degradation at PA12 melt temperatures. Desiccant-wheel dryers with a dew point of −40 °C or lower are specified; a drying cycle of 4–6 h at 80 °C is typical. Over-drying above 90 °C for more than 12 h may risk thermal ageing of impact modifiers and should be avoided.
Melt processing is carried out at melt temperatures of 230–260 °C, with short residence times below 6 min to prevent conductive-network degradation. Mould temperature influences skin crystallinity and therefore surface resistivity: 60–80 °C is typical for dimensional stability and moderate crystallinity. Lower mould temperatures can freeze the surface before filler particles relax, increasing local resistivity; higher mould temperatures lengthen cycle time and may increase post-mould shrinkage.
General-purpose injection screws with L/D ratios of 18:1–22:1 and compression ratios of 2:1–2.5:1 are suitable. Back pressure in the range 20–60 bar may be used, but excessive back pressure raises shear heating and can break the conductive filler; too little promotes streaking and non-uniform resistivity. Screw rotation speed should be adjusted to maintain a short recovery time without over-shearing the melt. For multi-cavity tools, balanced runner geometry is preferred because unbalanced fill generates pack-pressure differences that can alter conductive-filler orientation between cavities and widen the measured surface-resistivity distribution.
Regrind use requires production-scale validation because repeated heat history can shift surface resistivity and reduce impact strength. If regrind is added to virgin material, the pellet mixture should be introduced through a gravimetric blender to avoid layering; the blend ratio must be held constant once electrical and mechanical acceptance limits are established.
In semiconductor packaging and electronic assembly, injection-moulded trays and carrier elements use the ESD surface-resistivity window to meet the limits in ANSI/ESD S20.20 and IEC 61340-5-1 for protected areas. Parts that fall in the 106–109 Ω surface-resistivity range provide charge decay without the low-resistance path classed as conductive; this avoids a hard ground path that can damage sensitive devices. On automated placement lines, pallets moulded from the material are subjected to repeated cleaning with isopropanol/water mixtures. Because the ESD additive system is dispersed in the polymer matrix rather than deposited as a migrating antistatic film, surface resistivity is less prone to wash-off than external antistatic coatings; however, abrasive cleaning can remove conductive filler from the immediate surface and should be tested on production parts.
Fuel-system retaining clips and quick connectors are another documented use area. PA12 is preferred for its resistance to zinc chloride salts and aliphatic fuels; the ESD modification prevents static buildup during fuel flow through polymer lines. Compliance testing may include SAE J2260 or internal OEM immersion protocols. Published data for this specific product in road-vehicle fuel applications is limited, so part validation under actual fuel blends, temperature cycling and vibration is required before serial use.
Conveyor chain guides, guide rails and brackets in electronics assembly lines are process-equipment applications where the ESD range prevents charge accumulation from sliding contact with packaging films. The low moisture uptake of PA12 maintains dimensional stability in dry-room environments, while the impact-modified matrix reduces brittle failure at drive-lock assembly points. Wear performance depends on counterface material and load; continuous sliding against stainless steel may require additional solid lubrication if frictional heating exceeds 60 °C local surface temperature.
Selection of PA12 ESD over PA6 ESD is typically driven by moisture-related dimensional change and electrical stability. At 23 °C and 50 % RH, PA6 can absorb 2.5–3.0 wt% water, while PA12 absorbs 0.7–1.0 wt%. This difference reduces dimensional expansion and lowers the risk of surface-resistivity drift in variable-humidity production areas. PA12 also has a lower density, reducing part mass approximately 8–10 % relative to PA6 ESD at equivalent wall thickness. However, unreinforced PA6 ESD usually provides higher tensile modulus and higher heat deflection temperature; PA12 ESD is specified where low-temperature ductility down to −40 °C or better resistance to zinc chloride solutions is required.
Carbon-loaded polyolefins offer lower cost and lower moisture absorption, but their continuous operating temperature and creep resistance are lower. A carbon-black-filled polypropylene ESD may deform under sustained load at service temperatures above 70–80 °C, while PA12 ESD retains structural utility at higher temperatures because of its semi-crystalline PA12 matrix. In addition, PA12 ESD offers better resistance to automotive fluids and solvents, though it requires drying before processing, unlike most polyolefins.
A simplified early-selection matrix is provided below. The values are class-level or representative ranges and do not replace grade-specific verification.
| Property | PA12 ESD | PA6 ESD | Carbon-black-filled PP ESD |
|---|---|---|---|
| Density, ISO 1183-1 | 1.04–1.06 g/cm³ | 1.12–1.14 g/cm³ | 0.91–1.05 g/cm³ |
| Water absorption at 23 °C, 50 % RH, ISO 62 | 0.7–1.0 wt% | 2.5–3.0 wt% | <0.1 wt% |
| Tensile modulus, ISO 527-1/-2 | 1.3–1.6 GPa | 2.5–3.5 GPa | 0.8–1.5 GPa |
| Surface resistivity, IEC 61340-2-3 | 106–109 Ω | 106–109 Ω | 104–108 Ω |
| Typical low-temperature service capability | −40 °C with impact-modified grades | −30 to −40 °C depending on moisture state | −20 to −40 °C depending on copolymer phase |
Operational boundaries include sensitivity to prolonged hot-water immersion; PA12 is susceptible to hydrolysis above 100 °C in aqueous media, and ESD filler networks can be altered by aggressive glycol-based coolants at elevated temperature. The material is not a substitute for metallic grounding in equipment where fault currents must be carried because it is dissipative rather than conductive. Avoid dilution with virgin PA12, which raises surface resistivity and can move the part out of the dissipative range. Colour concentrates or additives containing amine-based species should be avoided because they can interact with the conductive filler system and shift electrical performance. For applications requiring food-contact or drinking-water compliance, specific grade approvals under FDA 21 CFR or EU 10/2011 must be confirmed with the manufacturer before use.
